CN110783213B - Wedge-shaped cleaver for wire bonding and preparation method - Google Patents
Wedge-shaped cleaver for wire bonding and preparation method Download PDFInfo
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- CN110783213B CN110783213B CN201910977011.8A CN201910977011A CN110783213B CN 110783213 B CN110783213 B CN 110783213B CN 201910977011 A CN201910977011 A CN 201910977011A CN 110783213 B CN110783213 B CN 110783213B
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- lead
- riving knife
- wedge
- cleaver
- hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78325—Auxiliary members on the pressing surface
- H01L2224/78328—Material of the auxiliary member
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to the field of microelectronic packaging, and provides a wedge-shaped riving knife for wire bonding and a preparation method thereof, wherein the riving knife comprises a riving knife handle, a riving knife head fixedly connected with the riving knife handle, and a wire through hole arranged at the end part of the riving knife head; the cutter head of the riving knife is a wedge-shaped cutter head; the lead through hole is a through hole which obliquely penetrates through the middle part of the end face of the tool bit of the wedge-shaped tool bit to the middle part of the wedge-shaped tool bit; and the inner wall of the lead through hole is tightly attached with an elastic material. According to the wedge-shaped riving knife for lead bonding and the preparation method, the elastic material filling of the lead through hole of the riving knife can be realized, so that the lead is tightly attached to the lead through hole, and the lead is prevented from moving in the lead through hole; by using the wedge-shaped riving knife, when the lead is bonded, the lead can be positioned in the center of the end surface of the knife head of the riving knife, the lengths of the tail fibers are consistent, and the precision and the quality of the lead bonding are improved.
Description
Technical Field
The invention relates to the field of microelectronic packaging, in particular to a wedge-shaped cleaver for wire bonding and a preparation method thereof.
Background
In the field of microelectronic packaging, wire bonding is commonly used for electrical interconnection between integrated circuit chips and between an integrated circuit chip and a peripheral circuit, and wedge bonding is one of the commonly used wire bonding methods. Wedge cleavers are important tools for wedge bonding, and the performance of wedge cleavers determines the quality, efficiency and economy of bonding. Wedge-shaped cleavers commonly used are made of high hardness, high toughness materials such as tungsten carbide (cemented carbide), titanium carbide, ceramics, etc., and have wire vias machined therein to enable wire feed during bonding. In the wedge bonding process, in order to ensure the bonding precision and the bonding quality, the lead is positioned in the center of the end face of the cutter head of the riving knife, and the lengths of the tail fibers are consistent; however, due to the matching problem of the lead through hole and the lead, the lead can move in the lead through hole (including moving along the lead through hole and moving perpendicular to the lead through hole), so that the lead deviates from the center of the end surface of the cutter head of the riving knife, and the tail is different in length, thereby affecting the welding precision and the consistency of the tail.
Chinese patent CN 107052557A discloses a welded ceramic chopper with a coating, which prevents the inner surface of the ceramic chopper from being adhered with a bonding lead by adding the coating on the inner surface of the ceramic chopper; chinese patent CN 107275243A discloses a welded chopper and a preparation method thereof, wherein the ultrasonic transmission efficiency is improved by arranging a passage of a cylindrical groove and a conical groove at the middle part of the chopper, and a groove is designed at the position of a knife mouth to avoid material residue; chinese patent CN 107710394A discloses a welding chopper, which realizes the purposes of improving bonding strength, improving filament truncation and inhibiting abrasion by the precise design of the end of the chopper; chinese patent CN 108389806A discloses a ceramic cleaver with improved lead bonding strength, and the design of the surface structure of the cleaver improves the bonding effect and the bonding stability; chinese patent CN 109332901A discloses a ceramic cleaver, a manufacturing method and application thereof, and the service life and welding effect of the cleaver are improved by laser bombardment treatment. Compared with the prior art, the service life of the cleaver and the welding effect of the cleaver and the preparation method are improved, but the lead bonding wedge-shaped cleaver and the bonding precision and the bonding consistency are not improved.
Disclosure of Invention
Aiming at the existing problems, the chopper for the wire bonding and the preparation method thereof are provided, the control of the position of the lead on the end face of the chopper head and the control of the length of the tail wire are realized, and the precision of the wire bonding and the consistency of the tail wire can be obviously improved by the chopper and the preparation method of the chopper.
The technical scheme adopted by the invention is as follows: a wedge-shaped riving knife for wire bonding comprises a riving knife handle, a riving knife head fixedly connected with the riving knife handle and a lead through hole arranged at the end part of the riving knife head; the cutter head of the riving knife is a wedge-shaped cutter head; the lead through hole is a through hole which obliquely penetrates through the middle part of the end face of the tool bit of the wedge-shaped tool bit to the middle part of the wedge-shaped tool bit; and the inner wall of the lead through hole is tightly attached with an elastic material.
Further, the elastic material is polytetrafluoroethylene.
Furthermore, the cleaver handle and the cleaver head are fixed by welding.
Further, the material of the cleaver handle includes, but is not limited to, tungsten carbide and ceramic.
Further, the material of the riving knife head includes, but is not limited to, tungsten carbide, titanium carbide, and ceramics.
The invention also provides a wedge-shaped cleaver for preparing the wire bonding, which comprises the following steps:
step 1: machining a cleaver handle and a cleaver tool bit by a machining method, and forming a lead through hole on the cleaver tool bit;
step 2: welding the machined tool bit of the riving knife on the riving knife handle;
and step 3: clamping the welded cleaver on a heating device, enabling the guide wire to penetrate through the lead wire through hole, and heating the cleaver through the heating device to melt the elastic material on the guide wire; clamping the guide wire by using a guide wire clamping device, moving the guide wire in the lead through hole back and forth, and filling the melted elastic material into the lead through hole;
and 4, step 4: after the elastic material is uniformly filled in the lead through holes, removing the redundant elastic material outside the lead through holes;
and 5: and stopping heating the cleaver, and taking out the guide line after the elastic material is solidified to finish the preparation of the cleaver.
Furthermore, in the step 3, the wire with the diameter of 13-45 microns is selected as the guide wire.
Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows: the wedge-shaped riving knife for lead bonding and the preparation method can realize the filling of the elastic material of the lead through hole of the riving knife, so that the lead is tightly attached to the lead through hole, and the lead is prevented from moving in the lead through hole; by using the wedge-shaped riving knife, when the lead is bonded, the lead can be positioned in the center of the end surface of the knife head of the riving knife, the lengths of the tail fibers are consistent, and the precision and the quality of the lead bonding are improved.
Drawings
FIG. 1 is a front view of a wedge-shaped riving knife for wire bonding in accordance with the present invention.
FIG. 2 is a side view of a wedge-shaped riving knife for wire bonding and a side view of a riving knife head of the present invention, partially enlarged.
FIG. 3 is a schematic illustration of a wedge-shaped riving knife for wire bonding in accordance with the present invention.
Fig. 4 is a schematic view of wedge-type riving wire bonding for wire bonding in accordance with the present invention.
Reference numerals: the wire-cutting device comprises a 1-cleaver handle, a 2-cleaver tool bit, a 3-lead through hole, a 4-elastic material, a 5-guide wire, a 6-guide wire clamping device and a 7-bonding lead.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, which are a front view, a side view and a partially enlarged view of a wedge-shaped riving knife in the embodiment, a wedge-shaped riving knife for wire bonding is illustrated, and includes a riving knife handle 1, a riving knife head 2 fixedly connected with the riving knife handle, and a wire passing hole 3 opened at an end of the riving knife head; the cutter head of the riving knife is a wedge-shaped cutter head; the lead through hole is a through hole which obliquely penetrates through the middle part of the end face of the tool bit of the wedge-shaped tool bit to the middle part of the wedge-shaped tool bit; and the inner wall of the lead through hole is tightly attached with an elastic material 4.
Preferably, the cleaver handle and the cleaver head are fixed by welding.
Preferably, the manufacturing material of the cleaver handle is one of tungsten carbide and ceramic.
Preferably, the riving knife head is made of one of tungsten carbide, titanium carbide and ceramic.
As shown in fig. 3, the invention also provides a method for preparing the wedge-shaped riving knife for wire bonding, which comprises the following steps:
step 1: machining the cleaver handle 1 and the cleaver tool bit 2 by a machining method, and forming a lead through hole 3 on the cleaver tool bit;
step 2: welding the machined tool bit of the riving knife on the riving knife handle;
and step 3: clamping the welded cleaver on a heating device, enabling the guide wire 5 to penetrate through the lead wire through hole, and heating the cleaver by the heating device to melt the elastic material 4 on the guide wire; clamping the guide wire by using a guide wire clamping device 6, moving the guide wire back and forth in the lead through hole, and filling the melted elastic material 4 into the lead through hole 3; the heating device heats the riving knife, because the guide line penetrates through the lead through hole and is in contact with the lead through hole, the temperature of the guide line correspondingly rises, at the moment, the elastic material to be filled is placed on the guide line at one end of the lead through hole, the elastic material can be melted on the guide line, and the clamping device clamps the guide line to move back and forth in the lead through hole, so that the melted elastic material can be uniformly filled into the lead through hole.
And 4, step 4: after the elastic material is uniformly filled in the lead through holes, removing the redundant elastic material outside the lead through holes;
and 5: and stopping heating the cleaver, and taking out the guide line after the elastic material is solidified to finish the preparation of the cleaver.
According to the prepared wedge-shaped cleaver, a layer of elastic material is attached to the lead through hole, and the bonding lead can be tightly attached to the lead through hole when penetrating through the lead through hole.
Wherein the guide wire is a metal wire with a diameter equivalent to that of the lead wire used by the wedge-shaped cleaver, and the wire diameter of the lead wire used by the guide wire and the cleaver is 13-45 micrometers.
In this embodiment, the heating device in step 3 employs a heating stage. The guide wire is a metal wire with the diameter equivalent to that of the lead used by the cleaver and used for guiding the elastic material to be filled into the lead through hole.
As shown in fig. 4, when wire bonding is performed, a bonding wire 7 penetrates through a wire through hole, the wire bonding equipment realizes fixation of the chopper by clamping a chopper handle, the bonding wire penetrates through the wire through hole and is attached to the end surface of the chopper head, and because the wire through hole is attached with an elastic material, the wire 7 can be always positioned in the center of the wire through hole and tightly attached to the center surface of the chopper head by virtue of elasticity in the bonding process, so that the movement of the wire in the wire through hole is avoided, the wire can be positioned in the center of the end surface of the chopper head, and the lengths of tail wires are consistent, so that the precision and the quality of wire bonding can be improved, wherein the bonding wire is usually a gold wire.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Claims (7)
1. A wedge-shaped riving knife for wire bonding is characterized by comprising a riving knife handle, a riving knife head fixedly connected with the riving knife handle and a lead through hole arranged at the end part of the riving knife head; the cutter head of the riving knife is a wedge-shaped cutter head; the lead through hole is a through hole which obliquely penetrates through the middle part of the end face of the tool bit of the wedge-shaped tool bit to the middle part of the wedge-shaped tool bit; and the inner wall of the lead through hole is tightly attached with an elastic material.
2. The wedge-shaped cleaver for wire bonding as claimed in claim 1, wherein said resilient material is polytetrafluoroethylene.
3. The wedge-shaped riving knife for wire bonding of claim 1, wherein the riving knife handle and the riving knife head are fixed by welding.
4. The wedge-shaped cleaver for wire bonding as claimed in claim 1, wherein the material of the cleaver handle includes but is not limited to tungsten carbide and ceramic.
5. The wedge for wire bonding of claim 1 wherein the material of the cleaver tip includes but is not limited to tungsten carbide, titanium carbide, ceramic.
6. A method for manufacturing a wedge-shaped riving knife for wire bonding, which is used for manufacturing the wedge-shaped riving knife for wire bonding of any one of claims 1 to 4, characterized by comprising the steps of:
step 1: machining a cleaver handle and a cleaver tool bit by a machining method, and forming a lead through hole on the cleaver tool bit;
step 2: welding the machined tool bit of the riving knife on the riving knife handle;
and step 3: clamping the welded cleaver on a heating device, enabling the guide wire to penetrate through the lead wire through hole, and heating the cleaver through the heating device to melt the elastic material on the guide wire; clamping the guide wire by using a guide wire clamping device, moving the guide wire in the lead through hole back and forth, and filling the melted elastic material into the lead through hole;
and 4, step 4: after the elastic material is uniformly filled in the lead through holes, removing the redundant elastic material outside the lead through holes;
and 5: and stopping heating the cleaver, and taking out the guide line after the elastic material is solidified to finish the preparation of the cleaver.
7. The method of claim 6, wherein the wire guide of step 3 is a wire with a wire diameter of 13-45 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910977011.8A CN110783213B (en) | 2019-10-15 | 2019-10-15 | Wedge-shaped cleaver for wire bonding and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910977011.8A CN110783213B (en) | 2019-10-15 | 2019-10-15 | Wedge-shaped cleaver for wire bonding and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110783213A CN110783213A (en) | 2020-02-11 |
| CN110783213B true CN110783213B (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910977011.8A Active CN110783213B (en) | 2019-10-15 | 2019-10-15 | Wedge-shaped cleaver for wire bonding and preparation method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020117641A1 (en) * | 2020-07-03 | 2022-01-05 | Hesse Gmbh | Wire guide module and ultrasonic wire bonder herewith |
| CN113035725B (en) * | 2021-02-25 | 2024-04-02 | 北京时代民芯科技有限公司 | Deep cavity bonding method |
| CN113770501B (en) * | 2021-07-27 | 2022-12-27 | 中国电子科技集团公司第二十九研究所 | Wedge-shaped cleaver structure for improving bonding density of lead |
| CN113787250B (en) * | 2021-07-27 | 2023-01-10 | 中国电子科技集团公司第二十九研究所 | Promote wedge riving knife structure of lead bonding precision |
| CN114799472A (en) * | 2022-03-16 | 2022-07-29 | 东莞市乾丰电子科技有限公司 | Wedge-shaped cleaver and aluminum wire bonding method |
| CN114986040A (en) * | 2022-07-28 | 2022-09-02 | 有研工程技术研究院有限公司 | Long-life automatic wedge welding cleaver and preparation method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3627192A (en) * | 1969-02-03 | 1971-12-14 | Bearings Seale & Gears Inc | Wire lead bonding tool |
| DE3912580C2 (en) * | 1989-04-17 | 1997-08-21 | F&K Delvotec Bondtechnik Gmbh | Bond stamp |
| US5217154A (en) * | 1989-06-13 | 1993-06-08 | Small Precision Tools, Inc. | Semiconductor bonding tool |
| JPH08124976A (en) * | 1994-10-21 | 1996-05-17 | Hitachi Ltd | Wire bonding tool and wire bonding equipment |
| JPH11186316A (en) * | 1997-12-24 | 1999-07-09 | Sony Corp | Device and method of wire bonding, and lead frame |
| JP2002289639A (en) * | 2001-03-26 | 2002-10-04 | Mitsubishi Materials Corp | Wedged tool |
| US20130119117A1 (en) * | 2011-11-04 | 2013-05-16 | Invensas Corporation | Bonding wedge |
| JP5899907B2 (en) * | 2011-12-26 | 2016-04-06 | 富士電機株式会社 | Wedge tool for wire bonding, bonding apparatus, wire bonding method, and method for manufacturing semiconductor device |
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2019
- 2019-10-15 CN CN201910977011.8A patent/CN110783213B/en active Active
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