CN110776850A - Conductive adhesive and preparation method thereof - Google Patents
Conductive adhesive and preparation method thereof Download PDFInfo
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- CN110776850A CN110776850A CN201911233367.7A CN201911233367A CN110776850A CN 110776850 A CN110776850 A CN 110776850A CN 201911233367 A CN201911233367 A CN 201911233367A CN 110776850 A CN110776850 A CN 110776850A
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- conductive adhesive
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- raw rubber
- silicone oil
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- 239000000853 adhesive Substances 0.000 title claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 89
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 229920001971 elastomer Polymers 0.000 claims abstract description 65
- 239000005060 rubber Substances 0.000 claims abstract description 65
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000001257 hydrogen Substances 0.000 claims abstract description 30
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 30
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 125000006038 hexenyl group Chemical group 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000001055 blue pigment Substances 0.000 claims abstract description 16
- 238000007599 discharging Methods 0.000 claims abstract description 8
- 238000001914 filtration Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 238000005303 weighing Methods 0.000 claims abstract description 8
- 229920002545 silicone oil Polymers 0.000 claims description 42
- 238000001035 drying Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 7
- -1 siloxane compound Chemical class 0.000 claims description 6
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 3
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 239000003921 oil Substances 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 4
- 239000010703 silicon Substances 0.000 abstract 4
- 241000872198 Serjania polyphylla Species 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 238000005086 pumping Methods 0.000 abstract 1
- 239000004576 sand Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The preparation method of the conductive adhesive comprises the steps of weighing raw rubber, silicon oil, hydrogen-containing silicon oil, a release agent, a blue pigment and conductive carbon black with ultrahigh hexenyl content according to a proportion, fully and uniformly mixing the raw rubber, putting the raw rubber, the silicon oil, the hydrogen-containing silicon oil, the release agent, the blue pigment and the conductive carbon black into a stirrer for stirring, heating and carrying out constant temperature treatment to obtain a crude conductive adhesive product, and carrying out inspection, vacuum pumping and discharging, adhesive airing, roll wrapping and adhesive filtering on the crude conductive adhesive product to obtain the conductive adhesive, wherein the conductive adhesive does not contain heavy metals such as gold, silver, nickel and the like, so that the production cost is greatly reduced, in addition, the environmental pollution is avoided, the conductive adhesive has an excellent conductive function, a surface resistance value of 50-1000 omega, and excellent high and low temperature resistance, can be used at the temperature of-50-200 ℃, is not easy to oxidize and explain in ozone and environment, has, the conductive adhesive also has good high temperature resistance, low temperature resistance and conductivity, and can meet the requirements of complex application environments such as moisture, sand, underwater and the like.
Description
Technical Field
The invention relates to the field of glue and preparation thereof, in particular to conductive glue and a preparation method thereof.
Background
The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material. The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain special requirements on the conductivity and the adhesive bonding strength. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like.
The conductive adhesive has the functions of conducting, radiating and bonding, and overcomes the defects of infirm joint, part deformation, reduced application performance and the like of a welding method. With the miniaturization and weight reduction of electric and electronic devices, conductive adhesives have become an indispensable material in the electronic industry. Conductive adhesives are widely used in electrical components and parts such as large scale integrated circuits, detectors, body sensors, photosensors, cameras, and instrument waveguides. Low cost printed wiring boards can be manufactured using this technique. Conductive paste has thus made a great contribution to the development of microelectronic packages.
Most of conductive adhesives in the current market realize conductivity by adding gold, silver, copper, aluminum, zinc, iron, nickel powder and the like, but the addition of a large amount of heavy metals not only greatly increases the production cost, but also influences the personal health and pollutes the environment.
Disclosure of Invention
In order to solve the problems, the invention provides a conductive adhesive and a preparation method thereof, wherein the contents of the conductive adhesive are as follows:
the invention aims to provide a conductive adhesive, which is technically characterized in that: the preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
In some embodiments of the present invention, the conductive adhesive comprises the following components in parts by weight:
in some embodiments of the invention, the extra-high hexenyl content raw gum has a relative molecular weight of (50-60) × 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4-5 wt%.
In some embodiments of the present invention, the raw rubber is selected from any one or more of smoked sheet rubber, standard rubber, styrene-butadiene rubber, cis-butyl rubber, chloroprene rubber or nitrile-butadiene rubber.
In some embodiments of the invention, the viscosity of the silicone oil is 300 to 500 cP.
In some embodiments of the present invention, the hydrogen content of the hydrogen-containing silicone oil is 1 to 1.5 wt%.
In some embodiments of the present invention, the release agent is selected from any one or more of siloxane compound, silicone grease, silicone resin, silicone rubber, polytetrafluoroethylene, and fluorine resin.
In some embodiments of the present invention, the particle size of the conductive carbon black is 30 to 200nm, and the purity of the conductive carbon black is 90 to 99.9 wt%.
Another object of the present invention is to provide a method for preparing a conductive adhesive, which comprises the following steps: the preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive pre-mixture prepared in the step S1 into a stirrer for stirring, heating to 140-180 ℃ for 3-4 hours, and then carrying out constant-temperature treatment for 20-40 min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
Compared with the prior art, the invention has the beneficial effects that:
the conductive adhesive disclosed by the invention does not contain heavy metals such as gold, silver, nickel and the like, so that the production cost is greatly reduced, no environmental pollution is caused, the conductive adhesive has an excellent conductive function, the surface resistance value is 50-1000 omega, the conductive adhesive has excellent high and low temperature resistance, the conductive adhesive can be used at the temperature of-50-200 ℃, the conductive adhesive is not easily oxidized or explained in ozone and radiation environments, the chemical stability is good, and the conductive adhesive has excellent hydrophobicity, moisture resistance, shock resistance, physiological inertia and the like.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below so that those skilled in the art can better understand the advantages and features of the present invention, and thus the scope of the present invention will be more clearly defined. The embodiments described herein are only a few embodiments of the present invention, rather than all embodiments, and all other embodiments that can be derived by one of ordinary skill in the art without inventive faculty based on the embodiments described herein are intended to fall within the scope of the present invention.
Example 1
The preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
The conductive adhesive comprises the following components in parts by weight:
wherein the relative molecular weight of the crude rubber with ultrahigh hexenyl content is 55 multiplied by 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4.5 wt%.
Wherein the raw rubber is selected from smoked sheet rubber.
Wherein the viscosity of the silicone oil is 400 cP.
Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.3 wt%.
Wherein the release agent is selected from siloxane compounds.
Wherein the particle diameter of the conductive carbon black is 115nm, and the purity of the conductive carbon black is 95 wt%.
The preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive premix prepared in the step S1 into a stirrer for stirring, heating to 160 ℃ for 3.5 hours, and carrying out constant-temperature treatment for 30min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
Example 2
The preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
The conductive adhesive comprises the following components in parts by weight:
wherein the relative molecular weight of the crude rubber with ultrahigh hexenyl content is 50 multiplied by 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4 wt%.
Wherein the raw rubber is selected from standard rubber.
Wherein the viscosity of the silicone oil is 300 cP.
Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1 wt%.
Wherein the release agent is selected from silicone grease.
Wherein the particle size of the conductive carbon black is 30nm, and the purity of the conductive carbon black is 90 wt%.
The preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive premix prepared in the step S1 into a stirrer for stirring, heating to 180 ℃ for 3 hours, and carrying out constant-temperature treatment for 20min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
Example 3
The preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
The conductive adhesive comprises the following components in parts by weight:
wherein the relative molecular weight of the crude rubber with ultrahigh hexenyl content is 60 multiplied by 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 5 wt%.
Wherein the raw rubber is selected from styrene butadiene rubber.
Wherein the viscosity of the silicone oil is 500 cP.
Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.5 wt%.
Wherein the release agent is selected from silicone resin.
Wherein the particle size of the conductive carbon black is 200nm, and the purity of the conductive carbon black is 99.9 wt%.
The preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive pre-mixture prepared in the step S1 into a stirrer for stirring, heating to 140-180 ℃ for 3-4 hours, and then carrying out constant-temperature treatment for 20-40 min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
Example 4
The preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
The conductive adhesive comprises the following components in parts by weight:
wherein the relative molecular weight of the crude rubber with ultrahigh hexenyl content is 52 multiplied by 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4.1 wt%.
Wherein the raw rubber is selected from butadiene rubber.
Wherein the viscosity of the silicone oil is 320 cP.
Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.2 wt%.
Wherein the release agent is selected from silicone rubber.
Wherein the particle size of the conductive carbon black is 50nm, and the purity of the conductive carbon black is 92 wt%.
The preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive premix prepared in the step S1 into a stirrer for stirring, heating to 140 ℃ for 3 hours, and carrying out constant-temperature treatment for 40min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
Example 5
The preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
The conductive adhesive comprises the following components in parts by weight:
wherein the relative molecular weight of the crude rubber with ultrahigh hexenyl content is 58 multiplied by 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4.7 wt%.
Wherein the raw rubber is selected from butyl rubber.
Wherein the viscosity of the silicone oil is 450 cP.
Wherein, the hydrogen content of the hydrogen-containing silicone oil is 1.4 wt%.
Wherein the release agent is selected from polytetrafluoroethylene.
Wherein the particle size of the conductive carbon black is 180nm, and the purity of the conductive carbon black is 96 wt%.
The preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive premix prepared in the step S1 into a stirrer for stirring, heating to 180 ℃ for 4 hours, and carrying out constant-temperature treatment for 30min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
The conductive adhesive prepared in the embodiment 1-5 has an excellent conductive function, a surface resistance value of 50-1000 omega, excellent high and low temperature resistance, good chemical stability, excellent hydrophobicity, moisture resistance, shock resistance, physiological inertia and the like, can be used at a temperature of-50-200 ℃, and is not easy to be oxidized and explained in an ozone and radiation environment.
The use of the product is divided into the mould pressing type:
adopting platinum or a 2.5 vulcanizing machine for manufacturing conductive silica gel products such as a capacitance pen point, a body-building variable-frequency vibration instrument, a remote controller electric plate, an electric appliance circuit board and the like;
the storage and transportation notice items of the product are as follows:
the paper box with the plastic bag lining is packaged without being contacted with open fire, prevents direct irradiation of sunlight, and is stored in a cool and dry place to keep ventilation and dryness and avoid rain.
The physical property parameters of the conductive adhesive prepared in examples 1-5 were measured as follows in Table 1:
TABLE 1
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. A conductive adhesive is characterized in that: the preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.
2. The conductive adhesive according to claim 1, wherein: the conductive adhesive comprises the following components in parts by weight:
3. a conductive paste according to any one of claims 1 or 2, wherein: the relative molecular weight of the raw rubber with the ultra-high hexenyl content is (50-60) x 10
4The vinyl content of the raw rubber with the ultra-high hexenyl content is 4-5 wt%.
4. A conductive paste according to any one of claims 1 or 2, wherein: the raw rubber is selected from one or more of smoked sheet rubber, standard rubber, styrene butadiene rubber, cis-butadiene rubber, butyl rubber, chloroprene rubber or butadiene-acrylonitrile rubber.
5. A conductive paste according to any one of claims 1 or 2, wherein: the viscosity of the silicone oil is 300-500 cP.
6. A conductive paste according to any one of claims 1 or 2, wherein: the hydrogen content of the hydrogen-containing silicone oil is 1-1.5 wt%.
7. A conductive paste according to any one of claims 1 or 2, wherein: the release agent is selected from any one or more of siloxane compound, silicone grease, silicone resin, silicone rubber, polytetrafluoroethylene and fluororesin.
8. A conductive paste according to any one of claims 1 or 2, wherein: the particle size of the conductive carbon black is 30-200 nm, and the purity of the conductive carbon black is 90-99.9 wt%.
9. A preparation method of conductive adhesive is characterized by comprising the following steps: the preparation method of the conductive adhesive comprises the following steps:
s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;
s2, putting the conductive adhesive pre-mixture prepared in the step S1 into a stirrer for stirring, heating to 140-180 ℃ for 3-4 hours, and then carrying out constant-temperature treatment for 20-40 min to obtain a crude conductive adhesive product;
s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009242508A (en) * | 2008-03-31 | 2009-10-22 | Asahi Kasei E-Materials Corp | Adhesive and bonded body |
| CN104140682A (en) * | 2014-07-25 | 2014-11-12 | 滁州君越高分子新材料有限公司 | Antistatic silicone rubber compound special for extruded wires and cables and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009242508A (en) * | 2008-03-31 | 2009-10-22 | Asahi Kasei E-Materials Corp | Adhesive and bonded body |
| CN104140682A (en) * | 2014-07-25 | 2014-11-12 | 滁州君越高分子新材料有限公司 | Antistatic silicone rubber compound special for extruded wires and cables and preparation method thereof |
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Application publication date: 20200211 |