CN110740575A - production and processing equipment for integrated circuit board - Google Patents

production and processing equipment for integrated circuit board Download PDF

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Publication number
CN110740575A
CN110740575A CN201910856163.2A CN201910856163A CN110740575A CN 110740575 A CN110740575 A CN 110740575A CN 201910856163 A CN201910856163 A CN 201910856163A CN 110740575 A CN110740575 A CN 110740575A
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CN
China
Prior art keywords
processing equipment
plate
rod
pressing
machine head
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Withdrawn
Application number
CN201910856163.2A
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Chinese (zh)
Inventor
黄诚
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Individual
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Individual
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Priority to CN201910856163.2A priority Critical patent/CN110740575A/en
Publication of CN110740575A publication Critical patent/CN110740575A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Abstract

The invention discloses integrated circuit board production and processing equipment, which structurally comprises a machine head, an upper pressing plate, a lower cushion plate and a base, wherein a mounting groove, a screw rod, an extrusion rod and a sealing support rod are arranged in the machine head, the mounting groove is internally provided with textures matched with the screw rod in a threaded manner, the machine head is mechanically connected with the upper pressing plate through the screw rod, a transfer printing cushion plate arranged in the lower cushion plate is matched with a pressing piece, an air hole, an ejection element and a lower pressing cross rod together, the pushing force generated by drawing the extrusion rod is used as the pushing force of a sliding plug, the lower pressing height of the lower pressing cross rod is changed in the process of continuous sliding, the atmospheric pressure in an air outlet cavity is discharged into the pressing piece, the height of a corner pressing plate is indirectly changed, when the corner pressing plate is higher than the pressing plate, the transfer printing paper on a circuit board is pressed by corners at two sides, and the excessive residue caused by tape fixation can be effectively prevented through the fixation generated.

Description

production and processing equipment for integrated circuit board
Technical Field
The invention relates to the technical field of circuit board processing, in particular to integrated circuit board production and processing equipment.
Background
, manufacturing IC chips requires hundreds of processes, cutting the printed circuit board into proper size in the transfer process of the IC board, attaching the surface printed with the circuit board to the copper-clad plate, placing the copper-clad plate into a thermal transfer machine after aligning, and for the condition that the area of the drawing is equivalent to the area of the copper-clad plate, in order to prevent the paper from deviating, the transfer paper must be fixed on the circuit board by using a high-temperature adhesive tape, but the adhesive tape is directly adhered to the circuit board during transfer, although adhesive tapes are high-temperature resistant, the residual adhesive can be left on the circuit board to a large extent, and the corrosion is not clean.
Disclosure of Invention
In order to solve the problems, the invention provides integrated circuit board production and processing equipment.
kinds of integrated circuit board production and processing equipment structurally comprises a machine head, an upper pressing plate, a lower cushion plate and a base, wherein an installation groove, a spiral rod, an extrusion rod and a sealing support rod are installed in the machine head, the installation groove is internally provided with textures matched with the spiral rod in a threaded mode, the machine head is mechanically connected with the upper pressing plate through the spiral rod, the upper pressing plate and the lower cushion plate are in structural size, the lower cushion plate is fixed on the base and is of a shape structure, the extrusion rod and the sealing support rod are arranged in the vertical end of the machine head, the lower cushion plate is provided with a transfer printing cushion plate, the transfer printing cushion plate is of a grid shape, a hollow groove is arranged between the adjacent transfer printing cushion plates, a pressing piece and an air hole are arranged inside the hollow groove, the air hole is opposite to the bottom of the pressing piece, the pressing piece comprises a corner pressing plate, a th piston, a second piston and a compression spring, more than two compression springs are arranged, the upper pressing plate and the lower pressing plate are uniformly fixed between the two corner pressing plates, the piston is matched with the air hole, and the second piston is.
The invention has the beneficial effects that: the rendition backing plate and the pressfitting piece that are equipped with in the lower bolster, the gas pocket, pop out the component, the common cooperation of horizontal pole pushes down, the thrust that utilizes the extrusion pole pull to produce is as the driving force of sliding plug, the in-process of continuous gliding changes and pushes down the horizontal pole height of pushing down, borrow this and go out the atmospheric pressure of intracavity portion and be discharged in the pressfitting piece, indirectly change the height of bent angle clamp plate, bent angle clamp plate is when going out the rendition backing plate, the transfer printing paper on the circuit board is lived to the bent angle suppression of both sides, can effectively prevent through the fixed unnecessary residue that the sticky tape was fixed brought of having solved in the skew of transfer printing paper of the pressure drive mode production of adoption.
As a further improvement of the present invention, the angled platen is a snap fit within the hollow channel and the angled end is in indirect contact with the transfer pad surface.
As a further improvement of the present invention, the piston and the second piston form closed standard atmospheric pressure cavities.
As a further improvement , the pressing rod is slidably fitted between two sealing struts, and the sealing struts are provided with ejection elements, and the ejection elements are composed of sliding plugs and sliding ways, and the sliding plugs are slidably fitted in the sliding ways.
As an improvement of the invention in step , a lower pressing cross rod is movably mounted at the horizontal end of the slide way, the lower pressing cross rod is matched with a vertical sliding plug and an air outlet cavity, and the vertical sliding plug is in up-and-down sliding fit in the air outlet cavity.
As a further improvement , the lower press beam has a ramp structure toward the end of the sliding plug, wherein the horizontal initial gap of the slide formed by the lower press beam is smaller than the vertical initial gap.
As a further improvement of , the end of the corner pressing plate with the corner is half of the length of the transfer pad plate, and the telescopic length is not , so that the fixing function of circuit boards with different sizes in transfer work is satisfied.
As a further improvement , the sliding plug is made of solid wooden products, the total weight of the wooden products is lighter than that of iron products, the sliding plug is better matched with the up-and-down sliding when the pressing rod is drawn, and meanwhile, the sliding plug is matched with the end of the pressing cross rod which is an inclined surface, so that the sliding efficiency is improved.
As a further improvement , a plurality of compression springs matched between the two corner pressing plates better complete outward expansion in the process of generating upward sliding, and the accuracy of pressing transfer paper is improved.
Drawings
Fig. 1 is a schematic perspective view of the appearance of kinds of integrated circuit board production and processing equipment according to the present invention.
FIG. 2 is a schematic view of a front partial press-down cross-sectional structure of the present invention. Search everywhere
FIG. 3 is a schematic diagram of the ascending structure of the upper platen shown in FIG. 2 according to the present invention.
FIG. 4 is a schematic structural view of the press-fitting member of the present invention.
FIG. 5 is a schematic diagram of the backside structure of FIG. 2 according to the present invention.
Fig. 6 is an enlarged view of the structure of the ejection element of fig. 5 according to the present invention.
In the figure, a machine head-1, an upper pressure plate-2, a lower cushion plate-3, a base-4, a mounting groove-11, a screw rod-12, an extrusion rod-13, a sealing support rod-14, a transfer printing cushion plate-31, a pressing piece-311, an air hole-312, a corner pressure plate-11 a, an th piston-11 b, a second piston-11 c, a pressure spring-11 d, an ejecting element-a, a sliding plug-a 1, a slideway-a 2, a lower pressure cross rod-b, a vertical sliding plug-b 1 and an air outlet cavity-b 2 are arranged.
Detailed Description
In order to make the technical means, creation features, achievement objects and effects of the present invention easy to understand, fig. 1 to 6 schematically show the structure of the integrated circuit board production processing equipment according to the embodiment of the present invention, and the present invention is further described with reference to the following specific embodiments .
Examples
As shown in fig. 1-6, the present invention provides kinds of integrated circuit board production and processing equipment, which structurally includes a machine head 1, an upper pressing plate 2, a lower pressing plate 3, and a base 4, wherein a mounting groove 11, a screw rod 12, an extrusion rod 13, and a sealing support rod 14 are installed in the machine head 1, a texture in threaded fit with the screw rod 12 is installed in the mounting groove 11, the machine head 1 is mechanically connected with the upper pressing plate 2 through the screw rod 12, the upper pressing plate 2 and the lower pressing plate 3 are structurally sized , the lower pressing plate 3 is fixed on the base 4, the machine head 1 is an L-shaped structure, the extrusion rod 13 and the sealing support rod 14 are installed in a vertical end of the machine head 1, a transfer pressing plate 31 is installed on the lower pressing plate 3, the transfer pressing plate 31 is in a grid shape, a hollow groove is installed between adjacent transfer pressing plates 31, a pressing piece 311 and an air hole 312 are installed inside the hollow groove, the air hole 312 is right opposite to the bottom of the pressing piece 311, the pressing piece 311 includes a corner pressing plate 11a, a second piston b, a second piston 11c and a compression spring are installed between the upper pressing plate 11a, and a compression spring is uniformly welded on the second piston 11b, and a compression spring .
The angled platen 11a fits movably within the hollow slot and the angled end is in indirect contact with the transfer pad 31 surface.
The th piston 11b and the second piston 11c form closed standard atmospheric pressure cavities.
The pressing rod 13 is slidably fitted between the two sealing struts 14, and the sealing strut 14 is provided with an ejecting element a, the ejecting element a is composed of a sliding plug a1 and a sliding way a2, and the sliding plug a1 is slidably fitted in the sliding way a 2.
The horizontal end of the slideway a is movably provided with a lower pressing cross rod b, the lower pressing cross rod b is matched with a vertical sliding plug b1 and an air outlet cavity b2, and the inside of the air outlet cavity b2 is vertically matched with a vertical sliding plug b1 in a sliding way.
The end of the lower press cross bar b facing the sliding plug a1 is of a slope structure, wherein the horizontal initial gap of the slide way a formed by the lower press cross bar b is smaller than the vertical initial gap.
The length of the end of the corner pressing plate 11a with a corner is half of that of the transfer printing pad plate 31, the telescopic length is not , and the fixing function of circuit boards with different sizes in transfer printing work is met.
The working principle of the integrated circuit board production and processing equipment in the above technical solution is explained as follows:
according to the invention, before the integrated circuit board is transferred, the area of the transfer printing and the circuit board needs to be corrected, as shown in fig. 1, before the circuit board is placed on a transfer printing backing plate 31, an upper pressing plate 2 is firstly rotated away, before the circuit board is rotated away, a worker starts a machine head 1, a screw rod 12 is rotated forwards, the upper pressing plate 2 is vertically lifted, as shown in fig. 3, after the proper height between the upper pressing plate 2 and a lower backing plate 3 is kept, the circuit board is accurately placed on the transfer printing backing plate 31, then the transfer printing paper is aligned with the circuit board, as the transfer printing backing plate 31 is provided with a plurality of formed lattices, the transfer printing operation of a plurality of circuit boards can be simultaneously carried out to improve the working efficiency, after the alignment, the worker waves an extrusion rod 13 downwards, at the moment, a1 slides downwards, until the height of a lower cross rod b is reduced when the slide rod b is contacted with a slope position, the horizontal gap of a1 is enlarged, the vertical sliding plug b1 is continuously compressed downwards, the pressure in a gas outlet cavity b2 closed by a constant change, the pressure is continuously changed towards the end , a pressure piston 48363 b is continuously enters into an air hole, the second piston 6711 b 63 b, the pressure is continuously changed, the second piston structure, the pressure of the second piston is prevented from being horizontally pushed upwards, the second piston 8611 c, the second piston structure is pushed towards the upper end of the second transfer printing paper, the second piston 11c, the second piston.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims (7)

1, integrated circuit board production and processing equipment, its structure includes aircraft nose (1), top board (2), lower bolster (3), base (4), install mounting groove (11), hob (12), extrusion stem (13), sealed branch (14), its characterized in that in aircraft nose (1):
the machine head is characterized in that the mounting groove (11) is internally provided with textures which are in threaded fit with the screw rod (12), the machine head (1) is mechanically connected with the upper pressure plate (2) through the screw rod (12), the upper pressure plate (2) and the lower padding plate (3) are in structural size, the lower padding plate (3) is fixed on the base (4), the machine head (1) is of an L-shaped structure, the extrusion rod (13) and the sealing support rod (14) are arranged in the vertical end of the machine head (1), the lower padding plate (3) is provided with the transfer padding plates (31), the transfer padding plates (31) are in a grid shape, and a hollow groove is formed between every two adjacent transfer padding plates (31);
the pressing piece (311) and the air hole (312) are arranged in the hollow groove, the air hole (312) is right opposite to the bottom of the pressing piece (311), the pressing piece (311) comprises more than two bent angle pressing plates (11a), th pistons (11b), second pistons (11c) and pressure springs (11d), the number of the pressure springs (11d) is more than two, the two bent angle pressing plates are uniformly fixed between the two bent angle pressing plates (11a) from top to bottom, the th pistons (11b) are matched with the air hole (312), and the bent angle pressing plates (11a) are vertically welded on the second pistons (11 c).
2. The types of IC board production and processing equipment according to claim 1, wherein the angled platen (11a) is movably fitted in the hollow groove, and the end with an angled corner is in indirect contact with the surface of the transfer pad (31).
3. The kinds of IC board production and processing equipment according to claim 1, wherein the piston (11b) and the second piston (11c) form closed standard atmospheric pressure cavities.
4. The production and processing equipment for IC boards according to claim 1, wherein the pressing rod (13) is slidably fitted between the two sealing struts (14), the sealing struts (14) are installed with ejection elements (a), the ejection elements (a) are composed of a sliding plug (a1) and a sliding way (a2), and the sliding plug (a1) is slidably fitted in the sliding way (a 2).
5. The production and processing equipment for IC boards according to claim 4, wherein a lower press bar (b) is movably mounted at the horizontal end of the slide way (a), the lower press bar (b) is fitted with a vertical sliding plug (b1) and an air outlet cavity (b2), and the inside of the air outlet cavity (b2) is fitted with a vertical sliding plug (b1) in a vertical sliding manner.
6. The production and processing equipment for IC boards according to claim 5, wherein the end of the hold-down bar (b) facing of the sliding plug (a1) is a ramp structure, and the horizontal initial clearance of the slide (a) formed by the hold-down bar (b) is smaller than the vertical initial clearance.
7. The kinds of IC board production and processing equipment according to claim 1 or 2, wherein the end of the angled platen (11a) with an angle is times shorter than the length of the transfer pad plate (31).
CN201910856163.2A 2019-09-11 2019-09-11 production and processing equipment for integrated circuit board Withdrawn CN110740575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910856163.2A CN110740575A (en) 2019-09-11 2019-09-11 production and processing equipment for integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910856163.2A CN110740575A (en) 2019-09-11 2019-09-11 production and processing equipment for integrated circuit board

Publications (1)

Publication Number Publication Date
CN110740575A true CN110740575A (en) 2020-01-31

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ID=69268080

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910856163.2A Withdrawn CN110740575A (en) 2019-09-11 2019-09-11 production and processing equipment for integrated circuit board

Country Status (1)

Country Link
CN (1) CN110740575A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1018760A1 (en) * 1999-01-07 2000-07-12 Alphasem AG Method and apparatus for encapsulating an electronic device, especially a semiconductor chip
JP2001311958A (en) * 2000-04-28 2001-11-09 Optrex Corp Heat seal compression bonding device
CN106538075A (en) * 2013-11-01 2017-03-22 Ppg工业俄亥俄公司 Methods of transferring electrically conductive materials
CN109496075A (en) * 2018-12-19 2019-03-19 杭州亿涞光电股份有限公司 The full-automatic molding apparatus of wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1018760A1 (en) * 1999-01-07 2000-07-12 Alphasem AG Method and apparatus for encapsulating an electronic device, especially a semiconductor chip
JP2001311958A (en) * 2000-04-28 2001-11-09 Optrex Corp Heat seal compression bonding device
CN106538075A (en) * 2013-11-01 2017-03-22 Ppg工业俄亥俄公司 Methods of transferring electrically conductive materials
CN109496075A (en) * 2018-12-19 2019-03-19 杭州亿涞光电股份有限公司 The full-automatic molding apparatus of wiring board

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Application publication date: 20200131

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