CN110793332A

CN110793332A - Wafer slide rotary type cleaning device

Info

Publication number: CN110793332A
Application number: CN201911056368.9A
Authority: CN
Inventors: 李响
Original assignee: Su Normal University Semiconductor Materials and Equipment Research Institute Pizhou Co Ltd
Current assignee: Su Normal University Semiconductor Materials and Equipment Research Institute Pizhou Co Ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-02-14

Abstract

The invention relates to the field of semiconductor processing, in particular to a rotary type cleaning device for a wafer carrier, which comprises a fixed frame, a rotary type cleaning device and a rotary type cleaning device, wherein the fixed frame is used for fixing a carrier disc and comprises a first baffle plate and a second baffle plate which are arranged oppositely, a plurality of first cross rods for fixedly connecting the first baffle plate and the second baffle plate, and a second cross rod arranged between the first baffle plate and the second baffle plate; the supporting columns are used for supporting the fixing frame, one ends of the supporting columns are movably connected to the second cross rod, and the other ends of the supporting columns are used as supporting points, so that the fixing frame is suspended; the driving mechanism is used for driving the fixing frame to rotate and is in transmission connection with the second cross rod to drive the second cross rod to rotate.

Description

Wafer slide rotary type cleaning device

Technical Field

The invention relates to the field of semiconductor processing, in particular to a rotary cleaning device for a wafer carrier.

Background

The high temperature vacuum oven that the semiconductor field used at present is used for roasting away the impurity on the graphite plate after MOCVD board epitaxial growth, and its oven cavity is that the barrelled water level is placed, and internally mounted has graphite to hold, jigs such as graphite loading board, gridion to be used for bearing relevant spare parts such as the graphite plate of fixed different diameters.

At present, the high-temperature vacuum oven that LED field used all has tools such as graphite loading board, gridion to hold the graphite dish, nevertheless is exactly because there is the existence of loading board, so make the unable even diffusion of the inside heat of oven, and then local temperature can not reach unanimity when making the high-temperature roast of graphite dish, and local unclean phenomenon can appear in the overware. Therefore, it is an urgent task to find a new type of grill to replace the currently used graphite carrying plate and grill matching device.

Disclosure of Invention

The invention aims to provide a rotary cleaning device for a wafer carrier, which cancels a graphite bearing plate by changing a supporting mode, reduces the heat shielding of the graphite bearing plate, and can ensure that the heat of a baking tray is diffused more uniformly, thereby achieving the effect of cleaning the baking tray.

In order to achieve the purpose, the invention adopts the following technical scheme:

a wafer carrier rotary cleaning device, comprising:

the fixing frame is used for fixing the carrying disc and comprises a first baffle plate and a second baffle plate which are arranged oppositely, a plurality of first cross rods fixedly connecting the first baffle plate and the second baffle plate, and a second cross rod arranged between the first baffle plate and the second baffle plate, wherein the carrying disc is arranged in a cavity enclosed between the first cross rods and is parallel to the first baffle plate and the second baffle plate;

the supporting columns are used for supporting the fixing frame, one ends of the supporting columns are movably connected to the second cross rod, and the other ends of the supporting columns are used as supporting points, so that the fixing frame is suspended;

and the driving mechanism is used for driving the fixing frame to rotate, is in transmission connection with the second cross rod and drives the second cross rod to rotate.

As a preferred scheme of the rotary cleaning device for the wafer carrier, the driving mechanism comprises a first gear, a second gear, a rotating shaft and a driving motor, the first gear is fixed on the second cross rod, the first gear is meshed with the second gear, the second gear is fixed on the rotating shaft, one end of the rotating shaft is fixed with the second gear, and the other end of the rotating shaft is in transmission connection with the driving motor.

As a preferred scheme of the rotary cleaning device for the wafer carrier, a plurality of clamping grooves are formed in the first cross rod, and the carrier disc is placed in the clamping grooves.

As a preferred scheme of the wafer slide rotary type cleaning device, through holes are formed in the first baffle and the second baffle, and two ends of the first cross rod are inserted into the through holes respectively and are fixed on the first baffle and the second baffle through bolts.

As a preferable scheme of the wafer slide rotary type cleaning device, the position of the first cross rod relative to the center of the fixed frame is adjusted by adjusting the position of the first cross rod in the through hole, and the wafer slide trays with different sizes can be clamped by adjusting the position of the first cross rod relative to the center of the fixed frame.

As a preferred embodiment of the wafer carrier rotary cleaning apparatus, the first cross bars are evenly distributed over the first baffle and the second baffle.

The invention has the beneficial effects that: by changing the supporting mode, the graphite bearing plate is eliminated, the heat energy shielded by the graphite bearing plate is reduced, and the heat of the baking tray can be diffused more uniformly; the fixed position of the second cross rod is adjusted or the second cross rod is replaced, so that the wafer carrying trays with different sizes and different shapes are baked; different rotating speeds can be set according to different baking tray processes by additionally arranging the gear and the rotating shaft, so that the aim of baking more cleanly is fulfilled; the rotary grill baking tray can enable gallium source drops in the baking tray process to be thrown out by inertia, and therefore the effect that the baking tray is cleaner is achieved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 is a schematic structural view of a rotary cleaning device for wafer carrier according to the present invention

FIG. 2 is a schematic view of a holder of the wafer carrier rotary cleaning apparatus according to the present invention;

FIG. 3 is a side view of a holder of the wafer carrier rotary cleaning apparatus of the present invention;

FIG. 4 is a schematic structural view of a first gear and a second gear of the rotary cleaning device for wafer carriers according to the present invention;

fig. 5 is a schematic structural view of a vacuum oven and a grill in the wafer slide rotary cleaning apparatus of the present invention.

In the figure: 100-a fixing frame; 110-a first baffle; 111-a via; 120-a first cross-bar; 121-bolt; 122-a card slot; 130-a second cross bar; 140-a second baffle; 200-carrying disc; 300-support column; 400-a drive mechanism; 410-a first gear; 420-a rotating shaft; 421-a second gear; 430-a drive motor; 500-outer wall; 510-vacuum heating chamber.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

The invention provides a rotary type cleaning device for a wafer carrier, which comprises a fixed frame, a rotary type cleaning device and a rotary type cleaning device, wherein the fixed frame is used for fixing a carrier disc and comprises a first baffle plate and a second baffle plate which are arranged oppositely, a plurality of first cross rods fixedly connected with the first baffle plate and the second baffle plate, and a second cross rod arranged between the first baffle plate and the second baffle plate, and the carrier disc is arranged in a cavity defined by the first cross rods and is parallel to the first baffle plate and the second baffle plate; the supporting columns are used for supporting the fixing frame, one ends of the supporting columns are movably connected to the second cross rod, and the other ends of the supporting columns are used as supporting points, so that the fixing frame is suspended; and the driving mechanism is used for driving the fixing frame to rotate, is in transmission connection with the second cross rod and drives the second cross rod to rotate.

Through the design of the cleaning device, the height of the lining pot is adjusted, the gap between the lining pot and the crater is reduced, the cross contamination phenomenon between adjacent evaporation sources in the evaporation process is improved, the sheet source abnormality caused by the pollution of the plating source is reduced, the abnormality rate is reduced, the waste of the plating source due to the fact that the plating source cannot be used continuously caused by the cross contamination of the plating source is reduced, and the cost is effectively reduced; in the evaporation process, the bottom of the lining pot is far away from the bottom of the crucible container, so that the cooling effect of the bottom of the crucible pot on a plating source in the lining pot is weakened, the power output in the process of coating is reduced, and the production cost is further saved.

The cleaning device will be described below with reference to preferred embodiments of the present invention.

Referring to fig. 1 to 5, the cleaning apparatus for rotatably cleaning a wafer carrier 200 at least includes a holder 100 for fixing the wafer carrier, a plurality of support pillars 300 at two ends of the holder 100 for supporting the holder 100, and a driving mechanism 400 for rotating the holder 100; the supporting column 300 is suspended and the driving mechanism 400 drives the fixing frame 100 to rotate.

The fixing frame 100 includes a first barrier 110 and a second barrier 140 disposed opposite to each other, a plurality of first bars 120 detachably and fixedly connected to the first barrier 110 and the second barrier 140, and a second bar 130 fixedly connected to the outer sides of the first barrier 110 and the second barrier 140, respectively, and the carrying tray 200 is placed in a cavity surrounded by the plurality of first bars 120 and is parallel to the first barrier 110 and the second barrier 140. In order to better fix the carrying tray 200 on the first cross bar 120, in the embodiment, a plurality of slots 122 are preferably disposed on the inner side of the first cross bar 120, the number and size of the slots 122 on each first cross bar 120 are the same, the carrying tray 200 is located in the slots 122, generally, for fixing the carrying tray 200, the number of the first cross bars 120 fixed on the fixing frame 100 in the cavity defined by the first cross bars 120 is not less than 3, so as to define a cavity for placing the carrying tray 200.

Specifically, the first baffle 110 and the second baffle 140 are both provided with through holes 111, two ends of the first cross bar 120 are respectively inserted into the through holes 111 and fixed on the first baffle 110 and the second baffle 140 through bolts 121, the position of the first cross bar 120 relative to the center of the fixing frame 100 is adjusted by adjusting the position of the first cross bar 120 in the through holes 111, and the position of the grill relative to the center of the fixing frame 100 is adjusted so that the first cross bar 120 encloses gaps with different areas for placing wafer trays 200 with different sizes.

A second cross bar 130 is disposed at the center of the outer sides of the first barrier 110 and the second barrier 140, and the second cross bar 130 may be integrally formed with the first barrier 110 and the second barrier 140, or may be connected to the first barrier 110 and the second barrier 140 by bolts 121. One end of the second cross bar 130 is fixed on the first barrier 110, and the other end points to the outside of the fixing frame 100. The second cross bars 130 are disposed at one end of the supporting pillars 300, each second cross bar 130 is at least provided with 2 supporting pillars 300, the joints between the supporting pillars 300 and the second cross bars 130 are movably connected, and the joints are disposed on the sliding members (not shown in the figure), so as to ensure that the second cross bars 130 can rotate under the driving of the driving mechanism 400 when the supporting pillars 300 are fixed. The driving mechanism 400 rotates the fixing frame 100 by driving the rotation of the second cross bar 130.

The driving mechanism 400 includes a first gear 410 fastened to the second rail 130, a rotating shaft 420 having one end provided with a second gear 421, and a driving motor 430 connected to the other end of the rotating shaft 420, and the driving motor 430 may be directly connected to one end of the rotating shaft 420 or may be connected to the rotating shaft 420 through a belt. The driving motor 430 drives the rotation shaft 420 to rotate, and the second gear 421 fastened to the rotation shaft 420 also rotates to drive the first gear 410 to rotate, thereby driving the fixing frame 100 to rotate. The first gear 410 and the second gear 421 are combined in a matching manner, and are tightly attached to each other during operation, so that the wafer carrier can be directly taken and placed in the cavity during baking of a wafer carrier with a smaller diameter. When the diameter of the wafer carrying tray is larger, the wafer carrying tray is taken and placed in the space outside the cavity of the oven, and the grill with the wafer carrying tray can be carried into the cavity by using a special forklift, so that batch baking tray operation is facilitated.

Adopt rotatable mount to bear the weight of the wafer and carry the dish and toast the effect, cancelled the graphite loading board among the prior art, reduced its heat energy when toasting to carrying the dish and sheltered from, heat diffusion's more even when making the overware, the position of adjustment second horizontal pole simultaneously or change the second horizontal pole to can toast not unidimensional, different shapes carry the dish.

According to different baking tray processes, different rotating speeds are set through the driving motor, so that the carrying tray can be baked more cleanly, and in the rotating process, the dirt dropped on the surface of the carrying tray can be thrown out by utilizing inertia, so that the baking effect is improved.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles applied thereto. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, such variations are within the scope of the invention as long as they do not depart from the spirit of the invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.

Claims

1. A wafer carrier rotary cleaning apparatus, comprising:

the fixing frame (100) is used for fixing the carrying disc (200) and comprises a first baffle plate (110) and a second baffle plate (140) which are arranged oppositely, a plurality of first cross rods (120) fixedly connected with the first baffle plate (110) and the second baffle plate (140) and a second cross rod (130) arranged between the first baffle plate (110) and the second baffle plate, and the carrying disc (200) is arranged in a cavity defined by the first cross rods (120) and is arranged in parallel with the first baffle plate (110) and the second baffle plate (140);

the supporting columns (300) are used for supporting the fixing frame (100), one ends of the supporting columns (300) are movably connected to the second cross rod (130), and the other ends of the supporting columns (300) are used as supporting points, so that the fixing frame (100) is suspended;

and the driving mechanism (400) is used for driving the fixed frame (100) to rotate, is in transmission connection with the second cross rod (130) and drives the second cross rod (130) to rotate.

2. The rotary wafer slide cleaning device according to claim 1, wherein the driving mechanism (400) comprises a first gear (410), a second gear (421), a rotating shaft (420) and a driving motor (430), the first gear (410) is fixed on the second cross bar (130), the second gear (421) is engaged with the first gear (410), the second gear (421) is fixed on the rotating shaft (420), the second gear (421) is fixed at one end of the rotating shaft (420), and the other end of the rotating shaft (420) is in transmission connection with the driving motor (430).

3. The rotary wafer slide cleaning device as claimed in claim 1, wherein the first rail (120) is provided with a plurality of slots (122), and the carrier plate (200) is disposed in the slots (122).

4. The rotary wafer slide cleaning device according to claim 1, wherein the first baffle (110) and the second baffle (140) are provided with through holes (111), and both ends of the first cross bar (120) are respectively inserted into the through holes (111) and fixed on the first baffle (110) and the second baffle (140) through bolts (121).

5. The rotary wafer slide cleaning device according to claim 4, wherein the position of the first cross bar (120) relative to the center of the holder (100) is adjusted by adjusting the position of the first cross bar (120) in the through hole (111), and the adjustment of the position of the first cross bar (120) relative to the center of the holder (100) can hold wafer trays (200) of different sizes.

6. The rotary wafer slide cleaning device as recited in claim 1, wherein the first cross bars (120) are evenly distributed across the first baffle (110) and the second baffle (140).