CN110815970A - Preparation method of high-diameter-thickness-ratio double-lamination sheet - Google Patents
Preparation method of high-diameter-thickness-ratio double-lamination sheet Download PDFInfo
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- CN110815970A CN110815970A CN201911037689.4A CN201911037689A CN110815970A CN 110815970 A CN110815970 A CN 110815970A CN 201911037689 A CN201911037689 A CN 201911037689A CN 110815970 A CN110815970 A CN 110815970A
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- ceramic
- double
- lamination
- metal plate
- sheet
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- 238000003475 lamination Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 230000009977 dual effect Effects 0.000 claims description 2
- 229920006335 epoxy glue Polymers 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 abstract description 6
- 238000013467 fragmentation Methods 0.000 abstract description 3
- 238000006062 fragmentation reaction Methods 0.000 abstract description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/045—Slitting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a preparation method of a high-diameter-thickness ratio double-lamination sheet, which comprises the following steps: s1, performing trisection cutting on the ceramic sheet in the length direction to form three ceramic sheet units; s2, the three ceramic chip units are mutually adjacently distributed and glued on any surface of the metal plate according to the length direction of the ceramic chip, the three glued ceramic chip units are positioned on the same plane, and the distances from two opposite side edges of the formed integral structure to the corresponding side edges of the metal plate are the same. The double-lamination obtained by the method keeps the original resonant frequency and impedance curve under the working condition, and the tensile strength is greatly improved. After the ceramic blocking method is adopted, the situation that the double-lamination bending amplitude is too large to cause ceramic fragmentation does not occur in the debugging process, and meanwhile, the frequency and the impedance of the double-lamination after the ceramic blocking are not reduced compared with the performance of the ceramic as a whole.
Description
Technical Field
The invention belongs to the field of preparation methods of double-lamination sheets with high aspect ratio.
Background
A common double-laminated bending transducer is formed by gluing a thin ceramic plate and a metal plate, and the metal plate is driven to vibrate by the 3-1 direction movement of the ceramic plate. The structural form can meet the requirements of small size and light weight at low frequency.
When the resonant frequency of the double-laminated bending transducer is designed to be at a low frequency, such as 2kHz, the equivalent compliance of the bending transducer is required to be higher, namely the metal plate and the ceramic plate are thinner, but the radius-thickness ratio of the ceramic can reach about 150. Therefore, if the voltage applied to the double-lamination sheet is high, the amplitude of the ceramic sheet is too large, and the stress limit is easily reached, so that the ceramic is cracked, and the sound source level is limited.
Therefore, the problem of improving the pressure resistance of the driving ceramic, enhancing the tensile strength of the driving ceramic and further improving the sound source level under the condition of not changing the resonant frequency and the impedance of the double-lamination is needed to be solved.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a preparation method of a double-lamination with a high aspect ratio.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides a preparation method of a high-diameter-thickness ratio double-lamination sheet, which comprises the following steps:
s1, performing trisection cutting on the ceramic sheet in the length direction to form three ceramic sheet units;
s2, distributing the three ceramic chip units adjacently to each other along the length direction of the ceramic chip in the step S1 and gluing the three ceramic chip units on any surface of the metal plate, wherein the three glued ceramic chip units are positioned on the same plane and the distances from the two opposite sides of the formed integral structure to the corresponding sides of the metal plate are the same.
In a preferred embodiment of the present invention, the metal plate has a length of 64mm, a width of 29mm and a thickness of 0.8 mm.
As a preferred technical scheme of the invention, the length of the ceramic plate is 51mm, the width of the ceramic plate is 23mm, and the thickness of the ceramic plate is 0.4 mm.
As a preferred embodiment of the present invention, a high temperature epoxy adhesive is used for gluing in step S2.
The invention has the beneficial effects that: the double-lamination obtained by the method keeps the original resonant frequency and impedance curve under the working condition, and the tensile strength is greatly improved. After the ceramic blocking method is adopted, the situation that the double-lamination bending amplitude is too large to cause ceramic fragmentation does not occur in the debugging process, and meanwhile, the frequency and the impedance of the double-lamination after the ceramic blocking are not reduced compared with the performance of the ceramic as a whole.
Drawings
FIG. 1 is a flow chart of the manufacturing method of the double lamination with high aspect ratio of the invention.
Fig. 2 is a schematic structural diagram of a double lamination manufactured by the method for manufacturing the double lamination with the high aspect ratio.
FIG. 3 is a comparative graph of the experiment of the double lamination obtained by ceramic partitioning using the preparation method of the present invention and the double lamination obtained by the prior art ceramic monolith.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
In order to achieve the object of the present invention, as shown in fig. 1, in one embodiment of the present invention, there is provided a method for preparing a high aspect ratio dual stack, comprising the steps of:
s1, performing trisection cutting on the ceramic sheet in the length direction to form three ceramic sheet units;
s2, distributing the three ceramic chip units adjacently to each other along the length direction of the ceramic chip in the step S1 and gluing the three ceramic chip units on any surface of the metal plate, wherein the three glued ceramic chip units are positioned on the same plane and the distances from the two opposite sides of the formed integral structure to the corresponding sides of the metal plate are the same.
Specifically, the length of the metal plate is 64mm, the width of the metal plate is 29mm, and the thickness of the metal plate is 0.8 mm.
Specifically, the length of the ceramic plate is 51mm, the width of the ceramic plate is 23mm, and the thickness of the ceramic plate is 0.4 mm.
Specifically, in step S2, a high-temperature epoxy adhesive is used for gluing, and other existing adhesives may be selected according to specific situations, which is not limited to this embodiment.
Fig. 3 is an experimental comparison of a double lamination obtained by partitioning a ceramic according to the present embodiment and a double lamination obtained by integrating a ceramic according to the prior art. The double-lamination obtained by the embodiment keeps the original resonant frequency and impedance curve under the working condition, and the tensile strength is greatly improved. After the ceramic blocking method is adopted, the situation that the double-lamination bending amplitude is too large to cause ceramic fragmentation does not occur in the debugging process, and meanwhile, the frequency and the impedance of the double-lamination after the ceramic blocking are not reduced compared with the performance of the ceramic as a whole.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The preparation method of the high-diameter-thickness-ratio double-lamination sheet is characterized by comprising the following steps of:
s1, performing trisection cutting on the ceramic sheet in the length direction to form three ceramic sheet units;
s2, distributing the three ceramic chip units adjacently to each other along the length direction of the ceramic chip in the step S1 and gluing the three ceramic chip units on any surface of the metal plate, wherein the three glued ceramic chip units are positioned on the same plane and the distances from the two opposite sides of the formed integral structure to the corresponding sides of the metal plate are the same.
2. The method of claim 1, wherein the length of the metal plate is 64mm, the width of the metal plate is 29mm, and the thickness of the metal plate is 0.8 mm.
3. The method of claim 1, wherein the ceramic sheet has a length of 51mm, a width of 23mm, and a thickness of 0.4 mm.
4. The method for preparing a high aspect ratio dual stack as claimed in claim 1, wherein a high temperature epoxy glue is used for gluing in step S2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911037689.4A CN110815970A (en) | 2019-10-29 | 2019-10-29 | Preparation method of high-diameter-thickness-ratio double-lamination sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911037689.4A CN110815970A (en) | 2019-10-29 | 2019-10-29 | Preparation method of high-diameter-thickness-ratio double-lamination sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110815970A true CN110815970A (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911037689.4A Pending CN110815970A (en) | 2019-10-29 | 2019-10-29 | Preparation method of high-diameter-thickness-ratio double-lamination sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110815970A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427110A (en) * | 2011-12-02 | 2012-04-25 | 济南大学 | Multi-element piezoelectric composite material and preparation method and application thereof |
| CN202634318U (en) * | 2012-06-01 | 2012-12-26 | 广州市番禺奥迪威电子有限公司 | Piezoelectric transducer device and piezoelectric generator using the piezoelectric transducer device |
| CN203801069U (en) * | 2014-03-13 | 2014-08-27 | 广州市番禺奥迪威电子有限公司 | Piezoelectric loudspeaker structure employing a plurality of ceramic chips |
-
2019
- 2019-10-29 CN CN201911037689.4A patent/CN110815970A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427110A (en) * | 2011-12-02 | 2012-04-25 | 济南大学 | Multi-element piezoelectric composite material and preparation method and application thereof |
| CN202634318U (en) * | 2012-06-01 | 2012-12-26 | 广州市番禺奥迪威电子有限公司 | Piezoelectric transducer device and piezoelectric generator using the piezoelectric transducer device |
| CN203801069U (en) * | 2014-03-13 | 2014-08-27 | 广州市番禺奥迪威电子有限公司 | Piezoelectric loudspeaker structure employing a plurality of ceramic chips |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20200221 |