CN110774173A

CN110774173A - Automatic discharging grinding machine for wafer processing

Info

Publication number: CN110774173A
Application number: CN201910998780.6A
Authority: CN
Inventors: 吴嘉至
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-02-11

Abstract

The invention discloses an automatic discharging grinder for wafer processing, which structurally comprises a mounting seat, a workbench, a grinding head, a lifting table, a motor and a lifting rod, wherein the mounting seat is fixed at the bottom end of the workbench, the motor and the lifting rod are installed in the lifting table, the lifting rod is connected with the grinding head in a mechanical connection mode, the grinding head corresponds to the workbench, the grinding head is provided with a drill hole and a machine body, the machine body is installed on the lifting rod and controls the drill hole, a partition plate, a flow guide channel, a jet orifice, a support rod, a surrounding plate and a drill hole controller are formed in the machine body, the upper end of the grinding head is provided with the flow guide channel, the flow guide channel is communicated with the inner part of the bottom end of the partition plate, the enlarged air of the grinding head is communicated, a liquid inlet end is arranged at the upper end of the machine body, part of cooling liquid acts on a, thereby reducing the temperature of the polishing head.

Description

Automatic discharging grinding machine for wafer processing

Technical Field

The invention relates to the technical field of wafer processing, in particular to an automatic discharging grinding machine for wafer processing.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer is called a wafer because the shape of the wafer is circular, various circuit element structures can be manufactured on the silicon wafer, so that an integrated circuit product with a specific electric function is formed.

Disclosure of Invention

In order to solve the problems, the invention provides an automatic discharging grinder for wafer processing.

In order to achieve the purpose, the invention is realized by the following technical scheme: an automatic discharging grinder for wafer processing comprises a mounting base, a workbench, a grinding head, a lifting table, a motor and a lifting rod, the mounting seat is fixed at the bottom end of the workbench, a motor and a lifting rod are arranged in the lifting platform, the lifting rod is connected with a grinding head in a mechanical connection mode, the grinding head corresponds to the workbench, the grinding head is provided with a drill hole and a machine body, the machine body is arranged on the lifting rod and controls the drill hole, the interior of the machine body is provided with a clapboard, a flow guide channel, a jet orifice, a support rod, a coaming and a drilling controller, the bottom end of the drilling controller is fixed through a partition plate, the diversion channel is communicated with the inside of the jet orifice, the other end of the flow guide channel, which is opposite to the jet orifice, is vertically welded with the support rod, the jet orifice is opposite to the drilling controller, and two sides of the drilling controller are sealed by coamings.

As a further improvement of the invention, a pressure outlet is provided in the injection port.

As a further improvement of the invention, the flow guide channel is provided with a liquid inlet end with a funnel-shaped structure.

As a further improvement of the invention, the liquid inlet end internally comprises a filter screen, a liquid outlet ball and a pressure spring, wherein one end of the liquid outlet ball is tightly attached to the filter screen, and the other end of the liquid outlet ball is matched with the pressure spring.

As a further improvement of the invention, the partition plate is hollow, and both sides and the bottom end of the partition plate positioned on the drilling controller are open.

As a further improvement of the invention, the pressure spring is wrapped in the sealed throat pipe, so that the pressure spring is prevented from directly contacting with cooling water to corrode and rust.

As a further improvement of the invention, two pressure springs are arranged, and a horizontal channel is formed between the two pressure springs and is communicated with the liquid inlet and the liquid outlet of the liquid outlet ball.

As a further improvement of the invention, the filter screen is provided with a plurality of layers, the layers are mutually staggered, and a gap of 5mm is reserved between the layers to form a wavy structure.

As a further improvement of the invention, the jet orifice mainly adopts the principle of a shower head to discharge water, and the water is discharged in a jet flow shape, so that the cooling efficiency on the partition plate is higher.

Compared with the prior art, the invention has the beneficial effects that:

1. the upper end of the grinding head body is provided with a flow guide channel, wherein the flow guide channel is communicated with the inside of the bottom end of the partition plate, the air circulation of the grinding head is increased, the liquid inlet end is arranged at the upper end of the grinding head body, part of cooling liquid acts on a grinding device during grinding, the water inside the grinding head is cooled, the cooling liquid is fully utilized, and the temperature of the grinding head is reduced.

2. The spray opening is matched with the pressure outlet, so that the cooling liquid is diffused on the outer surface of the whole drilling controller in an arc-shaped jet flow mode, and the temperature in the grinding head is reduced more efficiently.

3. The filter screen, the liquid outlet ball and the pressure spring are arranged to act together, the filter screen can filter impurities of cooling liquid in processing, and the pressure spring releases liquid pressure to reset and push out the liquid outlet ball when no cooling liquid exists, so that the liquid inlet end is sealed, and unnecessary flow channel pollution is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an automatic discharge grinder for wafer processing according to the present invention.

FIG. 2 is a schematic diagram of the polishing head of the present invention.

Fig. 3 is a schematic structural view of the flow guide of the present invention.

Fig. 4 is a schematic view of the working principle of the liquid outlet ball of the flow guide channel.

FIG. 5 is a schematic view of the water cooling structure inside the polishing head of the present invention.

In the figure: the device comprises a mounting seat-1, a workbench-2, a grinding head-3, a lifting table-4, a motor-5, a lifting rod-6, a drilling opening-31, a machine body-32, a partition plate-2 a, a flow guide channel-2 b, a jet opening-2 c, a pressure outlet-c 1, a support rod-2 d, a coaming-2 e, a drilling opening controller-2 f, a liquid inlet end-b 1, a filter screen-b 21, a liquid outlet ball-b 22 and a pressure spring-b 23.

Detailed Description

In order to make the technical means, the creation features, the achievement objects and the effects of the invention easy to understand, fig. 1 to fig. 5 schematically show the structure of the automatic discharging grinder according to the embodiment of the invention, and the technical solution in the embodiment of the invention will be clearly and completely described below with reference to the drawings in the embodiment of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

As shown in fig. 1-5, the present invention provides an automatic unloading grinder for wafer processing, which includes an installation base 1, a workbench 2, a grinding head 3, a lifting table 4, a motor 5, and a lifting rod 6, wherein the installation base 1 is fixed at the bottom end of the workbench 2, the lifting table 4 is provided with the motor 5 and the lifting rod 6, the lifting rod 6 is connected with the grinding head 3 in a mechanical connection manner, the grinding head 3 corresponds to the workbench 2, the grinding head 3 is provided with a drill 31 and a machine body 32, the machine body 32 is installed on the lifting rod 6 and controls the drill 31, the machine body 32 is internally provided with a partition plate 2a, a flow guide 2b, a spray opening 2c, a support rod 2d, a surrounding plate 2e, and a drill controller 2f, the bottom end of the drill controller 2f is fixed by the partition plate 2a, the flow guide 2b is communicated with the spray opening 2c, the other end of the flow guide channel 2b, which is opposite to the jet orifice 2c, is vertically welded with a support rod 2d, the jet orifice 2c is opposite to a drilling controller 2f, two sides of the drilling controller 2f are sealed by a surrounding plate 2e, a pressure outlet c1 is arranged in the jet orifice 2c, the flow guide channel 2b is provided with a liquid inlet b1 with a funnel-shaped structure, the inside of the liquid inlet b1 comprises a filter screen b21, a liquid outlet ball b22 and a pressure spring b23, one end of the liquid outlet ball b22 is tightly attached to the filter screen b21, the other end of the liquid outlet ball b22 is matched with the pressure spring b23, the partition plate 2a is hollow, two sides and the bottom end of the drilling controller 2f are both open, the pressure spring b23 is wrapped in a sealed throat tube to avoid direct contact corrosion and rust corrosion of the pressure spring b23 and cooling water, two pressure springs 23 are arranged, a horizontal channel is formed between the two pressure springs and is communicated with the liquid inlet and the liquid outlet of, crisscross each other and keep 5 mm's clearance between the layer and form a wavy structure, jet 2c mainly adopts the gondola water faucet principle to go out water, is efflux water and makes the cooling efficiency on the baffle 2a higher.

The working principle of the automatic discharging grinder in the above technical scheme is explained as follows:

when a wafer is processed and ground, in the prior art, in order to reduce grinding damage of the wafer under the influence of high temperature in grinding, cooling liquid needs to be continuously added in the grinding process, when the grinding head 3 works, under the high-speed rotation of the drill opening 31, the inside of a drill opening controller 2f can generate great working heat, in order to better realize internal cooling, the upper end of a machine body 32 is provided with a flow guide channel 2b, after the cooling liquid enters through a liquid inlet end b1, a pressure spring b23 is extruded based on liquid pressure, a filter screen b21 filters the cooling liquid layer by layer, the cooling liquid is diffused on the drill opening controller 2f through a jet opening 2c and a pressure outlet c1 to cool the outer surface of the machine body, part of the cooling water can be changed into vapor to be diffused when being heated, and a small part of the cooling water is discharged through the bottom ends through opening partition plates at two sides to be used as a water cooling loop, during operation, water cooling can be realized, after operation is stopped, air circulation inside the grinding head 3 can be accelerated by utilizing the loop, cooling timeliness can be effectively improved by matching with water cooling, the air circulation is vertical and vertical, and small mud accumulation caused by water cooling inside the grinding head is avoided.

In the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims

1. The utility model provides a wafer processing is with automatic discharge grinds machine, its structure includes mount pad (1), workstation (2), grinding head (3), elevating platform (4), motor (5), lifter (6), its characterized in that:

the mounting seat (1) is fixed at the bottom end of the workbench (2), a motor (5) and a lifting rod (6) are installed in the lifting platform (4), a grinding head (3) is connected in the lifting rod (6) in a mechanical connection mode, the grinding head (3) corresponds to the workbench (2), the grinding head (3) is provided with a drilling opening (31) and a machine body (32), and the machine body (32) is installed on the lifting rod (6) and controls the drilling opening (31);

fuselage (32) inside constitution has baffle (2 a), water conservancy diversion way (2 b), jet (2 c), bracing piece (2 d), bounding wall (2 e), bores mouthful controller (2 f), it is fixed that baffle (2 a) is passed through to the bottom of boring mouthful controller (2 f), water conservancy diversion way (2 b) and jet (2 c) are inside to communicate with each other, water conservancy diversion way (2 b) are for the other end and bracing piece (2 d) vertical welding of jet (2 c), jet (2 c) are just right with boring mouthful controller (2 f), bore mouthful controller (2 f) both sides and seal with bounding wall (2 e).

2. The automatic discharge grinder for wafer processing according to claim 1, wherein: a pressure outlet (c 1) is provided in the injection port (2 c).

3. The automatic discharge grinder for wafer processing according to claim 1, wherein: the flow guide channel (2 b) is provided with a liquid inlet end (b 1) in a funnel-shaped structure.

4. The automatic discharge grinder for wafer processing according to claim 3, wherein: the inside of feed liquor end (b 1) includes filter screen (b 21), goes out liquid ball (b 22), pressure spring (b 23), the one end of going out liquid ball (b 22) is hugged closely filter screen (b 21), the other end cooperation has pressure spring (b 23).

5. The automatic discharge grinder for wafer processing according to claim 1, wherein: the partition plate (2 a) is hollow, and both sides and the bottom end of the partition plate located on the drilling controller (2 f) are open.

6. The automatic discharge grinder for wafer processing according to claim 4, wherein: the pressure spring (b 23) is wrapped in the sealed throat pipe.

7. The automatic discharge grinder for wafer processing according to claim 1 or 6, wherein: two pressure springs (b 23) are arranged, and a horizontal channel is formed between the two pressure springs and is communicated with the liquid inlet and the liquid outlet of the liquid outlet ball (b 22).