CN110819805A - Device and method for vacuum smelting of circuit board - Google Patents
Device and method for vacuum smelting of circuit board Download PDFInfo
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- CN110819805A CN110819805A CN201810907034.7A CN201810907034A CN110819805A CN 110819805 A CN110819805 A CN 110819805A CN 201810907034 A CN201810907034 A CN 201810907034A CN 110819805 A CN110819805 A CN 110819805A
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- intermediate frequency
- circuit board
- vacuum
- drying device
- sealing cover
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/28—Selection of materials for use as drying agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
- B01D53/68—Halogens or halogen compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/77—Liquid phase processes
- B01D53/78—Liquid phase processes with gas-liquid contact
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D17/00—Arrangements for using waste heat; Arrangements for using, or disposing of, waste gases
- F27D17/008—Arrangements for using waste heat; Arrangements for using, or disposing of, waste gases cleaning gases
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2251/00—Reactants
- B01D2251/30—Alkali metal compounds
- B01D2251/304—Alkali metal compounds of sodium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2251/00—Reactants
- B01D2251/60—Inorganic bases or salts
- B01D2251/604—Hydroxides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention relates to a device for vacuum smelting of a circuit board, which comprises a plurality of intermediate frequency furnaces arranged above a casting system, a sealing cover arranged above the intermediate frequency furnaces, a spraying device and a drying device. The bottoms of the intermediate frequency furnaces are respectively connected with the casting system through siphon U-shaped pipes, and the tops of the intermediate frequency furnaces are respectively connected with the sealing cover through vacuum pumps; a nitrogen charging device is arranged at the lower part of one side of each intermediate frequency furnace, and a disc pushing device is arranged at the upper part of each intermediate frequency furnace; the top of the sealing cover is sequentially connected with the spraying device and the drying device through a flue gas collecting pipeline, and the tail end of the drying device is connected with a chimney through a compression pump. Meanwhile, the invention also discloses a method for smelting the circuit board in vacuum. The method has the characteristics of simple process, simple and convenient operation, low equipment investment and operation cost, maximized resource recovery and minimized environmental influence.
Description
Technical Field
The invention relates to the technical field of resource disposal of circuit boards, in particular to a device and a method for vacuum smelting of a circuit board.
Background
With the increasing updating speed of electronic products, the waste amount of Printed Circuit Boards (PCBs) which are main components of electronic garbage is also becoming larger and larger. The pollution of waste PCBs to the environment also draws attention of various countries. The waste PCB contains heavy metals such as lead, mercury and hexavalent chromium, and toxic chemical substances such as polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) which are used as flame retardant components, and the substances cause huge pollution to underground water and soil in natural environment and bring great harm to life, physical and mental health of people. The waste PCB contains nearly 20 kinds of nonferrous metals and rare metals, has high recovery value and economic value, is a real mineral deposit waiting for mining, and has very important significance on resource recovery and safe disposal.
At present, domestic methods for recycling circuit boards are as follows, and the advantages and disadvantages are detailed in the following table:
disclosure of Invention
The invention aims to provide a device for smelting a circuit board in vacuum, which maximizes resource recovery and minimizes environmental impact.
The invention also provides a method for vacuum smelting the circuit board.
In order to solve the problems, the device for smelting the circuit board in vacuum is characterized in that: the device comprises a plurality of intermediate frequency furnaces arranged above a casting system, a sealing cover arranged above the intermediate frequency furnaces, a spraying device and a drying device; the bottoms of the intermediate frequency furnaces are respectively connected with the casting system through siphon U-shaped pipes, and the tops of the intermediate frequency furnaces are respectively connected with the sealing cover through vacuum pumps; a nitrogen charging device is arranged at the lower part of one side of each intermediate frequency furnace, and a disc pushing device is arranged at the upper part of each intermediate frequency furnace; the top of the sealing cover is sequentially connected with the spraying device and the drying device through a flue gas collecting pipeline, and the tail end of the drying device is connected with a chimney through a compression pump.
A plurality of spray heads are uniformly distributed in the spraying device, and a sodium hydroxide solution with the mass concentration of 3-5% is filled in the spray heads.
Calcium carbonate is filled in the drying device.
A method for smelting a circuit board in vacuum comprises the following steps:
⑴ opening the nitrogen charging device to discharge all air in the intermediate frequency furnace;
⑵, closing the nitrogen charging device, and opening a vacuum pump to enable the interior of the intermediate frequency furnace to reach a negative pressure state;
⑶ adding the circuit board into the intermediate frequency furnace from the disc pushing device;
⑷ starting the intermediate frequency furnace, starting heating, and controlling the temperature at 800-1450 ℃;
⑸ cracking the circuit board at high temperature and negative pressure, and allowing the solid-phase and liquid-phase molten metal to enter a casting system through a siphon U-shaped pipe to complete resource collection of the alloy;
meanwhile, a compression pump is started, the cracked gas of the circuit board is collected through a sealing cover, the gas enters a spraying device after passing through a flue gas collecting pipeline, and a spray head sprays a dilute alkali solution with the mass concentration of 3-5% to remove the hydrogen halide gas in the cracked gas; then the cracked gas continuously enters a drying device, and the calcium carbonate in the drying device removes the moisture in the cracked gas; and finally, the treated gas is safely discharged through a chimney.
Compared with the prior art, the invention has the following advantages:
1. the invention applies the principle of vacuum metallurgy to the resource treatment of the circuit board, realizes the cracking of the circuit board under the conditions of high temperature and vacuum, and recovers rare and precious metals and alloys, thereby not only reducing the problems of difficult treatment and high cost of flue gas in the incineration treatment process of the circuit board, especially the problem of difficult disposal of toxic and harmful gas dioxin, but also directly discharging the generated cracked gas after washing and drying by alkali liquor, thereby achieving the purpose of low air pollution; in addition, the cracked gas has a certain heat value, and can be subjected to heat recovery and secondary utilization.
2. The invention is cracked in the intermediate frequency furnace at high temperature and in vacuum, thus preventing the metal in the circuit board from being oxidized and effectively separating the substances with different boiling points; it can also remove gas or impurities in the metal, enhance the deoxidation capability of carbon in the metal and improve the quality of the metal and the alloy.
3. The solid-liquid metal solution after cracking of the circuit board enters the casting system through the U-shaped siphon, so that slag and other impurities can be prevented from entering the cavity, and the purity of the metal is greatly improved.
4. The invention has no waste gas and waste water discharge, less solid waste amount and less pollution, and completely achieves the aim of minimizing the environmental influence.
5. The invention has simple process, simple and convenient operation, low equipment investment and operation cost, and adjustable disposal quantity according to actual production.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of the present invention.
In the figure: 1, an intermediate frequency furnace; 2-flue gas collecting pipe; 3, a spraying device; 4-a spray head; 5, a drying device; 6, a chimney; 7-a compression pump; 8, sealing a cover; 9-a vacuum pump; 10-disc pushing device; 11-a nitrogen charging device; 12-siphon U-tube; 13-casting system.
Detailed Description
As shown in figure 1, the device for vacuum smelting the circuit board comprises a plurality of intermediate frequency furnaces 1 arranged above a casting system 13, a sealing cover 8 arranged above the intermediate frequency furnaces 1, a spraying device 3 and a drying device 5.
The bottoms of the intermediate frequency furnaces 1 are respectively connected with a casting system 13 through siphon U-shaped pipes 12, and the tops of the intermediate frequency furnaces are respectively connected with a sealing cover 8 through a vacuum pump 9; a nitrogen charging device 11 is arranged at the lower part of one side of each intermediate frequency furnace 1, and a disc pushing device 10 is arranged at the upper part of each intermediate frequency furnace; the top of the sealing cover 8 is connected with the spraying device 3 and the drying device 5 in sequence through the flue gas collecting pipeline 2, and the tail end of the drying device 5 is connected with the chimney 6 through the compression pump 7.
Wherein: a plurality of spray heads 4 are uniformly distributed in the spray device 3, and a sodium hydroxide solution with the mass concentration of 3-5% is filled in the spray heads 4.
Calcium carbonate is filled in the drying device 5.
A method for smelting a circuit board in vacuum comprises the following steps:
⑴, opening the nitrogen charging device 11 to discharge all air in the intermediate frequency furnace 1;
⑵, closing the nitrogen charging device 11, and opening the vacuum pump 9 to make the interior of the intermediate frequency furnace 1 reach a negative pressure state;
⑶, adding the circuit board into the intermediate frequency furnace 1 from the disc pushing device 10;
⑷ starting the intermediate frequency furnace 1, starting heating, and controlling the temperature at 800-1450 ℃;
⑸ cracking the circuit board at high temperature and negative pressure, and allowing the solid-phase and liquid-phase molten metal to enter the casting system 13 through the siphon U-shaped pipe 12 to complete resource collection of the alloy;
meanwhile, the compression pump 7 is started, the cracked gas of the circuit board is collected through the sealing cover 8, enters the spraying device 3 after passing through the flue gas collecting pipeline 2, and the spray head 4 sprays dilute alkali solution with the mass concentration of 3-5% to remove the hydrogen halide gas in the cracked gas; then, the cracked gas continuously enters a drying device 5, and the calcium carbonate in the drying device 5 removes moisture in the cracked gas; finally, the treated gas is safely discharged through a chimney 6.
Claims (4)
1. A device for smelting a circuit board in vacuum is characterized in that: the device comprises a plurality of intermediate frequency furnaces (1) arranged above a casting system (13), a sealing cover (8) arranged above the intermediate frequency furnaces (1), a spraying device (3) and a drying device (5); the bottoms of the intermediate frequency furnaces (1) are respectively connected with the casting system (13) through siphon U-shaped pipes (12), and the tops of the intermediate frequency furnaces are respectively connected with the sealing cover (8) through vacuum pumps (9); a nitrogen charging device (11) is arranged at the lower part of one side of each intermediate frequency furnace (1), and a disc pushing device (10) is arranged at the upper part of each intermediate frequency furnace; the top of the sealing cover (8) is sequentially connected with the spraying device (3) and the drying device (5) through a flue gas collecting pipeline (2), and the tail end of the drying device (5) is connected with a chimney (6) through a compression pump (7).
2. The apparatus for vacuum melting a circuit board according to claim 1, wherein: a plurality of spray heads (4) are uniformly distributed in the spray device (3), and a sodium hydroxide solution with the mass concentration of 3-5% is filled in the spray heads (4).
3. The apparatus for vacuum melting a circuit board according to claim 1, wherein: calcium carbonate is filled in the drying device (5).
4. A method for smelting a circuit board in vacuum comprises the following steps:
⑴, opening the nitrogen charging device (11) to discharge all air in the intermediate frequency furnace (1);
⑵, the nitrogen charging device (11) is closed, the vacuum pump (9) is opened, and the interior of the intermediate frequency furnace (1) is in a negative pressure state;
⑶, adding the circuit board into the intermediate frequency furnace (1) from the disc pushing device (10);
⑷, starting the intermediate frequency furnace (1) to start heating, and controlling the temperature to be 800-1450 ℃;
⑸ cracking the circuit board at high temperature and negative pressure, and allowing the solid-phase and liquid-phase molten metal to enter a casting system (13) through a siphon U-shaped pipe (12) to complete resource collection of the alloy;
meanwhile, a compression pump (7) is started, the gas cracked by the circuit board is collected through a sealing cover (8), enters a spraying device (3) after passing through a flue gas collecting pipeline (2), and a spray head (4) sprays a dilute alkali solution with the mass concentration of 3-5% to remove the hydrogen halide gas in the cracked gas; then the cracked gas continues to enter a drying device (5), and the calcium carbonate in the drying device (5) removes moisture in the cracked gas; finally, the treated gas is safely discharged through a chimney (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810907034.7A CN110819805A (en) | 2018-08-10 | 2018-08-10 | Device and method for vacuum smelting of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810907034.7A CN110819805A (en) | 2018-08-10 | 2018-08-10 | Device and method for vacuum smelting of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110819805A true CN110819805A (en) | 2020-02-21 |
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ID=69541083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810907034.7A Pending CN110819805A (en) | 2018-08-10 | 2018-08-10 | Device and method for vacuum smelting of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110819805A (en) |
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2018
- 2018-08-10 CN CN201810907034.7A patent/CN110819805A/en active Pending
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