CN1108516C - Ceramic thick film resistor pressure transducer - Google Patents
Ceramic thick film resistor pressure transducer Download PDFInfo
- Publication number
- CN1108516C CN1108516C CN 98111124 CN98111124A CN1108516C CN 1108516 C CN1108516 C CN 1108516C CN 98111124 CN98111124 CN 98111124 CN 98111124 A CN98111124 A CN 98111124A CN 1108516 C CN1108516 C CN 1108516C
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- China
- Prior art keywords
- thick film
- film resistor
- ceramic thick
- pressure sensitive
- sensitive chip
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- Expired - Fee Related
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Abstract
The present invention relates to a ceramic thick-film resistance pressure transmitter. The present invention is characterized in that the ceramic thick-film resistance pressure transmitter adopts a ceramic thick-film resistance pressure sensitive chip which is sintered with a thick-film resistance network forming a detecting bridge in a ceramic sheet, the present invention adopts a tubular base, a platform with the same diameter as that of the pressure sensitive chip is arranged on the inner side wall of the tubular base, the pressure sensitive chip is pressed and sealed on the platform by a circular pressing ring screwed by screw threads, a corrosion-proof sealing gasket is arranged between the chip and the platform, a transmitting circuit board is arranged in a transmitter casing positioned above the circular pressing ring, and a signal wire is led out from a socket on the top of the casing. The present invention can largely raise the cost performance of the transmitter and satisfy the requirements of automatic control and centralized detection.
Description
The present invention relates to the pressure inverting device.More particularly, be a kind of being applied in industrial process control and the detection system, the pressure of controlled medium is detected, and the pressure signal that records is amplified, be transformed into the pressure unit of standard electric signal transmission.
For a long time, traditional pressure unit has been obtained certain status in control system.For example, utilize the DDZI type or the DDZI type force balance type pressure unit of machinery, mechanical property and some electronic technology formation of material.But, along with the automatic control of increasing production process and the needs of centralized detecting, problems such as the volume heaviness of traditional pressure unit, poor stability are embodied gradually, and the electronic pressure transmitter that volume is little, performance is high comes into one's own day by day, as condenser type, diffuse si formula pressure unit.But the force sensing element of this class transmitter of the prior art needs import, costs an arm and a leg, and can not satisfy the high requirement of the ratio of performance to price simultaneously.Especially diffused silicon pressure transmitter exists also that temperature is floated greatly, the defective of poor stability.Present ceramic-like pressure unit is only in German E+H company product ceramic condenser type.As for ceramic electrical resistance type, still product-free.
The objective of the invention is to, avoid the weak point in the above-mentioned existing skill water, provide a kind of,, satisfy the needs of control automatically and centralized detecting to improve the transmitter ratio of performance to price with the pressure unit of ceramic thick film resistor chip as force sensing element.
The present invention also aims to avoid the deficiency in the prior art, provide a kind of volume little, good airproof performance, the pressure unit that field-interchangeable is strong.
A further object of the present invention provides a kind of pressure unit that transmits with the international standard signal.
Purpose of the present invention is achieved through the following technical solutions.
The present invention adopts the ceramic thick film resistor pressure sensitive chip, and described ceramic thick film resistor pressure sensitive chip is that sintering has the thick film resistor network that constitutes the detection bridge in potsherd;
Architectural feature of the present invention also is to adopt tubular base, have on the tubular base madial wall one with the identical platform of ceramic thick film resistor pressure sensitive chip diameter, described ceramic thick film resistor pressure sensitive chip on platform, is provided with annular preserving and sealing pad by the circular hold-down ring press seal that adopts the screw thread precession between this presser sensor chip and platform; At the transmitter housing that is positioned at above the circular hold-down ring, be provided with to become and send wiring board, described change to send the wiring board rivet clasp on circular hold-down ring, signal wire is drawn from the case top socket.
Architectural feature of the present invention also is to be arranged on described change and send the signal transmitting circuit on the wiring board to adopt the signal input part of two-wire system transducer functional module, module to be connected with presser sensor chip detection signal output terminal, with modular power source signal output part pin as transducer signal output terminal pin.
Thick-film resistor has the quick effect of power, because the distortion of elastic body potsherd, the thick film resistor network that seal is burnt on elastic body produces an electric signal that is directly proportional with pressure signal, this electric signal compensates, amplifies, changes, debugs the current output signal that becomes standard through signal conversion circuit again, becomes the purpose of sending thereby reach pressure signal.
Compared with the prior art, the present invention has following clear superiority.
1, the ceramic thick film resistor pressure sensitive chip is to adopt the thick film technology (TFT) in the hydrid integrated circuit to make among the present invention, and this technology is simple, and is easy to adjust, flexible design, and can automated production, and material selects freely, is easy to other electronic devices and components and mixes and integrate.When requiring price low, when performance height or production in enormous quantities, these characteristics are vital.Since ceramic thick film resistor be by serigraphy with the thick-film resistor paste sintering on ceramic flexible sheet, making resistance and elastic body is one, when diaphragm bears pressure, thick-film resistor and ceramic diaphragm strain are in full accord, so that transmitter has the good linearity, repeatability, hysteresis and high reliability.In addition, this diaphragm is high temperature resistant and the burn into long-term work does not have creep and plastic yield, so transmitter is worked in various working environments and wide temperature province reliably.
2, the presser sensor chip among the present invention is to adopt the mode of screw thread precession extruding to carry out press seal by circular hold-down ring, transmission circuit also is arranged in the transmitter cavity volume simultaneously, its one-piece construction is simple, compact, volume is little, satisfies sealing, anti-vibration and the good requirement of field-interchangeable fully.
3, the present invention is than prior art, and its performance, price ratio are greatly improved, and have extensive applicability.The signal system 4-20mA two-wire system transmission owing to adopt international standards, it is supporting to help on-the-spot use and each instrument system.Its key technical indexes is as follows:
Each range of range: 0～25MPa
Precision: 0.1 grade 0.5 grade 1.0 grades
Power supply: U=12～36VDC load RL＜(U-12V)/20mA (K Ω)
Output signal: 4-20mADC (two-wire system)
Working temperature :-20 ℃～+ 80 ℃;-40 ℃～+ 120 ℃
Allow overload: 150% 200%
Fig. 1 is an one-piece construction synoptic diagram of the present invention.
Fig. 2 is a ceramic thick film resistor pressure sensitive chip structural representation of the present invention.
Fig. 3 is a transmission circuit principle schematic of the present invention:
By the following examples, in conjunction with the accompanying drawings the present invention is further described.
Embodiment:
Referring to Fig. 1, adopt tubular base 1.Base 1 lower end has the external thread interface, and this interface is in order to be connected with the measured medium pipeline thread.On its interface end face, offer inside and outside bipassage ring connected in star 11, so that form the double-layer seal of interface, thereby guarantee the reliability of sealing.Base 1 upper end is provided with inside and outside interface thread simultaneously.One platform 10 is arranged on base 1 madial wall, and the diameter of platform 10 is identical with the diameter of ceramic thick film resistor pressure sensitive chip 3, and platform 10 upper surfaces also offer ring seal groove 12.Ceramic thick film resistor pressure sensitive chip 3 by circular hold-down ring 4 press seals that adopt the screw thread precession on platform 10.Between circular hold-down ring 4 and ceramic thick film resistor pressure sensitive chip 3, and between ceramic thick film resistor pressure sensitive chip 3 and base platform 10, be lined with preserving and sealing pad 2 respectively.For the ease of the screw-in of circular hold-down ring 4, on the upper surface of circular hold-down ring 4, offer draw-in groove, instrument can insert draw-in groove and carry out fastening.
When being used for low pressure measurement, directly screwing in by circular hold-down ring 4 and to compress.But when being used for middle and high pressure and measuring, need between circular hold-down ring 4 and the base 1 to weld.Measure as middle and high pressure, preserving and sealing pad 2 places between sensitive chip 3 and platform 10 need add adhesion agent.In addition, at the transmitter housing 6 that is positioned at above the circular hold-down ring 4, be provided with to become and send wiring board 5, become and send wiring board 5 rivet clasps on circular hold-down ring 4, signal wire is drawn from case top socket 7.In addition the lead-out mode of signal wire also can directly draw by housing upper end and cap screw, also on the cap screw a circular fairlead is being arranged.Also the anti-explosion terminal box that can directly add in addition by the housing upper end is drawn.
In the present embodiment, housing 6 and base 1 all adopt the stainless steel starting material.
Referring to Fig. 2, the ceramic thick film resistor pressure sensitive chip adopts the thick film technology (TFT) in the hydrid integrated circuit to make, and sintering constitutes the thick film resistor network 9 that detects bridge in potsherd 8.Each thick-film resistor in the thick film resistor network 9 can be by symmetrical distribution as shown in Figure 1.
Referring to Fig. 3; in the present embodiment; be arranged on and become the signal transmitting circuit employing IC modules A D693 that send on the wiring board 5; modules A D693 is the two-wire system transducer functional module of the special exploitation of ADI; it is the loop signal regulator of a complete low-voltage/current transformation; it can receive the light current of presser sensor chip and press signal; with two-wire system way of output outputting standard electric current; the adjusting of its zero current and full scale electric current is independently to carry out; output area has 4-20mA; 0-10mA; three kinds of 12 ± 8mA are available, can oneself supply with the operating voltage of sensor, and load capacity is strong; operating voltage range is wide, and has the reversal of power defencive function.The application of present embodiment is that signal input part 17,18 pin with module I C are connected with presser sensor chip detection signal output terminal, and with modular power source signal output part pin 10,7 pin as transducer signal output terminal pin.
When the pressure P of measured medium (gas or liquid) enters transmitter by base lower end hickey, at first act on the ceramic thick film resistor pressure sensitive chip, to produce a distortion as elastomeric ceramic chip, along with this distortion, thick film resistor network will produce the electric signal that is directly proportional with pressure signal, this electric signal becomes the 4-20mA current output signal of standard by after the functional module IC.
Claims (2)
1, a kind of ceramic thick film resistor pressure transducer is characterized in that: adopt ceramic thick film resistor pressure sensitive chip (3), described ceramic thick film resistor pressure sensitive chip (3) is that sintering has the thick film resistor network (9) that constitutes the detection bridge in potsherd (8); Adopt tubular base (1), one platform (10) identical with ceramic thick film resistor pressure sensitive chip (3) diameter arranged on tubular base (1) madial wall, described ceramic thick film resistor pressure sensitive chip (3) on platform (10), is provided with annular preserving and sealing pad (2) by circular hold-down ring (4) press seal that adopts the screw thread precession between this presser sensor core (3) and platform; At the transmitter housing (6) that is positioned at circular hold-down ring (4) top, be provided with to become and send wiring board (5), described change to send wiring board (5) rivet clasp on circular hold-down ring (4), signal wire is drawn from case top socket (7).
2, ceramic thick film resistor pressure transducer according to claim 1, it is characterized in that being arranged on described change send the signal transmitting circuit on the wiring board (5) to adopt two-wire system transducer functional module IC (AD693), the signal input part of described module I C (17,18 pin) is connected with presser sensor chip detection signal output terminal, and with modular power source signal output part pin (10,7 pin) as transducer signal output terminal pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98111124 CN1108516C (en) | 1998-01-19 | 1998-01-19 | Ceramic thick film resistor pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98111124 CN1108516C (en) | 1998-01-19 | 1998-01-19 | Ceramic thick film resistor pressure transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1224154A CN1224154A (en) | 1999-07-28 |
| CN1108516C true CN1108516C (en) | 2003-05-14 |
Family
ID=5221129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98111124 Expired - Fee Related CN1108516C (en) | 1998-01-19 | 1998-01-19 | Ceramic thick film resistor pressure transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1108516C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20219732U1 (en) * | 2002-12-18 | 2003-03-06 | Dbt Autom Gmbh | Pressure transducers for measuring hydraulic pressures |
| CN103674407A (en) * | 2012-09-17 | 2014-03-26 | 昆山尚达智机械有限公司 | Novel pressure transmitter |
| CN103968975B (en) * | 2014-05-07 | 2016-03-02 | 衢州学院 | Based on the anti-corrosion pressure transducer of PDMS pressure drag and stainless steel electric capacity |
| CN105067162A (en) * | 2015-07-20 | 2015-11-18 | 湖南菲尔斯特传感器有限公司 | Ceramic pressure sensor and installing method thereof |
| CN106404271A (en) * | 2015-08-10 | 2017-02-15 | 浙江三花制冷集团有限公司 | Pressure sensor |
| JP6410105B2 (en) * | 2015-09-18 | 2018-10-24 | Smc株式会社 | Pressure sensor and manufacturing method thereof |
| CN110265543B (en) * | 2019-06-17 | 2022-08-02 | 中北大学 | Differential capacitance type ceramic high-temperature-resistant pressure-sensitive chip |
| CN110333028B (en) * | 2019-08-06 | 2021-03-16 | 中北大学 | Pressure parameter real-time online monitoring system under special environment |
| CN112326105B (en) * | 2020-11-23 | 2022-03-29 | 南京沃天科技股份有限公司 | Special pressure transmitter for compressor air |
-
1998
- 1998-01-19 CN CN 98111124 patent/CN1108516C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1224154A (en) | 1999-07-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AR01 | Abandonment of patent right to avoid double patenting |
According to article 9 of the patent law and article 13 of the detailed rules for the implementation of the patent law: 98111124.6 of the invention patents in the current issue of authorization announcement, and at the same time corresponding to the 97213985 utility model patent to be given up, and in the 19 volume of the 20 issue of the new type of communique on the patent right to abandon the announcement. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |