CN110809375A - Processing method for solving size expansion and shrinkage of FPC (Flexible printed Circuit) large spliced board in SMT (surface mount technology) printing - Google Patents
Processing method for solving size expansion and shrinkage of FPC (Flexible printed Circuit) large spliced board in SMT (surface mount technology) printing Download PDFInfo
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- CN110809375A CN110809375A CN201911126532.9A CN201911126532A CN110809375A CN 110809375 A CN110809375 A CN 110809375A CN 201911126532 A CN201911126532 A CN 201911126532A CN 110809375 A CN110809375 A CN 110809375A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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Abstract
The invention discloses a processing method for solving the problem of size expansion and shrinkage of a large FPC jointed board in SMT printing, wherein two solder paste printing machines are combined together according to processing requirements; manufacturing a first steel mesh and a second steel mesh for producing a product object; a small window for printing is arranged on the left side of the first steel mesh, no window is arranged on the right side of the first steel mesh, a large window is arranged on the left side of the second steel mesh, and a small window for printing is arranged on the right side of the second steel mesh; designing induction PAD according to the left and right sections of the first steel mesh and the second steel mesh; respectively installing the first steel mesh and the second steel mesh on two solder paste printing machines, and installing scrapers at the small windowing positions of the first steel mesh and the second steel mesh; printing the left side of the FPC substrate and printing the right side of the FPC substrate; and when the detection result of the thickness and deviation of the printing tin of the FPC substrate is not abnormal, carrying out SMT (surface mount technology) device pasting treatment and furnace treatment on the FPC substrate to finish board discharging.
Description
Technical Field
The invention relates to the technical field of SMT (surface mount technology) processing and manufacturing of large FPC (flexible printed circuit) jointed boards, in particular to a processing method for solving size expansion and shrinkage of large FPC jointed boards in SMT printing.
Background
The sizes of common FPC (flexible printed circuit board) SMT printing solder paste and pasted devices are small, the reason is that the sizes of the FPC are changed to a certain extent in the processing process, the sizes are also influenced by slight changes of conditions in the manufacturing process, SMT steel meshes can be manufactured only in small sizes of jointed boards (such as 250mm x 250 mm), and the expansion and contraction values of larger jointed boards are difficult to control, so that the FPC and the pasted devices are all processed under the small jointed boards. The above reasons make the whole SMT process inefficient, resulting in an inability to increase production.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
For the reasons, the applicant proposes a processing method for solving the dimensional expansion and shrinkage of the large jointed FPC board in SMT printing, and aims to solve the problems.
Disclosure of Invention
In order to meet the requirements, the invention aims to provide a processing method for solving the problem of size expansion and shrinkage of a large FPC jointed board in SMT printing, aims to solve the printing problem caused by the expansion and shrinkage of the large jointed board in printing, and utilizes the phenomenon of relative size fixation of the existing small jointed board to produce the large jointed board. The large jointed board is printed in sections according to the sleeve board, wherein SMT attaching parts in the FPC machining process are also aligned and attached in a partition mode according to the sleeve board, and the production quality can be guaranteed.
In order to achieve the purpose, the invention adopts the following technical scheme:
the processing method for solving the problem of size expansion and shrinkage of the large FPC jointed board in SMT printing comprises the following steps:
combining two solder paste printing machines according to processing requirements, and connecting an SMT (surface mount technology) chip mounter behind the solder paste printing machines;
manufacturing a first steel mesh and a second steel mesh for producing the product object according to the expansion and contraction coefficients tested at the front end and the rear end of the product object; a small window for printing is arranged on the left side of the first steel mesh, no window is arranged on the right side of the first steel mesh, a large window is arranged on the left side of the second steel mesh, and a small window for printing is arranged on the right side of the second steel mesh; designing induction PAD according to the left and right sections of the first steel mesh and the second steel mesh;
respectively installing the first steel mesh and the second steel mesh on two solder paste printing machines, and installing scrapers at the small windowing positions of the first steel mesh and the second steel mesh;
fixing an FPC (flexible printed circuit) substrate on a jig, entering from a board inlet area of a solder paste printer, automatically conveying the FPC substrate to a solder paste printing area, positioning the left side of the FPC substrate according to the inductive PAD (PAD application program) of the first steel mesh, aligning the left side of the FPC substrate with the small windowing position of the first steel mesh, and printing the left side of the FPC substrate;
conveying the FPC substrate to a second steel mesh position, positioning the right side of the FPC substrate according to the inductive PAD of the second steel mesh, aligning the right side of the FPC substrate with the small windowing position of the second steel mesh, aligning the left side of the FPC substrate with the large windowing position of the second steel mesh, and printing the right side of the FPC substrate;
and when the detection result of the thickness and deviation of the printing tin of the FPC substrate is not abnormal, carrying out SMT (surface mount technology) device pasting treatment and furnace treatment on the FPC substrate to finish board discharging.
In one possible embodiment, the furnace-through treatment further comprises before-furnace AOI treatment, and the furnace-through treatment further comprises after-furnace AOI treatment.
In one possible embodiment, the SMT device-mounting process on the FPC substrate includes separately mounting devices after positioning the left and right portions of the FPC substrate, respectively.
In one possible embodiment, the range of the large fenestrations includes the full profile of the small fenestrations.
In one possible embodiment, the positioning of the FPC substrate is achieved based on a positioning system.
In a possible embodiment, a solder paste detection machine is also connected between the solder paste printer and the SMT pick-and-place machine, and is used for detecting the thickness of solder paste on the FPC substrate.
In one possible embodiment, the printed solder paste area is a small window position of the first steel mesh and the second steel mesh.
In a possible embodiment, the expansion and contraction coefficients measured at the front end and the rear end of the product object are the expansion and contraction coefficients measured when the FPC product is divided into a left part and a right part which are equal according to the sleeve plates of the jointed boards.
Compared with the prior art, the invention has the beneficial effects that: by adopting the scheme, the processing method for solving the size expansion and shrinkage of the large FPC jointed board in the SMT printing is realized, the sectional printing of the FPC substrate is realized by manufacturing different first steel meshes and second steel meshes, the problem of repeated printing of the part printed with the solder paste is effectively avoided in the sectional printing, the problem that the production needs to be improved under the condition that equipment is not increased in the in-factory SMT production is solved, secondly, the conventional thinking of the product is changed to be designed into a mode of one-time printing of the whole piece, the practical problem of the sectional printing on the large FPC jointed board or the large size can be solved, a more efficient mode is provided for the production and the manufacture, and the sectional printing mode of the scheme can be expanded to the SMT printing of all the large jointed boards.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic flow chart of a processing method for solving the problem of dimensional expansion and shrinkage of a large FPC jointed board in SMT printing according to the present invention;
FIG. 2 is a schematic diagram showing the state of a first steel mesh for a specific embodiment of the processing method for solving the dimensional expansion and shrinkage of a large jointed FPC board in SMT printing according to the present invention;
FIG. 3 is a schematic diagram showing the state of a second steel net for solving the problem of dimensional expansion and shrinkage of a large FPC board in SMT printing according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Fig. 1 is a schematic flow chart of a method, which is a schematic view of a specific embodiment of the processing method for solving the problem of dimensional expansion and shrinkage of a large FPC splice plate in SMT printing, and includes the following steps:
step S1, combining two solder paste printing machines according to the processing requirement, and connecting an SMT chip mounter behind the solder paste printing machines;
step S2, manufacturing a first steel mesh and a second steel mesh for producing the product object according to the expansion and contraction coefficients tested at the front end and the rear end of the product object; a small window for printing is arranged on the left side of the first steel mesh, no window is arranged on the right side of the first steel mesh, a large window is arranged on the left side of the second steel mesh, and a small window for printing is arranged on the right side of the second steel mesh; designing induction PAD according to the left and right sections of the first steel mesh and the second steel mesh;
step S3, respectively installing the first steel mesh and the second steel mesh on two solder paste printing machines, and installing scrapers at the small windowing positions of the first steel mesh and the second steel mesh;
step S4, fixing the FPC substrate on a jig, entering from a board inlet area of the solder paste printer, automatically conveying the FPC substrate to a solder paste printing area, positioning the left side of the FPC substrate according to the induction PAD of the first steel mesh, aligning the left side of the FPC substrate with the small windowing position of the first steel mesh, and printing the left side of the FPC substrate;
step S5, the FPC substrate is conveyed to a second steel mesh position, the right side of the FPC substrate is positioned according to the inductive PAD of the second steel mesh, the right side of the FPC substrate is aligned with the small windowing position of the second steel mesh, the left side of the FPC substrate is aligned with the large windowing position of the second steel mesh, and the right side of the FPC substrate is printed;
and step S6, when the detection result of the thickness and the deviation of the FPC substrate printing tin is not abnormal, carrying out SMT device pasting processing and furnace processing on the FPC substrate to finish board discharging.
Specifically, in step S1, two solder paste printers need to keep the discharging position of the first printer and the feeding position of the second printer on the same line; when the first printer prints on the FPC substrate, only part of the FPC substrate can be printed due to the fact that the FPC substrate is too long, so that the problem that the printing range of the solder paste printer is not enough can be effectively solved by the two solder paste printers, and a large problem in manufacturing of large FPC jointed boards is solved by the positioning segmented printing in the steps S2-S6.
In other alternative embodiments, the number of the solder paste printers can be more than two, and the solder paste printers are designed to be matched with large-size FPC jointed boards.
As a preferred embodiment, the production of FPC further needs to be processed by a furnace, specifically, a tin furnace (referred to as "furnace") is a link in the production process of FPC manufacture by the manufacturer, wherein the tin furnace refers to a molten tin pool, and a welding tool used in electronic welding. The welding consistency of the circuit board of the discrete component is good, the operation is convenient and fast, the working efficiency is high, and the welding tool is a welding tool for production and processing.
In a preferred embodiment, before the furnace-passing treatment, the furnace-passing treatment further comprises before-furnace AOI treatment, and after-furnace AOI treatment.
Specifically, the normal conditions of whether the element is attached askew (if the element is attached correctly), wrong, leaked, reversed and the like are mainly observed in front of the furnace, and the welding effect is mainly checked after the furnace, whether the element is subjected to virtual/continuous welding, tin beads and the like are detected, so that the reliability of product manufacturing is ensured. The AOI refers to automatic optical detection and is equipment for detecting common defects encountered in welding production based on an optical principle. AOI is a new emerging testing technology, but the development is rapid, and AOI testing equipment is released by many manufacturers. During automatic detection, the machine automatically scans the FPC through the camera, acquires images, compares the tested welding spots with qualified parameters in the database, inspects defects on the FPC through image processing, and displays/marks the defects through a display or an automatic mark for repair personnel to repair. Therefore, the scheme adopts AOI detection to improve the product manufacturing efficiency.
In one possible embodiment, the SMT device-mounting process on the FPC substrate includes separately mounting devices after positioning the left and right portions of the FPC substrate, respectively. Specifically, the processing mode of the scheme also directly realizes the processing of the large-size FPC on the SMT chip mounter when the processing range of the large-size FPC is insufficient, and the steps S2-S6 can be referred to in the specific chip mounting mode.
In one possible embodiment, the range of the large fenestrations includes the full profile of the small fenestrations. When the area of the large window is large enough, the second solder paste printer can be effectively prevented from printing the FPC substrate printed with the solder paste again, and the FPC substrate part printed with the solder paste can be shielded.
In one possible embodiment, the positioning of the FPC substrate is achieved based on a positioning system. Wherein, the positioning system can adopt the positioning system in the prior art, including but not limited to a photoelectric sensor,
In a possible embodiment, a solder paste detection machine is also connected between the solder paste printer and the SMT pick-and-place machine, and is used for detecting the thickness of solder paste on the FPC substrate. Specifically, in the present scheme, one complete processing step of the FPC is: solder paste printer → solder paste detector → SMT chip mounter → AOI in front of furnace → furnace through → AOI behind furnace → plate out.
In one possible embodiment, the printed solder paste area is a small window position of the first steel mesh and the second steel mesh.
In a possible embodiment, the expansion and contraction coefficients measured at the front end and the rear end of the product object are the expansion and contraction coefficients measured when the FPC product is divided into a left part and a right part which are equal according to the sleeve plates of the jointed boards.
In the embodiment shown in fig. 2 and 3, a specific example of the FPC processing of the present scheme is as follows:
the windowing positions of the front and the rear printing steel meshes are respectively shown in fig. 2 and fig. 3, when the first steel mesh (shown in fig. 2) is used for printing, the right part of the steel mesh is not windowed and does not need to be printed, so that the right side is blocked for printing, and the left side is subjected to counterpoint printing according to a left counterpoint system; when the second steel mesh (shown in fig. 3) is used for printing, because the left side of the FPC substrate is printed with the solder paste, the solder paste is required to be avoided from being contacted with the solder during printing, the position opposite to the left side is required to be windowed and exposed, the position opposite to the left side of the FPC is printed by using the alignment system, and similarly, the left part and the right part can be separately aligned and attached to the device in the SMT attaching process, so that the processing and manufacturing of the FPC product can be realized.
In conclusion, the processing method for solving the size expansion and shrinkage of the large FPC jointed board in the SMT printing is adopted, the segmented printing of the FPC substrate is realized by manufacturing different first steel meshes and second steel meshes, the problem of repeated printing of a part printed with solder paste is effectively avoided in the segmented printing, the problem that the production needs to be increased under the condition that equipment is not increased in the SMT production in a factory is solved, the conventional thinking mode that products are designed to be printed in a whole piece at one time is changed, the practical problem of the segmented printing on the large FPC jointed board or the large FPC board can be solved better, a more efficient mode is provided for production and manufacturing, and the segmented printing mode can be expanded to the SMT printing of all the large FPC jointed boards.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (8)
1. The processing method for solving the problem of size expansion and shrinkage of the large FPC jointed board in SMT printing is characterized by comprising the following steps of:
combining two solder paste printing machines according to processing requirements, and connecting an SMT (surface mount technology) chip mounter behind the solder paste printing machines;
manufacturing a first steel mesh and a second steel mesh for producing the product object according to the expansion and contraction coefficients tested at the front end and the rear end of the product object; a small window for printing is arranged on the left side of the first steel mesh, no window is arranged on the right side of the first steel mesh, a large window is arranged on the left side of the second steel mesh, and a small window for printing is arranged on the right side of the second steel mesh; designing induction PAD according to the left and right sections of the first steel mesh and the second steel mesh;
respectively installing the first steel mesh and the second steel mesh on two solder paste printing machines, and installing scrapers at the small windowing positions of the first steel mesh and the second steel mesh;
fixing an FPC (flexible printed circuit) substrate on a jig, entering from a board inlet area of a solder paste printer, automatically conveying the FPC substrate to a solder paste printing area, positioning the left side of the FPC substrate according to the inductive PAD (PAD application program) of the first steel mesh, aligning the left side of the FPC substrate with the small windowing position of the first steel mesh, and printing the left side of the FPC substrate;
conveying the FPC substrate to a second steel mesh position, positioning the right side of the FPC substrate according to the inductive PAD of the second steel mesh, aligning the right side of the FPC substrate with the small windowing position of the second steel mesh, aligning the left side of the FPC substrate with the large windowing position of the second steel mesh, and printing the right side of the FPC substrate;
and when the detection result of the thickness and deviation of the printing tin of the FPC substrate is not abnormal, carrying out SMT (surface mount technology) device pasting treatment and furnace treatment on the FPC substrate to finish board discharging.
2. The processing method for solving the dimensional expansion and shrinkage of the large jointed FPC board in SMT printing according to claim 1, wherein the pre-baking treatment further comprises a pre-baking AOI treatment, and the post-baking treatment further comprises a post-baking AOI treatment.
3. The processing method for solving the dimensional expansion and shrinkage problem of the large jointed FPC board in SMT printing as recited in claim 1, wherein the SMT processing of the FPC substrate includes separately attaching devices after positioning the left and right portions of the FPC substrate.
4. The processing method for solving the dimensional expansion and shrinkage of the large jointed FPC board in SMT printing as recited in claim 1, wherein the range of the large fenestration includes the entire contour of the small fenestration.
5. The processing method for solving the dimensional expansion and shrinkage of the large jointed FPC board in SMT printing according to claim 1, wherein the positioning of the FPC substrate is realized based on a positioning system.
6. The processing method for solving the dimensional expansion and shrinkage of the large FPC jointed board in SMT printing according to claim 1, wherein a solder paste detector is connected between the solder paste printer and the SMT chip mounter for detecting the thickness of solder paste on the FPC substrate.
7. The processing method for solving the problem of dimensional expansion and shrinkage of the large jointed FPC board in SMT printing according to claim 1, wherein the printing solder paste area is a small windowing position of the first steel mesh and the second steel mesh.
8. The processing method for solving the dimensional expansion and shrinkage problem of the large jointed FPC board in SMT printing as recited in claim 1, wherein the expansion and shrinkage coefficients measured at the front and back ends of the product object are the expansion and shrinkage coefficients measured when the FPC product is divided into two equal parts, namely left and right, according to the sheathing of the jointed FPC board.
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| CN201911126532.9A CN110809375B (en) | 2019-11-18 | 2019-11-18 | Processing method for solving size expansion and shrinkage of FPC (Flexible printed Circuit) large spliced board in SMT (surface mount technology) printing |
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| CN201911126532.9A CN110809375B (en) | 2019-11-18 | 2019-11-18 | Processing method for solving size expansion and shrinkage of FPC (Flexible printed Circuit) large spliced board in SMT (surface mount technology) printing |
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| CN112389078A (en) * | 2020-11-18 | 2021-02-23 | 东莞市凯格精机股份有限公司 | Printing equipment and printing method thereof |
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