CN110760216A - High-temperature-resistant release ink - Google Patents

High-temperature-resistant release ink Download PDF

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Publication number
CN110760216A
CN110760216A CN201910966770.4A CN201910966770A CN110760216A CN 110760216 A CN110760216 A CN 110760216A CN 201910966770 A CN201910966770 A CN 201910966770A CN 110760216 A CN110760216 A CN 110760216A
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CN
China
Prior art keywords
parts
agent
resistant release
release ink
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910966770.4A
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Chinese (zh)
Inventor
丁国晏
周勋
阳光国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Yundian New Material Technology Co Ltd
Original Assignee
Huizhou Yundian New Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Yundian New Material Technology Co Ltd filed Critical Huizhou Yundian New Material Technology Co Ltd
Priority to CN201910966770.4A priority Critical patent/CN110760216A/en
Publication of CN110760216A publication Critical patent/CN110760216A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/102Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/103Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/106Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

The invention provides high-temperature-resistant release ink which is characterized by comprising the following components in parts by weight: 40-58 parts of resin, 15-27 parts of solvent, 5-10 parts of curing agent, 3-5 parts of auxiliary agent and 12-33 parts of functional filler. The invention provides the ink which can resist high temperature and release well during molding in the process of manufacturing the back cover of the mobile phone, has the temperature resistance of more than 300 ℃, and is superior to the similar products existing in the market at present.

Description

High-temperature-resistant release ink
Technical Field
The invention belongs to the technical field of ink, and particularly relates to high-temperature-resistant release ink.
Background
The high-temperature resistant printing ink on the market at present is a liquid adhesive with certain fluidity, and can enable a printed product to resist temperature of more than 200 ℃ after being uniformly mixed and stirred and printed and dried on a printing stock, thereby playing the effects of protecting base ink and preventing adhesion, but easily causing the phenomena of ink stripping and the like with a die mucosa during molding.
Disclosure of Invention
In view of the above, the present invention is to provide a high temperature resistant and release ink for molding in a process of manufacturing a back cover of a mobile phone, which is resistant to temperatures above 300 ℃, and is superior to similar products in the market at present.
The technical scheme of the invention is as follows:
the high-temperature-resistant release ink is characterized by comprising the following components in parts by weight: 40-58 parts of resin, 15-27 parts of solvent, 5-10 parts of curing agent, 3-5 parts of auxiliary agent and 12-33 parts of functional filler.
Further, the resin is any one of or a combination of polyurethane modified acrylic resin and modified phenolic resin.
Further, the solvent is any one of isoamyl acetate, butanol and dipropylene glycol dimethyl ether.
Further, the curing agent is isophorone diisocyanate or hexamethylene tetramine.
Furthermore, the auxiliary agent comprises a flatting agent, a defoaming agent and a dispersing agent. In the present invention, the auxiliary can be achieved by any one of the prior art in the field.
Further, the functional filler is any one of mica powder, nano barium sulfate and talcum powder or a combination of two or three of the mica powder, the nano barium sulfate and the talcum powder.
In the functional filler, the nano barium sulfate has the following advantages: the particle size distribution is narrow, the specific surface area and the base material consumption are small, and high gloss can be obtained; high-inertia chemical substances, acid and alkali resistance, and good sun resistance and weather resistance; the material has high thermal conductivity and rheological property, and the molding period of the material is shortened; increase the crystallinity of the crystalline material, improve the strength (especially impact strength at low temperature) and geometric stability of the article; the pigment is easy to disperse, plays a role of a pigment dispersant in the color master batch, and can effectively save the pigment dosage in the color master batch; the product has high purity and less impurities; high activation degree and good compatibility with the matrix.
The high-temperature resistant release ink can be prepared by any prior art.
The inventor selects components and dosage through a large number of creative tests, so that the components in the technical scheme can play a role in synergy.
The invention provides high-temperature resistant release ink, which can solve the problem that poor release is caused by the phenomenon of ink re-adhesion or dry cracking during high-temperature and high-pressure molding.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
The high-temperature-resistant photo-curing ink comprises the following components in parts by weight: the modified phenolic resin comprises 10 parts of modified phenolic resin, 35 parts of polyurethane modified acrylic resin, 5 parts of talcum powder, 7 parts of mica powder, 10 parts of nano barium sulfate, 23 parts of solvent, 7 parts of curing agent and 3 parts of auxiliary agent, wherein the auxiliary agent comprises 1 part of flatting agent, 1 part of defoaming agent and 1 part of dispersing agent.
Further, the solvent is isoamyl acetate.
Further, the curing agent is isophorone diisocyanate.
The invention provides high-temperature resistant release ink, which can solve the problem that poor release is caused by the phenomenon of ink re-adhesion or dry cracking during high-temperature and high-pressure molding.
Example 2
The embodiment provides high-temperature-resistant release ink which is characterized by comprising the following components in parts by weight: resin 40, solvent 15, curing agent 5, auxiliary agent 3 and functional filler 12.
Further, the resin is polyurethane modified acrylic resin.
Further, the solvent is butanol.
Further, the curing agent is hexamethylenetetramine.
Further, the auxiliary agent comprises 1 part of a leveling agent, 1 part of a defoaming agent and 1 part of a dispersing agent.
Further, the functional filler is nano barium sulfate.
Example 3
The embodiment provides high-temperature-resistant release ink which is characterized by comprising the following components in parts by weight: resin 58, solvent 27, curing agent 10, auxiliary agent 5 and functional filler 33.
Further, the resin is modified phenolic resin.
Further, the solvent is dipropylene glycol dimethyl ether.
Further, the curing agent is isophorone diisocyanate.
Further, the auxiliary agent comprises 1.5 parts of a leveling agent, 1.5 parts of a defoaming agent and 2 parts of a dispersing agent.
Further, the functional filler is a combination of mica powder and nano barium sulfate, and comprises mica powder 8 and nano barium sulfate 15.
Example 4
The embodiment provides high-temperature-resistant release ink which is characterized by comprising the following components in parts by weight: resin 48, solvent 19, curing agent 7, auxiliary agent 4 and functional filler 18.
Further, the resin is a combination of polyurethane modified acrylic resin and modified phenolic resin, and comprises 20 parts of polyurethane modified acrylic resin and 28 parts of modified phenolic resin.
Further, the solvent is dipropylene glycol dimethyl ether.
Further, the curing agent is hexamethylenetetramine.
Further, the auxiliary agent comprises 1 part of a leveling agent, 1.5 parts of a defoaming agent and 1.5 parts of a dispersing agent.
Further, the functional filler is a combination of mica powder, nano barium sulfate and talcum powder, and comprises 5 parts of mica powder, 13 parts of nano barium sulfate and 10 parts of talcum powder.
Example 5
The embodiment provides high-temperature-resistant release ink which is characterized by comprising the following components in parts by weight: resin 53, solvent 24, curing agent 8, auxiliary agent 4.5 and functional filler 29.
Further, the resin is a combination of polyurethane modified acrylic resin and modified phenolic resin, and comprises 28 parts of polyurethane modified acrylic resin and 25 parts of modified phenolic resin.
Further, the solvent is butanol.
Further, the curing agent is isophorone diisocyanate.
Further, the auxiliary agent comprises 1.5 parts of a leveling agent, 1.5 parts of a defoaming agent and 1.5 parts of a dispersing agent.
Further, the functional filler is a combination of mica powder, nano barium sulfate and talcum powder, and comprises 7 parts of mica powder, 17 parts of nano barium sulfate and 11 parts of talcum powder.
Comparative example 1
The high-temperature-resistant photo-curing ink comprises the following components in parts by weight: the modified phenolic resin comprises 10 parts of modified phenolic resin, 35 parts of polyurethane modified acrylic resin, 5 parts of talcum powder, 7 parts of mica powder, 23 parts of solvent, 7 parts of curing agent and 3 parts of auxiliary agent, wherein the auxiliary agent comprises 1 part of flatting agent, 1 part of defoaming agent and 1 part of dispersing agent.
Further, the solvent is isoamyl acetate.
Further, the curing agent is isophorone diisocyanate.
Performance testing
The high temperature resistant release inks prepared in examples 1 to 5 were subjected to performance tests in accordance with the relevant standards, and the results are as follows.
Figure DEST_PATH_IMAGE002
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.

Claims (6)

1. The high-temperature-resistant release ink is characterized by comprising the following components in parts by weight: 40-58 parts of resin, 15-27 parts of solvent, 5-10 parts of curing agent, 3-5 parts of auxiliary agent and 12-33 parts of functional filler.
2. The high temperature resistant release ink according to claim 1, wherein the resin is any one of or a combination of polyurethane modified acrylic resin and modified phenolic resin.
3. The high temperature resistant release ink according to claim 1, wherein the solvent is any one of isoamyl acetate, butanol, dipropylene glycol dimethyl ether.
4. The high temperature resistant release ink according to claim 1, wherein the curing agent is isophorone diisocyanate or hexamethylene tetramine.
5. The high-temperature resistant release ink according to claim 1, wherein the auxiliary agent comprises a leveling agent, a defoaming agent and a dispersing agent.
6. The high-temperature resistant release ink according to claim 5, wherein the functional filler is any one or a combination of two or three of mica powder, nano barium sulfate and talcum powder.
CN201910966770.4A 2019-10-12 2019-10-12 High-temperature-resistant release ink Pending CN110760216A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910966770.4A CN110760216A (en) 2019-10-12 2019-10-12 High-temperature-resistant release ink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910966770.4A CN110760216A (en) 2019-10-12 2019-10-12 High-temperature-resistant release ink

Publications (1)

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CN110760216A true CN110760216A (en) 2020-02-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113370693A (en) * 2021-07-13 2021-09-10 浙江英赛德数码科技有限公司 High-efficiency curing transfer printing digital roller printing process and equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102964922A (en) * 2012-12-03 2013-03-13 恒昌涂料(惠阳)有限公司 Super-weatherproof high-resolution liquid photosensitive solder-resisting tin printing ink and preparation method thereof
CN104311757A (en) * 2014-09-23 2015-01-28 广州大学 Nanometer modified SiO2/epoxy acrylic acid composite resin, IMD ink and preparation method thereof
CN106366751A (en) * 2016-08-29 2017-02-01 成都纳硕科技有限公司 High-temperature-resisting photo-cured printing ink
CN108359312A (en) * 2018-03-12 2018-08-03 江门市阪桥电子材料有限公司 A kind of high temperature resistant type UV-LED inkjet printings welding resistance ink and its preparation method and application

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102964922A (en) * 2012-12-03 2013-03-13 恒昌涂料(惠阳)有限公司 Super-weatherproof high-resolution liquid photosensitive solder-resisting tin printing ink and preparation method thereof
CN104311757A (en) * 2014-09-23 2015-01-28 广州大学 Nanometer modified SiO2/epoxy acrylic acid composite resin, IMD ink and preparation method thereof
CN106366751A (en) * 2016-08-29 2017-02-01 成都纳硕科技有限公司 High-temperature-resisting photo-cured printing ink
CN108359312A (en) * 2018-03-12 2018-08-03 江门市阪桥电子材料有限公司 A kind of high temperature resistant type UV-LED inkjet printings welding resistance ink and its preparation method and application

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
徐竹: "《复合材料成型工艺及应用》", 31 March 2017, 国防工业出版社 *
朱毅: "《家具表面涂饰》", 31 August 2016, 东北林业大学出版社 *
燃料化学工业出版社编: "《油漆制造概说》", 31 August 1974, 燃料化学工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113370693A (en) * 2021-07-13 2021-09-10 浙江英赛德数码科技有限公司 High-efficiency curing transfer printing digital roller printing process and equipment

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Application publication date: 20200207

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