CN1108400C - Method for removing heavy metal impurity from monocrystal silicon - Google Patents
Method for removing heavy metal impurity from monocrystal silicon Download PDFInfo
- Publication number
- CN1108400C CN1108400C CN 99117832 CN99117832A CN1108400C CN 1108400 C CN1108400 C CN 1108400C CN 99117832 CN99117832 CN 99117832 CN 99117832 A CN99117832 A CN 99117832A CN 1108400 C CN1108400 C CN 1108400C
- Authority
- CN
- China
- Prior art keywords
- crystal
- silicon single
- metal melt
- metal
- heavy metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- 239000010703 silicon Substances 0.000 title claims abstract description 45
- 239000012535 impurity Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910001385 heavy metal Inorganic materials 0.000 title claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 17
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims description 28
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 238000005247 gettering Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Abstract
The present invention discloses a method for removing heavy metal impurities from a silicon monocrystal. On the basis of the characteristic that the dissolubility of harmful heavy metal of iron, copper, gold, etc. in metal melt is far larger than the dissolubility in the silicon monocrystal, the silicon monocrystal is immersed in one of or the combined metal melt of tin, gallium, aluminium, indium or lead with high pure which do not affect the service life of a silicon monocrystal current carrier to make the harmful heavy metal impurities in the silicon monocrystal diffuse to the metal melt so as to realize the purpose of thoroughly removing the heavy metal impurities from the silicon monocrystal. The method has the advantages of simple device and convenient operation.
Description
The present invention relates to remove the method for beavy metal impurity in the silicon single-crystal semiconductor material.
At present the method that beavy metal impurities such as the iron that influences silicon single-crystal carrier lifetime, copper, gold are driven away from silicon single-crystal mainly contain intrinsic gettering and outside two kinds of getterings, intrinsic gettering is to utilize the defective of oxygen precipitation and generation thereof to absorb metallic impurity, thereby forms the clean area that a beavy metal impurity atomic percent has descended greatly at silicon chip surface.Outer gettering has back side phosphorous diffusion, the back side to sandblast, backside laser is damaged, back side ion implantation damage, back side silicon-nitrogen compound deposition, back side polysilicon deposition etc.These two kinds of methods all are that the defective of utilizing the silicon chip inside or the silicon chip back side to form is absorbed the metallic impurity of silicon chip surface workspace (making the zone of device), but the metallic impurity of being absorbed are still stayed in the silicon chip.Therefore the impurity of being absorbed might (as pyroprocessing) reenter in the workspace of device by diffusion in later process.
In view of above-mentioned, the purpose of this invention is to provide a kind of easy, reliable, the method that can thoroughly remove beavy metal impurity in the silicon single-crystal.
Technical solution of the present invention is: silicon single-crystal is immersed fusing silicon single-crystal carrier lifetime is not had in the high purity tin of influence or gallium or aluminium or indium or plumbous or their metal melt of combination, utilize in the silicon single-crystal solubleness of harmful heavy metal in metal melt much larger than the characteristics of solubleness in silicon single-crystal, make harmful heavy metal diffusion of contaminants in the silicon single-crystal in metal melt, and realize thoroughly removing the purpose of beavy metal impurity.
Concrete operations comprise the steps:
1) place crucible to be fused into metal melt highly purified tin or gallium or aluminium or indium or lead metal or their combination.
2) silicon single-crystal is preheated to the temperature close with metal melt, immerses then in the metal melt, the harmful heavy metal impurity of silicon single-crystal will be by diffusing into metal melt.
3) decon finishes, and takes out silicon single-crystal from metal melt.
Usually, in metal melt, dissolve, can take before silicon single-crystal is immersed metal melt, in metal melt, add earlier silicon, with the saturated metal melt of silicon in order to prevent silicon single-crystal.
Below in conjunction with accompanying drawing, be that example is described in detail the present invention with tin.
The fusing point of tin is 292 ℃, and boiling point is 2270 ℃, so the tin existence that is in a liquid state between 292 ℃～2270 ℃.At first high-purity tin is placed crucible 1 to be fused into tin 2, use the saturated molten tin of silicon then, immerse in the molten tin after again silicon single-crystal 3 being preheating to the temperature close with molten tin, and keep molten tin it not to be solidified at a certain proper temperature, at this moment, harmful heavy metal impurity in the silicon single-crystal will arrive the silicon single-crystal surface by diffusion, enter into molten tin at last.The gettering required time is determined according to the size of foreign matter content and silicon single-crystal, after the harmful heavy metal impurity in the silicon single-crystal is absorbed by molten tin, takes out silicon single-crystal from molten tin, and removes the tin of remained on surface.
Usually, for avoiding staiing, body of heater can be vacuumized and feeds gases such as hydrogen or nitrogen.
Because method of the present invention is that the harmful heavy metal impurity that will clear out in the silicon single-crystal is dissolved in metal melt, and no longer remain on the silicon single-crystal, so can avoid removed impurity in later process, to come back to workspace, this method is easy to be more reliable than traditional impurity absorption method, and it is more thorough to remove impurity.
Claims (2)
1. the method for beavy metal impurity in the removal silicon single-crystal is characterized in that comprising following operation steps:
1) place crucible to be fused into metal melt highly purified tin or gallium or aluminium or indium or lead metal or their combination;
2) silicon single-crystal is preheated to the temperature close with metal melt, immerses then in the metal melt, the harmful heavy metal impurity of silicon Dan Pin will be by diffusing into metal melt;
3) decon finishes, and takes out silicon single-crystal from metal melt.
2. by the method for beavy metal impurity in the described removal silicon single-crystal of claim 1, it is characterized in that before silicon single-crystal is immersed metal melt, earlier with the saturated metal melt of silicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99117832 CN1108400C (en) | 1999-08-23 | 1999-08-23 | Method for removing heavy metal impurity from monocrystal silicon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99117832 CN1108400C (en) | 1999-08-23 | 1999-08-23 | Method for removing heavy metal impurity from monocrystal silicon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1285422A CN1285422A (en) | 2001-02-28 |
| CN1108400C true CN1108400C (en) | 2003-05-14 |
Family
ID=5280289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99117832 Expired - Fee Related CN1108400C (en) | 1999-08-23 | 1999-08-23 | Method for removing heavy metal impurity from monocrystal silicon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1108400C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101759188B (en) * | 2010-01-19 | 2012-01-25 | 浙江大学 | Method for purifying metallic silicon by using aluminum melt |
| CN108796606B (en) * | 2018-07-07 | 2020-11-03 | 玉环市几偶孵化器有限公司 | Solar-grade polycrystalline silicon preparation device |
-
1999
- 1999-08-23 CN CN 99117832 patent/CN1108400C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1285422A (en) | 2001-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2751228C (en) | Method for producing thin silicon rods | |
| CN102168314B (en) | Internal gettering process of Czochralski silicon wafer | |
| CN113793801B (en) | Method for cleaning indium phosphide substrate wafer | |
| CN102229430B (en) | Technical method for preparing solar energy polycrystalline silicon by using metallurgical method | |
| JP5491783B2 (en) | Crystalline silicon substrate purification method and solar cell manufacturing process | |
| US5544616A (en) | Crystallization from high temperature solutions of Si in Cu/Al solvent | |
| CN1108400C (en) | Method for removing heavy metal impurity from monocrystal silicon | |
| CN102515555B (en) | Quartz crucible surface processing method | |
| CN101628718A (en) | Method for removing impurity of phosphorus from metallurgical grade silicon | |
| US20090074650A1 (en) | Method for the production of silicon suitable for solar purposes | |
| JPH10182134A (en) | Refining of silicon | |
| CN101775650A (en) | Preparation method of solar polycrystalline silicon cast ingot and device thereof | |
| JP2905353B2 (en) | Purification method of metallic silicon | |
| JP2007161505A (en) | Method for regenerating semiconductor silicon material | |
| JP3061057B1 (en) | Quartz crucible regeneration method | |
| CN103922344A (en) | Method for recovering and preparing solar-grade silicon material | |
| US6059887A (en) | Process for cleaning the interior of semiconductor substrate | |
| Syvertsen et al. | Recycling of broken Si based structures and solar cells | |
| JP2911023B2 (en) | Quartz glass jig for heat treatment of silicon wafer and method of using the same | |
| CN102427020A (en) | Wafer cleaning method capable of effectively reducing water mark defect | |
| JP3157201B2 (en) | Method for manufacturing semiconductor device | |
| JPH10182132A (en) | Refining of silicon and refining apparatus therefor | |
| CN108658080A (en) | The method of oxidation processes purifying metal silicon | |
| CN102142359B (en) | Silicon wafer external gettering method | |
| CN108128778B (en) | Method for removing boron in silicon by steam-assisted electron beam melting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |