CN110753446A - Circuit board packaging and packaging method for different combustible gas sensors - Google Patents

Circuit board packaging and packaging method for different combustible gas sensors Download PDF

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Publication number
CN110753446A
CN110753446A CN201911211067.9A CN201911211067A CN110753446A CN 110753446 A CN110753446 A CN 110753446A CN 201911211067 A CN201911211067 A CN 201911211067A CN 110753446 A CN110753446 A CN 110753446A
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CN
China
Prior art keywords
pin
circuit board
combustible gas
printed circuit
power supply
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911211067.9A
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Chinese (zh)
Inventor
刘宣冰
王尚平
卢鑫鑫
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JINAN CHANGQING COMPUTER APPLICATION CO Ltd
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JINAN CHANGQING COMPUTER APPLICATION CO Ltd
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Priority to CN201911211067.9A priority Critical patent/CN110753446A/en
Publication of CN110753446A publication Critical patent/CN110753446A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

The invention provides a circuit board packaging and packaging method for different combustible gas sensors, and the technical scheme of the invention integrates an MP-4 printed circuit board and an MQ-4 printed circuit board in the MPQ-4 printed circuit board packaging, and the pins of the two printed circuit boards are arranged according to the electrically same and close placement principle, so that the circuit board wiring is convenient, and the pins are adapted to combustible gas sensors of different types, therefore, in the process of stock in the production link, two different circuit boards are not required to be prepared, the problems of inconvenient use and easy error caused by using different circuit boards are avoided, and the production management is convenient.

Description

Circuit board packaging and packaging method for different combustible gas sensors
Technical Field
The invention relates to the technical field of sensor packaging, in particular to a circuit board packaging method for different combustible gas sensors and a packaging method thereof.
Background
In a combustible gas alarm, a combustible gas sensor is indispensable as an important electronic component. During the packaging process using a combustible gas sensor, the different sensor packages are different. Since different circuit boards must be used for different sensors, inconvenience is brought to the use of the sensors.
Disclosure of Invention
The invention aims to provide circuit board packaging and a packaging method for different combustible gas sensors, aims to solve the problems that in the prior art, different sensors are inconvenient to use and prone to error due to the fact that matched circuit board packaging is needed, achieves adaptation to different types of combustible gas sensors, and facilitates production management.
To achieve the above technical object, the present invention provides a circuit board package for different flammable gas sensors, the package comprising:
MQ-4 printed circuit board package consisting of a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin;
the MP-4 printed circuit board package consisting of a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
As shown in FIG. 1, the MP-4 PCB package has four pins, the 1 st pin is connected to the power GND, the 2 nd pin is connected to the signal output, and the 3 rd pin and the 4 th pin are connected to the power supply 5V.
Preferably, the 1 st pin, the 3 rd pin and the 8 th pin are located on the same side; the 2 nd pin and the 7 th pin are positioned on the same side; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are positioned on the same side.
Preferably, when the combustible gas sensor is used, the combustible gas sensor is adapted to an MP-4 printed circuit board package, the sensor is connected to a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin, the 7 th pin is connected with a power supply GND, the 8 th pin is connected with a signal output, and the 9 th pin and the 10 th pin are connected with a 5V power supply.
Preferably, when the combustible gas sensor is packaged by using an adaptation MQ-4 printed circuit board, the sensor is connected to a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, the 2 nd pin is connected with a power supply GND, and the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
The invention also provides a circuit board packaging method for different combustible gas sensors, which comprises the following operations:
setting 10 pins, and forming MQ-4 printed circuit board package by the 1 st pin, the 2 nd pin, the 3 rd pin, the 4 th pin, the 5 th pin and the 6 th pin; forming a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin into an MP-4 printed circuit board package;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
Preferably, the 1 st pin, the 3 rd pin and the 8 th pin are located on the same side; the 2 nd pin and the 7 th pin are positioned on the same side; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are positioned on the same side.
Preferably, when the combustible gas sensor is used, the combustible gas sensor is adapted to an MP-4 printed circuit board package, the sensor is connected to a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin, the 7 th pin is connected with a power supply GND, the 8 th pin is connected with a signal output, and the 9 th pin and the 10 th pin are connected with a 5V power supply.
Preferably, when the combustible gas sensor is packaged by using an adaptation MQ-4 printed circuit board, the sensor is connected to a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, the 2 nd pin is connected with a power supply GND, and the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
compared with the prior art, the MPQ-4 printed circuit board is integrated with the MP-4 printed circuit board and the MQ-4 printed circuit board in the MPQ-4 printed circuit board package, pins of the two printed circuit boards are arranged according to the electrically identical close placement principle, the circuit board wiring is convenient, and the circuit board is adaptive to combustible gas sensors of different types, so that two different circuit boards are not required to be prepared in the process of stock in the production link, the problems of inconvenient use and easy error caused by using different circuit boards are avoided, and the production management is convenient.
Drawings
FIG. 1 is a diagram of an MPQ-4 circuit board package suitable for use with various combustible gas sensors provided in an embodiment of the invention;
FIG. 2 is a diagram of an MP-4 circuit board package provided in an embodiment of the present invention;
fig. 3 is a diagram of MQ-4 circuit board packaging provided in an embodiment of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
The following describes in detail a circuit board package and a packaging method for different flammable gas sensors according to the present invention with reference to the accompanying drawings.
As shown in fig. 1, the present invention discloses a circuit board package for different flammable gas sensors, the circuit board package comprising:
MQ-4 printed circuit board package consisting of a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin;
the MP-4 printed circuit board package consisting of a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
As shown in FIG. 2, the MP-4 PCB package has four pins, the 1 st pin is connected to the power GND, the 2 nd pin is connected to the signal output, and the 3 rd pin and the 4 th pin are connected to the power supply 5V.
As shown in fig. 3, the MQ-4 pcb package has six pins, the 1 st pin and the 3 rd pin are connected to the signal output, the 2 nd pin is connected to the GND, and the 4 th pin, the 5 th pin and the 6 th pin are connected to the 5V power supply.
On the electrical schematic diagram, the pins required to be connected together are placed at the close position, so that the later-stage production, technology and quality can be conveniently known by various personnel. On the printed circuit board. Similarly, two different packages are arranged in the same electrical proximity, and the two packages are combined into one package. And recombining the two packages to form an MPQ-4 printed circuit board package, wherein the MPQ-4 printed circuit board package has 10 pins in total, and in order to avoid repeated pin numbering, the 1 st pin in the MP-4 package is marked as a 7 th pin, the 2 nd pin in the MP-4 package is marked as an 8 th pin, the 3 rd pin is marked as a 9 th pin, and the 4 th pin is marked as a 10 th pin. In the MPQ-4 printed circuit board package, the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
In the position arrangement, the 1 st pin, the 3 rd pin and the 8 th pin are arranged on the same side and are close to each other in position; the 2 nd pin and the 7 th pin are arranged on the same side and are close to each other in position; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are arranged on the same side and are close to each other in position. Therefore, the pins are arranged according to the principle that the pins are electrically arranged in the same and close mode, and wiring of the circuit board is facilitated.
When the combustible gas sensor which is packaged by the adaptive MP-4 printed circuit board is required to be used, the sensor is connected to a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin, the 7 th pin is connected with a power supply GND, the 8 th pin is connected with a signal output, and the 9 th pin and the 10 th pin are connected with a 5V power supply; when the combustible gas sensor packaged by the adaptive MQ-4 printed circuit board is required to be used, the sensor is connected to a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, the 2 nd pin is connected with a power supply GND, and the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
Through the scheme, the MP-4 printed circuit board and the MQ-4 printed circuit board are integrated in the MPQ-4 printed circuit board package, pins of the two printed circuit boards are arranged according to the electrically same close placement principle, circuit board wiring is facilitated, and the combustible gas sensors of different types are adapted, so that two different circuit boards do not need to be prepared in the stock process in the production link, the problems of inconvenience in use and easiness in error caused by the use of different circuit boards are avoided, and production management is facilitated.
The embodiment of the invention also discloses a circuit board packaging method for different combustible gas sensors, which comprises the following operations:
setting 10 pins, and forming MQ-4 printed circuit board package by the 1 st pin, the 2 nd pin, the 3 rd pin, the 4 th pin, the 5 th pin and the 6 th pin; forming a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin into an MP-4 printed circuit board package;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
And recombining the MP-4 package and the MQ-4 package to form an MPQ-4 printed circuit board package, wherein the total number of the MPQ-4 printed circuit board package is 10 pins, and in order to avoid repeated pin numbering, the 1 st pin in the MP-4 package is marked as the 7 th pin, the 2 nd pin is marked as the 8 th pin, the 3 rd pin is marked as the 9 th pin, and the 4 th pin is marked as the 10 th pin in the MPQ-4 package. In the MPQ-4 printed circuit board package, the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
In the position arrangement, the 1 st pin, the 3 rd pin and the 8 th pin are arranged on the same side and are close to each other in position; the 2 nd pin and the 7 th pin are arranged on the same side and are close to each other in position; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are arranged on the same side and are close to each other in position. Therefore, the pins are arranged according to the principle that the pins are electrically arranged in the same and close mode, and wiring of the circuit board is facilitated.
When the combustible gas sensor which is packaged by the adaptive MP-4 printed circuit board is required to be used, the sensor is connected to a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin, the 7 th pin is connected with a power supply GND, the 8 th pin is connected with a signal output, and the 9 th pin and the 10 th pin are connected with a 5V power supply; when the combustible gas sensor packaged by the adaptive MQ-4 printed circuit board is required to be used, the sensor is connected to a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, the 2 nd pin is connected with a power supply GND, and the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (8)

1. A circuit board package for different combustible gas sensors, the package comprising:
MQ-4 printed circuit board package consisting of a 1 st pin, a 2 nd pin, a 3 rd pin, a 4 th pin, a 5 th pin and a 6 th pin;
the MP-4 printed circuit board package consisting of a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
As shown in FIG. 1, the MP-4 PCB package has four pins, the 1 st pin is connected to the power GND, the 2 nd pin is connected to the signal output, and the 3 rd pin and the 4 th pin are connected to the power supply 5V.
2. The circuit board package for different flammable gas sensors of claim 1, wherein the 1 st pin, the 3 rd pin, and the 8 th pin are located on the same side; the 2 nd pin and the 7 th pin are positioned on the same side; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are positioned on the same side.
3. The circuit board package for different flammable gas sensors as claimed in claim 1, wherein when the flammable gas sensor is used with an MP-4 pcb package, the sensor is connected to the 7 th pin, 8 th pin, 9 th pin and 10 th pin, the 7 th pin is connected to the power GND, the 8 th pin is connected to the signal output, and the 9 th pin and the 10 th pin are connected to the 5V power.
4. The circuit board package for different combustible gas sensors according to claim 2, wherein when the combustible gas sensor is a MQ-4 printed circuit board package, the sensor is connected to the 1 st pin, the 2 nd pin, the 3 rd pin, the 4 th pin, the 5 th pin and the 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, and the 2 nd pin is connected with a power supply GND, the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
5. A method of circuit board packaging for different combustible gas sensors, the method comprising the operations of:
setting 10 pins, and forming MQ-4 printed circuit board package by the 1 st pin, the 2 nd pin, the 3 rd pin, the 4 th pin, the 5 th pin and the 6 th pin; forming a 7 th pin, an 8 th pin, a 9 th pin and a 10 th pin into an MP-4 printed circuit board package;
the 1 st pin, the 3 rd pin and the 8 th pin are connected with a signal output, the 2 nd pin and the 7 th pin are connected with a power supply GND, and the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are connected with a 5V power supply.
6. The circuit board packaging method for different combustible gas sensors according to claim 5, wherein the 1 st pin, the 3 rd pin and the 8 th pin are located on the same side; the 2 nd pin and the 7 th pin are positioned on the same side; the 4 th pin, the 5 th pin, the 6 th pin, the 9 th pin and the 10 th pin are positioned on the same side.
7. The circuit board packaging method for different combustible gas sensors according to claim 5, wherein when the combustible gas sensor adapted to the MP-4 printed circuit board package is used, the sensor is connected to the 7 th pin, the 8 th pin, the 9 th pin and the 10 th pin, the 7 th pin is connected to a power supply GND, the 8 th pin is connected to a signal output, and the 9 th pin and the 10 th pin are connected to a 5V power supply.
8. The circuit board packaging method for different combustible gas sensors according to claim 5, wherein when the combustible gas sensor is packaged by using an MQ-4 printed circuit board, the sensor is connected to the 1 st pin, the 2 nd pin, the 3 rd pin, the 4 th pin, the 5 th pin and the 6 th pin, the 1 st pin and the 3 rd pin are connected with a signal output, and the 2 nd pin is connected with a power supply GND, the 4 th pin, the 5 th pin and the 6 th pin are connected with a 5V power supply.
CN201911211067.9A 2019-12-02 2019-12-02 Circuit board packaging and packaging method for different combustible gas sensors Pending CN110753446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911211067.9A CN110753446A (en) 2019-12-02 2019-12-02 Circuit board packaging and packaging method for different combustible gas sensors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911211067.9A CN110753446A (en) 2019-12-02 2019-12-02 Circuit board packaging and packaging method for different combustible gas sensors

Publications (1)

Publication Number Publication Date
CN110753446A true CN110753446A (en) 2020-02-04

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Application Number Title Priority Date Filing Date
CN201911211067.9A Pending CN110753446A (en) 2019-12-02 2019-12-02 Circuit board packaging and packaging method for different combustible gas sensors

Country Status (1)

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CN (1) CN110753446A (en)

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