CN110757374A - Chip radiating substrate rotating and positioning tool and positioning method - Google Patents
Chip radiating substrate rotating and positioning tool and positioning method Download PDFInfo
- Publication number
- CN110757374A CN110757374A CN201911183372.1A CN201911183372A CN110757374A CN 110757374 A CN110757374 A CN 110757374A CN 201911183372 A CN201911183372 A CN 201911183372A CN 110757374 A CN110757374 A CN 110757374A
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- heat dissipation
- dissipation substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 76
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010923 batch production Methods 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention provides a chip heat dissipation substrate rotary positioning device and a positioning method, wherein the chip heat dissipation substrate rotary positioning device comprises a rotary table fixing seat, a clamping assembly, a station adjusting assembly and a rotating assembly, wherein the clamping assembly is arranged on the rotary table fixing seat and used for clamping a chip heat dissipation substrate; the rotating assembly is sleeved on the clamping assembly and drives the clamping assembly and the chip heat dissipation substrate to rotate under the driving of the rotating assembly; the station adjusting assembly is fixed on one side of the rotary table fixing seat and used for overturning the chip heat dissipation substrate to an operation station and adjusting the operation height and the operation angle of the chip heat dissipation substrate. The multi-freedom-degree control can be realized, the operation height and the operation angle can be adjusted, full-automatic clamping can be realized, the production efficiency is greatly improved, the labor cost is reduced, and the realization of batch production is facilitated; the adaptability is strong, and the method is suitable for processing more parts and various occasions and working applications.
Description
Technical Field
The invention relates to the field of positioning of radiating substrates, in particular to a chip radiating substrate rotary positioning device and a positioning method.
Background
The direct type high-power LED bulb lamp generally needs to take heat dissipation and lighting effects into consideration at present. The bulb lamp manufacturing process flow is provided with a bulb lamp chip heat dissipation substrate chip pasting process, chip pasting operation needs to be carried out on the surface of a bulb lamp chip heat dissipation substrate, functions such as high-precision fine-tuning rotation and the like cannot be achieved due to the fact that a positioning device of an automatic chip mounter is provided with the automatic chip mounter, the appearance of the bulb lamp chip heat dissipation substrate researched and developed by the department is special, and an ordinary rotary positioning device cannot meet the requirement of chip pasting.
Disclosure of Invention
In order to overcome the problems, the invention designs a set of special rotary positioning device for the bulb lamp chip heat dissipation substrate so as to achieve efficient and high-precision chip mounting operation of the bulb lamp chip heat dissipation substrate.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the invention provides a chip radiating substrate rotary positioning device which comprises a rotary table fixing seat, a clamping assembly, a station adjusting assembly and a rotating assembly, wherein the clamping assembly is arranged on the rotary table fixing seat and used for clamping the chip radiating substrate; the rotating assembly is sleeved on the clamping assembly and drives the clamping assembly and the chip radiating substrate to rotate under the driving of the rotating assembly; the station adjusting assembly is fixed on one side of the rotary table fixing seat and used for overturning the chip heat dissipation substrate to an operation station and adjusting the operation height and the operation angle of the chip heat dissipation substrate.
Further, the clamping subassembly includes propelling movement cylinder, bloated chock, anchor clamps, connecting rod, the connecting rod runs through propelling movement cylinder, bloated chock in proper order, and the anchor clamps are equipped with to bloated chock front end cover, at the clamping during chip heat dissipation base plate, propelling movement cylinder promotes connecting rod forward and bloated chock until anchor clamps outwards expand tightly, make anchor clamps press from both sides tight chip heat dissipation base plate.
Furthermore, a rotating shaft disc is arranged between the clamping assembly and the rotating assembly.
Further, rotating assembly includes motor, action wheel, hold-in range, follows the driving wheel, is provided with the action wheel on the motor, the action wheel pass through the hold-in range with connect from the driving wheel cooperation the motor starts the back, drive action wheel, hold-in range, follow driving wheel synchronous drive to it has to drive the clamping of chip heat dissipation base plate the clamping subassembly is rotatory.
Further, station adjustment subassembly includes revolving cylinder and high fine setting ware, and revolving cylinder is fixed in revolving stage fixing base one side, is equipped with angle adjust knob on the revolving cylinder, and the revolving cylinder below is equipped with high fine setting ware, is equipped with high adjust knob on the high fine setting ware.
Further, the chip heat dissipation substrate rotary positioning device further comprises a sensor assembly, wherein the sensor assembly is arranged below the rotating assembly and used for counting the number of rotation turns of the rotating assembly.
Further, the sensor assembly comprises a sensor and a sensing piece.
Further, the chip heat dissipation substrate rotation positioning device further comprises a control module, and the control module is used for controlling: the clamping assembly clamps the chip heat dissipation substrate; the station adjusting assembly turns the chip heat dissipation substrate to an operation station; the angle of rotation and the number of revolutions of the rotating assembly.
The invention also provides a chip heat dissipation substrate rotation positioning method, which is used for positioning a chip heat dissipation substrate by using the chip heat dissipation substrate rotation positioning device, and the positioning method comprises the following steps:
1) sleeving the chip heat dissipation substrate on a clamping assembly to enable the clamping assembly to clamp the chip heat dissipation substrate;
2) starting a station adjusting assembly, and controlling the chip heat dissipation substrate to overturn to an operation station;
3) adjusting the working height and the working angle of the chip heat dissipation substrate by using the station adjusting assembly;
4) and starting the rotating assembly to drive the chip heat dissipation substrate to rotate, and controlling the rotating angle and the number of rotating turns of the rotating assembly to adapt to chip mounting operation on the chip heat dissipation substrate.
Further, the positioning method further comprises: and adjusting an angle adjusting knob and a height adjusting knob on the station adjusting assembly to adjust the operation height and the operation angle of the chip heat dissipation substrate.
Compared with the prior art, the technical scheme of the chip radiating substrate rotating and positioning device and the positioning method has the following beneficial effects: the multi-degree-of-freedom control can be realized, the fine adjustment in the height direction can be realized for height operation adjustment, and the fine adjustment in the angle direction can also be realized for angle operation adjustment; the full-automatic clamping can be realized, compared with manual clamping in the prior art, the production efficiency is greatly improved, the labor cost is reduced, and the batch production is favorably realized; the adaptability is strong, and the method can be suitable for processing more parts and various occasions and working applications; meanwhile, the invention integrates complex and various parts, so that the structure is more compact, the space arrangement is more favorable, the occupied area of a work place/factory building is saved due to the reduction of the volume, and the site cost is greatly reduced.
Drawings
FIG. 1 is a side view of a rotational positioning apparatus for a heat-dissipating substrate according to the present invention;
FIG. 2 is another side view of the rotational positioning apparatus for a heat-dissipating substrate of the present invention;
FIG. 3 is an exploded view of the rotational positioning apparatus of the chip heat-dissipating substrate of the present invention;
FIG. 4 is a side cross-sectional view of the rotational positioning apparatus of the chip heat-dissipating substrate according to the present invention;
FIGS. 5a-5c are schematic views illustrating the operation of the clamping assembly of the rotational positioning apparatus for a heat-dissipating substrate of the chip of the present invention;
FIGS. 6a-6c are schematic diagrams illustrating the operation of the station adjustment assembly in the rotational positioning apparatus for a chip heat-dissipating substrate according to the present invention;
FIG. 7 is a flow chart of a method for rotational positioning of a chip heat-dissipating substrate according to the present invention;
in the figures, the reference numerals are as follows:
1. a base plate; 2. a height trimmer; 3. a rotating cylinder; 4. a bulb lamp chip radiating substrate; 5. a push cylinder; 6. a motor; 7. a rotating cylinder mounting plate; 8. a clamp; 9. expanding the chock block; 10. a first bearing; 11. a connecting rod; 12. a shaft rotating disk; 13. a second bearing; 14. a turntable fixing seat; 15. a sensor; 16. An induction sheet; 17. a sensor holder; 18. a third bearing; 19. a clamp spring; 20. a synchronous belt driving wheel; 21. A synchronous belt driven wheel; 22. and (4) a synchronous belt.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
It should be understood that the drawings and figures are only for the purpose of illustrating the invention, and are not to be construed as limiting the invention.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," "retained," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention provides a chip radiating substrate rotary positioning device, which is used for meeting the chip mounting operation of a bulb lamp chip radiating substrate. Referring to fig. 1-4, the structure of the present invention will be described with reference to the accompanying drawings.
It should be noted that the chip heat dissipation substrate 4 in the present invention refers to a chip mounting substrate for a bulb lamp, including but not limited to a planar substrate and a special-shaped substrate, and the hemispherical chip mounting substrate used in the bulb lamp developed by me is taken as an example in the drawings, which is only used for illustration and is not used for limiting the limitation conditions that the present invention can be implemented.
The invention provides a chip heat dissipation substrate rotary positioning device, which mainly comprises a rotary table fixing seat 13, a clamping assembly, a station adjusting assembly and a rotating assembly, wherein the clamping assembly is arranged on the rotary table fixing seat 13 and used for clamping the chip heat dissipation substrate 4; the rotating assembly is sleeved on the clamping assembly and drives the clamping assembly and the chip heat dissipation substrate to rotate under the driving of the rotating assembly; and the station adjusting assembly is fixed on one side of the rotary table fixing seat 13 and used for turning the chip heat dissipation substrate 4 to an operation station and adjusting the operation height and the operation angle of the chip heat dissipation substrate 4.
Referring to the exploded structural views shown in fig. 3 and fig. 4, in this embodiment, the clamping assembly mainly includes a pushing cylinder 5, an expanding plug block 9, a clamp 8, and a connecting rod 11, where the connecting rod 11 sequentially penetrates through the pushing cylinder 5 and the expanding plug block 9 from bottom to top, and the clamp 8 is sleeved at the front end of the expanding plug block 9, so that the pushing cylinder 5 and the connecting rod 11 form an action assembly using the pushing cylinder as a driving end and the connecting rod 11 as a central axis, thereby driving the expanding plug block 9, the clamp 8, and other components to act. Before clamping, the pushing cylinder 5 is in a contraction state, when the chip heat dissipation substrate 4 is clamped, the chip heat dissipation substrate 4 is placed on the clamp 8, the pushing cylinder 5 acts to further push the connecting rod 11 and the expanding plug block 9 forwards, the expanding plug block 9 guides the clamp 8 to expand outwards, and the clamp 8 clamps the chip heat dissipation substrate 4 sleeved on the clamp 8 after expansion, so that the clamping assembly clamps the chip heat dissipation substrate 4.
It should be noted that the structure of the clamp 8 is matched with the chip heat dissipation substrate 4, and the clamp 8 in the figure is taken as an example of matching with a hemispherical chip heat dissipation substrate, but not limited thereto, and in other embodiments, the clamp can clamp the chip heat dissipation substrate 4.
The rotating assembly mainly comprises a motor 6, a driving wheel 20, a synchronous belt 22 and a driven wheel 21, wherein the driving wheel 20 is arranged on the motor, and the driving wheel 20 is connected with the driven wheel 21 in a matching mode through the synchronous belt 22. On the driving wheel, after the motor 6 is started, the driving wheel 20, the synchronous belt 22 and the driven wheel 21 are driven to perform synchronous transmission so as to drive the clamping assembly clamped with the chip heat dissipation substrate 4 to rotate.
In some embodiments of the present invention, a rotating shaft disc 12 is disposed between the clamping component and the rotating component, when the clamping component is installed, the rotating shaft disc 12 is installed between the turntable fixing seat 14 and the clamping component, the rotating shaft disc 12 is hollow, so that the connecting rod 11 can penetrate through the rotating shaft disc, the lower end of the rotating shaft disc 12 penetrates through the turntable fixing seat 14 and is fixed at the central axis of the driving wheel 20, so that when the rotating component rotates, the clamping component can be driven to rotate, and the axial force of the clamping component can be increased to a certain extent.
In some embodiments of the present invention, the chip heat dissipation substrate rotation positioning device further includes a matching component for supporting the chip heat dissipation substrate rotation positioning device to rotate and reducing friction between the components, where the matching component includes a first bearing 10, a second bearing 13, a third bearing 18, and a clamp spring 19; wherein, the first bearing 10 is sleeved on the connecting rod 11 and is arranged between the rotating shaft disc 12 and the expansion plug block; the second bearing 13, the third bearing 18 and the clamp spring 19 are arranged between the turntable shaft 12 and the driving wheel.
Station adjustment subassembly mainly includes revolving cylinder 3 and high fine setting ware 2, revolving cylinder 3 is fixed in revolving stage fixing base 13 one side through revolving cylinder mounting panel 7, be equipped with two angle modulation knobs on the revolving cylinder 3 for finely tune revolving stage fixing base 13 for operation personnel's operation angle, revolving cylinder 3 below is equipped with high fine setting ware, be equipped with two height modulation knobs on the high fine setting ware 2, be used for finely tuning revolving stage fixing base 13 for operation personnel's operation height, for example upwards or adjust the operation height downwards.
In some embodiments, the chip heat dissipation substrate rotation positioning device of the present invention further includes a sensor assembly disposed below the rotation assembly through a sensor bracket 17 for counting the number of rotations of the rotation assembly. Preferably, the sensor assembly comprises a sensor 15 and a sensing piece 16, and the sensor assembly further comprises a control module and sensor-related circuits for realizing the functions of the sensor.
In some embodiments, the chip heat sink substrate rotation positioning device of the present invention further comprises a control module, wherein the control module is configured to:
controlling the clamping assembly to clamp or unload the chip heat dissipation substrate;
controlling a station adjusting assembly to overturn the chip heat dissipation substrate to an operation station;
the rotation angle and the number of rotations of the rotating assembly are controlled.
Wherein the control module is any suitable driver, solenoid, PLC, etc., and/or combination thereof, capable of implementing the control functions described above.
The invention also provides a chip heat dissipation substrate rotation positioning method, referring to the flow chart shown in fig. 7, the chip heat dissipation substrate rotation positioning method uses the chip heat dissipation substrate rotation positioning device to position the chip heat dissipation substrate, and the specific steps are as follows:
1) sleeving the chip heat dissipation substrate 4 on a clamping assembly to enable the clamping assembly to clamp the chip heat dissipation substrate;
as shown in fig. 5a-5c, before the chip heat-dissipating substrate is clamped by the clamping assembly, the pushing cylinder 5 is in a contracted state to drive the connecting rod 11 and the expanding plug block 9 to contract inwards, and at this time, the structure of the chip heat-dissipating substrate rotation positioning device is shown in fig. 5 a; placing the clamping chip heat dissipation substrate as shown in fig. 5 b; during clamping, the control module controls the pushing cylinder 5 to push the connecting rod 11 and push the expansion plug block 9 forwards, so that the clamp 8 is guided to expand outwards to complete clamping of the heat dissipation substrate 4 of the bulb lamp chip, and the clamping is shown in fig. 5 c;
2) starting the station adjusting assembly, starting the rotary cylinder 3 to control the chip heat-dissipation substrate rotary positioning device to turn inwards, and turning the chip heat-dissipation substrate 4 to an operation station, as shown in fig. 6 a;
3) adjusting the working height and the working angle of the chip heat dissipation substrate 4 by using the station adjusting assembly, and adjusting an angle adjusting knob and a height adjusting knob on the station adjusting assembly to adjust the working height and the working angle of the chip heat dissipation substrate, as shown in fig. 6 b;
4) and starting the rotating assembly to drive the chip heat dissipation substrate 4 to rotate, and accurately controlling the rotating angle and the number of rotating turns of the rotating assembly to adapt to chip mounting operation on the chip heat dissipation substrate, as shown in fig. 6 c.
The chip radiating substrate rotary positioning device specially designed for the shape of the bulb lamp chip radiating substrate has the characteristics of strong adaptability and high precision, can meet the requirement of butt joint with various automatic devices, such as an automatic chip mounter, an automatic solder paste printer, an automatic glue spreader, an automatic soldering machine and the like, can adjust the operation angle and the operation height, is convenient to assemble and disassemble, and is simple to operate.
In conclusion, the invention can realize multi-degree-of-freedom control, and can realize fine adjustment in the height direction to adjust the height operation and also can realize fine adjustment in the angle direction to adjust the angle operation; and can realize that cylinder propelling movement, shrink realize full automatic clamping, for prior art's artifical joint, used the cooperation of bloated chock and cylinder to carry out full automatic positioning. The production efficiency is greatly improved, the labor cost is reduced, and the batch production is favorably realized.
The design of multiple degrees of freedom enables the adaptability of the chip radiating substrate rotary positioning device to be enhanced, and the chip radiating substrate rotary positioning device is suitable for more occasions and working applications and can be matched with more components. Meanwhile, the invention integrates complex and various parts, so that the structure is more compact, the space arrangement is more favorable, the occupied area of a work place/factory building is saved due to the reduction of the volume, and the site cost is greatly reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention. The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A chip radiating substrate rotary positioning device is characterized by comprising a turntable fixing seat, a clamping assembly, a station adjusting assembly and a rotating assembly,
the clamping assembly is arranged on the rotary table fixing seat and used for clamping the chip heat dissipation substrate;
the rotating assembly is sleeved on the clamping assembly and drives the clamping assembly and the chip radiating substrate to rotate under the driving of the rotating assembly;
the station adjusting assembly is fixed on one side of the rotary table fixing seat and used for overturning the chip heat dissipation substrate to an operation station and adjusting the operation height and the operation angle of the chip heat dissipation substrate.
2. The device as claimed in claim 1, wherein the clamping assembly includes a pushing cylinder, an expanding plug, a clamp, and a connecting rod, the connecting rod sequentially penetrates through the pushing cylinder and the expanding plug, the clamp is sleeved at a front end of the expanding plug, and when the chip heat-dissipating substrate is clamped, the pushing cylinder pushes the connecting rod and the expanding plug forward until the clamp expands outward, so that the clamp clamps the chip heat-dissipating substrate.
3. The device of claim 1, wherein a rotating shaft disk is disposed between the clamping assembly and the rotating assembly.
4. The device as claimed in claim 1, wherein the rotating assembly comprises a motor, a driving wheel, a synchronous belt, and a driven wheel, the motor is provided with the driving wheel, the driving wheel is connected with the driven wheel through the synchronous belt, and after the motor is started, the driving wheel, the synchronous belt, and the driven wheel are driven to perform synchronous transmission to drive the clamping assembly with the chip heat-dissipating substrate to rotate.
5. The apparatus of claim 1, wherein the station adjusting assembly comprises a rotary cylinder and a height fine-adjuster, the rotary cylinder is fixed to one side of the turntable fixing seat, an angle adjusting knob is disposed on the rotary cylinder, the height fine-adjuster is disposed below the rotary cylinder, and the height adjusting knob is disposed on the height fine-adjuster.
6. The apparatus of claim 1, further comprising a sensor assembly disposed below the rotating assembly for counting the number of turns of the rotating assembly.
7. The apparatus of claim 1, wherein the sensor assembly comprises a sensor and a sensor strip.
8. The apparatus of claim 1, further comprising a control module, the control module being configured to control: the clamping assembly clamps the chip heat dissipation substrate; the station adjusting assembly turns the chip heat dissipation substrate to an operation station; the angle of rotation and the number of revolutions of the rotating assembly.
9. A method for rotationally positioning a chip heat-dissipating substrate, wherein the chip heat-dissipating substrate is positioned by using the apparatus for rotationally positioning a chip heat-dissipating substrate according to claims 1 to 8, the method comprising:
1) sleeving the chip heat dissipation substrate on a clamping assembly to enable the clamping assembly to clamp the chip heat dissipation substrate;
2) starting a station adjusting assembly, and controlling the chip heat dissipation substrate to overturn to an operation station;
3) adjusting the working height and the working angle of the chip heat dissipation substrate by using the station adjusting assembly;
4) and starting the rotating assembly to drive the chip heat dissipation substrate to rotate, and controlling the rotating angle and the number of rotating turns of the rotating assembly to adapt to chip mounting operation on the chip heat dissipation substrate.
10. The method of claim 9, further comprising: and adjusting an angle adjusting knob and a height adjusting knob on the station adjusting assembly to adjust the operation height and the operation angle of the chip heat dissipation substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911183372.1A CN110757374B (en) | 2019-11-27 | 2019-11-27 | Chip heat dissipation substrate rotary positioning tool and positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911183372.1A CN110757374B (en) | 2019-11-27 | 2019-11-27 | Chip heat dissipation substrate rotary positioning tool and positioning method |
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| CN110757374A true CN110757374A (en) | 2020-02-07 |
| CN110757374B CN110757374B (en) | 2023-11-21 |
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| DE4442803C1 (en) * | 1994-12-01 | 1996-01-04 | Shanview Patents Ltd | Device for clamping workpiece on table |
| CN202894819U (en) * | 2012-12-06 | 2013-04-24 | 四川新动脉汽车零部件制造有限公司 | Rotating fixture for machining center |
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| Publication number | Publication date |
|---|---|
| CN110757374B (en) | 2023-11-21 |
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Application publication date: 20200207 Assignee: SHANGHAI SANSI ELECTRONIC ENGINEERING Co.,Ltd. Assignor: PUJIANG SANSI PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Contract record no.: X2023330000915 Denomination of invention: A chip cooling substrate rotation positioning fixture and positioning method Granted publication date: 20231121 License type: Common License Record date: 20231213 |