CN110838559A - Display device, display panel and manufacturing method thereof - Google Patents
Display device, display panel and manufacturing method thereof Download PDFInfo
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- CN110838559A CN110838559A CN201911175501.2A CN201911175501A CN110838559A CN 110838559 A CN110838559 A CN 110838559A CN 201911175501 A CN201911175501 A CN 201911175501A CN 110838559 A CN110838559 A CN 110838559A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
Abstract
The present disclosure relates to the field of display technologies, and relates to a display panel, a method for manufacturing the display panel, and a display device, wherein the display panel includes: the display device comprises a substrate, a driving layer, a display layer, an encapsulation layer and a reflection layer, wherein the driving layer is arranged on one side of the substrate; the display layer is arranged on one side, far away from the substrate, of the driving layer and comprises a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel; the packaging layer is arranged on one side of the display layer far away from the substrate; the reflection layer is arranged on one side, far away from the substrate, of the packaging layer and made of metal materials, a plurality of electrode blocks are formed on the reflection layer, gaps are formed between the adjacent electrode blocks, each electrode block comprises a plurality of through holes, and the pixel unit area corresponding to each electrode block is exposed out of the through holes. According to the display panel, the self-contained touch electrode plate can be formed through the reflecting layer, and an external touch screen is not needed.
Description
Technical Field
The disclosure relates to the technical field of display, and particularly to a display panel, a manufacturing method of the display panel and a display device.
Background
With the development of Thin Film Transistor Liquid Crystal displays (TFT-LCDs), Liquid Crystal displays have been widely used in various fields.
Mirror display is a novel display technology which appears only in recent years, and the structure of a mirror display panel is that a semi-reflecting film is arranged on an existing liquid crystal display panel, and the semi-reflecting film can enable a user to see pictures such as weather conditions or real-time news of the day from a mirror surface while using a mirror. The mirror display technology is a new application, and is more and more concerned about the daily life of people because the mirror display technology can better approach the daily life of people, and the market prospect is expected to be bright.
However, the transflective film is disposed on the liquid crystal display panel, so that the transmittance of the display area is reduced and the display area is affected by external reflected light, resulting in a low contrast ratio displayed on the mirror display screen; in addition, when a touch function is required, an external touch screen is required, but the external touch screen affects the emergent light and the reflected light of the liquid crystal display panel, and the display performance of the liquid crystal display panel is reduced.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The present disclosure provides a display panel, a method for manufacturing the display panel, and a display device, which directly display a pixel display region, and totally reflect the non-display region, and have the advantages of excellent black level, contrast, color gamut, viewing angle, and flexibility.
According to an aspect of the present disclosure, there is provided a display panel including:
a substrate;
the driving layer is arranged on one side of the substrate;
the display layer is arranged on one side, far away from the substrate, of the driving layer and comprises a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel;
the packaging layer is arranged on one side, far away from the substrate, of the display layer;
the reflecting layer is arranged on one side, far away from the substrate, of the packaging layer and made of metal materials, a plurality of electrode blocks are formed on the reflecting layer, gaps are formed between the adjacent electrode blocks, each electrode block comprises a plurality of through holes, and the pixel unit area corresponding to each electrode block is exposed out of the through holes.
In an exemplary embodiment of the present disclosure, an orthographic projection of the gap on the display layer is located in a region of the display layer other than the pixel unit region.
In an exemplary embodiment of the present disclosure, the reflective layer further includes a plurality of conductive lines, each of the conductive lines is connected to each of the electrode blocks in a one-to-one correspondence, and the conductive lines are located in the gaps.
In an exemplary embodiment of the present disclosure, an orthogonal projection of the conductive line on the display layer is located on an area outside the pixel unit area.
In an exemplary embodiment of the present disclosure, each of the pixel unit regions has one of the sub-pixels.
In an exemplary embodiment of the present disclosure, an area of an orthogonal projection of any one of the through holes on the substrate is 50% to 150% of an area of an orthogonal projection of the corresponding pixel unit region on the substrate.
According to another aspect of the present disclosure, there is also provided a manufacturing method of a display panel, the manufacturing method including:
providing a substrate;
forming a driving layer on one side of the substrate;
forming a display layer on one side of the driving layer, which is far away from the substrate, wherein the display layer is formed with a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel;
forming an encapsulation layer on one side of the display layer far away from the substrate;
and forming a reflecting layer made of a metal material on one side of the packaging layer, which is far away from the substrate, wherein the reflecting layer comprises a plurality of electrode blocks, a gap is formed between every two adjacent electrode blocks, the electrode blocks comprise a plurality of through holes, and the pixel unit areas corresponding to the electrode blocks are exposed from the through holes.
In an exemplary embodiment of the present disclosure, forming a reflective layer of a metal material on a side of the encapsulation layer away from the substrate includes:
forming a metal material layer on one side of the display layer far away from the substrate;
forming a plurality of electrode blocks on the metal material layer by etching, wherein gaps are formed between every two adjacent electrode blocks;
and forming a plurality of through holes on each electrode block by etching, so that the orthographic projection area of any through hole on the substrate is 50-150% of the orthographic projection area of the corresponding pixel unit area on the substrate.
In an exemplary embodiment of the present disclosure, forming a reflective layer of a metal material on a side of the encapsulation layer away from the substrate further includes:
and forming a plurality of leads on the metal material layer by etching, wherein the leads are correspondingly connected with the electrode blocks one by one, and the leads are positioned in the gaps.
According to still another aspect of the present disclosure, there is also provided a display device including the display panel described above.
The display panel provided by the disclosure adopts a reflecting layer graphical mirror display scheme, the area of each pixel unit area is directly displayed through a through hole, and the non-display area outside the pixel unit area is displayed in a total reflection manner through the reflecting layer; the reflecting layer is directly integrated on the packaging layer of an OLED (Organic Light Emitting Diode) display screen, so that the mirror display effect can be effectively improved; compared with the common mirror LCD technology, the OLED mirror display panel structure and the integration method have the advantages of excellent black level, contrast, color gamut, visual angle, flexibility and the like. In addition, when the display panel needs a touch function, the self-contained touch electrode plate can be formed through the reflecting layer, an external touch screen is not needed, emergent light and reflected light of the display panel caused by the external touch screen are avoided, the display performance of the display panel is reduced, and therefore the display performance of the display panel is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1 is a cross-sectional view of a display panel provided in an embodiment of the present disclosure;
FIG. 2 is a schematic view of a reflective layer provided in an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the disclosure.
Description of reference numerals:
110. a first protective layer 120, a first adhesive layer 130, a substrate 140, a buffer layer;
211. an active layer 212, a source electrode 213, a drain electrode 220, a first gate insulating layer 221, a first gate electrode 222, a second gate electrode 230, a second gate insulating layer 240, an interlayer dielectric layer 250, a planarization layer 261, a first electrode layer 262, a second electrode layer 270, a pixel defining layer 280, and a light emitting layer;
310. a first encapsulation layer, 320, a second encapsulation layer, 330, a third encapsulation layer;
400. the reflection layer 410, the electrode block 411, the through hole 420, the lead wire 430 and the self-contained driving end;
510. a second adhesive layer 520, and a second protective layer.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not limiting on the number of their objects.
The disclosed embodiments provide a display panel, as shown in fig. 1, including: the display device comprises a substrate 130, a driving layer, a display layer, an encapsulation layer and a reflection layer 400, wherein the driving layer is arranged on one side of the substrate 130; the display layer is arranged on one side of the driving layer far away from the substrate 130, the display layer comprises a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel; the encapsulation layer is arranged on one side of the display layer far away from the substrate 130; the reflective layer 400 is disposed on a side of the package layer away from the substrate 130, and a plurality of through holes 411 exposing each pixel unit area are formed on the reflective layer 400, and each pixel unit area corresponds to one through hole 411. The area of the orthographic projection of any through hole 411 on the substrate 130 is 50% -150% of the area of the orthographic projection of the corresponding pixel unit region on the substrate 130.
Further, as shown in fig. 2, the reflective layer 400 is made of a metal material, the reflective layer 400 is formed with a plurality of electrode blocks 410, a gap is formed between adjacent electrode blocks 410, each electrode block 410 includes a plurality of through holes 411, and pixel unit regions corresponding to each electrode block 410 are exposed from the through holes 411. The reflective layer 400 is formed by a metal material, on one hand, the reflective layer 400 made of the metal material has a good reflectivity, on the other hand, the reflective layer 400 can form the electrode blocks 410 through a patterning process, and the electrode blocks 410 arranged at intervals can form self-capacitance touch electrodes.
The display panel provided by the disclosure adopts a reflecting layer graphical mirror display scheme, the area of each pixel unit area is directly displayed through a through hole, and the non-display area outside the pixel unit area is displayed in a total reflection manner through the reflecting layer; the reflecting layer is directly integrated on the packaging layer of an OLED (organic light Emitting Diode) display screen, so that the mirror display effect can be effectively improved; compared with the common mirror LCD technology, the OLED mirror display panel structure and the integration method have the advantages of excellent black level, contrast, color gamut, visual angle, flexibility and the like. In addition, when the display panel needs a touch function, the self-contained touch electrode plate can be formed through the reflecting layer, an external touch screen is not needed, emergent light and reflected light of the display panel caused by the external touch screen are avoided, the display performance of the display panel is reduced, and therefore the display performance of the display panel is improved.
The metal material may include metal, conductive oxide, or a combination thereof, for example, the metal material may be titanium, aluminum, copper, gold, nickel, or a combination thereof, and the metal or alloy formed by titanium, aluminum, copper, gold, and nickel has a high reflection characteristic, so that light can be reflected more when being irradiated onto the reflective layer 400, and finally emitted from the light-emitting direction required by the light-emitting element, thereby further improving the display performance of the display panel. Of course, the metal material may also be selected from other materials, such as aluminum, and when the display panel is a flexible display panel, the metal material with better bending performance may be selected, which is not limited in this disclosure. The orthographic projection of each electrode block 410 on the display layer covers at least one image cell area. The electrode blocks 410 with a larger number are arranged in a unit area to increase the number of self-contained touch electrodes, thereby improving the touch sensitivity of the display panel.
In addition, since the reflective layer 400 is disposed on the encapsulation layer to form a touch layer, and the electrode blocks 410 formed by the reflective layer 400 have certain flexibility, the OLED mirror display panel can be a flexible display panel.
In order to more clearly understand the technical solution of the present invention, the touch principle of the electrode block 410 as a self-contained touch electrode is briefly described: the self-capacitance driving terminal 430 supplies an electric signal to the electrode block 410 through the wire 420, and then the induced electric signal returns to the self-capacitance driving terminal 430 through the wire 420. After the finger touches the display panel, the sensing electric signal of the electrode block 410 at the position where the finger touches the display panel changes due to the coupling capacitance formed between the finger and the touch electrode, so that the touch position of the finger is detected. It should be noted that the induced electrical signal may be a voltage, a current, or an electric charge, and the induced electrical signal is not particularly limited in this embodiment.
Specifically, the orthographic projection of the region on the display layer other than the electrode blocks 410 on the reflective layer 400 is located in the region on the display layer other than the pixel unit region, i.e., the orthographic projection of the gaps between the electrode blocks 410 on the display layer is located in the region on the display layer other than the pixel unit region. This electrode block 410 through reflective layer 400 formation can not lead to the fact the pixel unit district of display layer to shelter from, can respectively make direct demonstration from reflective layer 400 of pixel unit, and the region outside the pixel unit district shelters from through touch electrode formation on the display layer to reflect external light, guaranteed that display device possesses good black level, contrast, colour gamut, but visual angle.
Specifically, as shown in fig. 2, the reflective layer 400 further includes a plurality of wires 420, each wire 420 is connected to each electrode block 410 in a one-to-one correspondence manner, and the wires 420 are located in the gaps, that is, the wires 420 of the electrode blocks 410 are located in the region outside the electrode blocks 410 on the reflective layer 400, each electrode block 410 and the wires 420 thereof are disposed in the same layer, the wires 420 of each electrode block 411 in the same column can be arranged in the same column gap, and each wire 420 is led out from the same side of the reflective layer 400 to be connected to the same self-contained driving end 430. Of course, the conduction of the touch electrodes of each column may also be located in different column gaps, which is not limited in the present disclosure.
Further, the orthographic projection of the conductive line 420 on the display layer is located on an area outside the pixel unit area. The orthographic projection of the conducting wire 420 arranged on the display layer is located in the region outside the pixel unit area, the shielding of the electrode block 410 and the conducting wire 420 on the pixel unit area can be avoided simultaneously, the pixel unit can be directly displayed through the reflecting layer, and the display performance of the display device is improved.
Specifically, each pixel unit area has one sub-pixel, that is, one sub-pixel is a pixel unit area, and the reflective layer 400 is provided with through holes 411 corresponding to the positions and the number of the sub-pixels, so that each sub-pixel can be directly displayed through the through holes 411, and the areas other than each sub-pixel on the display layer are shielded and reflected, thereby further improving the display performance of the display device. Of course, each pixel unit region may include two, three, six or more sub-pixels, and the number of each pixel unit may be the same or different; for example, the pixel unit region includes three sub-pixels, and the three sub-pixels can emit red light, blue light, and green light, respectively.
The following are embodiments of the disclosed method that may be used to implement embodiments of the disclosed apparatus. For details not disclosed in the embodiments of the disclosed method, refer to the embodiments of the disclosed apparatus.
An embodiment of the present disclosure also provides a method for manufacturing a display panel, as shown in fig. 3, including:
step S100, providing a substrate;
step S200, forming a driving layer on one side of a substrate;
step S300, forming a display layer on one side of the driving layer, which is far away from the substrate, wherein the display layer is provided with a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel;
step S400, forming an encapsulation layer on one side of the display layer far away from the substrate;
step S500, forming a reflective layer made of a metal material on a side of the encapsulation layer away from the substrate, where the reflective layer includes a plurality of electrode blocks, a gap is formed between adjacent electrode blocks, the electrode blocks include a plurality of through holes, and pixel unit regions corresponding to the electrode blocks are exposed from the through holes.
The manufacturing method of the display panel provided by the disclosure adopts a reflection layer graphical mirror display scheme, the area of each pixel unit area is directly displayed through a through hole, and the non-display area outside the pixel unit area is displayed in a total reflection way through the reflection layer; the reflecting layer is directly integrated on the packaging layer of the OLED display screen, so that the mirror display effect can be effectively improved; compared with the common mirror LCD technology, the OLED mirror display panel structure and the integration method have the advantages of excellent black level, contrast, color gamut, visual angle, flexibility and the like. In addition, when the display panel needs a touch function, the self-contained touch electrode plate can be formed through the reflecting layer, an external touch screen is not needed, emergent light and reflected light of the display panel caused by the external touch screen are avoided, the display performance of the display panel is reduced, and therefore the display performance of the display panel is improved.
Next, each step of the manufacturing method of the display panel in the present exemplary embodiment will be further described.
In step S100, a substrate is provided.
Specifically, as shown in fig. 1, the substrate 130 may be formed by deposition or the like, and the material of the substrate 130 may be an inorganic material or an organic material, for example, the inorganic material may be a glass material such as soda-lime glass, quartz glass, sapphire glass, or a metal material of various metals such as stainless steel, aluminum, nickel, or an alloy thereof; the organic material may be polymethylmethacrylate, polyvinyl alcohol, polyvinyl phenol, polyethersulfone, polyimide, polyamide, or a combination thereof. The substrate 130 may be a flexible substrate.
In addition, when the substrate 130 is formed, the first protection layer 110 may be formed by Chemical Vapor Deposition (CVD), and the material of the first protection layer 110 may be SiO2, Si3N4, SiON, or polysilicon; next, a first Adhesive layer 120 is formed on one side of the first protection layer 110, the first protection layer 110 is adhered to the substrate 130 through the first Adhesive layer 120, and the material of the first Adhesive layer 120 may be PSA (Pressure Sensitive Adhesive).
In step S200, a driving layer is formed on one side of a substrate.
Specifically, as shown in fig. 1, the buffer layer 140 may be formed on the side of the substrate 130 away from the first protection layer 110 by deposition, spraying, or the like, and the material of the buffer layer 140 may be silicon oxide, silicon oxynitride, silicon nitride, or a combination of the above materials; a driving layer including a plurality of thin film transistors is then formed on the buffer layer 140. Of course, the driving layer may be directly formed on the substrate 130.
As shown in fig. 1, the driving layer specifically includes an active layer 211 formed on the buffer layer 140 on a side away from the substrate 130 by a physical vapor deposition method, a chemical vapor deposition method, a spin coating method, or a combination thereof, the active layer 211 partially covers the buffer layer 140, and the active layer 211 may be amorphous silicon, polycrystalline silicon, microcrystalline silicon, monocrystalline silicon, an oxide semiconductor material, an organic silicon material, an organic oxide semiconductor material, or a combination thereof; forming a first gate insulating layer 220 covering the buffer layer 140 and the active layer 211 on a side of the buffer layer 140 away from the substrate 130 by pvd, cvd, spin-coating, or a combination thereof, forming a first gate layer 221 on a side of the first gate insulating layer 220 away from the substrate 130 by deposition, the first gate layer 221 may include a plurality of first electrodes disposed at intervals, the first gate insulating layer 220 may be made of silicon oxide, silicon oxynitride, silicon nitride, or other suitable insulating materials or a combination thereof, the first gate layer 221 may be made of metal, conductive metal oxide, conductive polymer, conductive composite material, or a combination thereof, for example, the metal may be platinum, gold, silver, aluminum, chromium, barium, sodium, palladium, iron, manganese, or a combination thereof, and the conductive metal oxide may be InO2、SnO2Indium Tin Oxide (ITO), or combinations thereof; forming a second gate insulating layer 230 covering the first gate insulating layer 220 and the first gate layer 221 on the first gate insulating layer 220 away from the substrate 130 by deposition or the like, forming a second gate layer 222 on the second gate insulating layer 230, wherein the second gate layer 222 partially covers the second gate insulating layer 230, an orthographic projection on the substrate 130 is staggered from an orthographic projection of the active layer 211 on the substrate 130, and the second gate insulating layer 230 may be silicon oxide, silicon oxynitride, silicon nitride or other suitable insulating substances or a combination thereof; then, an interlayer dielectric layer 240 is formed on the side of the second gate insulating layer 230 away from the substrate 130 by deposition and other processes, and the material of the interlayer dielectric layer 240 is silicon oxide, silicon nitride or other suitable insulating substances; forming source and drain via holes on the interlayer dielectric layer 240, the second gate insulating layer 230, and the first gate insulating layer 220 by exposure, etching, and the like, wherein the source via hole and the drain via hole are respectively located at two sides of the first gate in the first gate layer 221 and are communicated with the active layer 211; then, the source electrode 212 and the drain electrode 213 are formed in the source via hole and the drain via hole by deposition, etc. to form a thin film transistor, the material of the source electrode 212 and the drain electrode 213 may include metal, conductive oxide, or a combination thereof, for example, the metal may be titanium, platinum, gold, silver, molybdenum, aluminum, tungsten, copper, or an alloy thereof, or a combination thereof, and the conductive oxide may be IZO, AZO, ITO, GZO, ZTO, or a combination thereof.
In step S300, a display layer is formed on a side of the driving layer away from the substrate, and the display layer is formed with a plurality of pixel unit regions, each of which includes at least one sub-pixel.
Specifically, as shown in fig. 1, a flat layer 250 is formed on a side of the interlayer dielectric layer 240 away from the substrate 130 by a deposition process or the like, and the flat layer 250 may be made of any one of butadiene rubber, polyurethane, polyvinyl chloride, polyamide, polycarbonate, polyimide, polyether alum resin, and epoxy resin; forming via holes exposing the drain electrodes 213 on the planarization layer 250 by etching or the like, and forming a first electrode layer 261 on one side of the planarization layer 250 away from the substrate 130 by deposition or the like, where the first electrode layer 261 includes a plurality of first electrodes, each first electrode is connected with each drain electrode 213 through a via hole in a one-to-one correspondence manner, and the material of the first electrode layer 261 may be metal, conductive oxide, or a combination thereof; forming a pixel defining layer 270 on one side of the planarization layer 250 away from the substrate 130 by deposition and the like, forming a plurality of through holes 411 on the pixel defining layer 270 by etching and the like, wherein each through hole 411 exposes each first electrode layer 261; then, a light emitting layer 280 is formed on the pixel defining layer 270, wherein the light emitting layer 280 may include a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer, and an electron injection layer; a second electrode layer 262 is formed on the side of the light emitting layer 280 away from the substrate 130 by deposition or the like, where the second electrode layer 262 is a common electrode layer, the first electrode layer 261 can be an anode layer, and the second electrode layer 262 can be a transparent common cathode layer.
Specifically, each pixel unit area has one sub-pixel, that is, one sub-pixel is a pixel unit area, and the reflective layer 400 is provided with through holes 411 corresponding to the positions and the number of the sub-pixels, so that each sub-pixel can be directly displayed through the through holes 411, and the areas other than each sub-pixel on the display layer are shielded and reflected, thereby further improving the display performance of the display device. Of course, each pixel unit region may include two, three, six or more sub-pixels, and the number of each pixel unit may be the same or different; for example, the pixel unit region includes three sub-pixels, and the three sub-pixels can emit red light, blue light, and green light, respectively.
In step S400, an encapsulation layer is formed on a side of the display layer away from the substrate.
Specifically, as shown in fig. 1, a first encapsulation layer 310, a second encapsulation layer 320, and a third encapsulation layer 330 are sequentially formed on a side of the second electrode layer 262 away from the substrate 130 by deposition or the like, the first encapsulation layer 310 may be silicon oxynitride, the second encapsulation layer 320 may be IJP (inkjet Printing) layer, and the third encapsulation layer 330 may be SiNXThe number of the specific layers of the packaging layer is not limited by the present disclosure, and those skilled in the art can design the packaging layer according to specific situations, and all the changes on the packaging layer belong to the protection scope of the present disclosure.
In step S500, a reflective layer made of a metal material is formed on a side of the encapsulation layer away from the substrate, the reflective layer includes a plurality of electrode blocks, a gap is formed between adjacent electrode blocks, the electrode blocks include a plurality of through holes, and pixel unit regions corresponding to the electrode blocks are exposed from the through holes.
Specifically, as shown in fig. 1, a metal material layer is formed on a side of the encapsulation layer away from the substrate 130 by using a metal material, then a patterning process is performed on the metal material layer to form the reflection layer 400, a plurality of electrode blocks 410 are formed on the metal material layer by etching, a gap is formed between adjacent electrode blocks 410, a plurality of through holes are formed on each electrode block 410 by etching, and an area of an orthogonal projection of any through hole 411 on the substrate 130 is 50% to 150% of an area of an orthogonal projection of a corresponding pixel unit region on the substrate 130, so that the pixel unit region corresponding to the electrode block 410 is exposed from the through hole 411. The metal material may include metal, conductive oxide, or a combination thereof, for example, the metal material may be titanium, aluminum, copper, gold, nickel, or a combination thereof, and the metal or alloy formed by titanium, aluminum, copper, gold, and nickel has a high reflection characteristic, so that light can be reflected more when being irradiated onto the reflective layer 400, and finally emitted from the light-emitting direction required by the light-emitting element, thereby further improving the display performance of the display panel.
Further, as shown in fig. 2, a plurality of wires 420 are formed on the metal material layer by etching, each wire 420 is connected to each electrode block 410 in a one-to-one correspondence manner, and the wires 420 are located in the gaps, that is, the wires 420 of the electrode blocks 410 are located in the region outside the electrode blocks 410 on the reflective layer 400, each electrode block 410 and the wires 420 thereof are disposed in the same layer, and the wires 420 of the electrode blocks 411 in the same column can be arranged in the same column gap. Of course, the conduction of the touch electrodes of each column may also be located in different column gaps, which is not limited in the present disclosure. The material of each wire 420 may be the same as or different from the material of each electrode layer.
In addition, the orthographic projection of the conductive line 420 on the display layer is located on an area outside the pixel unit area. The orthographic projection of the conducting wire 420 arranged on the display layer is located in the region outside the pixel unit area, the shielding of the electrode block 410 and the conducting wire 420 on the pixel unit area can be avoided simultaneously, the pixel unit can be directly displayed through the reflecting layer, and the display performance of the display device is improved. Of course, the orthographic projection of the conductive line 420 on the display layer may also be located on the pixel unit area.
In addition, the orthographic projection of each electrode block 410 on the display layer covers at least one pixel unit area. The touch sensitivity of the display panel can be improved by providing a large number of electrode blocks 410 in a unit area.
In addition, as shown in fig. 1, the manufacturing method further includes forming a second adhesive layer 510 and a second protective layer 520 in sequence on the side of the reflective layer 400 away from the substrate 130. For example, the second protective layer 520 may be a protective film (cover film), the second protective layer 520 is adhered to the reflective layer 400 by a second adhesive layer 510, and the second adhesive layer 510 may be an OCA (Optical clear adhesive tape).
It should be noted that although the various steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that these steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.
Embodiments of the present disclosure also provide a display device including the display panel of the above embodiment. The display device can be a mobile phone, a tablet computer, a television or other terminal equipment with a display panel, and the beneficial effects of the display device can be referred to the beneficial effects of the display panel, which are not described in detail herein.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A display panel, comprising:
a substrate;
the driving layer is arranged on one side of the substrate;
the display layer is arranged on one side, far away from the substrate, of the driving layer and comprises a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel;
the packaging layer is arranged on one side, far away from the substrate, of the display layer;
the reflecting layer is arranged on one side, far away from the substrate, of the packaging layer and made of metal materials, a plurality of electrode blocks are formed on the reflecting layer, gaps are formed between the adjacent electrode blocks, each electrode block comprises a plurality of through holes, and the pixel unit area corresponding to each electrode block is exposed out of the through holes.
2. The display panel according to claim 1, wherein an orthographic projection of the gap on the display layer is located in a region of the display layer other than the pixel unit region.
3. The display panel according to claim 1, wherein the reflective layer further comprises a plurality of conductive lines, each of the conductive lines is connected to each of the electrode blocks in a one-to-one correspondence, and the conductive lines are located in the gaps.
4. The display panel according to claim 3, wherein an orthographic projection of the conductive line on the display layer is located on a region outside the pixel unit region.
5. The display panel according to claim 1, wherein each of the pixel unit regions has one of the sub-pixels.
6. The display panel according to claim 1, wherein an area of an orthogonal projection of any one of the through holes on the substrate is 50% to 150% of an area of an orthogonal projection of the corresponding pixel unit region on the substrate.
7. A method of manufacturing a display panel, comprising:
providing a substrate;
forming a driving layer on one side of the substrate;
forming a display layer on one side of the driving layer, which is far away from the substrate, wherein the display layer is formed with a plurality of pixel unit areas, and each pixel unit area comprises at least one sub-pixel;
forming an encapsulation layer on one side of the display layer far away from the substrate;
and forming a reflecting layer made of a metal material on one side of the packaging layer, which is far away from the substrate, wherein the reflecting layer comprises a plurality of electrode blocks, a gap is formed between every two adjacent electrode blocks, the electrode blocks comprise a plurality of through holes, and the pixel unit areas corresponding to the electrode blocks are exposed from the through holes.
8. The method of manufacturing according to claim 7, wherein forming a reflective layer of a metallic material on a side of the encapsulation layer remote from the substrate comprises:
forming a metal material layer on one side of the display layer far away from the substrate;
forming a plurality of electrode blocks on the metal material layer by etching, wherein gaps are formed between every two adjacent electrode blocks;
and forming a plurality of through holes on each electrode block by etching, so that the orthographic projection area of any through hole on the substrate is 50-150% of the orthographic projection area of the corresponding pixel unit area on the substrate.
9. The method of manufacturing according to claim 8, wherein forming a reflective layer of a metallic material on a side of the encapsulation layer remote from the substrate further comprises:
and forming a plurality of leads on the metal material layer by etching, wherein the leads are correspondingly connected with the electrode blocks one by one, and the leads are positioned in the gaps.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 6.
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| CN201911175501.2A CN110838559A (en) | 2019-11-26 | 2019-11-26 | Display device, display panel and manufacturing method thereof |
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| CN201911175501.2A CN110838559A (en) | 2019-11-26 | 2019-11-26 | Display device, display panel and manufacturing method thereof |
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