CN110791803A

CN110791803A - Backflow defoaming system of electroplating process tank

Info

Publication number: CN110791803A
Application number: CN201911146699.1A
Authority: CN
Inventors: 不公告发明人
Original assignee: Guangde Dongwei Technology Co Ltd
Current assignee: Guangde Dongwei Technology Co Ltd
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-02-14
Anticipated expiration: 2039-11-20
Also published as: CN110791803B

Abstract

The invention discloses a reflux defoaming system of an electroplating process tank, which comprises: the upper groove body is provided with a through hole for the plate to be plated to pass through; the drainage groove body is arranged on one side of the upper groove body and is communicated with the upper groove body through a through hole; the lower tank body is positioned below the upper tank body, and the bottom of the lower tank body is provided with a partition board which divides the inner space of the lower tank body into a reflux area and a defoaming area; the bubble layer above the electroplating solution or the cleaning solution in the reflux area overflows from the top of the partition plate and then enters the defoaming area; the overflow box is communicated with a plate passing liquid outlet on one side of the drainage groove body opposite to the upper groove body, and a drainage pipe communicated with the reflux area is arranged below the overflow box; and the defoaming device is positioned above the defoaming area, and a negative pressure area is formed above the defoaming area to suck away bubbles in the backflow area and shear and eliminate the bubbles. Through set up the overflow pipe between last cell body and lower cell body to set up baffle and fire fighting equipment in the cell body down, can eliminate the bubble in the plating solution or the washing liquid that the backward flow obtained, reduce the influence of bubble to product electroplating quality.

Description

Backflow defoaming system of electroplating process tank

Technical Field

The invention relates to the technical field of electroplating equipment, in particular to a reflux defoaming system of an electroplating process tank.

Background

The common vertical electroplating equipment drives a circuit board to run along an electroplating bath filled with electroplating solution through a circularly running transmission device, the circuit board continuously enters from one end of the electroplating bath and is output from the other end, and electroplating ions in the electroplating solution are electroplated on the surface of the circuit board in the process.

The prior electroplating process tank comprises an electroplating tank, a liquid storage tank and a backflow tank, wherein the electroplating tank is positioned at the upper part for a circuit board to carry out electroplating, the liquid storage tank is positioned at the lower part for recovering electroplating liquid, the backflow tank is positioned between the electroplating tank and the liquid storage tank, overflow ports are formed in two sides of the electroplating tank along the conveying direction of the circuit board, and the electroplating liquid in the electroplating tank flows out through the overflow ports, then passes through the backflow tank and enters the liquid storage tank; meanwhile, the electroplating solution in the liquid storage tank sequentially passes through the conveying pipeline and the jet flow pipe positioned in the electroplating bath and is sprayed out of the jet hole on the jet flow pipe to the electroplating bath, so that the electroplating solution circularly flows in the electroplating process tank.

However, a large amount of electroplating solution in the electroplating bath directly falls into the reflux tank through the overflow port, because the fall between the overflow port and the reflux tank is large, the electroplating solution is impacted to generate a large amount of bubbles when falling into the reflux tank, the bubbles cannot be dissipated in a short time and are brought into the liquid storage tank by strong water flow, when the electroplating solution containing a large amount of bubbles is conveyed into the electroplating bath again for use, the bubbles and air brought by the part of electroplating solution can form bubble points on the electroplating plate, the bubbles can run into the holes of the circuit board, so that the holes cannot be cleaned completely, and phenomena such as plating leakage, core wrapping and the like are formed during electroplating.

The Chinese patent with publication number CN109750345A discloses a water retaining device and an electroplating solution recovery system, wherein the water retaining device is arranged in a reflux tank and is blocked at the position of an overflow port of an electroplating bath, gaps are reserved between two opposite water retaining rollers on the water retaining device and the inner wall surfaces of arc grooves where the two water retaining rollers are respectively positioned, when a plate passes through a plate passing gap between the water retaining rollers, electroplating solutions flowing out of the overflow port in the electroplating bath form shunt through the gaps of the water retaining rollers at two sides and the plate passing gap respectively, and bubbles formed by the electroplating solutions which are downwards flushed at the position of the water retaining rollers can be reduced.

However, the electroplating solution of the electroplating solution recovery system is totally refluxed by flowing out from the overflow port, and although the water blocking device can reduce the amount of bubbles generated in the process of refluxing the electroplating solution to a certain extent, a certain amount of bubbles are still generated in the process of refluxing the electroplating solution due to the relatively large flow rate of the electroplating solution, and the bubbles cannot be completely eliminated, so that the electroplating quality of a product is affected after the bubbles circularly flow into the electroplating tank.

Disclosure of Invention

Therefore, the technical problem to be solved by the present invention is to overcome the problem that bubbles are easily generated when the plating solution in the plating solution circulation system of the plating tank in the prior art reflows, thereby affecting the plating quality of the product, and thus to provide a reflow defoaming system for a plating process tank.

In order to solve the technical problems, the technical scheme of the invention is as follows:

a reflux defoaming system for an electroplating process tank comprising:

the two opposite side walls of the upper groove body are provided with through holes for the plates to be plated to pass through;

the drainage groove body is arranged on one side of the upper groove body and is communicated with the upper groove body through the through hole;

the lower tank body is positioned below the upper tank body, and the bottom of the lower tank body is provided with a partition board which divides the inner space of the lower tank body into a reflux area and a defoaming area; the bubble layer above the electroplating solution or the cleaning solution in the reflow region overflows from the top of the partition plate and then enters the defoaming region;

the overflow box is communicated with a plate passing liquid outlet on one side of the drainage groove body, which is opposite to the upper groove body, and a drainage pipe communicated with the reflux area is communicated below the overflow box;

and the defoaming device is positioned above the defoaming area, and a negative pressure area is formed above the defoaming area to suck away the bubbles in the backflow area and shear and eliminate the bubbles.

Furthermore, the top of the partition board is connected with a backflow inclined plate which slants to the direction of the bottom of the defoaming area and extends.

Furthermore, a defoaming body is arranged on the overflow box.

Furthermore, a water retaining device which is arranged at the position of the through opening of the upper groove body is arranged in the drainage groove body.

Further, the water blocking device includes:

a support base;

the two mounting seats are oppositely arranged on the supporting base, and one ends of the two mounting seats, which face each other, are respectively provided with at least one arc-shaped groove which is recessed inwards and extends along the height direction of the arc-shaped groove; the arc-shaped grooves on the two mounting seats are opposite one to one; the arc-shaped groove is provided with at least one first drainage port communicated with the outside;

the water blocking rollers are embedded into the arc-shaped grooves one by one and are rotatably arranged on the supporting base; one end of each of the two opposite water blocking rollers, which is close to each other, is in sealing abutting joint and forms a plate passing gap for a plate to be plated to pass through when being extruded;

and a required gap is reserved between the circumferential outer wall surface of the water retaining roller and the inner wall surface of the arc groove where the water retaining roller is located.

Further, the defoaming device includes:

the defoaming pump is arranged at the top of the lower groove body and is positioned above the defoaming area, and the lower end of the defoaming pump is provided with a suction inlet for air bubbles to enter;

the extension pipe is connected to a suction inlet of the defoaming pump and extends towards the direction of the lower groove body; the lower opening of the extension pipe is positioned above the liquid level in the defoaming area.

Further, the defoaming pump includes:

the defoaming motor is arranged in the lower groove body, and an impeller assembly positioned above the defoaming area is assembled on an output shaft of the defoaming motor;

the defoaming pipe is covered on the periphery of the impeller assembly and is provided with a lower end opening, and the extension pipe is connected to the lower end opening of the defoaming pipe.

Further, the bubble elimination tube includes:

an upper pipe body which comprises a top plate connected with the defoaming motor and blocked above the impeller assembly, an upper sleeve connected with the peripheral edge of the top plate and covering the periphery of the impeller assembly, and a bottom plate connected below the upper sleeve and blocked below the impeller assembly, wherein the bottom plate is provided with a first through hole corresponding to the lower end surface of the impeller assembly;

the lower pipe body comprises a connecting plate and a lower sleeve; the connecting plate is connected to the bottom of the bottom plate, a connecting gap is formed between the connecting plate and the bottom plate, the connecting plate is provided with a second through hole which is arranged corresponding to the first through hole, the lower sleeve is connected to the edge position of the bottom of the connecting plate, which corresponds to the second through hole, and the extension pipe is connected to the lower end of the lower sleeve; the pipe diameter of the lower sleeve is smaller than that of the upper sleeve.

Furthermore, a backflow pipeline is communicated between the upper tank body and the lower tank body, and electroplating liquid or cleaning liquid overflowing from the upper tank body flows to the lower tank body through the backflow pipeline.

Furthermore, a flow control valve for controlling the flow of the electroplating liquid or the cleaning liquid flowing into the lower tank body is arranged on the return pipeline.

Further, a conveying device used for conveying electroplating liquid or cleaning liquid in the lower tank body into the upper tank body is communicated between the upper tank body and the lower tank body.

Further, the conveying device comprises a circulating pump for pumping electroplating liquid or cleaning liquid from the lower tank body, a liquid suction pipeline communicated between a liquid inlet of the circulating pump and the defoaming area, and a liquid outlet pipeline communicated between a liquid outlet of the circulating pump and the upper tank body; the liquid outlet pipeline comprises a liquid outlet of the circulating pump, a first pipeline and a second pipeline, wherein the first pipeline is positioned between the jet pipes in the upper groove body and is connected with the liquid outlet of the circulating pump, the second pipeline extends into the circulating pipe in the upper groove body, an electric control valve used for controlling the flow of the first pipeline is arranged on the first pipeline, and a manual control valve used for controlling the flow of the second pipeline is arranged on the second pipeline.

Furthermore, one end of the liquid suction pipeline extending into the defoaming area is also provided with a suction inlet mesh enclosure.

The technical scheme of the invention has the following advantages:

1. according to the backflow defoaming system of the electroplating process tank, electroplating liquid or cleaning liquid in the upper tank body flows out through the through holes on the two sides and then enters the drainage tank body; electroplating solution or cleaning solution in the drainage tank overflows through a plate-passing liquid outlet on one side and then enters the overflow box, flows to a backflow zone of the lower tank body through an overflow pipe of the overflow box, an air bubble layer above the electroplating solution or the cleaning solution in the backflow zone overflows from the top of a partition plate in the lower tank body and then enters a defoaming zone of the lower tank body, and a defoaming device above the defoaming zone sucks away air bubbles in the backflow zone through a negative pressure zone and shears and eliminates the air bubbles, so that defoaming of the electroplating solution or the cleaning solution is realized; compared with the mode that electroplating solution or cleaning solution directly flows out from an overflow port on an upper tank body in the prior art in a downward flushing mode, the overflow pipe can guide the electroplating solution or cleaning solution flowing out from the upper tank body to the bottom of a reflux area of a lower tank body, so that the bubble amount generated by impact when the electroplating solution or cleaning solution falls into the lower tank body can be reduced, after the electroplating solution or cleaning solution in the reflux area of the lower tank body is kept stand, a bubble layer on the upper layer of a liquid level overflows from the top of a partition plate and then enters a defoaming area to be defoamed through a defoaming device, so that bubbles in the electroplating solution or cleaning solution obtained by backflow can be eliminated, and the influence of the bubbles; meanwhile, the drain pipe is of a relatively sealed structure, and when electroplating solution or cleaning solution flows into the lower tank body from the upper tank body through the drain pipe, the electroplating solution or the cleaning solution is less in contact with air, so that the oxidation of effective components in the electroplating solution caused by the contact of the electroplating solution and the air can be reduced, and the stability of chemical components in the electroplating solution can be better ensured.

2. According to the reflux defoaming system of the electroplating process tank, the partition plate is arranged in the lower tank body, so that the inner space of the lower tank body can be divided into the reflux area and the defoaming area, and the defoaming device can better perform concentrated shearing and defoaming on bubbles.

3. According to the backflow defoaming system of the electroplating process tank, the backflow sloping plate is arranged, so that bubbles can flow to the action center of the defoaming device along the backflow sloping plate conveniently; on the other hand, liquid drops formed after the bubbles are cut and eliminated are convenient to converge into liquid flow on the backflow inclined plate and then flow to the defoaming area for cyclic utilization, and the loss of electroplating liquid or cleaning liquid components is reduced.

4. According to the backflow defoaming system of the electroplating process tank, the defoaming body is arranged on the overflow box, and when electroplating solution or cleaning solution passes through the defoaming body, bubbles carried in the electroplating solution or cleaning solution collide with the defoaming body to be broken or are adsorbed on the defoaming body, so that foams generated by sputtering resilience due to fall are reduced.

5. According to the backflow defoaming system of the electroplating process tank, the arrangement of the water retaining device can reduce the pressure difference applied when electroplating solution or cleaning solution flows out from the gap between the plates in the moving process of the electroplating solution or cleaning solution along with the plates to be plated, and further reduce the bubble amount formed in the downward-rushing backflow process of the electroplating solution or cleaning solution.

6. According to the reflux defoaming system of the electroplating process tank, the extension pipe extending to the upper part of the liquid level in the defoaming area is connected below the defoaming pump, so that the phenomenon of air streaming can be effectively prevented, and the defoaming pump can be ensured to suck more bubbles.

7. According to the backflow defoaming system of the electroplating process tank, the defoaming motor drives the impeller assembly to rotate in the defoaming pipe, on one hand, a negative pressure area can be formed in the defoaming area to suck bubbles, on the other hand, blades rotating at high speed in the impeller assembly can shear and crush the sucked bubbles, the broken bubbles fall towards the inner wall of the defoaming pipe under the action of centrifugal force to form liquid flow back into the lower tank body, and therefore loss of electroplating liquid or cleaning liquid can be effectively reduced.

8. According to the backflow defoaming system of the electroplating process tank, the defoaming pipe comprises an upper pipe body and a lower pipe body, a top plate of the upper pipe body is blocked above the impeller assembly, the outer peripheral wall of the impeller assembly can be completely covered in the upper pipe body by the upper sleeve, and bubbles can be completely thrown to the inner wall of the upper pipe body under the action of centrifugal force after being sheared and broken to form liquid flow which returns to the lower tank body, so that the loss of electroplating liquid or cleaning liquid in the defoaming process can be better reduced; in addition, connect the lower body that opening diameter is less than the upper tube body in the below of upper tube body, can make the bubble in the upper tube body by impeller assembly shearing breakage ground more thoroughly, promote the defoaming effect.

9. According to the backflow defoaming system for the electroplating process tank, provided by the invention, in a manner that part of electroplating solution or cleaning solution in the upper tank body flows to the lower tank body through the backflow pipeline, the part of electroplating solution or cleaning solution flowing out of the through hole of the upper tank body can be shunted, the liquid level height in the upper tank body is controlled, and the bubble amount formed in the process of downward flushing backflow of the electroplating solution or cleaning solution in the upper tank body is further reduced.

10. According to the backflow defoaming system of the electroplating process tank, the flow control valve on the backflow pipeline can control the flow of electroplating solution or cleaning solution flowing into the lower tank body, so that the flow speed of the electroplating solution or cleaning solution flowing out of the through hole of the upper tank body is slowed down, and further, bubbles are reduced; on the other hand, the purpose of controlling the liquid level height of the upper tank body can be achieved by controlling the flow in the return pipeline.

11. According to the reflux defoaming system of the electroplating process tank, after the circulating pump is started, the manual control valve is started first, and electroplating liquid or cleaning liquid in the lower tank body enters the upper tank body through the second pipeline and the circulating pipe; when the liquid level in the upper tank body reaches a certain height, the electric control valve is opened, and electroplating liquid or cleaning liquid in the lower tank body enters the upper tank body through the first pipeline and the jet flow pipe; the mode of pumping the electroplating solution or the cleaning solution in the lower tank body into the upper tank body by adopting two paths can reduce the generation of bubbles when the electroplating solution or the cleaning solution is sprayed out through the jet pipe.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a front view of an electroplating process tank provided in an embodiment of the present invention;

FIG. 2 is a top view of an electroplating process tank provided in accordance with an embodiment of the present invention;

FIG. 3 is a schematic view of the installation structure of the partition board, the overflow box and the defoaming body in the electroplating process tank according to the embodiment of the invention;

FIG. 4 is a schematic view showing a connection structure of a circulation pipe and a liquid outlet pipe in an electroplating process tank according to an embodiment of the present invention;

FIG. 5 is a right side view of an electroplating process tank provided in accordance with an embodiment of the present invention;

FIG. 6 is a right side view of an electroplating process tank according to an embodiment of the present invention, in which a portion of the structure is hidden in shadow to show an installation structure of a defoaming device and a lower tank body;

FIG. 7 is a schematic diagram of an overall structure of a defoaming pump in an electroplating process tank according to an embodiment of the present invention;

FIG. 8 is a schematic view of the overall structure of a liquid outlet pipe of a conveying device in an electroplating process tank according to an embodiment of the present invention;

FIG. 9 is a top view of a water stop in an electroplating process tank according to an embodiment of the present invention;

fig. 10 is a front view of a water stop device in an electroplating process tank according to an embodiment of the invention.

Description of reference numerals: 1. an upper trough body; 2. a lower trough body; 21. a reflux zone; 22. a defoaming zone; 3. a return line; 31. a flow control valve; 4. a defoaming device; 41. a defoaming motor; 42. an impeller assembly; 43. a defoaming pipe; 431. a pipe body is arranged; 4311. a top plate; 4312. sleeving a sleeve; 4313. a base plate; 432. a lower pipe body; 4321. a connecting plate; 4322. setting a sleeve; 44. an extension tube; 5. a conveying device; 51. a circulation pump; 52. a liquid suction pipe; 53. a liquid outlet pipeline; 531. a first conduit; 532. a second conduit; 54. an electrically controlled valve; 55. a manual control valve; 56. a suction inlet mesh enclosure; 6. a partition plate; 7. a backflow sloping plate; 8. a drainage groove body; 9. a water retaining device; 91. a support base; 92. a mounting seat; 93. an arc-shaped groove; 94. a first drain port; 95. a water-retaining roller; 10. an overflow box; 11. a bleeder tube; 12. a defoaming body; 13. a jet pipe; 14. a delivery pipe.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

The backflow defoaming system of the electroplating process tank shown in fig. 1-4 comprises an upper tank body 1, a lower tank body 2, a backflow pipeline 3, a defoaming device 4, a conveying device 5, a drainage tank body 8 and an overflow box 10.

Wherein, the upper tank body 1 is used for electroplating or cleaning a plate to be plated therein, and the lower tank body 2 is positioned below the upper tank body 1 and separated from the upper tank body 1 through a partition board at the bottom of the upper tank body 1. The side wall of the upper tank body 1 is provided with a through hole for a plate to be plated to pass through, and the drainage tank body 8 is arranged on one side of the upper tank body 1 and is communicated with the upper tank body 1 through the through hole. The bottom of lower cell body 2 is installed baffle 6, and baffle 6 separates the inner space of cell body 2 down into backward flow district 21 and defoaming district 22, and the export of backflow pipeline 3 is located backward flow district 21. The overflow box 10 is communicated with a drain outlet of the drain tank body 8 opposite to the upper tank body 1, and a drain pipe 11 leading to a reflux area is communicated below the overflow box. The defoaming device 4 is located above the defoaming area 22, and bubbles above the plating liquid or the cleaning liquid in the reflow area 21 overflow from the top of the partition plate 6 and enter the defoaming area 22.

The electroplating liquid or cleaning liquid in the upper tank body 1 flows out through the through holes at two sides and then enters the drainage tank body 8; electroplating solution or cleaning solution in the drainage tank body 8 overflows through a plate-passing liquid outlet on one side and then enters the overflow box 10, and flows to the backflow area 21 of the lower tank body 2 through an overflow pipe 11 of the overflow box 10, an air bubble layer above the electroplating solution or cleaning solution in the backflow area 21 overflows from the top of a partition plate 6 in the lower tank body 2 and then enters the defoaming area 22 of the lower tank body 2, and the defoaming device 4 above the defoaming area 22 sucks air bubbles in the defoaming area 22 through forming a negative pressure area and shears and eliminates the air bubbles, so that defoaming of the electroplating solution or cleaning solution is realized; compared with the prior art in which the electroplating solution or the cleaning solution directly flows downwards from an overflow port on the upper tank body 1, the backflow pipe 11 can guide the electroplating solution or the cleaning solution flowing out of the upper tank body 1 to the bottom of the backflow area 21 of the lower tank body 2, so that the bubble amount generated by impact when the electroplating solution or the cleaning solution falls into the lower tank body 2 can be reduced, and after the electroplating solution or the cleaning solution in the backflow area 21 of the lower tank body 2 is kept stand, a bubble layer on the upper layer of the liquid level overflows from the top of the partition plate 6 and then enters the defoaming area 21 to be defoamed through the defoaming device 4, so that bubbles in the electroplating solution or the cleaning solution obtained by backflow can be eliminated, and the influence of the bubbles on; meanwhile, the drain pipe 11 is of a relatively sealed structure, and when electroplating solution or cleaning solution flows into the lower tank body 2 from the upper tank body 1 through the drain pipe 11, the contact with air is less, so that the oxidation of effective components in the electroplating solution caused by the contact of the electroplating solution and the air can be reduced, and the stability of chemical components in the electroplating solution can be better ensured.

As shown in fig. 2, in the present embodiment, a backflow pipeline 3 is communicated between the upper tank body 1 and the lower tank body 2, the backflow pipeline 3 has an inlet communicated with the upper tank body 1 and an outlet located below the inlet and leading to the lower tank body 2, the inlet of the backflow pipeline 3 is communicated above the side wall of the upper tank body 1, and the outlet of the backflow pipeline 3 is located in the lower tank body 2; electroplating liquid or cleaning liquid overflowing from the upper part of the upper tank body 1 flows to the lower tank body 2 through the backflow pipeline 3 to control the liquid level height in the upper tank body 1.

As shown in fig. 2, in the present embodiment, the return line 3 is provided with a flow control valve 31 for controlling the flow rate of the plating liquid or the cleaning liquid flowing into the lower tank 2. By arranging the flow control valve 31 on the return pipeline 3, on one hand, the flow of the electroplating solution or the cleaning solution flowing into the lower tank body 2 can be controlled, the flow speed of the electroplating solution or the cleaning solution flowing out is slowed down, and further the generation of bubbles is reduced; on the other hand, the purpose of controlling the liquid level height of the upper tank body 1 can be achieved by controlling the flow in the return pipeline 3.

In a preferred embodiment of the present embodiment, the outlet below the drain pipe 11 is located at a position above the tank body 2 by the caliber height of the drain pipe 11, and when the plating solution or the cleaning solution in the plating process tank flows circularly, the outlet of the drain pipe 11 is submerged in the lower tank body 2.

Referring to fig. 3 and 5, in the present embodiment, the outlet of the return pipe 3 is located in the return area 21, the defoaming device 4 is located above the defoaming area 22, and bubbles above the plating solution or the cleaning solution in the return area 21 overflow from the top of the partition plate 6 and enter the defoaming area 22. Further, the baffle 6 of lower cell body 2 bottom has two and sets up relatively, and two baffles 6 will be separated in proper order for 2 inner spaces of lower cell body for backward flow district 21, defoaming district 22 and backward flow district 21, and defoaming district 22 is located the centre of two backward flow districts 21, and the bubble of plating solution or washing liquid top is crossed behind 6 tops of baffle to concentrate in defoaming district 22 in two backward flow districts 21. Two partition plates 6 are arranged in the lower tank body 2, so that the defoaming device 4 positioned in the defoaming area 22 can shear and eliminate the bubbles in the defoaming area 22 more intensively.

Furthermore, the top of the clapboard 6 is connected with a backflow inclined plate 7 which extends towards the bottom of the oblique defoaming area 22. The arrangement of the backflow sloping plate 7 facilitates the bubbles to flow to the action center of the defoaming device 4 along the backflow sloping plate 7; on the other hand, liquid drops formed after the bubbles are cut and eliminated are convenient to converge into liquid flow on the backflow inclined plate 7 and then flow to the defoaming area 22 for recycling, and the loss of electroplating liquid or cleaning liquid components is reduced.

As shown in fig. 6 and 7, in the present embodiment, the defoaming device 4 includes a defoaming pump and an extension pipe 44, the defoaming pump is installed at the top of the lower tank body 2 and above the defoaming area 22, and the lower end of the defoaming pump has a suction port for air bubbles to enter; the extension pipe 44 is connected with the suction inlet of the defoaming pump and extends towards the lower tank body 2; the lower opening of the extension tube 44 is located above the liquid level in the bubble removal zone 22. The extension pipe 44 extending to the upper part of the liquid level in the defoaming area 22 is connected below the defoaming pump, so that the phenomenon of air streaming can be effectively prevented, and more bubbles can be sucked by the defoaming pump.

In the present embodiment, the defoaming pump includes a defoaming motor 41 and a defoaming pipe 43. The defoaming motor 41 is arranged on the lower tank body 2, and an impeller assembly 42 positioned above the defoaming area 22 is assembled on an output shaft of the defoaming motor; the defoaming pipe 43 is covered on the periphery of the impeller assembly 42 and has a lower end opening, and the extension pipe 44 is connected to the lower end opening of the defoaming pipe 43. The impeller assembly 42 rotates in the defoaming pipe 43 under the driving of the defoaming motor 41 to form a negative pressure zone; after the bubbles in the defoaming area 22 are sucked into the negative pressure area, the bubbles are sheared and broken under the action of the shearing force of the impeller assembly 42 and fall to the inner wall of the defoaming pipe 43 under the action of centrifugal force to form liquid flow which returns to the lower tank body 2. Defoaming motor 41 passes through drive impeller subassembly 42 at defoaming pipe 43 internal rotation, can form the negative pressure district in order to inhale the bubble in defoaming district 22 on the one hand, and the broken piece can be cuted the broken to inspiratory bubble to high-speed rotatory blade in on the other hand impeller subassembly 42, and the bubble is broken the back and is formed the liquid stream to defoaming pipe 43 inner wall and get back to down in cell body 2 under centrifugal force effect, can effectively reduce the loss of plating solution or washing liquid.

Specifically, the defoaming pipe 43 includes an upper pipe body 431 and a lower pipe body 432. The upper tube body 431 includes a top plate 4311 connected to the defoaming motor 41 and positioned above the impeller unit 42, an upper sleeve 4312 connected to an outer circumferential edge of the top plate 4311 and covering an outer circumference of the impeller unit 42, and a bottom plate 4313 connected below the upper sleeve 4312 and positioned below the impeller unit 42, wherein the bottom plate 4313 has a first through hole corresponding to a lower end surface of the impeller unit 42. The lower tube 432 includes a connection plate 4321 and a lower sleeve 4322; the connecting plate 4321 is connected to the bottom of the bottom plate 4313 with a connecting gap between the connecting plate 4321 and the bottom plate 4313, the connecting plate 4321 has a second through hole corresponding to the first through hole, the lower sleeve 4322 is connected to the edge of the bottom of the connecting plate 4321 corresponding to the second through hole, and the extension tube 44 is connected to the lower end of the lower sleeve 4322; the aperture of the second port is smaller than the aperture of the first port.

The top plate 4311 of the upper pipe body 431 is blocked above the impeller assembly 42, the outer peripheral wall of the impeller assembly 42 can be completely covered in the upper sleeve 4312, and bubbles can be completely thrown to the inner wall of the upper pipe body 431 under the action of centrifugal force after being sheared and broken to form liquid flow to return to the lower tank body 2, so that the loss of electroplating liquid or cleaning liquid in the defoaming process can be better reduced; in addition, the lower pipe 432 with the opening diameter smaller than that of the upper pipe 431 is connected below the upper pipe 431, so that bubbles can be sheared and broken more thoroughly by the impeller assembly 42 in the upper pipe 431, and the defoaming effect is improved.

As shown in fig. 1, 5 and 8, in the present embodiment, a conveying device 5 is communicated between the upper tank body 1 and the lower tank body 2, and the conveying device 5 is used for conveying the electroplating solution or the cleaning solution in the lower tank body 2 into the upper tank body 1 and spraying the electroplating solution or the cleaning solution out through a spray pipe 13 located in the upper tank body 1 to realize the circulation flow of the electroplating solution or the cleaning solution.

Specifically, the conveying device 5 comprises a circulating pump 51 for pumping the electroplating liquid or the cleaning liquid from the lower tank body 2, a liquid suction pipeline 52 communicated between a liquid inlet of the circulating pump 51 and the defoaming area 22, and a liquid outlet pipeline 53 communicated between a liquid outlet of the circulating pump 51 and the upper tank body 1; the liquid outlet pipeline 53 comprises a first pipeline 531 communicated between a liquid outlet of the circulating pump 51 and the jet pipe 13 positioned in the upper tank body 1 and a second pipeline 532 connected between the liquid outlet of the circulating pump 51 and the circulating pipe 14 extending into the upper tank body 1, the first pipeline 531 is provided with an electric control valve 54 for controlling the flow of the first pipeline 531, and the second pipeline 532 is provided with a manual control valve 55 for controlling the flow of the second pipeline 532. Specifically, a suction port mesh cover 56 is further provided at the end of the suction line 52 extending into the defoaming area 22. After the circulating pump 51 is started, the manual control valve 55 is started first, and the electroplating liquid or cleaning liquid in the lower tank body 2 enters the upper tank body 1 through the second pipeline 532 and the circulating pipe 14; when the liquid level in the upper tank body 1 reaches a certain height, the electric control valve 54 is opened, and the electroplating liquid or the cleaning liquid in the lower tank body 2 enters the upper tank body 1 through the first pipeline 531 and the jet pipe 13; the way of pumping the plating solution or cleaning solution in the lower tank body 2 into the upper tank body 1 by using two paths can reduce the generation of bubbles when the plating solution or cleaning solution is sprayed out through the spray pipe 13, compared with the way of injecting the plating solution or cleaning solution into the upper tank body 1 only through the first pipe 531 and the spray pipe 13.

As shown in fig. 1 and fig. 9-10, in this embodiment, a water retaining device 9 is installed in the drainage tank body 8, a plate liquid outlet is provided on a support base 91 of the water retaining device 9, the overflow box 10 is communicated with the drainage tank body 8, and a drain pipe 11 connected below the overflow box 10 directly leads to the bottom of the reflux area 21 in the lower tank body 2. The overflow box 10 is provided with a defoaming body 12, and the defoaming body 12 can be defoaming cotton or other materials with hollow gaps inside. The defoaming body 12 is arranged on the overflow box 10, and when the electroplating solution or the cleaning solution passes through the defoaming body 12, bubbles carried in the electroplating solution or the cleaning solution collide with the defoaming body 12 to be broken or are adsorbed on the defoaming body 12, so that foams generated by sputtering rebound due to fall are reduced.

As shown in fig. 1 and fig. 9 to 10, in the present embodiment, the water blocking device 9 includes a support base 91, two mounting bases 92, and two pairs of water blocking rollers 95. The supporting base 91 is arranged in the drainage groove body 8, and two installation bases 92 are oppositely arranged on the supporting base 91, and two arc-shaped grooves 93 which are recessed inwards and extend along the height direction of the grooves are respectively arranged at the mutually facing ends of the two installation bases 92; the arc-shaped grooves 93 on the two mounting seats 92 are opposite one to one; the arc-shaped groove 93 is provided with at least one first drainage port 94 communicated with the outside; the two pairs of water blocking rollers 95 are embedded into the arc-shaped grooves 93 one by one and are rotatably arranged on the supporting base 91; in the two opposite water blocking rollers 95, one ends close to each other are in sealing abutment and form a plate passing gap for a plate to be plated to pass through when being extruded; and a required gap is reserved between the circumferential outer wall surface of the water retaining roller 95 and the inner wall surface of the arc-shaped groove 93 where the water retaining roller is located. The water retaining device 9 is arranged to divide partial electroplating solution or cleaning solution flowing out from the through opening of the upper tank body 1, so that the pressure difference of the electroplating solution or cleaning solution flowing out from the plate passing gap in the moving process of the electroplating plate is reduced, and the bubble amount formed in the downward-rushing and backflow process of the electroplating solution or cleaning solution is reduced. There are various ways to implement the water retaining device 9, and only one common embodiment is shown here.

In summary, in the reflux defoaming system for an electroplating process tank provided by the embodiment of the invention, the electroplating solution or cleaning solution in the upper tank body 1 flows out through the through holes at two sides and then enters the drainage tank body 8; electroplating solution or cleaning solution in the drainage tank body 8 overflows through a plate-passing liquid outlet on one side and then enters the overflow box 10, and flows to the backflow area 21 of the lower tank body 2 through an overflow pipe 11 of the overflow box 10, an air bubble layer above the electroplating solution or cleaning solution in the backflow area 21 overflows from the top of a partition plate 6 in the lower tank body 2 and then enters the defoaming area 22 of the lower tank body 2, and the defoaming device 4 above the defoaming area 22 sucks air bubbles in the defoaming area 22 through forming a negative pressure area and shears and eliminates the air bubbles, so that defoaming of the electroplating solution or cleaning solution is realized; compared with the prior art in which the electroplating solution or the cleaning solution directly flows downwards from an overflow port on the upper tank body 1, the backflow pipe 11 can guide the electroplating solution or the cleaning solution flowing out of the upper tank body 1 to the bottom of the backflow area 21 of the lower tank body 2, so that the bubble amount generated by impact when the electroplating solution or the cleaning solution falls into the lower tank body 2 can be reduced, and after the electroplating solution or the cleaning solution in the backflow area 21 of the lower tank body 2 is kept stand, a bubble layer on the upper layer of the liquid level overflows from the top of the partition plate 6 and then enters the defoaming area 21 to be defoamed through the defoaming device 4, so that bubbles in the electroplating solution or the cleaning solution obtained by backflow can be eliminated, and the influence of the bubbles on; meanwhile, the drain pipe 11 is of a relatively sealed structure, and when electroplating solution or cleaning solution flows into the lower tank body 2 from the upper tank body 1 through the drain pipe 11, the contact with air is less, so that the oxidation of effective components in the electroplating solution caused by the contact of the electroplating solution and the air can be reduced, and the stability of chemical components in the electroplating solution can be better ensured.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims

1. A backflow defoaming system of an electroplating process tank is characterized by comprising:

the upper tank body (1) is provided with through holes for the plates to be plated to pass through on two opposite side walls;

the drainage tank body (8) is arranged on one side of the upper tank body (1) and is communicated with the upper tank body (1) through the through hole;

the lower tank body (2) is positioned below the upper tank body (1), and the bottom of the lower tank body is provided with a partition plate (6) which divides the inner space of the lower tank body (2) into a reflux area (21) and a defoaming area (22); the bubble layer above the electroplating solution or the cleaning solution in the reflow area (21) overflows from the top of the clapboard (6) and then enters the defoaming area (22);

the overflow box (10) is communicated with a plate-passing liquid outlet on one side of the drainage groove body (8) opposite to the upper groove body (1), and a drainage pipe (11) communicated with the reflux area (21) is arranged below the overflow box;

and the defoaming device (4) is positioned above the defoaming area (22) and is used for forming a negative pressure area above the defoaming area (22) so as to suck away the bubbles in the backflow area (21) and shear and eliminate the bubbles.

2. The reflux defoaming system for electroplating process tanks according to claim 1, characterized in that a backflow sloping plate (7) extending obliquely towards the bottom of the defoaming zone (22) is connected to the top of the partition plate (6).

3. The reflow defoaming system for electroplating process tanks according to claim 1, characterized in that the overflow box (10) is provided with a defoaming body (12).

4. The reflux defoaming system of the electroplating process tank as claimed in claim 1, wherein a water retaining device (9) which is blocked at the position of the through opening of the upper tank body (1) is installed in the drainage tank body (8).

5. The reflow defoaming system for electroplating process tanks according to claim 4, characterized in that the water-retaining device (9) comprises:

a support base (91);

two mounting seats (92), wherein one ends of the two mounting seats (92) which are oppositely arranged on the supporting base (91) and face each other are respectively provided with at least one arc-shaped groove (93) which is recessed inwards and extends along the height direction of the groove; the arc-shaped grooves (93) on the two mounting seats (92) are opposite one to one; the arc-shaped groove (93) is provided with at least one first liquid discharge port (94) communicated with the outside;

the water blocking rollers (95) are embedded into the arc-shaped grooves (93) one by one and are rotatably arranged on the supporting base (91); one ends of the two opposite water blocking rollers (95) close to each other are in sealing abutting joint and form a plate passing gap for a plate to be plated to pass through when being extruded;

and a required gap is reserved between the circumferential outer wall surface of the water retaining roller (95) and the inner wall surface of the arc groove (93) where the water retaining roller is located.

6. The reflow defoaming system for plating process tanks according to claim 1, characterized in that the defoaming device (4) comprises:

the defoaming pump is arranged at the top of the lower tank body (2) and is positioned above the defoaming area (22), and the lower end of the defoaming pump is provided with a suction inlet for bubbles to enter;

an extension pipe (44) connected to the suction port of the defoaming pump and extending in the direction of the lower tank body (2); the lower opening of the extension tube (44) is located above the liquid level in the bubble removal zone (22).

7. The system of claim 6, wherein the defoaming pump comprises:

the defoaming motor (41) is arranged on the lower groove body (2), and an impeller assembly (42) positioned above the defoaming area (22) is assembled on an output shaft of the defoaming motor;

and the defoaming pipe (43) is covered on the periphery of the impeller assembly (42) and is provided with a lower end opening, and the extension pipe (44) is connected to the lower end opening of the defoaming pipe (43).

8. The reflow defoaming system for plating process tanks as claimed in claim 7, wherein the defoaming pipe (43) comprises:

an upper pipe body (431) including a top plate (4311) connected to the defoaming motor (41) and positioned above the impeller assembly (42), an upper sleeve (4312) connected to an outer circumferential edge of the top plate (4311) and covering an outer circumference of the impeller assembly (42), and a bottom plate (4313) connected below the upper sleeve (4312) and positioned below the impeller assembly (42), the bottom plate (4313) having a first through hole corresponding to a lower end surface of the impeller assembly (42);

a lower tube body (432) comprising a connecting plate (4321) and a lower sleeve (4322); the connecting plate (4321) is connected to the bottom of the bottom plate (4313) with a connecting gap between the connecting plate and the bottom plate (4313), the connecting plate (4321) has a second through opening corresponding to the first through opening, the lower sleeve (4322) is connected to the bottom of the connecting plate (4321) at an edge position corresponding to the second through opening, and the extension pipe (44) is connected to the lower end of the lower sleeve (4322); the pipe diameter of the lower sleeve (4322) is smaller than that of the upper sleeve (4312).

9. The reflux defoaming system of the electroplating process tank as claimed in claim 1, wherein a reflux pipeline (3) is further communicated between the upper tank body (1) and the lower tank body (2), and electroplating solution or cleaning solution overflowing from the upper tank body (1) flows to the lower tank body (2) through the reflux pipeline (3).

10. The reflux defoaming system of electroplating process tank as claimed in claim 9, wherein a flow control valve (31) for controlling the flow of the electroplating solution or cleaning solution flowing into the lower tank body (2) is arranged on the reflux pipeline (3).

11. The reflux defoaming system of the electroplating process tank as claimed in claim 1, wherein a conveying device (5) for conveying the electroplating solution or cleaning solution in the lower tank body (2) into the upper tank body (1) is further communicated between the upper tank body (1) and the lower tank body (2).

12. The reflux defoaming system of electroplating process tank as claimed in claim 11, wherein the conveying device (5) comprises a circulating pump (51) for drawing electroplating solution or cleaning solution from the lower tank body (2), a liquid suction pipeline (52) communicated between a liquid inlet of the circulating pump (51) and the defoaming area (22), and a liquid outlet pipeline (53) communicated between a liquid outlet of the circulating pump (51) and the upper tank body (1); the liquid outlet pipeline (53) comprises a liquid outlet of the circulating pump (51) and a first pipeline (531) and a second pipeline (532), wherein the first pipeline (531) is positioned between the jet pipes (13) in the upper trough body (1) and connected with the liquid outlet of the circulating pump (51) and extends into the second pipeline (532) between the circulating pipes (14) in the upper trough body (1), an electric control valve (54) used for controlling the flow of the first pipeline (531) is arranged on the first pipeline (531), and a manual control valve (55) used for controlling the flow of the second pipeline (532) is arranged on the second pipeline (532).

13. The system of claim 12, wherein the end of the liquid suction pipe (52) extending into the defoaming area (22) is further provided with a suction port screen (56).