CN110803910A - Preparation method of high-water-resistance gypsum-based heat-insulation composite board - Google Patents
Preparation method of high-water-resistance gypsum-based heat-insulation composite board Download PDFInfo
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- CN110803910A CN110803910A CN201911159530.XA CN201911159530A CN110803910A CN 110803910 A CN110803910 A CN 110803910A CN 201911159530 A CN201911159530 A CN 201911159530A CN 110803910 A CN110803910 A CN 110803910A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/14—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B24/00—Use of organic materials as active ingredients for mortars, concrete or artificial stone, e.g. plasticisers
- C04B24/24—Macromolecular compounds
- C04B24/26—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B24/2688—Copolymers containing at least three different monomers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B40/00—Processes, in general, for influencing or modifying the properties of mortars, concrete or artificial stone compositions, e.g. their setting or hardening ability
- C04B40/0028—Aspects relating to the mixing step of the mortar preparation
- C04B40/0039—Premixtures of ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/20—Resistance against chemical, physical or biological attack
- C04B2111/27—Water resistance, i.e. waterproof or water-repellent materials
Abstract
The invention relates to a preparation method of a high-water-resistance gypsum-based heat-insulation composite board, belonging to the technical field of building materials. According to the invention, the organosilicon modified paraffin emulsion is added to prepare a high-water-resistance gypsum heat-insulating material, the molecular main chain of organosilicon contains Si groups or certain reactive silicon-containing compounds, a cross-linked net film structure can be formed in gypsum, and the cross-linked net film structure can be attached to the inner hole wall, so that the defects in the gypsum heat-insulating plate are filled, the water resistance of the plate is improved, and the organosilicon waterproof agent has good hydrophobic performance due to high rotational freedom and low surface energy of silicon-containing molecular chains, and the water absorption of the plate can be obviously reduced; after the paraffin is prepared into the emulsion, the paraffin can be uniformly adsorbed on the plate, so that the waterproof performance is improved.
Description
Technical Field
The invention relates to a preparation method of a high-water-resistance gypsum-based heat-insulation composite board, belonging to the technical field of building materials.
Background
The energy conservation of the building can effectively relieve the contradiction between urban development and energy shortage, and realize the sustainable development of the economic society. One of the effective methods for building energy conservation is to use the building external wall heat-insulating material, gypsum is applied to the field of building materials due to the advantages of heat insulation, noise reduction and the like of products of gypsum, the gypsum is used as a new generation of green environment-friendly building material, and deep processing of gypsum products is concerned by a plurality of researchers. The storage capacity of the gypsum is large, the resources are abundant, but most of the used gypsum is raw materials or primary low-end products, so that the resources are greatly wasted, the gypsum resources are optimized to the maximum extent reasonably, and the existing economic policy is met.
The gypsum product has gaps and pores, is a porous structure, and has a porous network inside, so that the internal surface area is large, the structure is related to the interaction force among gypsum crystals and the nature and the quantity of contact points among crystal particles, and because of the large internal surface area, when the gypsum meets water, water flows into the gypsum along capillary pores to partially dissolve the gypsum, so that the strength is reduced, and the gypsum product is easy to absorb water mainly has the following three reasons: (1) because of construction needs, the water amount which is often added in the process of hydration and hardening of the gypsum is larger than the theoretical water requirement, redundant water in the gypsum is evaporated after the gypsum is hardened, a plurality of micropore gaps are formed in the gypsum, the pore passages are communicated with each other, and when the gypsum meets water, the water can permeate into the gypsum through the pore passages, so that the gypsum has poor waterproofness, the internal structure of the gypsum is damaged, and the mechanical property of the gypsum is influenced; (2) a large number of hydrophilic groups exist on the surface of the gypsum, so that the surface of the gypsum is easy to absorb water; (3) the solubility of the gypsum is relatively high, the gypsum is dissolved when meeting water, and the contact points of crystals inside the gypsum are also dissolved, so that the strength of the gypsum is reduced.
The gypsum material has the advantages of strong air permeability, fire resistance, easily available raw materials, strong plasticity, low manufacturing cost and the like, and also has the defects of strong water absorption and easy moisture deformation, thereby greatly limiting the application field of the gypsum material.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: aiming at the problems of strong water absorption and easy deformation caused by moisture of gypsum materials, the preparation method of the high-water-resistance gypsum-based heat-insulation composite board is provided.
In order to solve the technical problems, the invention adopts the technical scheme that:
(1) respectively weighing 100-120 parts by weight of portland cement, 100-120 parts by weight of gypsum powder, 40-48 parts by weight of epoxy resin modified styrene-acrylic emulsion, 20-24 parts by weight of organic silicon modified paraffin emulsion, 1.0-1.2 parts by weight of sodium citrate, 10-12 parts by weight of vitrified micro bubbles, 10-12 parts by weight of polyvinyl alcohol, 0.5-0.6 part by weight of polycarboxylic acid high-efficiency water reducing agent and 50-60 parts by weight of deionized water;
(2) adding the organic silicon modified paraffin emulsion into gypsum powder, placing the gypsum powder into a high-speed stirrer, and stirring the mixture for 30-40 min at the rotating speed of 4000-5000 r/min at normal temperature to obtain a gypsum mixture;
(2) adding the epoxy resin modified styrene-acrylic emulsion, sodium citrate, vitrified micro bubbles and polyvinyl alcohol into deionized water, placing the mixture in a high-speed shearing machine, and stirring the mixture for 20 to 30 minutes at the normal temperature at the rotating speed of 8000 to 10000r/min to obtain mixed emulsion;
(3) adding the gypsum mixture and the portland cement into the mixed emulsion, and stirring at the rotating speed of 300-350 r/min for 1-2 h at normal temperature to obtain mixed slurry;
(3) and pouring the mixed slurry into a mold, standing and curing at normal temperature for 4-8 days, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
The average particle size of the vitrified micro bubbles in the step (1) is 20-40 mu m.
The specification of the die in the step (4) is 120cm multiplied by 60cm multiplied by 40 cm.
The specific preparation steps of the organosilicon modified paraffin emulsion in the step (1) are as follows:
(1) respectively weighing 20-30 parts of paraffin, 2-3 parts of polyoxyethylene lauryl ether, 2-3 parts of polyoxyethylene octylphenol ether, 8-12 parts of hydroxy silicone oil, 2-3 parts of polydimethylsiloxane and 80-120 parts of deionized water in parts by weight;
(2) adding polyoxyethylene lauryl ether and polyoxyethylene octylphenol ether into paraffin, and stirring at the rotating speed of 200-250 r/min for 30-40 min under the condition of an oil bath at the temperature of 120-160 ℃ to obtain liquid paraffin mixed liquid;
(3) heating hydroxyl silicone oil and deionized water to 60-70 ℃, adding the mixture into the liquid paraffin mixed solution, placing the mixture into a high-shear emulsifying machine, and stirring and emulsifying the mixture for 2-4 hours at the rotating speed of 8000-10000 r/min under the condition of oil bath at the temperature of 100-120 ℃ to obtain an emulsion;
(4) adding polydimethylsiloxane into the emulsion, placing the emulsion in an ultrasonic dispersion machine, and performing ultrasonic treatment for 20-30 min at normal temperature to obtain the organic silicon modified paraffin emulsion.
And (4) the power of ultrasonic treatment in the step (4) is 400-500W.
The solid content of the organosilicon modified paraffin emulsion in the step (4) is 40%.
The specific preparation steps of the epoxy resin modified styrene-acrylic emulsion in the step (1) are as follows:
(1) respectively weighing 30-40 parts of styrene, 36-48 parts of acrylic acid, 24-32 parts of butyl acrylate, 18-24 parts of methyl methacrylate, 6-8 parts of bisphenol A epoxy resin, 1.2-1.6 parts of nonylphenol polyoxyethylene ether, 0.6-0.8 part of sodium dodecyl sulfate, 0.3-0.4 part of sodium persulfate, 15-20 parts of sodium carbonate, 6-8 parts of glycerol and 60-80 parts of deionized water in parts by weight;
(2) adding nonylphenol polyoxyethylene ether and sodium dodecyl sulfate into 1/2 parts by weight of deionized water, and stirring at the rotating speed of 120-160 r/min for 10-15 min at normal temperature to obtain an emulsifier solution;
(3) adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into an emulsifier solution, and stirring at the normal temperature at the rotating speed of 180-200 r/min for 30-40 min to obtain a pre-emulsion;
(5) adding sodium persulfate into 1/4 parts by weight of deionized water, and stirring at the rotating speed of 160-180 r/min for 10-12 min at normal temperature to obtain an initiator solution;
(5) adding sodium carbonate into the residual 1/4 parts by weight of deionized water, and stirring at the normal temperature at the rotating speed of 180-200 r/min for 8-10 min to obtain a sodium carbonate solution;
(6) adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of initiator solution into sodium carbonate solution, and stirring for 1-2 hours at a rotating speed of 200-240 r/min under a water bath condition of 50-60 ℃ to obtain seed emulsion;
(7) adding bisphenol A epoxy resin, glycerol, the rest 1/2 parts by weight of initiator solution and the rest 2/3 pre-emulsion into the seed emulsion, and stirring for 2-3 hours at a rotating speed of 250-300 r/min under a water bath condition of 70-80 ℃ to obtain reaction emulsion;
(7) and (3) standing and cooling the reaction emulsion at normal temperature, and adjusting the pH to 7.5-8.5 to obtain the epoxy resin modified styrene-acrylic emulsion. And (4) adopting ammonia water with the mass fraction of 1% for pH adjustment in the step (7).
Compared with other methods, the method has the beneficial technical effects that:
the invention prepares a high-water-resistance gypsum heat-insulating material by adding organosilicon modified paraffin emulsion, wherein the main chain of the molecule of organosilicon contains Si group or a certain reactive silicon-containing compound, when the high-molecular compound is mixed with inorganic base material for molding, on one hand, the high-molecular compound can form a cross-linked net film structure in a gypsum system through self hydrolysis condensation, on the other hand, the organosilicon can perform condensation with hydroxyl on the surface of gypsum, thereby generating firm adsorption with the gypsum base material, so that the gypsum heat-insulating board modified by the organosilicon has good water resistance and larger compressive strength, the organosilicon can permeate into the interior of the gypsum or even the whole gypsum heat-insulating board after being mixed with the gypsum, at the moment, the cross-linked net film formed between the organosilicon and the gypsum base material can be attached to the inner hole wall, thereby filling the defect of the gypsum heat-insulating board, the compression strength of the product is improved while the water resistance is improved, and the molecular structure characteristics of the organic silicon show that the organic silicon has high bond energy due to the fact that the organic silicon molecular chain contains alternate Si-O, Si-O or Si-C bonds, so that after the organic silicon is used on the gypsum insulation board, the insulation board has good thermal stability and can be used at a high temperature; in addition, the organosilicon waterproofing agent has good hydrophobic property due to high rotational freedom degree and low surface energy of the silicon-containing molecular chain, and can obviously reduce the water absorption of the gypsum insulation board when used on the gypsum insulation board; after the paraffin is prepared into the emulsion, the particles are small, so that the wax particles can be separated out from a water phase through demulsification in the manufacturing process of the artificial board and are uniformly adsorbed on the board, the waterproof performance of the board is improved, the using amount of the paraffin is obviously reduced, compared with solid paraffin, the paraffin emulsion does not need to be melted or dissolved when in use, the formed film is uniform, the coverage is good, and the water resistance of the gypsum-based heat-insulation composite board can be effectively improved.
Detailed Description
Respectively weighing 30-40 parts of styrene, 36-48 parts of acrylic acid, 24-32 parts of butyl acrylate, 18-24 parts of methyl methacrylate, 6-8 parts of bisphenol A epoxy resin, 1.2-1.6 parts of nonylphenol polyoxyethylene ether, 0.6-0.8 part of sodium dodecyl sulfate, 0.3-0.4 part of sodium persulfate, 15-20 parts of sodium carbonate, 6-8 parts of glycerol and 60-80 parts of deionized water, adding nonylphenol polyoxyethylene ether and sodium dodecyl sulfate into 1/2 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 120-160 r/min for 10-15 min to obtain an emulsifier solution, adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into the emulsifier solution, stirring at the normal temperature at the rotating speed of 180-200 r/min for 30-40 min to obtain a pre-emulsion, adding sodium persulfate into 1/4 parts of deionized water by weight, stirring at a rotating speed of 160-180 r/min for 10-12 min at normal temperature to obtain an initiator solution, adding sodium carbonate into the residual 1/4 parts by weight of deionized water, stirring at a rotating speed of 180-200 r/min for 8-10 min at normal temperature to obtain a sodium carbonate solution, adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of the initiator solution into the sodium carbonate solution, stirring at a rotating speed of 200-240 r/min for 1-2 h at a water bath condition of 50-60 ℃ to obtain a seed emulsion, adding bisphenol A epoxy resin, glycerol, the residual 1/2 parts by weight of the initiator solution and the residual 2/3 parts by weight of the pre-emulsion into the seed emulsion, stirring at a rotating speed of 250-300 r/min for 2-3 h at a water bath condition of 70-80 ℃ to obtain a reaction emulsion, standing and cooling the reaction emulsion at normal temperature, dropwise adding ammonia water with a mass fraction of 1% to adjust the pH to 7.5-8.5, obtaining epoxy resin modified styrene-acrylic emulsion;
respectively weighing 20-30 parts of paraffin, 2-3 parts of polyoxyethylene lauryl ether, 2-3 parts of polyoxyethylene octylphenol ether, 8-12 parts of hydroxy silicone oil, 2-3 parts of polydimethylsiloxane and 80-120 parts of deionized water according to parts by weight, adding the polyoxyethylene lauryl ether and the polyoxyethylene octylphenol ether into the paraffin, stirring the mixture for 30 to 40min at a rotating speed of 200 to 250r/min under the condition of an oil bath at the temperature of 120 to 160 ℃ to obtain liquid paraffin mixed solution, heating the hydroxyl silicone oil and the deionized water to the temperature of 60 to 70 ℃, adding the mixture into the liquid paraffin mixed solution, placing the mixture into a high-shear emulsifying machine, stirring and emulsifying for 2-4 h at 8000-10000 r/min under the condition of oil bath at 100-120 ℃ to obtain emulsion, adding polydimethylsiloxane into the emulsion, placing the mixture in an ultrasonic dispersion machine, and carrying out ultrasonic treatment for 20-30 min at normal temperature with the power of 400-500W to obtain organic silicon modified paraffin emulsion with the solid content of 40%;
then respectively weighing 100-120 parts of portland cement, 100-120 parts of gypsum powder, 40-48 parts of epoxy resin modified styrene-acrylic emulsion, 20-24 parts of organic silicon modified paraffin emulsion, 1.0-1.2 parts of sodium citrate, 10-12 parts of vitrified micro bubbles with the average particle size of 20-40 mu m, 10-12 parts of polyvinyl alcohol, 0.5-0.6 part of polycarboxylic acid high-efficiency water reducing agent and 50-60 parts of deionized water according to parts by weight, adding the organic silicon modified paraffin emulsion into the gypsum powder, placing the gypsum powder in a high-speed stirrer, stirring the gypsum powder at the normal temperature at the rotating speed of 4000-5000 r/min for 30-40 min to obtain a gypsum mixture, adding the epoxy resin modified styrene-acrylic emulsion, the sodium citrate, the vitrified micro bubbles and the polyvinyl alcohol into the deionized water, placing the gypsum powder in a high-speed shearing machine, stirring the gypsum mixture at the normal temperature at the rotating speed of 8000-10000 r/min for 20-30 min to obtain a mixed emulsion, stirring at the rotation speed of 300-350 r/min for 1-2 h at normal temperature to obtain mixed slurry, pouring the mixed slurry into a mold with the specification of 120cm × 60cm × 40cm, standing and curing at normal temperature for 4-8 days, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
Example 1
Respectively weighing 30 parts of styrene, 36 parts of acrylic acid, 24 parts of butyl acrylate, 18 parts of methyl methacrylate, 6 parts of bisphenol A epoxy resin, 1.2 parts of nonylphenol polyoxyethylene ether, 0.6 part of lauryl sodium sulfate, 0.3 part of sodium persulfate, 15 parts of sodium carbonate, 6 parts of glycerol and 60 parts of deionized water, adding nonylphenol polyoxyethylene ether and lauryl sodium sulfate into 1/2 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 120r/min for 10min to obtain an emulsifier solution, adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into the emulsifier solution, stirring at the normal temperature at the rotating speed of 180r/min for 300min to obtain a pre-emulsion, adding sodium persulfate into 1/4 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 160r/min for 10min to obtain an initiator solution, adding sodium carbonate into the rest 1/4 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 180r/min for 8min to obtain a sodium carbonate solution, adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of initiator solution into the sodium carbonate solution, stirring for 1h at the rotating speed of 200r/min under the water bath condition of 50 ℃ to obtain seed emulsion, adding bisphenol A epoxy resin, glycerol, the rest 1/2 parts by weight of initiator solution and the rest 2/3 pre-emulsion into the seed emulsion, stirring for 2h at the rotating speed of 250r/min under the water bath condition of 70 ℃ to obtain reaction emulsion, standing and cooling the reaction emulsion at the normal temperature, adding 1 mass percent of ammonia water, and adjusting the pH to 7.5 to obtain epoxy resin modified styrene-acrylic emulsion;
respectively weighing 20 parts of paraffin, 2 parts of polyoxyethylene lauryl ether, 2 parts of polyoxyethylene octylphenol ether, 8 parts of hydroxy silicone oil, 2 parts of polydimethylsiloxane and 80 parts of deionized water according to parts by weight, adding the polyoxyethylene lauryl ether and the polyoxyethylene octylphenol ether into the paraffin, stirring for 30min at the rotating speed of 200r/min under the condition of an oil bath at 120 ℃ to obtain liquid paraffin mixed liquid, heating the hydroxy silicone oil and the deionized water to 60 ℃, adding the liquid paraffin mixed liquid into a high-shear emulsifying machine, stirring and emulsifying for 2h at the rotating speed of 8000r/min under the condition of an oil bath at 100 ℃ to obtain an emulsion, adding the polydimethylsiloxane into the emulsion, placing the emulsion into an ultrasonic dispersing machine, and carrying out ultrasonic treatment for 20min at the normal temperature by the power of 400W to obtain the organosilicon modified paraffin emulsion with the solid content of 40%; respectively weighing 100 parts of portland cement, 100 parts of gypsum powder, 40 parts of epoxy resin modified styrene-acrylic emulsion, 20 parts of organic silicon modified paraffin emulsion, 1.0 part of sodium citrate, 10 parts of vitrified micro-beads with the average particle size of 20 mu m, 10 parts of polyvinyl alcohol, 0.5 part of polycarboxylic acid high-efficiency water reducing agent and 50 parts of deionized water according to parts by weight, adding the organic silicon modified paraffin emulsion into the gypsum powder, placing the gypsum powder in a high-speed stirrer, stirring the gypsum powder at the normal temperature for 30min at the rotating speed of 4000r/min to obtain a gypsum mixture, adding the epoxy resin modified styrene-acrylic emulsion, the sodium citrate, the vitrified micro-beads and the polyvinyl alcohol into the deionized water, placing the mixture in a high-speed shearing machine, stirring the mixture at the normal temperature for 20min at the rotating speed of 8000r/min to obtain a mixed emulsion, adding the gypsum mixture and the portland cement into the mixed emulsion, stirring the mixture at the, and pouring the mixed slurry into a mold with the specification of 120cm multiplied by 60cm multiplied by 40cm, standing and curing for 4 days at normal temperature, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
Example 2
Respectively weighing 35 parts of styrene, 42 parts of acrylic acid, 28 parts of butyl acrylate, 21 parts of methyl methacrylate, 7 parts of bisphenol A epoxy resin, 1.4 parts of nonylphenol polyoxyethylene ether, 0.7 part of lauryl sodium sulfate, 0.35 part of sodium persulfate, 17.5 parts of sodium carbonate, 7 parts of glycerol and 70 parts of deionized water, adding nonylphenol polyoxyethylene ether and lauryl sodium sulfate into 1/2 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 140r/min for 12.5min to obtain an emulsifier solution, adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into the emulsifier solution, stirring at the normal temperature at the rotating speed of 190r/min for 35min to obtain a pre-emulsion, adding sodium persulfate into 1/4 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 170r/min for 11min to obtain an initiator solution, adding sodium carbonate into the rest 1/4 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 190r/min for 9min to obtain a sodium carbonate solution, adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of initiator solution into the sodium carbonate solution, stirring for 1.5h at the rotating speed of 220r/min under the water bath condition of 55 ℃ to obtain seed emulsion, adding bisphenol A epoxy resin, glycerol, the rest 1/2 parts by weight of initiator solution and the rest 2/3 pre-emulsion into the seed emulsion, stirring for 2.5h at the rotating speed of 275r/min under the water bath condition of 75 ℃ to obtain reaction emulsion, standing and cooling the reaction emulsion at the normal temperature, adding 1% by mass of ammonia water to adjust the pH to 8, and obtaining epoxy resin modified styrene-acrylic emulsion;
respectively weighing 25 parts of paraffin, 2.5 parts of polyoxyethylene lauryl ether, 2.5 parts of polyoxyethylene octylphenol ether, 10 parts of hydroxy silicone oil, 2.5 parts of polydimethylsiloxane and 100 parts of deionized water according to parts by weight, adding the polyoxyethylene lauryl ether and the polyoxyethylene octylphenol ether into the paraffin, stirring for 35min at the rotating speed of 225r/min under the condition of oil bath at 140 ℃ to obtain liquid paraffin mixed liquid, heating the hydroxy silicone oil and the deionized water to 65 ℃, adding the liquid paraffin mixed liquid into a high-shear emulsifying machine, stirring and emulsifying for 3h at the rotating speed of 9000r/min under the condition of oil bath at 110 ℃ to obtain emulsion, adding the polydimethylsiloxane into the emulsion, placing the emulsion into an ultrasonic dispersing machine, and carrying out ultrasonic treatment for 25min at the normal temperature and the power of 450W to obtain the organosilicon modified paraffin emulsion with the solid content of 40%;
then respectively weighing 110 parts of portland cement, 110 parts of gypsum powder, 44 parts of epoxy resin modified styrene-acrylic emulsion, 22 parts of organic silicon modified paraffin emulsion, 1.1 parts of sodium citrate, 11 parts of vitrified micro-beads with the average particle size of 30 mu m, 11 parts of polyvinyl alcohol, 0.55 part of polycarboxylic acid high-efficiency water reducing agent and 55 parts of deionized water according to parts by weight, adding the organic silicon modified paraffin emulsion into the gypsum powder, placing the gypsum powder in a high-speed stirrer, stirring at the normal temperature at the rotating speed of 4500r/min for 35min to obtain a gypsum mixture, adding the epoxy resin modified styrene-acrylic emulsion, the sodium citrate, the vitrified micro-beads and the polyvinyl alcohol into the deionized water, placing the mixture in a high-speed shearing machine, stirring at the rotating speed of 9000r/min at the normal temperature for 25min to obtain a mixed emulsion, adding the gypsum mixture and the portland cement into the mixed emulsion, stirring at the normal temperature at the rotating speed of 325, and pouring the mixed slurry into a mold with the specification of 120cm multiplied by 60cm multiplied by 40cm, standing and curing for 6 days at normal temperature, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
Example 3
Respectively weighing 40 parts of styrene, 48 parts of acrylic acid, 32 parts of butyl acrylate, 24 parts of methyl methacrylate, 8 parts of bisphenol A epoxy resin, 1.6 parts of nonylphenol polyoxyethylene ether, 0.8 part of lauryl sodium sulfate, 0.4 part of sodium persulfate, 20 parts of sodium carbonate, 8 parts of glycerol and 80 parts of deionized water, adding nonylphenol polyoxyethylene ether and lauryl sodium sulfate into 1/2 parts of deionized water by weight, stirring at the rotating speed of 160r/min for 15min at normal temperature to obtain an emulsifier solution, adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into the emulsifier solution, stirring at the rotating speed of 200r/min at normal temperature for 40min to obtain a pre-emulsion, adding sodium persulfate into 1/4 parts of deionized water by weight, stirring at the rotating speed of 180r/min at normal temperature for 12min to obtain an initiator solution, adding sodium carbonate into the rest 1/4 parts of deionized water by weight, stirring at the normal temperature at the rotating speed of 200r/min for 10min to obtain a sodium carbonate solution, adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of initiator solution into the sodium carbonate solution, stirring for 2h at the rotating speed of 240r/min under the water bath condition of 60 ℃ to obtain seed emulsion, adding bisphenol A epoxy resin, glycerol, the rest 1/2 parts by weight of initiator solution and the rest 2/3 pre-emulsion into the seed emulsion, stirring for 3h at the rotating speed of 300r/min under the water bath condition of 80 ℃ to obtain reaction emulsion, standing and cooling the reaction emulsion at the normal temperature, adding 1 mass percent of ammonia water, and adjusting the pH to 8.5 to obtain epoxy resin modified styrene-acrylic emulsion;
respectively weighing 30 parts of paraffin, 3 parts of polyoxyethylene lauryl ether, 3 parts of polyoxyethylene octylphenol ether, 12 parts of hydroxy silicone oil, 3 parts of polydimethylsiloxane and 120 parts of deionized water according to parts by weight, adding the polyoxyethylene lauryl ether and the polyoxyethylene octylphenol ether into the paraffin, stirring for 40min at the rotating speed of 250r/min under the condition of an oil bath at 160 ℃ to obtain liquid paraffin mixed liquid, heating the hydroxy silicone oil and the deionized water to 70 ℃, adding the liquid paraffin mixed liquid into a high-shear emulsifying machine, stirring and emulsifying for 4h at the rotating speed of 10000r/min under the condition of the oil bath at 120 ℃ to obtain an emulsion, adding the polydimethylsiloxane into the emulsion, placing the emulsion into an ultrasonic dispersing machine, and carrying out ultrasonic treatment for 30min at the normal temperature by the power of 500W to obtain the organosilicon modified paraffin emulsion with the solid content of 40%; respectively weighing 120 parts of portland cement, 120 parts of gypsum powder, 48 parts of epoxy resin modified styrene-acrylic emulsion, 24 parts of organic silicon modified paraffin emulsion, 1.2 parts of sodium citrate, 12 parts of vitrified micro-beads with the average particle size of 40 mu m, 12 parts of polyvinyl alcohol, 0.6 part of polycarboxylic acid high-efficiency water reducing agent and 60 parts of deionized water according to parts by weight, adding the organic silicon modified paraffin emulsion into the gypsum powder, placing the gypsum powder in a high-speed stirrer, stirring at the normal temperature at the rotating speed of 5000r/min for 40min to obtain a gypsum mixture, adding the epoxy resin modified styrene-acrylic emulsion, the sodium citrate, the vitrified micro-beads and the polyvinyl alcohol into the deionized water, placing the mixture in a high-speed shearing machine, stirring at the normal temperature at the rotating speed of 10000r/min for 30min to obtain a mixed emulsion, adding the gypsum mixture and the portland cement into the mixed emulsion, stirring at the normal temperature at the rotating speed of, and pouring the mixed slurry into a mold with the specification of 120cm multiplied by 60cm multiplied by 40cm, standing and curing for 8 days at normal temperature, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
Claims (8)
1. A preparation method of a high-water-resistance gypsum-based heat-insulation composite board is characterized by comprising the following specific preparation steps:
(1) respectively weighing 100-120 parts by weight of portland cement, 100-120 parts by weight of gypsum powder, 40-48 parts by weight of epoxy resin modified styrene-acrylic emulsion, 20-24 parts by weight of organic silicon modified paraffin emulsion, 1.0-1.2 parts by weight of sodium citrate, 10-12 parts by weight of vitrified micro bubbles, 10-12 parts by weight of polyvinyl alcohol, 0.5-0.6 part by weight of polycarboxylic acid high-efficiency water reducing agent and 50-60 parts by weight of deionized water;
(2) adding the organic silicon modified paraffin emulsion into gypsum powder, placing the gypsum powder into a high-speed stirrer, and stirring the mixture for 30-40 min at the rotating speed of 4000-5000 r/min at normal temperature to obtain a gypsum mixture;
(2) adding the epoxy resin modified styrene-acrylic emulsion, sodium citrate, vitrified micro bubbles and polyvinyl alcohol into deionized water, placing the mixture in a high-speed shearing machine, and stirring the mixture for 20 to 30 minutes at the normal temperature at the rotating speed of 8000 to 10000r/min to obtain mixed emulsion;
(3) adding the gypsum mixture and the portland cement into the mixed emulsion, and stirring at the rotating speed of 300-350 r/min for 1-2 h at normal temperature to obtain mixed slurry;
(3) and pouring the mixed slurry into a mold, standing and curing at normal temperature for 4-8 days, and demolding to obtain the high-water-resistance gypsum-based heat-insulation composite board.
2. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board according to claim 1, wherein the average particle size of the vitrified micro bubbles in the step (1) is 20-40 μm.
3. The method for preparing the high-water-resistance gypsum-based heat-insulating composite board as claimed in claim 1, wherein the specification of the mold in the step (4) is 120cm x 60cm x 40 cm.
4. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board according to claim 1, wherein the specific preparation steps of the organosilicon modified paraffin emulsion in the step (1) are as follows:
(1) respectively weighing 20-30 parts of paraffin, 2-3 parts of polyoxyethylene lauryl ether, 2-3 parts of polyoxyethylene octylphenol ether, 8-12 parts of hydroxy silicone oil, 2-3 parts of polydimethylsiloxane and 80-120 parts of deionized water in parts by weight;
(2) adding polyoxyethylene lauryl ether and polyoxyethylene octylphenol ether into paraffin, and stirring at the rotating speed of 200-250 r/min for 30-40 min under the condition of an oil bath at the temperature of 120-160 ℃ to obtain liquid paraffin mixed liquid;
(3) heating hydroxyl silicone oil and deionized water to 60-70 ℃, adding the mixture into the liquid paraffin mixed solution, placing the mixture into a high-shear emulsifying machine, and stirring and emulsifying the mixture for 2-4 hours at the rotating speed of 8000-10000 r/min under the condition of oil bath at the temperature of 100-120 ℃ to obtain an emulsion;
(4) adding polydimethylsiloxane into the emulsion, placing the emulsion in an ultrasonic dispersion machine, and performing ultrasonic treatment for 20-30 min at normal temperature to obtain the organic silicon modified paraffin emulsion.
5. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board according to claim 4, wherein the power of the ultrasonic treatment in the step (4) is 400-500W.
6. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board as claimed in claim 4, wherein the solid content of the organosilicon-modified paraffin emulsion in the step (4) is 40%.
7. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board as claimed in claim 1, wherein the specific preparation steps of the epoxy resin modified styrene-acrylic emulsion in the step (1) are as follows:
(1) respectively weighing 30-40 parts of styrene, 36-48 parts of acrylic acid, 24-32 parts of butyl acrylate, 18-24 parts of methyl methacrylate, 6-8 parts of bisphenol A epoxy resin, 1.2-1.6 parts of nonylphenol polyoxyethylene ether, 0.6-0.8 part of sodium dodecyl sulfate, 0.3-0.4 part of sodium persulfate, 15-20 parts of sodium carbonate, 6-8 parts of glycerol and 60-80 parts of deionized water in parts by weight;
(2) adding nonylphenol polyoxyethylene ether and sodium dodecyl sulfate into 1/2 parts by weight of deionized water, and stirring at the rotating speed of 120-160 r/min for 10-15 min at normal temperature to obtain an emulsifier solution;
(3) adding styrene, acrylic acid, butyl acrylate and methyl methacrylate into an emulsifier solution, and stirring at the normal temperature at the rotating speed of 180-200 r/min for 30-40 min to obtain a pre-emulsion;
(5) adding sodium persulfate into 1/4 parts by weight of deionized water, and stirring at the rotating speed of 160-180 r/min for 10-12 min at normal temperature to obtain an initiator solution;
(5) adding sodium carbonate into the residual 1/4 parts by weight of deionized water, and stirring at the normal temperature at the rotating speed of 180-200 r/min for 8-10 min to obtain a sodium carbonate solution;
(6) adding 1/3 parts by weight of pre-emulsion and 1/2 parts by weight of initiator solution into sodium carbonate solution, and stirring for 1-2 hours at a rotating speed of 200-240 r/min under a water bath condition of 50-60 ℃ to obtain seed emulsion;
(7) adding bisphenol A epoxy resin, glycerol, the rest 1/2 parts by weight of initiator solution and the rest 2/3 pre-emulsion into the seed emulsion, and stirring for 2-3 hours at a rotating speed of 250-300 r/min under a water bath condition of 70-80 ℃ to obtain reaction emulsion;
(7) and (3) standing and cooling the reaction emulsion at normal temperature, and adjusting the pH to 7.5-8.5 to obtain the epoxy resin modified styrene-acrylic emulsion.
8. The preparation method of the high-water-resistance gypsum-based heat-insulation composite board as claimed in claim 7, wherein the pH adjustment in the step (7) is 1% by mass of ammonia water.
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| CN113186755A (en) * | 2021-04-28 | 2021-07-30 | 湖南省科富花炮实业有限公司 | Preparation method of environment-friendly and safe line-fragrant fireworks |
| CN115160801A (en) * | 2022-07-20 | 2022-10-11 | 江苏博拓新型建筑材料股份有限公司 | Enhanced organic silicon microcapsule gypsum waterproof emulsion and preparation method and application thereof |
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| CN101974194A (en) * | 2010-09-29 | 2011-02-16 | 江苏科技大学 | Epoxy modified styrene-acrylate emulsion and preparation method thereof |
| CN108129122A (en) * | 2018-01-16 | 2018-06-08 | 四川华邦保和涂料有限公司 | A kind of preparation method of phosphorus paring stone cream base lightweight gravity flowing levelling mortar |
| CN109705364A (en) * | 2019-02-18 | 2019-05-03 | 济南大学 | A kind of preparation and its application of hyperbranched silicone modified paraffin |
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| CN101974194A (en) * | 2010-09-29 | 2011-02-16 | 江苏科技大学 | Epoxy modified styrene-acrylate emulsion and preparation method thereof |
| CN108129122A (en) * | 2018-01-16 | 2018-06-08 | 四川华邦保和涂料有限公司 | A kind of preparation method of phosphorus paring stone cream base lightweight gravity flowing levelling mortar |
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| CN113186755A (en) * | 2021-04-28 | 2021-07-30 | 湖南省科富花炮实业有限公司 | Preparation method of environment-friendly and safe line-fragrant fireworks |
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| CN115160801A (en) * | 2022-07-20 | 2022-10-11 | 江苏博拓新型建筑材料股份有限公司 | Enhanced organic silicon microcapsule gypsum waterproof emulsion and preparation method and application thereof |
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Application publication date: 20200218 |