CN110739242A - wafer photoresist and antifog gas overflow device in metal stripping process - Google Patents
wafer photoresist and antifog gas overflow device in metal stripping process Download PDFInfo
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- CN110739242A CN110739242A CN201810794940.0A CN201810794940A CN110739242A CN 110739242 A CN110739242 A CN 110739242A CN 201810794940 A CN201810794940 A CN 201810794940A CN 110739242 A CN110739242 A CN 110739242A
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- ring
- splash
- splashproof
- fixed
- exhaust
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/0002—Casings; Housings; Frame constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
- B01D46/12—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces in multiple arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/56—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours with multiple filtering elements, characterised by their mutual disposition
- B01D46/62—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours with multiple filtering elements, characterised by their mutual disposition connected in series
Abstract
The invention belongs to the technical field of wafer manufacturing, and particularly relates to an anti-fog overflow device in wafer photoresist and metal stripping processes, which comprises a fixed anti-splash ring, an inner anti-splash ring, a -level filter device, a lifting anti-splash ring driving mechanism and an exhaust pipeline, wherein the fixed anti-splash ring, the inner anti-splash ring and the lifting anti-splash ring are sequentially nested from outside to inside, an annular gap is reserved between the inner anti-splash ring and the fixed anti-splash ring, the -level filter device is arranged at the lower end of the inner anti-splash ring, the lifting anti-splash ring driving mechanism is connected with the lifting anti-splash ring and is used for driving the lifting anti-splash ring to ascend and descend, and the exhaust pipeline is connected with the fixed anti-splash ring and is communicated with the annular gap between the inner anti-splash ring and the fixed anti-splash ring.
Description
Technical Field
The invention belongs to the technical field of wafer manufacturing, and particularly relates to an anti-mist overflow device for wafer photoresist and metal stripping processes.
Background
In the LED industry, wafer processing is divided into several processes, wherein the lift-off process is a method of using sacrificial materials (e.g., photoresist) to create a structure (patterning) of target materials on the surface of a substrate (e.g., wafer). when the sacrificial layer (photoresist in solvent) is washed away, the top material is stripped and washed with the underlying sacrificial layer . this process typically uses high temperature and high pressure solvent to strip off the photoresist and the overlying precious metals ( is typically gold, silver, etc.) and needs to be recycled, . in the case of wet lift-off process, due to the high temperature and high pressure, the cavity can generate a lot of mist and carry with precious metal swarf, which can easily enter the exhaust duct to be difficult to recycle, causing the duct to block, and the mist can accumulate in the duct after condensation, causing the solution to overflow and corrode components, even harm to operators.
Disclosure of Invention
In view of the above problems, the present invention provides kinds of wafer photoresists and anti-mist overflow devices for metal stripping process, so as to solve the problems of mist overflow, air duct blockage and low metal recovery rate during the existing stripping chamber process.
In order to achieve the purpose, the invention adopts the following technical scheme:
antifog gas overflow arrangement in wafer photoresist and metal stripping process, including fixed splashproof ring, interior splashproof ring, level filter equipment, lift splashproof ring actuating mechanism and exhaust pipe way, wherein fixed splashproof ring, interior splashproof ring and lift splashproof ring by outer in proper order nested setting, and leave the annular gap between interior splashproof ring and the fixed splashproof ring, level filter equipment set up in the lower extreme of interior splashproof ring, lift splashproof ring actuating mechanism with lift splashproof ring is connected, is used for the drive lift splashproof ring goes up and down, exhaust pipe way with fixed splashproof ring connect, and with the annular gap intercommunication between interior splashproof ring and the fixed splashproof ring.
Fixed splashproof ring is including fixed splashproof rampart, fixed splashproof ring bottom plate and exhaust box, wherein fixed splashproof ring bottom plate set up in the lower extreme of fixed splashproof rampart, and with the unit bottom plate sealing connection of technology cavity, be equipped with a plurality of air outlets along circumference on the fixed splashproof rampart, each air outlet department all is equipped with the second grade filter screen, exhaust box set up in the outside of fixed splashproof rampart, the air outlet is located exhaust box, the exhaust pipeline with exhaust box intercommunication.
The outer side of the fixed splash-proof ring wall is symmetrically provided with two air exhaust boxes, and the two air exhaust boxes are respectively connected with the two air exhaust pipelines through air exhaust pipes.
And an exhaust filter screen is arranged at the joint between the exhaust pipeline and the exhaust pipe, and the exhaust pipeline is led out from the inside of the process cavity from bottom to top.
And a motor buckle cover connected with the bottom plate of the fixed splash-proof ring is arranged in the wall of the fixed splash-proof ring.
The upper end of the inner splash-proof ring is connected with the fixed splash-proof ring through a flange.
The level filter equipment is level filter screen, level filter screen adopts metal filter screen to make.
The top of lift splashproof ring is equipped with the apron, the center of apron is equipped with the fabrication hole.
And a sealing ring and a pressing sheet arranged above the sealing ring are arranged between the upper end edge of the lifting splash-proof ring and the top of the inner splash-proof ring.
The lifting splash-proof ring driving mechanism comprises two lifting cylinders, and the two lifting cylinders are respectively arranged on two sides of the lifting splash-proof ring and the output end of the lifting splash-proof ring is connected with the lifting splash-proof ring through a connecting piece.
The invention has the advantages and positive effects that:
1. the air exhaust device is provided with the three layers of filtering devices, so that metal debris is prevented from entering the air duct to a great extent, the risk of blocking the air duct is reduced, and the metal recovery rate is increased.
2. The inner splash-proof ring blocks the air outlet of the fixed splash-proof ring, and an interlayer is formed between the air outlet and the fixed splash-proof ring, so that mist enters the interlayer through a filter screen at the lower end of the inner splash-proof ring and then is led to the air outlet, and an air exhaust flow field is optimized.
3. The lifting splash-proof ring cover plate effectively prevents fog and metal chips from overflowing, the size of the opening of the cover plate is 2mm to 7mm larger than the outer diameter of a wafer, the fog can overflow when the opening is too large, and the wafer is easy to scrape when the opening is too small, so that the wafer is damaged.
4. The lifting splash-proof ring is lifted in linkage with the unit through the two cylinders, so that the lifting stability of the splash-proof ring is improved.
5. In the invention, after the mist is condensed into liquid, the liquid flows back into the fixed splash-proof ring along the exhaust pipeline and is discharged. The damage to equipment after the mist condenses the hydrops is avoided.
6. According to the invention, the cavity gap is sealed by the sealing ring, and no mist overflows from the gap between the two splash-proof rings in the stripping process.
7. The fixed splash-proof ring is provided with a plurality of symmetrical air outlets, so that the flow field in the cavity is more uniform.
8. The invention can realize compatible processing of wafers with different sizes by replacing the lifting splash-proof ring cover plate.
9. The exhaust pipe is internally provided with the filter screen, the filter screen and the pipeline are cleaned by removing the clamp when the clamp is used for fixing and periodically cleaning and recovering metal, the operation is convenient, and the maintenance is simple.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view taken at I in FIG. 1;
FIG. 3 is a top view of FIG. 1;
FIG. 4 is an exploded view of the fixed splash ring and inner splash ring of the present invention;
FIG. 5 is an isometric view of a fixed splash ring of the present invention;
fig. 6 is an isometric view of the lift splash ring of the present invention.
The device comprises a fixed splash-proof ring 1, an -grade filter screen 2, an inner splash-proof ring 3, a sealing ring 4, a pressing sheet 5, a secondary filter screen 6, an exhaust pipeline 7, an exhaust filter screen 8, a filter screen gasket 9, a hoop 10, a lifting cylinder 11, a unit , a splash-proof ring adapter plate 13, a cover plate 14, a lifting splash-proof ring 15, a lifting splash-proof ring cylinder 16, a cylinder fixing plate 17, a splash-proof ring connecting plate 18, a unit bottom plate 19, a bearing platform 20, a vacuum shaft motor 21, a motor lower fixing plate 22, a sealing pad 23, a process cavity 24, a fixed splash-proof ring wall 101, a fixed splash-proof ring bottom plate 102, a motor buckle cover 103, an exhaust box 104, an L-shaped exhaust pipe 105 and an opening 106.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 4, the anti-mist overflow device for kinds of wafer photoresists and metal stripping processes provided by the invention comprises a fixed splash-proof ring 1, an inner splash-proof ring 3, a -grade filter device, a lifting splash-proof ring 15, a lifting splash-proof ring driving mechanism and an exhaust pipeline 7, wherein the fixed splash-proof ring 1, the inner splash-proof ring 3 and the lifting splash-proof ring 15 are sequentially nested from outside to inside, an annular gap is reserved between the inner splash-proof ring 3 and the fixed splash-proof ring 1, the -grade filter device is arranged at the lower end of the inner splash-proof ring 3, the lifting splash-proof ring driving mechanism is connected with the lifting splash-proof ring 15 and used for driving the lifting splash-proof ring 15 to ascend and descend, and the exhaust pipeline 7 is connected with the fixed splash-proof ring 1 and is communicated with the annular gap between the inner splash.
As shown in fig. 5, the fixed splash-proof ring 1 includes a fixed splash-proof ring wall 101, a fixed splash-proof ring bottom plate 102 and an exhaust box 104, wherein the fixed splash-proof ring bottom plate is disposed at a lower end of the fixed splash-proof ring wall 101 and is hermetically connected to the unit bottom plate 19 of the process chamber 24, a plurality of air outlets 106 are circumferentially disposed on the fixed splash-proof ring wall 101, each air outlet 106 is provided with a secondary filter screen 6, the exhaust box 104 is disposed at an outer side of the fixed splash-proof ring wall 101, the air outlets 106 are located in the exhaust box 104, and the exhaust pipeline 7 is communicated with the exhaust box 104.
Two air exhaust boxes 104 are symmetrically arranged on the outer side of the fixed splash-proof annular wall 101, and the two air exhaust boxes 104 are respectively connected with the two air exhaust pipelines 7 through an air exhaust pipe 105. The exhaust duct 105 is of an L-shaped structure, and the exhaust pipeline 7 is a bent pipe. An exhaust filter screen 8 is arranged at the joint between the exhaust pipeline 7 and the exhaust pipe 105, and the exhaust pipeline 7 is led out from the inside of the process cavity 24 from bottom to top.
A motor buckle cover 103 connected with the fixed splash ring bottom plate 102 is arranged in the fixed splash ring wall 101. The upper end of the inner splash-proof ring 3 is connected with the fixed splash-proof ring 1 through a flange.
The grade filter device is grade filter screen 2, and grade filter screen 2 is made of metal filter screen.
As shown in fig. 6, a cover plate 14 is provided on the top of the lifting splash ring 15, and a process hole is provided in the center of the cover plate 14. A sealing ring 4 and a pressing sheet 5 arranged above the sealing ring 4 are arranged between the upper end edge of the lifting splash-proof ring 15 and the top of the inner splash-proof ring 3, as shown in fig. 2.
The lifting splash-proof ring driving mechanism comprises two lifting cylinders 11, wherein the two lifting cylinders 11 are respectively arranged on two sides of the lifting splash-proof ring 15, and the output ends of the two lifting cylinders are connected with the lifting splash-proof ring 15 through connecting pieces.
Examples
The invention relates to an anti-fog overflow device, which comprises a three-layer anti-splash ring (rubber cup) structure, wherein the upper part of a fixed anti-splash ring base plate 102 is in a circular ring shape, the center position of the fixed anti-splash ring base plate is welded with a motor buckle cover 103, the lower part of the fixed anti-splash ring base plate is connected with a unit base plate 19 through threads, the outer side of the fixed anti-splash ring base plate is provided with a circular groove which is sealed through a sealing gasket 23, a fixed anti-splash ring wall 101 is welded on the fixed anti-splash ring base plate 102, a plurality of air outlets 106 which are uniformly distributed on the circumference are arranged at the position 3-10 mm below the axial direction of a flange, the fixed anti-splash ring base plate is completely wrapped and welded without gaps by using two air exhaust boxes 104, the upper end surfaces of the two air exhaust boxes 104 are horizontal and coplanar, the air exhaust boxes 104 are in a shell shape, the upper end surfaces of the two elongated secondary filter screens 6 are fastened through threads, the center position in the vertical direction of the side surfaces is provided with a circular hole, an L-shaped air exhaust pipe 105 is horizontally welded on the air exhaust box 104, the L-shaped exhaust box 101 is vertical layer, the surface of the fixed anti-splash ring wall 7 is connected with the coplanar, the inner surface of the L-splash.
Interior splashproof ring 3 is the ring form, axial cross-section is nearly "T" shape, the bell mouth of four circumference equipartitions and the screw hole of four circumference equipartitions are seted up to the upper portion flange, eight hole equipartitions, be connected with fixed splashproof ring 1 through the bell mouth, level filter screen 2 is inlayed to terminal surface under interior splashproof ring 3, level filter screen 2 bottom flange and fixed splashproof ring bottom plate 102 coincidence, the upper end is "L" shape hem, make 3 terminal surface card of interior splashproof ring at level filter screen 2 hem positions, central point puts up the rectangular mouth of four equipartitions, install 10 meshes to 50 mesh filter screens in open position, put into fixed splashproof ring 1, can form unilateral 6 to 12 mm's space between interior splashproof ring 3 and fixed splashproof ring 1, as shown in figure 2 and figure 3, install annular anticorrosive sealing ring 4 of circle on 3 flange of splashproof ring, and the screw hole connection on interior splashproof ring 3 through four bell mouths on the annular 5 compresses tightly sealing ring 4, set up the.
As shown in fig. 6, the shape of the lifting splash-proof ring 15 is similar to that of the inner splash-proof ring 3, the flange is wider, the lower cylinder is longer, four uniformly distributed threaded holes are formed in the inner side of the flange, eight symmetrical threaded holes are formed in the outer side of the flange, a splash-proof ring cover plate 14 is installed on the upper end face through the threaded holes in the inner side, the thickness of the cover plate ranges from 1.5mm to 3mm, an opening suitable for the size of a wafer and for the movement track of a nozzle is formed in the center of the flange, the size of the circular opening is 2mm to 7mm larger than the outer diameter of the wafer, when the circular opening is too large, mist overflows, when the circular opening is too small, the wafer is easily scraped, damage is caused to the wafer, the lifting splash-proof ring 15 is connected with the splash-proof ring adapter plate 13 and the splash-proof ring connecting plate 18 through the threaded holes in the outer side of the flange, the splash-proof ring adapter plate 13 and the splash-proof ring connecting plate 18 are connected with the lifting cylinder 11 through the threaded holes in a triangular distribution, when the splash-proof ring connecting plate 18 and the lifting cylinder 16 are too large, when the lifting ring 15 and the lifting cylinder are connected, the lifting cylinder 15 and lifting cylinder 12, the lifting cylinder can lift ring 15 can lift the lifting cylinder can lift ring can lift the lifting unit to lift ring to lift unit to prevent the splash-proof ring from.
The working principle of the invention is as follows:
in the peeling process of the wafer, firstly, the equipment is started and initialized, each unit is enabled to reach an initial working position, after the wafer is placed into a degumming cavity, the lifting splash-proof ring 15 is lifted, the wafer is adsorbed by the rotating motor 21 to rotate at a high speed, the nozzle is driven by the swing arm to swing, scan and spray liquid medicine, under the action of the lifting splash-proof ring cover plate 14, mist generated under the conditions of high temperature and high pressure is mixed with metal scraps to fill the whole cavity, if no air is exhausted, the mist can overflow from an opening of the lifting splash-proof ring cover plate 14 to pollute the whole process unit, and precious metal is not easy to collect.
The anti-fog overflow device, the three-layer filtering system and the special exhaust flow field used in the wafer photoresist and metal stripping process provided by the invention prevent metal debris from entering the exhaust pipeline and fog from being condensed and accumulated in the exhaust pipeline, and solve the problems of fog overflow, air duct blockage, low metal recovery rate and the like in the conventional stripping cavity process.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, extension, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (10)
1, kinds of wafer photoresist and metal strip antifog gas overflow arrangement in technology, its characterized in that, including fixed splashproof ring (1), interior splashproof ring (3), level filter equipment, lift splashproof ring (15), lift splashproof ring actuating mechanism and exhaust pipe way (7), wherein fixed splashproof ring (1), interior splashproof ring (3) and lift splashproof ring (15) by outer in proper order nested setting, and in splashproof ring (3) and fixed splashproof ring (1) between leave the annular gap, level filter equipment set up in the lower extreme of interior splashproof ring (3), lift splashproof ring actuating mechanism with lift splashproof ring (15) are connected, are used for the drive lift splashproof ring (15) go up and down, exhaust pipe way (7) with fixed splashproof ring (1) are connected, and with the annular gap intercommunication between interior splashproof ring (3) and fixed splashproof ring (1).
2. The wafer photoresist and metal strip in technology anti-fog overflow arrangement of claim 1, characterized in that, fixed splashproof ring (1) includes fixed splashproof rampart (101), fixed splashproof ring bottom plate (102) and exhaust box (104), wherein fixed splashproof ring bottom plate sets up in the lower extreme of fixed splashproof rampart (101) and with unit bottom plate (19) sealing connection of technology cavity (24), be equipped with a plurality of air exit (106) along circumference on fixed splashproof rampart (101), each air exit (106) department all is equipped with second grade filter screen (6), exhaust box (104) set up in the outside of fixed splashproof rampart (101), air exit (106) are located exhaust box (104), exhaust pipeline (7) with exhaust box (104) intercommunication.
3. The wafer photoresist and metal stripping process anti-fog-gas overflow device as claimed in claim 2, wherein two of the exhaust boxes (104) are symmetrically arranged on the outer side of the fixed splash-proof ring wall (101), and the two exhaust boxes (104) are respectively connected with the two exhaust pipelines (7) through exhaust pipes (105).
4. The wafer photoresist and metal stripping process anti-fog gas overflow device as claimed in claim 3, wherein an exhaust filter screen (8) is arranged at the connection between the exhaust pipeline (7) and the exhaust pipe (105), and the exhaust pipeline (7) is led out from the inside of the process cavity (24) from bottom to top.
5. The wafer photoresist and metal stripping process anti-fog overflow device of claim 2, wherein a motor cover (103) connected to the fixed splash ring base plate (102) is disposed in the fixed splash ring wall (101).
6. The device for preventing the fog overflow in the photoresist and metal stripping process of the wafer according to claim 1, wherein the upper end of the inner splash ring (3) is connected with the fixed splash ring (1) through a flange.
7. The wafer photoresist and metal stripping process anti-fog-out device as claimed in claim 1, wherein the -grade filtering device is a -grade filtering screen (2), and the -grade filtering screen (2) is made of metal filtering screen.
8. The device for preventing the out-flowing of fog in the photoresist and metal stripping process of the wafer according to claim 1, wherein a cover plate (14) is arranged on the top of the lifting splash-proof ring (15), and a process hole is arranged in the center of the cover plate (14).
9. The wafer photoresist and metal stripping process anti-fog overflow device of claim 8, wherein a sealing ring (4) and a pressing sheet (5) arranged above the sealing ring (4) are arranged between the upper edge of the lifting splash-proof ring (15) and the top of the inner splash-proof ring (3).
10. The wafer photoresist and metal stripping process anti-fog overflow device as claimed in claim 1, wherein the lifting splash-proof ring driving mechanism comprises two lifting cylinders (11), the two lifting cylinders (11) are respectively disposed on two sides of the lifting splash-proof ring (15), and the output ends of the two lifting cylinders are connected to the lifting splash-proof ring (15) through connecting pieces.
Priority Applications (1)
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CN201810794940.0A CN110739242A (en) | 2018-07-19 | 2018-07-19 | wafer photoresist and antifog gas overflow device in metal stripping process |
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CN201810794940.0A CN110739242A (en) | 2018-07-19 | 2018-07-19 | wafer photoresist and antifog gas overflow device in metal stripping process |
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CN201810794940.0A Pending CN110739242A (en) | 2018-07-19 | 2018-07-19 | wafer photoresist and antifog gas overflow device in metal stripping process |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
-
2018
- 2018-07-19 CN CN201810794940.0A patent/CN110739242A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
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