CN110750141A - Closed heat radiation structure of high-power magnetic disk array - Google Patents
Closed heat radiation structure of high-power magnetic disk array Download PDFInfo
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- CN110750141A CN110750141A CN201910885524.6A CN201910885524A CN110750141A CN 110750141 A CN110750141 A CN 110750141A CN 201910885524 A CN201910885524 A CN 201910885524A CN 110750141 A CN110750141 A CN 110750141A
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- 230000005855 radiation Effects 0.000 title claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000003491 array Methods 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 230000002265 prevention Effects 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 8
- 239000000428 dust Substances 0.000 abstract description 3
- 150000003839 salts Chemical class 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 2
- 230000009977 dual effect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to a closed heat radiation structure of a high-power disk array, which is mainly technically characterized in that: the front end of the disk array host is a disk module and is positioned on the inner side of the front panel of the plug box, the rear end of the disk array host is a power module and is positioned on the inner side of the rear panel of the plug box, a heat collection fan is arranged at the tail part of the power module, a heat guide groove is arranged between the disk array host and the rear panel of the plug box, a wind-liquid heat exchange device is arranged on the rear panel of the plug box, the hot end of the wind-liquid heat exchange device is arranged inside the plug box, the cold end of the wind-liquid heat exchange device is arranged outside the plug box, and a cooling fan is arranged outside the cold end. The invention has reasonable design, realizes the fully-closed heat dissipation function of the high-power disk array through the internal structure of the plug box, adjusts the rotating speed of the heat dissipation fan in real time through the intelligent temperature control circuit, and meets the requirements of low noise, dust prevention, damp and heat prevention, mould prevention and salt spray prevention of the high-power disk array.
Description
Technical Field
The invention belongs to the technical field of high-power disk arrays, and particularly relates to a closed heat dissipation structure of a high-power disk array.
Background
With the rapid development of computer technology and integrated circuit technology, high-performance servers and disk array units are increasingly used, so as to continuously meet the requirements of systems on computing processing capacity and mass data storage capacity. Meanwhile, along with the deep development of informatization and intelligent construction, the high-performance server and the disk array unit are also widely applied to various special industrial equipment.
After the high-performance server and the disk array unit are used for equipment in the characteristic industry, the problem of environmental adaptability in severe environment resistance such as low noise, dust prevention, mold prevention, damp and heat prevention, salt mist prevention and the like is solved. Thermal design is an important content of high-power electronic equipment, and the high-power electronic equipment can be ensured to work stably and reliably only through good thermal design capability. Therefore, how to achieve the closed heat dissipation to reduce the cell redesign and manufacturing cost is a problem to be solved urgently.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides the closed heat dissipation structure of the high-power disk array, which has the advantages of reasonable design, good heat dissipation effect and low cost.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
a closed heat dissipation structure of a high-power disk array comprises an insert box and a disk array host, wherein the disk array host is installed in the insert box, the front end of the disk array host is a disk module and is positioned on the inner side of a front panel of the insert box, the rear end of the disk array host is a power module and is positioned on the inner side of a rear panel of the insert box, a heat collection fan is installed at the tail of the power module, a heat guide groove is arranged between the disk array host and the rear panel of the insert box, a wind-liquid heat exchange device is installed on the rear panel of the insert box, the hot end of the wind-liquid heat exchange device is arranged inside the insert box, the cold end of the wind-liquid heat exchange device is arranged outside the insert box, and a cooling fan is installed outside the cold end.
The disk array host comprises disk modules, a middle back plate, a dual-redundancy power supply and a disk array dual-redundancy controller, wherein the front end of the middle back plate is provided with a matrix type distribution disk interface for installing the disk modules, the middle of the rear end of the middle back plate is provided with the disk array dual-redundancy controller which is distributed up and down, and the two sides of the controller are provided with the dual-redundancy power supply modules of the disk arrays and a heat collection fan thereof; and the disk module, the double redundant power supply and the disk array double redundant controller are in signal interconnection through a back plate.
The intelligent temperature control circuit is arranged in the disk array host and comprises a microprocessor, a plurality of temperature sensors, an array state monitoring interface and an audible and visual alarm, wherein the temperature sensors are arranged on the disk array host; and the microprocessor is connected with the audible and visual alarm to realize the audible and visual alarm function.
The temperature sensors are arranged on two sides and the center of the middle back plate, and the double-redundancy controller and the double-redundancy power supply are arranged at the positions.
The microprocessor adopts an embedded low-power microprocessor.
The front panel of the plug-in box is provided with a detachable and perspective shielding glass.
The wind-liquid heat exchanger is a wall-mounted high-efficiency wind-liquid heat exchanger.
The heat collecting fan and the cooling fan have the functions of adjustable rotating speed and variable air quantity.
The invention has the advantages and positive effects that:
1. the invention installs the heat collecting fan at the tail part of the disk array, arranges the heat guide groove between the disk array host and the plug-in box back panel, installs the high-efficiency wind-liquid heat exchange device on the plug-in box back panel and installs the cooling fan outside, thereby realizing the fully-closed heat dissipation function of the high-power disk array, and being applicable to the electronic equipment within 600W to meet the use scenes of low-noise, dustproof and high-temperature working environment.
2. The intelligent temperature control circuit is arranged in the disk array host, the temperature sensors are arranged at the two sides and the middle of the back plate and at a plurality of positions of the controller, the power supply and the like, the state monitoring data of the disk array is adopted to adjust the cooling fan with adjustable supporting rotating speed and variable air volume in real time, and the intelligent temperature control circuit adjusts the rotating speed of the cooling fan in real time by comparing the value of the acquired temperature sensor with the set working temperature threshold value so as to achieve the purpose of energy conservation.
3. The high-power disk array design of the invention adopts a modular component structure and has a consistent heat dissipation wind direction design. When the high-power disk array works, heat is collected to the tail of the plug box from the front to the middle, then to the two sides and finally to the tail of the plug box, and the requirements of low noise, dust prevention, damp and heat prevention, mold prevention and salt spray prevention of the high-power disk array are met.
4. The detachable and observable shielding glass is arranged on the front panel of the plug-in box, so that the magnetic disk is conveniently maintained.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a schematic plan view of a disk array host;
FIG. 4 is a perspective view (front view) of a disk array host;
FIG. 5 is a perspective view (rear view) of a disk array host;
FIG. 6 is a block diagram of an intelligent temperature control circuit;
in the figure, 1-plug box, 2-shielding glass, 3-plug box front panel, 4-disk array host, 5-heat guide groove, 6-plug box rear panel, 7-cooling fan and 8-wind-liquid heat exchanger.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the accompanying drawings.
A closed heat dissipation structure of a high-power disk array is shown in figures 1 and 2 and comprises a plug box 1, a disk array host 4, a wind-liquid heat exchange device 8 and a cooling fan 7. The plug-in box is an air-cooled disk array rack-mounted plug-in box, the plug-in box is of a fully-closed structure with front air inlet and rear air outlet, and the front panel 1 of the plug-in box is provided with the detachable shielding glass 2 which can be observed in a perspective mode, so that the disk module can be maintained conveniently. The disk array host is installed inside the plug-in box, the front end of the disk array host is a disk module and is positioned on the inner side of the front panel 3 of the plug-in box, the rear end of the disk array host is a power module and is positioned on the inner side of the rear panel 6 of the plug-in box, and the tail of the power module is provided with a heat collection fan, so that the function of exhausting air from the front panel to the rear panel is realized. A heat guide groove 5 is arranged between the disk array host and the rear panel of the plug-in box. The wind-liquid heat exchanger is a wall-mounted high-efficiency wind-liquid heat exchanger and is mounted on a rear panel of the plug box, wherein the hot end is arranged inside the plug box, the cold end is arranged outside the plug box, and rapid heat exchange is carried out through a plurality of copper heat pipes. And the cooling fan is arranged outside the closed high-power disk array plug box and is responsible for radiating the cold end of the high-efficiency air-liquid heat exchange device outside the plug box.
In this embodiment, the heat collecting fan and the cooling fan both support the functions of adjustable rotating speed and variable air volume.
The working principle of the closed heat exchange is as follows: when the high-power disk array host works, heat is collected to the left tail part and the right tail part of the plug-in box from the front part to the middle part, then to the two sides and finally by the fan. The functions of collecting internal heat and quickly transferring external heat are realized by wall-mounted high-efficiency air-liquid heat exchange devices and separable guide grooves arranged at the air duct concentration position of the disk array host; and the transmission of heat to the surrounding space is further realized through a liquid cooling medium and a low-noise fan at the outer side of the closed back panel of the equipment.
As shown in fig. 3 to 5, the disk array host includes a disk module, a middle back plate, a dual redundant power supply, and a disk array dual redundant controller, where the front end of the middle back plate is provided with 4 × 4 matrix-type distributed disk interfaces for installing the disk module, the middle of the rear end of the middle back plate is provided with the disk array dual redundant controller distributed up and down, and the two sides of the controller are provided with the disk array dual redundant power supply module and the heat collection fan thereof. And the disk module, the double redundant power supply and the disk array double redundant controller are in signal interconnection through a back plate.
The invention installs temperature sensors at two sides of the middle backboard and a plurality of positions of the center, the dual-redundancy controller, the dual-redundancy power supply and the like, adjusts the rotating speed of the high-power fan in real time by comparing the value of the collected temperature sensors with the set working temperature threshold value, achieves the purpose of energy saving, and can provide sound and light alarm to the outside when the temperature exceeds the set safety value. Therefore, the invention installs the intelligent temperature control circuit in the disk array host, as shown in fig. 6, the intelligent temperature control circuit includes the microprocessor, each temperature sensor installed on the disk array host, the array state monitoring interface, the audible and visual alarm, the microprocessor can be realized by the embedded and low power consumption microprocessor, the microprocessor is connected with the temperature sensor to collect the temperature of the temperature sensor on the disk array host, the microprocessor is connected with the array state monitoring interface to realize the interactive function of the external device, the microprocessor is connected with the heat collecting fan and the cooling fan, the health state of the disk array when running is sensed by collecting the information of the temperature sensor and the information of the array state monitoring interface through the intelligent temperature controller, the threshold value is set by grading the importance of each information of the disk array, when the threshold value is exceeded, the intelligent temperature control circuit firstly controls the heat collection fan to accelerate and then controls the external cooling fan to accelerate the heat exchange capacity of the array. The serious over-limit value can provide an audible and visual alarm function through an audible and visual alarm.
A manageable and monitoring program module based on a Web interface is arranged in the intelligent temperature control circuit, and an alarm limit value can be set and the current operating temperature of each sensor in the equipment can be checked in real time; in emergency, an automatic shutdown mode can be set, a safety shutdown message is sent to inform an external server of safe shutdown, and the automatic shutdown operation is further triggered after communication is interrupted.
Through practical engineering tests, the heat dissipation of 600W power electronic equipment can be realized by adopting the closed disk array of the thermal design method, and the heat dissipation test and the electromagnetic compatibility test of working at high temperature plus 50 ℃ and with the humidity of 95% can be met. In addition, a 15dB noise reduction design is realized.
Nothing in this specification is said to apply to the prior art.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but also includes other embodiments that can be derived from the technical solutions of the present invention by those skilled in the art.
Claims (8)
1. The utility model provides a high-power disk array's airtight heat radiation structure, includes subrack and disk array host computer, and the disk array host computer is installed in the subrack, its characterized in that: the front end of the disk array host is a disk module and is positioned on the inner side of the front panel of the plug box, the rear end of the disk array host is a power module and is positioned on the inner side of the rear panel of the plug box, a heat collection fan is arranged at the tail part of the power module, a heat guide groove is arranged between the disk array host and the rear panel of the plug box, a wind-liquid heat exchange device is arranged on the rear panel of the plug box, the hot end of the wind-liquid heat exchange device is arranged inside the plug box, the cold end of the wind-liquid heat exchange device is arranged outside the plug box, and a cooling fan is arranged outside the cold end.
2. The enclosed heat dissipation structure of high power disc array as claimed in claim 1, wherein: the disk array host comprises disk modules, a middle back plate, a dual-redundancy power supply and a disk array dual-redundancy controller, wherein the front end of the middle back plate is provided with a matrix type distribution disk interface for installing the disk modules, the middle of the rear end of the middle back plate is provided with the disk array dual-redundancy controller which is distributed up and down, and the two sides of the controller are provided with the dual-redundancy power supply modules of the disk arrays and a heat collection fan thereof; and the disk module, the double redundant power supply and the disk array double redundant controller are in signal interconnection through a back plate.
3. The enclosed heat dissipation structure of high power disc array as claimed in claim 2, wherein: the intelligent temperature control circuit is arranged in the disk array host and comprises a microprocessor, a plurality of temperature sensors, an array state monitoring interface and an audible and visual alarm, wherein the temperature sensors are arranged on the disk array host; and the microprocessor is connected with the audible and visual alarm to realize the audible and visual alarm function.
4. The enclosed heat dissipation structure of high power disc array as claimed in claim 3, wherein: the temperature sensors are arranged on two sides and the center of the middle back plate, and the double-redundancy controller and the double-redundancy power supply are arranged at the positions.
5. The enclosed heat dissipation structure for high power disk arrays as recited in claim, wherein: the microprocessor adopts an embedded low-power microprocessor.
6. The enclosed heat dissipation structure for high power disc arrays as claimed in any one of claims 1 to 5, wherein: the front panel of the plug-in box is provided with a detachable and perspective shielding glass.
7. The enclosed heat dissipation structure for high power disc arrays as claimed in any one of claims 1 to 5, wherein: the wind-liquid heat exchanger is a wall-mounted high-efficiency wind-liquid heat exchanger.
8. The enclosed heat dissipation structure for high power disc arrays as claimed in any one of claims 1 to 5, wherein: the heat collecting fan and the cooling fan have the functions of adjustable rotating speed and variable air quantity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910885524.6A CN110750141B (en) | 2019-09-19 | 2019-09-19 | Airtight heat radiation structure of high-power disk array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910885524.6A CN110750141B (en) | 2019-09-19 | 2019-09-19 | Airtight heat radiation structure of high-power disk array |
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| CN110750141A true CN110750141A (en) | 2020-02-04 |
| CN110750141B CN110750141B (en) | 2024-02-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112667040A (en) * | 2020-12-16 | 2021-04-16 | 深圳市三合钜科电子有限公司 | Raid buffer type disk array assembly device |
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| Publication number | Publication date |
|---|---|
| CN110750141B (en) | 2024-02-23 |
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