CN1224154A - Ceramic thick film resistor pressure transducer - Google Patents

Ceramic thick film resistor pressure transducer Download PDF

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Publication number
CN1224154A
CN1224154A CN 98111124 CN98111124A CN1224154A CN 1224154 A CN1224154 A CN 1224154A CN 98111124 CN98111124 CN 98111124 CN 98111124 A CN98111124 A CN 98111124A CN 1224154 A CN1224154 A CN 1224154A
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CN
China
Prior art keywords
film resistor
thick film
ceramic thick
chip
resistor pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 98111124
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Chinese (zh)
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CN1108516C (en
Inventor
黄英
胡璋
胡瑱
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TIANSHEN ELECTRIC APPLIANCE CO Ltd HEFEI CITY
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TIANSHEN ELECTRIC APPLIANCE CO Ltd HEFEI CITY
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Publication date
Application filed by TIANSHEN ELECTRIC APPLIANCE CO Ltd HEFEI CITY filed Critical TIANSHEN ELECTRIC APPLIANCE CO Ltd HEFEI CITY
Priority to CN 98111124 priority Critical patent/CN1108516C/en
Publication of CN1224154A publication Critical patent/CN1224154A/en
Application granted granted Critical
Publication of CN1108516C publication Critical patent/CN1108516C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A pressure transducer with ceramic thick-film resistor features use of pressure-sensing chip which is a thick-film resistor network sintered in ceramic substrate to form a sensing bridge. A tubular base with a table whose diameter is equal to that of chip is used. The chip is fixed to table by a circular press ring with spiral thread. An anticorrosion seal packing is between chip and table. The circuit board of said transducer is arranged above the chip in the casing. Its advantages are high performance and low cost.

Description

Ceramic thick film resistor pressure transducer
The present invention relates to the pressure inverting device.More particularly, be a kind of being applied in industrial process control and the detection system, the pressure of controlled medium is detected, and the pressure signal that records is amplified, be transformed into the pressure unit of standard electric signal transmission.
For a long time, traditional pressure unit has been obtained certain status in control system.For example, utilize the DDZ II type or the DDZ III type force balance type pressure unit of machinery, mechanical property and some electronic technology formation of material.But, along with the automatic control of increasing production process and the needs of centralized detecting, problems such as the volume heaviness of traditional pressure unit, poor stability are embodied gradually, and the electronic pressure transmitter that volume is little, performance is high comes into one's own day by day, as condenser type, diffuse si formula pressure unit.But the force sensing element of this class transmitter of the prior art needs import, costs an arm and a leg, and can not satisfy the high requirement of the ratio of performance to price simultaneously.Especially diffused silicon pressure transmitter exists also that temperature is floated greatly, the defective of poor stability.Present ceramic-like pressure unit is only in German E+H company product ceramic condenser type.As for ceramic electrical resistance type, still product-free.
The objective of the invention is to, avoid above-mentioned weak point of the prior art, provide a kind of,, satisfy the needs of control automatically and centralized detecting to improve the transmitter ratio of performance to price with the pressure unit of ceramic thick film resistor chip as force sensing element.
The present invention also aims to avoid the deficiency in the prior art, provide a kind of volume little, good airproof performance, the pressure unit that field-interchangeable is strong.
A further object of the present invention provides a kind of pressure unit that transmits with the international standard signal.
Purpose of the present invention is achieved through the following technical solutions.
The present invention adopts the ceramic thick film resistor pressure sensitive chip, and described ceramic thick film resistor pressure sensitive chip is that sintering has the thick film resistor network that constitutes the detection bridge in potsherd;
Architectural feature of the present invention also is to adopt tubular base, have on the tubular base madial wall one with the identical platform of ceramic thick film resistor pressure sensitive chip diameter, described ceramic thick film resistor pressure sensitive chip on platform, is provided with annular preserving and sealing pad by the circular hold-down ring press seal that adopts the screw thread precession between this presser sensor chip and platform; At the transmitter housing that is positioned at above the circular hold-down ring, be provided with to become and send wiring board, described change to send the wiring board rivet clasp on circular hold-down ring, signal wire is drawn from the case top socket.
Architectural feature of the present invention also is to be arranged on described change and send the signal transmitting circuit on the wiring board to adopt the signal input part of two-wire system transducer functional module, module to be connected with presser sensor chip detection signal output terminal, with modular power source signal output part pin as transducer signal output terminal pin.
Thick-film resistor has the quick effect of power, because the distortion of elastic body potsherd, the thick film resistor network that seal is burnt on elastic body produces an electric signal that is directly proportional with pressure signal, this electric signal compensates, amplifies, changes, debugs the current output signal that becomes standard through signal conversion circuit again, becomes the purpose of sending thereby reach pressure signal.
Compared with the prior art, the present invention has following clear superiority.
1, the ceramic thick film resistor pressure sensitive chip is to adopt the thick film technology (TFT) in the hydrid integrated circuit to make among the present invention, and this technology is simple, and is easy to adjust, flexible design, and can automated production, and material selects freely, is easy to other electronic devices and components and mixes and integrate.When requiring price low, when performance height or production in enormous quantities, these characteristics are vital.Since ceramic thick film resistor be by serigraphy with the thick-film resistor paste sintering on ceramic flexible sheet, making resistance and elastic body is one, when diaphragm bears pressure, thick-film resistor and ceramic diaphragm strain are in full accord, so that transmitter has the good linearity, repeatability, hysteresis and high reliability.In addition, this diaphragm is high temperature resistant and the burn into long-term work does not have creep and plastic yield, so transmitter is worked in various working environments and wide temperature province reliably.
2, the presser sensor chip among the present invention is to adopt the mode of screw thread precession extruding to carry out press seal by circular hold-down ring, transmission circuit also is arranged in the transmitter cavity volume simultaneously, its one-piece construction is simple, compact, volume is little, satisfies sealing, anti-vibration and the good requirement of field-interchangeable fully.
3, the present invention is than prior art, and its performance, price ratio are greatly improved, and have extensive applicability.The signal system 4-20mA two-wire system transmission owing to adopt international standards helps on-the-spot the use with each and only shows system support.Its key technical indexes is as follows:
Each range of range: 0~25MPa
Precision: 0.1 grade 0.5 grade 1.0 grades
Power supply: U=12~36VDC load RL<(U-12V)/20mA (K Ω)
Output signal: 4-20mADC (two-wire system)
Working temperature :-20 ℃~+ 80 ℃;-40 ℃~+ 120 ℃
Allow overload: 150%200%
Fig. 1 is an one-piece construction synoptic diagram of the present invention.
Fig. 2 is a ceramic thick film resistor pressure sensitive chip structural representation of the present invention.
Fig. 3 is a transmission circuit principle schematic of the present invention.
By the following examples, in conjunction with the accompanying drawings the present invention is further described.
Embodiment:
Referring to Fig. 1, adopt tubular base 1.Base 1 lower end has the external thread interface, and this interface is in order to be connected with the measured medium pipeline thread.On its interface end face, offer inside and outside bipassage ring connected in star 11, so that form the double-layer seal of interface, thereby guarantee the reliability of sealing.Base 1 upper end is provided with inside and outside interface thread simultaneously.One platform 10 is arranged on base 1 madial wall, and the diameter of platform 10 is identical with the diameter of ceramic thick film resistor pressure sensitive chip 3, and platform 10 upper surfaces also offer ring seal groove 12.Ceramic thick film resistor pressure sensitive chip 3 by circular hold-down ring 4 press seals that adopt the screw thread precession on platform 10.Between circular hold-down ring 4 and ceramic thick film resistor pressure sensitive chip 3, and between ceramic thick film resistor pressure sensitive chip 3 and base platform 10, be lined with preserving and sealing pad 2 respectively.For the ease of the screw-in of circular hold-down ring 4, on the upper surface of circular hold-down ring 4, offer draw-in groove, instrument can insert draw-in groove and carry out fastening.
When being used for low pressure measurement, directly screwing in by circular hold-down ring 4 and to compress.But when being used for middle and high pressure and measuring, need between circular hold-down ring 4 and the base 1 to weld.Measure as middle and high pressure, preserving and sealing pad 2 places between sensitive chip 3 and platform 10 need add adhesion agent.In addition, at the transmitter housing 6 that is positioned at above the circular hold-down ring 4, be provided with to become and send wiring board 5, become and send wiring board 5 rivet clasps on circular hold-down ring 4, signal wire is drawn from case top socket 7.In addition the lead-out mode of signal wire also can directly draw by housing upper end and cap screw, also on the cap screw a circular fairlead is being arranged.Also the anti-explosion terminal box that can directly add in addition by the housing upper end is drawn.
In the present embodiment, housing 6 and base 1 all adopt the stainless steel starting material.
Referring to Fig. 2, the ceramic thick film resistor pressure sensitive chip adopts the thick film technology (TFT) in the hydrid integrated circuit to make, and sintering constitutes the thick film resistor network 9 that detects bridge in potsherd 8.Each thick-film resistor in the thick film resistor network 9 can be by symmetrical distribution as shown in Figure 1.
Referring to Fig. 3; in the present embodiment; be arranged on and become the signal transmitting circuit employing IC modules A D693 that send on the wiring board 5; modules A D693 is the two-wire system transducer functional module of the special exploitation of ADI; it is the loop signal regulator of a complete low-voltage/current transformation; it can receive the light current of presser sensor chip and press signal; with two-wire system way of output outputting standard electric current; the adjusting of its zero current and full scale electric current is independently to carry out; output area has 4-20mA; 0-10mA; three kinds of 12 ± 8mA are available, can oneself supply with the operating voltage of sensor, and load capacity is strong; operating voltage range is wide, and has the reversal of power defencive function.The application of present embodiment is that signal input part 17,18 pin with module I C are connected with presser sensor chip detection signal output terminal, and with modular power source signal output part pin 10,7 pin as transducer signal output terminal pin.
When the pressure P of measured medium (gas or liquid) enters transmitter by base lower end hickey, at first act on the ceramic thick film resistor pressure sensitive chip, to produce a distortion as elastomeric ceramic chip, along with this distortion, thick film resistor network will produce the electric signal that is directly proportional with pressure signal, this electric signal becomes the 4-20mA current output signal of standard by after the functional module IC.

Claims (3)

1, a kind of ceramic thick film resistor pressure transducer is characterized in that: adopt ceramic thick film resistor pressure sensitive chip (3), described ceramic thick film resistor pressure sensitive chip (3) is that sintering has the thick film resistor network (9) that constitutes the detection bridge in potsherd (8);
2, ceramic thick film resistor pressure transducer according to claim 1, it is characterized in that adopting tubular base (1), one platform (10) identical with ceramic thick film resistor pressure sensitive chip (3) diameter arranged on tubular base (1) madial wall, described ceramic thick film resistor pressure sensitive chip (3) on platform (10), is provided with annular preserving and sealing pad (2) by circular hold-down ring (4) press seal that adopts the screw thread precession between this presser sensor chip (3) and platform; At the transmitter housing (6) that is positioned at circular hold-down ring (4) top, be provided with to become and send wiring board (5), described change to send wiring board (5) rivet clasp on circular hold-down ring (4), signal wire is drawn from case top socket (7).
3, ceramic thick film resistor pressure transducer according to claim 1, it is characterized in that being arranged on described change send the signal transmitting circuit on the wiring board (5) to adopt two-wire system transducer functional module IC (AD693), the signal input part of described module I C (17,18 pin) is connected with presser sensor chip detection signal output terminal, and with modular power source signal output part pin (10,7 pin) as transducer signal output terminal pin.
CN 98111124 1998-01-19 1998-01-19 Ceramic thick film resistor pressure transducer Expired - Fee Related CN1108516C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 98111124 CN1108516C (en) 1998-01-19 1998-01-19 Ceramic thick film resistor pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 98111124 CN1108516C (en) 1998-01-19 1998-01-19 Ceramic thick film resistor pressure transducer

Publications (2)

Publication Number Publication Date
CN1224154A true CN1224154A (en) 1999-07-28
CN1108516C CN1108516C (en) 2003-05-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 98111124 Expired - Fee Related CN1108516C (en) 1998-01-19 1998-01-19 Ceramic thick film resistor pressure transducer

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100385220C (en) * 2002-12-18 2008-04-30 Dbt有限公司 Pressure sensor for measuring hydraulic pressure
CN103674407A (en) * 2012-09-17 2014-03-26 昆山尚达智机械有限公司 Novel pressure transmitter
CN103968975A (en) * 2014-05-07 2014-08-06 衢州学院 Corrosion resistant pressure sensor based on PDMS piezoresistor and stainless steel capacitor
CN105067162A (en) * 2015-07-20 2015-11-18 湖南菲尔斯特传感器有限公司 Ceramic pressure sensor and installing method thereof
CN106404271A (en) * 2015-08-10 2017-02-15 浙江三花制冷集团有限公司 Pressure sensor
CN106546373A (en) * 2015-09-18 2017-03-29 Smc株式会社 Pressure transducer and its manufacture method
CN110265543A (en) * 2019-06-17 2019-09-20 中北大学 Differential capacitance type ceramic high-temperature resistant chip varistor and its high-temp pressure sensor
CN110333028A (en) * 2019-08-06 2019-10-15 中北大学 Pressure parameter real time on-line monitoring system under a kind of particular surroundings
CN112326105A (en) * 2020-11-23 2021-02-05 南京沃天科技股份有限公司 Special pressure transmitter for compressor air

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100385220C (en) * 2002-12-18 2008-04-30 Dbt有限公司 Pressure sensor for measuring hydraulic pressure
CN103674407A (en) * 2012-09-17 2014-03-26 昆山尚达智机械有限公司 Novel pressure transmitter
CN103968975A (en) * 2014-05-07 2014-08-06 衢州学院 Corrosion resistant pressure sensor based on PDMS piezoresistor and stainless steel capacitor
CN103968975B (en) * 2014-05-07 2016-03-02 衢州学院 Based on the anti-corrosion pressure transducer of PDMS pressure drag and stainless steel electric capacity
CN105067162A (en) * 2015-07-20 2015-11-18 湖南菲尔斯特传感器有限公司 Ceramic pressure sensor and installing method thereof
CN106404271A (en) * 2015-08-10 2017-02-15 浙江三花制冷集团有限公司 Pressure sensor
CN106546373A (en) * 2015-09-18 2017-03-29 Smc株式会社 Pressure transducer and its manufacture method
CN110265543A (en) * 2019-06-17 2019-09-20 中北大学 Differential capacitance type ceramic high-temperature resistant chip varistor and its high-temp pressure sensor
CN110333028A (en) * 2019-08-06 2019-10-15 中北大学 Pressure parameter real time on-line monitoring system under a kind of particular surroundings
CN110333028B (en) * 2019-08-06 2021-03-16 中北大学 Pressure parameter real-time online monitoring system under special environment
CN112326105A (en) * 2020-11-23 2021-02-05 南京沃天科技股份有限公司 Special pressure transmitter for compressor air

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SE01 Entry into force of request for substantive examination
AR01 Abandonment of patent right to avoid double patenting

According to article 9 of the patent law and article 13 of the detailed rules for the implementation of the patent law: 98111124.6 of the invention patents in the current issue of authorization announcement, and at the same time corresponding to the 97213985 utility model patent to be given up, and in the 19 volume of the 20 issue of the new type of communique on the patent right to abandon the announcement.

C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee