CN110798773A

CN110798773A - Semi-in-ear earphone and assembling method thereof

Info

Publication number: CN110798773A
Application number: CN201911203493.8A
Authority: CN
Inventors: 何亮; 夏波; 詹寿昌; 邱肇源; 黄宗德
Original assignee: Hunan National Sound Pal Acoustics Technology Ltd
Current assignee: Hunan National Sound Pal Acoustics Technology Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-02-14

Abstract

The embodiment of the invention discloses a semi-in-ear earphone and an assembling method thereof, relating to the technical field of earphones. The semi-in-ear earphone comprises an earphone front shell and an earphone rear shell, wherein the earphone rear shell is arranged on the earphone front shell, the earphone front shell and the earphone rear shell are combined to form a cavity, and an earphone main board, a battery and a touch FPC are arranged in the cavity; the touch FPC is fixed on one end face of the battery and is fixed with the battery into a whole, and the touch FPC is electrically connected with the earphone main board. For current needs fix touch FPC earlier on the earphone backshell through electric core wire and earphone mainboard welded connection and need keep somewhere longer wire, the length of the connecting wire between touch FPC and the earphone mainboard can effectively be shortened in this application, very big earphone cavity inner space of saving satisfies the earphone towards the demand of miniaturized development, and assembly process is simple moreover, can effectively improve the efficiency of piling up of earphone when production.

Description

Semi-in-ear earphone and assembling method thereof

Technical Field

The invention relates to the technical field of earphones, in particular to a semi-in-ear earphone and an assembling method thereof.

Background

Besides the earphone main board, a touch FPC is required to be assembled in the existing earphone so as to increase the operation of a user for directly controlling the earphone through touch, and therefore the user experience can be greatly improved. Present equipment touch FPC commonly used welds earlier on touch FPC and connects the core wire to be connected to the earphone mainboard, then pastes touch FPC to the internal surface of corresponding earphone back lid again, and the earphone mainboard is in the earphone casing of assembling this moment in addition, just so require to connect the length of touch FPC and the connection core wire of earphone mainboard long enough, so can the equipment of better soldering tin.

However, the conventional assembly method needs to retain the long wire core, which results in that the inner cavity of the earphone needs a large space to store the redundant wire core, which inevitably needs to increase the volume of the earphone, and is not favorable for the demand of the earphone for miniaturization development. In addition, in the conventional assembly method, the touch FPC is directly attached to the inner surface of the rear cover of the earphone, so that a user is likely to have poor contact even when performing touch control.

Disclosure of Invention

In view of the above, an embodiment of the present invention provides a half-in-ear earphone and an assembling method thereof, so as to solve the problem that when the conventional half-in-ear earphone is assembled, a long wire core needs to be left, which results in a large space required for storing the extra wire core in an inner cavity of the earphone, which inevitably requires an increase in volume of the earphone, and is not favorable for the demand of miniaturization development of the earphone.

The technical scheme adopted by the invention for solving the technical problems is as follows:

according to an aspect of an embodiment of the present invention, a half-in-ear earphone is provided, including an earphone front shell and an earphone rear shell, where the earphone rear shell is disposed on the earphone front shell, the earphone front shell and the earphone rear shell form a cavity, and an earphone main board, a battery and a touch FPC are disposed in the cavity; the touch FPC is fixed on one end face of the battery and is fixed with the battery into a whole, and the touch FPC is electrically connected with the earphone mainboard.

The touch FPC comprises a touch FPC body and a battery, wherein foam is arranged between the touch FPC body and the battery, one surface of the foam is fixed to one surface of the touch FPC body, the other surface of the foam is fixed to the battery, and a conductive sponge is fixed to the other surface of the touch FPC body.

The foam is fixed with the touch FPC through colloid, and the foam is fixed with the battery through colloid.

The earphone comprises a battery, a cavity, a touch FPC, a battery, a front cavity and a rod cavity, wherein the cavity comprises the front cavity close to the ear and the rod cavity located in the portion of the earphone rod, the earphone main board is arranged in the rod cavity, the touch FPC is arranged in the front cavity after the battery is fixed into a whole, and the touch FPC is electrically connected with the earphone main board through a wire.

The earphone comprises a battery, a cavity, a touch FPC, a battery, a front cavity, a rod cavity and a battery, wherein the cavity comprises a front cavity close to the ear and a rod cavity located in the rod part of the earphone, the earphone main board is arranged in the rod cavity, the touch FPC and the battery are fixed into a whole and then placed in the front cavity, and pins of the touch FPC are directly welded to the earphone main board.

According to another aspect of an embodiment of the present invention, there is provided an assembling method of a half-in-ear headphone, including the steps of:

fixing a touch FPC on one end face of a battery to be fixed with the battery into a whole;

placing the touch FPC and the battery which are fixed into a whole in a cavity of the half-in-ear earphone;

placing an earphone main board in a half-in-ear earphone cavity;

electrically connecting a touch FPC with the earphone main board;

the rear shell of the earphone is buckled with the front shell of the earphone.

Wherein the fixing of the touch FPC on one end surface of the battery integrally with the battery includes:

arranging foam between the touch FPC and the battery, fixing one surface of the foam with one surface of the touch FPC, fixing the other surface of the foam with the battery, and fixing a conductive sponge on the other surface of the touch FPC.

One surface of the foam is fixed with the touch FPC through colloid, and the other surface of the foam is fixed with the battery through colloid.

Wherein, it includes to touch FPC with earphone mainboard electricity is connected:

and electrically connecting the touch FPC with the earphone mainboard through a conducting wire.

Wherein, it includes to touch FPC with earphone mainboard electricity is connected: and directly welding the pins of the touch FPC to the earphone mainboard.

According to the semi-in-ear earphone and the assembling method thereof provided by the embodiment of the invention, the touch FPC13 and the battery 12 are fixed into a whole and then are placed in the front cavity 101, and then the touch FPC13 is electrically connected with the earphone main board 11, so that compared with the existing method that the touch FPC is fixed on the earphone rear shell and is welded with the earphone main board through a cell lead to leave a longer lead, the length of the connecting lead between the touch FPC and the earphone main board can be effectively shortened, the internal space of the earphone cavity is greatly saved, the requirement of miniaturization development of the earphone is met, the assembling process is simple, and the stacking efficiency of the earphone in production can be effectively improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic perspective view of a half-in-ear headphone according to an embodiment of the present invention;

fig. 2 is an exploded view of a half-in-ear headphone according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating the combination and assembly of the battery and peripheral components of the half-in-ear earphone according to the embodiment of the present invention;

fig. 4 is a sectional view of a half-in-ear headphone according to an embodiment of the present invention.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Please refer to fig. 1 and fig. 4, which are schematic structural diagrams of a half-in-ear earphone according to an embodiment of the present invention. Only the portions related to the present embodiment are shown for convenience of explanation.

Referring to fig. 1 to 3, a half-in-ear earphone 1 provided in an embodiment of the present application includes an earphone front shell 10 and an earphone rear shell 20, where the earphone rear shell 20 is covered on the earphone front shell 10, the earphone front shell 10 and the earphone rear shell 20 are covered to form a cavity, and an earphone main board 11, a battery 12, and a touch FPC13 are disposed in the cavity; the touch FPC13 is fixed to one end face of the battery 12 and is fixed integrally with the battery 12, and the touch FPC13 is electrically connected to the earphone main board 11.

Referring to fig. 2 to 4, the cavity includes a front cavity 101 near the ear and a rod cavity 102 at the rod of the earphone, the earphone main board 11 is disposed in the rod cavity, the touch FPC13 is fixed with the battery 12 and then placed in the front cavity 101, and the touch FPC13 is electrically connected to the earphone main board 11 through an electrical conductor 30.

This application embodiment, through with touch FPC13 with place in preceding cavity 101 after battery 12 is fixed as an organic whole, then touch FPC13 with connect through electric wire 30 electricity between the earphone mainboard 11, fix touch FPC13 earlier on the earphone backshell for current needs need keep somewhere longer wire with earphone mainboard welding on connecting wire, this application can effectively shorten the length of touching the connecting wire between FPC13 and the earphone mainboard 11, saves earphone cavity inner space.

In an embodiment, the touch FPC13 is fixed with the battery 12 and then placed in the front cavity 101, and the pins of the touch FPC13 can be soldered directly to the earphone main board 11.

This application through with touch FPC13 with place in preceding cavity 101 after battery 12 is fixed as an organic whole, then touch FPC13 with through pin direct weld between the earphone mainboard 11, so make inside each part of earphone whole realize no electric wire and connect, the very big earphone inner space that saves, and the internal assembly is simple, the efficiency of piling up of improvement earphone when production that can be very big.

In one embodiment, foam 14 is disposed between the touch FPC13 and the battery 12, one surface of the foam 14 is fixed to one surface of the touch FPC13, the other surface of the foam 14 is fixed to the battery 12, and the other surface of the touch FPC13 is fixed to a conductive sponge 15.

In one embodiment, the foam 14 and the touch FPC13 are fixed by glue, and the foam 14 and the battery 12 are fixed by glue.

By arranging the foam 14 between the touch FPC13 and the battery 12, the stress between the touch FPC13 and the battery 12 can be buffered, two hard components can be effectively prevented from being in direct contact, and the product is easily damaged when external force is applied to the product, and by arranging the foam 14 between the touch FPC13 and the battery 12, the product can be prevented from being directly damaged by falling to the touch FPC13 and the battery 12.

In one embodiment, the touch FPC13 is fixed to a surface of the conductive sponge by glue. The other surface of the conductive sponge is fixed on the inner side surface of the earphone rear case 20 by glue.

So, half in-ear earphone 1 of this application through with touch FPC13 with place in preceding cavity 101 after battery 12 is fixed as an organic whole, then will touch FPC13 with carry out the electricity between the earphone mainboard 11 and connect, fix touch FPC on the earphone backshell earlier for current needs and need keep somewhere longer wire through electric core wire and earphone mainboard welded connection, the length of the connecting wire between touch FPC and the earphone mainboard can effectively be shortened in this application, very big saving earphone cavity inner space, satisfy the demand of earphone towards miniaturized development, and assembly process is simple, can effectively improve the pile up efficiency of earphone when producing.

The application also provides a semi-in-ear earphone assembling method, which comprises the following steps:

fixing the touch FPC13 on one end face of the battery 12 integrally with the battery;

placing the touch FPC13 and battery 12 secured in one piece in the half-in-ear headphone cavity;

placing the earphone main board 11 in the half-in-ear earphone cavity;

electrically connecting a touch FPC13 with the headphone main board 11;

the rear earphone shell 20 and the front earphone shell are buckled, connected and fixed.

In one embodiment, securing the touch FPC13 on an end face of the battery 12 integrally with the battery 12 includes:

a foam 14 is disposed between the touch FPC13 and the battery 12, one surface of the foam 14 is fixed to one surface of the touch FPC13, the other surface of the foam 14 is fixed to the battery, and the other surface of the touch FPC13 is fixed to a conductive sponge 15.

In one embodiment, the method further comprises the steps of:

one surface of the foam 14 is fixed to the touch FPC12 through a glue, and the other surface is fixed to the battery 12 through a glue.

The electrically connecting the touch FPC12 with the headphone main board 11 further includes the steps of:

the touch FPC12 is electrically connected to the earphone main board 11 by a wire.

In one embodiment, the electrically connecting the touch FPC12 with the headset main board 11 further includes the steps of: the pins of the touch FPC12 are soldered directly to the headphone main board 11.

In this embodiment, the cavity includes a front cavity 101 close to the ear and a rod cavity 102 at the rod part of the earphone, the earphone main board 11 is disposed in the rod cavity 102, the touch FPC12 is fixed with the battery 12 and then placed in the front cavity 101, and the touch FPC12 is electrically connected with the earphone main board 11 through a conducting wire.

This application through with touch FPC12 with place in preceding cavity 101 after battery 12 is fixed as an organic whole, then with touch FPC12 with connect through the wire electricity between the earphone mainboard 11, so can effectively shorten the length of the connecting wire between touch FPC and the earphone mainboard, save earphone cavity inner space.

Fix touch FPC for current needs earlier behind the earphone shell, weld at connecting wire and earphone mainboard, for the good operability of welding that makes things convenient for touch FPC and earphone mainboard, need keep somewhere longer wire, this application embodiment half pleasant formula assembly method, through earlier touch FPC with place in the cavity after the battery is fixed as an organic whole, then touch FPC with carry out the electricity between the earphone mainboard and be connected to this application can effectively shorten the length of the connecting wire between touch FPC and the earphone mainboard, saves earphone cavity inner space, and the internal assembly is simple, improvement earphone that can be very big piling up efficiency when producing.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, and are not to be construed as limiting the scope of the invention. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present invention are intended to be within the scope of the claims.

Claims

1. A half-in-ear earphone comprises an earphone front shell and an earphone rear shell, and is characterized in that the earphone rear shell is arranged on the earphone front shell, the earphone front shell and the earphone rear shell are combined to form a cavity, and an earphone main board, a battery and a touch FPC are arranged in the cavity; the touch FPC is fixed on one end face of the battery and is fixed with the battery into a whole, and the touch FPC is electrically connected with the earphone mainboard.

2. The half-in-ear headphone as claimed in claim 1, wherein a foam is disposed between the touch FPC and the battery, one surface of the foam is fixed to one surface of the touch FPC, the other surface of the foam is fixed to the battery, and a conductive sponge is fixed to the other surface of the touch FPC.

3. The half-in-ear headphone as recited in claim 2, wherein the foam is fixed to the touch FPC by a glue, and the foam is fixed to the battery by a glue.

4. A half-in-ear headphone according to any one of claims 1 to 3, wherein the cavity comprises a front cavity near the ear and a stem cavity at the stem of the headphone, the headphone main board is disposed in the stem cavity, the touch FPC is fixed integrally with the battery and then placed in the front cavity, and the touch FPC is electrically connected to the headphone main board by a wire.

5. A semi-in-ear headphone as claimed in any one of claims 1 to 3, wherein the cavity comprises a front cavity near the ear and a stem cavity at the stem of the headphone, the headphone main board is disposed in the stem cavity, the touch FPC is fixed integrally with the battery and then placed in the front cavity, and the pins of the touch FPC are directly soldered to the headphone main board.

6. A method of assembling a semi-in-ear headphone, comprising the steps of:

placing an earphone main board in a half-in-ear earphone cavity;

electrically connecting a touch FPC with the earphone main board;

the rear shell of the earphone is buckled with the front shell of the earphone.

7. The method of assembling a half-in-ear headphone according to claim 6, wherein fixing the touch FPC to an end surface of the battery integrally with the battery comprises:

8. The method of assembling a half-in-ear headphone according to claim 7, wherein one surface of the foam is fixed to the touch FPC by a gel, and the other surface is fixed to the battery by a gel.

9. The method of assembling a half-in-ear headphone according to any one of claims 6 to 8, wherein the electrically connecting the touch FPC to the headphone main board includes:

10. The half-in-ear headphone of any one of claims 6 to 8, wherein the electrically connecting the touch FPC with the headphone main board comprises: and directly welding the pins of the touch FPC to the earphone mainboard.