CN110808259A - Wafer lens module - Google Patents
Wafer lens module Download PDFInfo
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- CN110808259A CN110808259A CN201911166094.9A CN201911166094A CN110808259A CN 110808259 A CN110808259 A CN 110808259A CN 201911166094 A CN201911166094 A CN 201911166094A CN 110808259 A CN110808259 A CN 110808259A
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- 239000011248 coating agent Substances 0.000 claims abstract description 81
- 238000000576 coating method Methods 0.000 claims abstract description 81
- 239000010408 film Substances 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 239000012788 optical film Substances 0.000 claims abstract description 11
- 239000002313 adhesive film Substances 0.000 claims abstract description 10
- 238000003384 imaging method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 54
- 238000007747 plating Methods 0.000 description 21
- 238000002834 transmittance Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a wafer lens module, which comprises at least one micro lens, a glass wafer substrate, an optical adhesive film and at least one image sensor, wherein the micro lens, the glass wafer substrate, the optical adhesive film and the at least one image sensor are arranged from top to bottom; the optical film is characterized by further comprising at least one residual layer, wherein the residual layer is formed between the lens and the glass wafer substrate, a first coating interface is formed between the lower surface of the glass wafer substrate and the optical film, and a second coating interface is formed between the upper surface of the glass wafer substrate and the residual layer. According to the invention, different film combinations can be flexibly selected according to the actual imaging requirements, each film combination has the respective advantages, the film adhesion is greatly improved by manufacturing the film on the residual layer, and the problem of insufficient die set firmness caused by the manufacturing process is solved.
Description
Technical Field
The invention relates to the technical field of optics, in particular to a wafer lens module.
Background
With the promotion of markets such as smart phones, security protection, automotive electronics and the like to the purchase demand of the camera, the camera industry is explosively upgraded, the market puts higher demands on the camera, and the trend of miniaturization of the camera makes a wafer level optical lens (WLO) attract attention.
Because the glass wafer in the wafer-level optical lens is transparent, in order to improve the light with required wavelength to pass through the optical area of the lens, reduce the reflectivity of the lens and filter stray light, a method of plating an anti-reflection film and an anti-reflection film is generally adopted, the existing film plating mode is to plate a diaphragm aperture and an IR infrared cut-off filter film on the upper surface and the lower surface of a glass wafer substrate respectively, the plating form is single and can limit the transmittance of the light with required wave band; and the adhesion between the plating layer and the wafer substrate is not high, and the plating layer is easy to fall off.
Disclosure of Invention
In order to solve the problems in the prior art, the invention adopts the following technical means:
in a first aspect, the present invention provides a wafer lens module, which includes at least one microlens, a glass wafer substrate, an optical film, and at least one image sensor, the microlens corresponds to the image sensor, the microlens is disposed on the glass wafer substrate, and the optical film is disposed between the glass wafer substrate and the image sensor; the optical film is arranged on the lower surface of the glass wafer substrate, and the optical film is arranged on the lower surface of the glass wafer substrate.
Preferably, the optical adhesive film is an adhesive medium between the glass wafer substrate and the image sensor.
Preferably, the residual layer is an optical glue residual layer or an optical resin residual layer.
The invention provides a wafer lens module, which comprises at least one microlens and at least one image sensor which are arranged from top to bottom, wherein the microlens corresponds to the image sensor in position.
Preferably, the wafer lens module further includes a third residual layer formed above the second residual layer, a first plating interface is formed between the first residual layer and the second residual layer, and a second plating interface is formed between the second residual layer and the third residual layer.
Preferably, the first coating interface and the second coating interface of the wafer lens module of the present invention are coated with the following combinations:
the first combination mode: the first coating interface is coated with an IR infrared cut-off filter film, and the second coating interface is coated with a diaphragm.
The second combination mode is as follows: coating interface I is coated with an IR infrared cut filter film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film; the combination mode improves the cut-off rate of an unnecessary waveband, compared with the technical requirement of a single-layer IR infrared cut-off filter film, the technical requirement on a film layer can be greatly reduced by plating the IR infrared cut-off filter film on the double surfaces, and the cut-off rate can be effectively improved.
The third combination mode is as follows: coating the first coating interface with an IR infrared cut-off filter film and a diaphragm, and coating the second coating interface with a diaphragm; the double-sided diaphragm can suppress stray light more effectively than a single-sided diaphragm.
A fourth combination: coating interface I is coated with an IR infrared cut filter film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film and a diaphragm; the combination method can effectively inhibit stray light and improve the infrared light cut-off rate.
The fifth combination mode: coating an IR infrared cut filter film and an AR anti-reflection film on the first coating interface, and coating an IR infrared cut filter film and an AR anti-reflection film on the second coating interface; the combination mode can cut off the unnecessary wave band and increase the reflection of the required wave band, and the illumination of the image surface is improved.
A sixth combination: plating diaphragm on the first plating interface and plating diaphragm on the second plating interface; the combination mode transmits all wave bands and reduces stray light.
A seventh combination: coating an IR infrared cut filter film and an AR anti-reflection film on the first coating interface, and coating a diaphragm on the second coating interface; the combination mode effectively improves the transmittance of the required wave band.
The eighth combination mode: coating interface I is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film and an AR anti-reflection film; the combination mode can improve the cutoff rate of the unnecessary wave band and the transmittance of the required wave band to the maximum extent.
Ninth combination: coating the first coating interface with an IR cut-off filter film, an AR antireflection film and a diaphragm, and coating the second coating interface with a diaphragm; the combination mode can effectively improve the transmittance and reduce the stray light to the maximum extent;
the tenth combination mode: coating interface I is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm; the combination mode can improve the transmittance of the required wave band to the maximum extent, improve the cut-off rate of the unnecessary wave band and reduce the stray light to the maximum extent.
Preferably, in the film layer combination, the diaphragm may be any one of an aperture diaphragm, a field diaphragm, and a vignetting diaphragm.
Compared with the prior art, the invention has the following advantages:
1. according to the actual needs of imaging, different film layer combinations can be flexibly selected.
2. The combination of each film layer has respective advantages, such as the adoption of an infrared cut-off filter film increases the filtering effect on infrared rays, and the adoption of an antireflection film can enhance the permeability of light with required wavelength and reduce the reflected light.
3. Be provided with and remain the layer, preparation rete on remaining the layer, the rete adhesive force improves greatly, solves the not enough problem of module rete firmness that the processing procedure caused.
Drawings
Fig. 1 is a schematic view of a wafer lens module according to an embodiment of the invention.
Fig. 2 is a schematic view of a wafer lens module according to a second embodiment of the invention.
FIG. 3 is a schematic view of a wafer lens module according to a third embodiment of the present invention;
the following description of the reference numerals refers to the accompanying drawings:
1: a microlens; 2: a residual layer; 21: a first residual layer; 22: a second residual layer; 23: a residual layer III; 3: a glass wafer substrate; 4: an optical adhesive film; 5: an image sensor; 6: a first coating interface; 7: and coating interface II.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it should be understood that all terms indicating orientation or positional relationship such as "upper" and "lower" are based on the orientation or positional relationship shown in the drawings only for the convenience of describing technical solutions of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus should not be construed as limiting the present invention.
Example one
As shown in fig. 1, the wafer lens module provided by the present invention includes a microlens 1, a residual layer 2, a glass wafer substrate 3, an optical film 4, and an image sensor 5, which are arranged from top to bottom, wherein the microlens 1 corresponds to the image sensor 5, the residual layer 2 is formed between the microlens 1 and the glass wafer substrate 3, and the optical film 4 is arranged between the glass wafer substrate 3 and the image sensor 5.
A first coating interface 6 is formed between the lower surface of the glass wafer substrate 3 and the optical adhesive film 4, and a second coating interface 7 is formed between the upper surface of the glass wafer substrate 3 and the residual layer 2.
In the wafer lens module of the present invention, the optical adhesive film 4 is an adhesive medium between the glass wafer substrate 3 and the image sensor 5, and the residual layer 2 is an optical adhesive residual layer or an optical resin residual layer.
Coating the first coating interface 6 and the second coating interface 7 with coating layers according to actual needs, wherein the combination mode is as follows:
the first combination mode: the first coating interface is coated with an IR infrared cut-off filter film, and the second coating interface is coated with a diaphragm.
The second combination mode is as follows: coating interface I is coated with an IR infrared cut filter film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film; the combination mode improves the cut-off rate of an unnecessary waveband, compared with the technical requirement of a single-layer IR infrared cut-off filter film, the technical requirement on a film layer can be greatly reduced by plating the IR infrared cut-off filter film on the double surfaces, and the cut-off rate can be effectively improved.
The third combination mode is as follows: coating the first coating interface with an IR infrared cut-off filter film and a diaphragm, and coating the second coating interface with a diaphragm; the double-sided diaphragm can suppress stray light more effectively than a single-sided diaphragm.
A fourth combination: coating interface I is coated with an IR infrared cut filter film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film and a diaphragm; the combination method can effectively inhibit stray light and improve the infrared light cut-off rate.
The fifth combination mode: coating an IR infrared cut filter film and an AR anti-reflection film on the first coating interface, and coating an IR infrared cut filter film and an AR anti-reflection film on the second coating interface; the combination mode can cut off the unnecessary wave band and increase the reflection of the required wave band, and the illumination of the image surface is improved.
A sixth combination: plating diaphragm on the first plating interface and plating diaphragm on the second plating interface; the combination mode transmits all wave bands and reduces stray light.
A seventh combination: coating an IR infrared cut filter film and an AR anti-reflection film on the first coating interface, and coating a diaphragm on the second coating interface; the combination mode effectively improves the transmittance of the required wave band.
The eighth combination mode: coating interface I is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film and an AR anti-reflection film; the combination mode can improve the cutoff rate of the unnecessary wave band and the transmittance of the required wave band to the maximum extent.
Ninth combination: coating the first coating interface with an IR cut-off filter film, an AR antireflection film and a diaphragm, and coating the second coating interface with a diaphragm; the combination mode can effectively improve the transmittance and reduce the stray light to the maximum extent;
the tenth combination mode: coating interface I is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm, and coating interface II is coated with an IR infrared cut filter film, an AR anti-reflection film and a diaphragm; the combination mode can improve the transmittance of the required wave band to the maximum extent, improve the cut-off rate of the unnecessary wave band and reduce the stray light to the maximum extent.
Example two
As shown in fig. 2, the present invention provides a wafer lens module, which includes a microlens 1, a residual layer two 22, a residual layer one 21, and an image sensor 5, which are disposed from top to bottom, wherein the microlens 1 corresponds to the image sensor 5, the residual layer one 21 is formed above the image sensor, the residual layer two 22 is formed above the residual layer one 21, and the microlens 1 is disposed above the residual layer two 22.
A first plating interface 6 is formed between the image sensor 5 and the first residual layer 21, and a second plating interface 7 is formed between the first residual layer 21 and the second residual layer 22.
The first coating interface 6 and the second coating interface 7 are coated with the coating layer according to actual needs, and the combination method is the same as that of the first embodiment, and is not described herein again.
Compared with the first embodiment, the wafer lens module in the first embodiment omits a glass wafer substrate and an optical adhesive film structure, the image sensor is used as the substrate, the optical film layer is directly plated on the surface of the image sensor to be combined with the residual layer, and the firmness is superior to the adhesion of the optical adhesive film to the image sensor and the wafer.
EXAMPLE III
As shown in fig. 3, the wafer lens module according to the present invention includes a microlens 1, a residual layer three 23, a residual layer two 22, a residual layer one 21, and an image sensor 5, which are disposed from top to bottom, wherein the microlens 1 corresponds to the image sensor 5, the residual layer one 21 is formed above the image sensor, the residual layer two 22 is formed above the residual layer one 21, the residual layer three 23 is formed above the residual layer two 22, and the microlens 1 is disposed above the residual layer three 23.
A first plating film interface 6 is formed between the first residual layer 21 and the second residual layer 22, and a second plating film interface 7 is formed between the second residual layer 22 and the third residual layer 23.
The first coating interface 6 and the second coating interface 7 are coated with the coating layer according to actual needs, and the combination method is the same as that of the first embodiment, and is not described herein again.
Compared with the wafer lens module in the second embodiment, two coating interfaces are formed on the residual layer, so that the adhesive force of the film layer is greatly improved, and the reliability of the product is stronger.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A wafer lens module comprises at least one micro lens, a glass wafer substrate, an optical adhesive film and at least one image sensor, wherein the micro lens, the glass wafer substrate, the optical adhesive film and the at least one image sensor are arranged from top to bottom; the optical film is characterized by further comprising at least one residual layer, wherein the residual layer is formed between the lens and the glass wafer substrate, a first coating interface is formed between the lower surface of the glass wafer substrate and the optical film, and a second coating interface is formed between the upper surface of the glass wafer substrate and the residual layer.
2. A wafer lens module comprises at least one micro lens and at least one image sensor which are arranged from top to bottom, wherein the micro lens corresponds to the image sensor in position.
3. The wafer lens module of claim 2, further comprising a third residual layer formed over the second residual layer, a first plated film interface formed between the first residual layer and the second residual layer, and a second plated film interface formed between the second residual layer and the third residual layer.
4. The wafer lens module according to any one of claims 1-3, wherein the first coating interface is coated with an IR cut filter and the second coating interface is coated with a stop.
5. The wafer lens module according to any one of claims 1-3, wherein the first coating interface is coated with an IR cut filter and the stop, and the second coating interface is coated with an IR cut filter.
6. The wafer lens module according to any one of claims 1-3, wherein the first coating interface is coated with the IR cut filter and the stop, and the second coating interface is coated with the stop.
7. The wafer lens module as set forth in any one of claims 1-3, wherein the first coating interface is coated with an IR cut filter, an AR reflection reducing coating, and the second coating interface is coated with a stop.
8. The wafer lens module as set forth in any one of claims 1 to 3, wherein the first coated interface is coated with the IR cut filter, the AR antireflection film and the stop, and the second coated interface is coated with the IR cut filter and the AR antireflection film.
9. The wafer lens module according to any one of claims 1-3, wherein the first coated interface is coated with IR cut filter, AR antireflection film and stop, and the second coated interface is coated with stop.
10. The wafer lens module of any of claims 1-3, wherein the first coating interface and the second coating interface are coated with the same layer or combination of layers, respectively: (a) an IR infrared cut filter film and a diaphragm; (b) an IR cut filter film and an AR antireflection film; (c) a diaphragm; (d) an IR infrared cut filter film, an AR antireflection film and a diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166094.9A CN110808259A (en) | 2019-11-25 | 2019-11-25 | Wafer lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166094.9A CN110808259A (en) | 2019-11-25 | 2019-11-25 | Wafer lens module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110808259A true CN110808259A (en) | 2020-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911166094.9A Pending CN110808259A (en) | 2019-11-25 | 2019-11-25 | Wafer lens module |
Country Status (1)
| Country | Link |
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| CN (1) | CN110808259A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1619826A (en) * | 2003-11-21 | 2005-05-25 | 联华电子股份有限公司 | Manufacturing method of image sensor element |
| CN101542246A (en) * | 2007-06-08 | 2009-09-23 | 浜松光子学株式会社 | Spectroscopic module |
| CN103201838A (en) * | 2010-06-14 | 2013-07-10 | 赫普塔冈微光学有限公司 | Method of manufacturing a plurality of optical devices |
-
2019
- 2019-11-25 CN CN201911166094.9A patent/CN110808259A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1619826A (en) * | 2003-11-21 | 2005-05-25 | 联华电子股份有限公司 | Manufacturing method of image sensor element |
| CN101542246A (en) * | 2007-06-08 | 2009-09-23 | 浜松光子学株式会社 | Spectroscopic module |
| CN103201838A (en) * | 2010-06-14 | 2013-07-10 | 赫普塔冈微光学有限公司 | Method of manufacturing a plurality of optical devices |
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Application publication date: 20200218 |