CN110736396A - Missile testing system - Google Patents

Missile testing system Download PDF

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Publication number
CN110736396A
CN110736396A CN201911018975.6A CN201911018975A CN110736396A CN 110736396 A CN110736396 A CN 110736396A CN 201911018975 A CN201911018975 A CN 201911018975A CN 110736396 A CN110736396 A CN 110736396A
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China
Prior art keywords
relay
power supply
double
path
grounded
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CN201911018975.6A
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Chinese (zh)
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CN110736396B (en
Inventor
黄文斌
宋祥君
李万领
李强
刘彦宏
王振生
王正军
刘永进
毛向东
张连武
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PLA China 32181 Army
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PLA China 32181 Army
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42AMMUNITION; BLASTING
    • F42BEXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B35/00Testing or checking of ammunition
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/22Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Abstract

The invention discloses an missile testing system, which relates to the technical field of missile testing devices and comprises a system box body, wherein a computer measurement and control unit placing grid, a rotary table control unit placing grid, a missile performance testing unit placing grid, a launching mechanism testing unit placing grid, a target simulation rotary table placing grid, a gas cylinder placing grid, a gas circuit accessory placing grid, a gas cylinder support placing grid, a matching connection cable placing grid and a rotary table accessory placing grid are arranged in the system box body, a computer measurement and control unit is positioned in the computer measurement and control unit placing grid, a rotary table control unit is positioned in the rotary table control unit placing grid, and the missile testing system can improve the missile fault diagnosis rate and the maintenance efficiency.

Description

Missile testing system
Technical Field
The invention relates to the technical field of missile testing devices, in particular to missile testing systems.
Background
Before the missile is launched, although the missile is subjected to comprehensive and detailed unit test and comprehensive test, tests are required after the missile enters a launching field to ensure reliable and safe launching of the missile, but test items are few and precise.
The early missile ground comprehensive testing system adopts manual testing or semi-automatic testing, and has the defects of large volume, poor portability, complex testing process, more required equipment, manual participation, low efficiency, long testing and launching control interval time, short distance between a person and a tested missile and potential safety hazard. With the progress of missile automatic testing technology, the traditional manual or semi-automatic testing is converted into concise automatic testing, which is imperative.
Disclosure of Invention
The invention aims to solve the technical problem of how to provide missile testing systems capable of improving fault diagnosis rate and maintenance efficiency.
In order to solve the technical problems, the missile testing systems are characterized by comprising a system box body, wherein a computer measurement and control unit placing grid, a rotary table control unit placing grid, a missile performance testing unit placing grid, a launching mechanism testing unit placing grid, a target simulation rotary table placing grid, a gas cylinder placing grid, a gas circuit accessory placing grid, a gas cylinder support placing grid, a matching connection cable placing grid and a rotary table accessory placing grid are arranged in the system box body, a computer measurement and control unit is located in the computer measurement and control unit placing grid, a rotary table control unit is located in the rotary table control unit placing grid, a missile performance testing unit is located in the missile performance testing unit placing grid, a launching mechanism testing unit is located in the launching mechanism testing unit placing grid, a target simulation rotary table is placed in the target simulation missile rotary table placing grid, a gas cylinder is placed in the gas circuit accessory placing grid, a gas cylinder support is located in the gas cylinder support placing grid, a matching connection cable is located in the matching connection placing grid, a rotary table accessory is located in the rotary table accessory placing grid, gas cylinder accessories is matched with a gas cylinder testing unit, and a launching mechanism testing unit is matched with a launching mechanism through a gas source testing unit.
Adopt the produced beneficial effect of above-mentioned technical scheme to lie in: the test system adopts a mode of program control of an upper computer and a lower computer, and reduces the dependence of the system on upper computer software and hardware resources of the data acquisition card. The system functions are divided, upper computer software is responsible for overall flow control, data processing and display, and lower computer programs are responsible for control in the unit; the mode is convenient for later-stage system expansion, main control work inside the new test unit is realized by an internal lower computer program, data transmission is completed through a communication interface and a data acquisition card in the turntable control unit, and the hardware dependence on a common unit (turntable control) is reduced. And in the later expansion process, the turntable control unit can meet the system requirement.
The inclination angle detection chip is mounted on the mounting plate of the launching mechanism, when the performance test of the inclination angle sensor in the launching mechanism is carried out, the inclination angle of the launching mechanism is detected in real time by the aid of the external inclination angle detection chip, and compared with the output data of the inclination angle sensor in the launching mechanism, the test purpose is achieved, and the test is convenient.
A control circuit board is placed in the new target simulation rotary table, and the rotary table control part is removed from a public unit (rotary table control unit), so that the internal structure of the rotary table control unit is simplified, the interference of a driving part to the internal part of the system is reduced, and the test stability is improved. The rotation speed adjustment, the light source adjustment and other control functions of the rotary table are realized in a communication mode, and the control of the rotary table is realized by an internal control circuit board and is not limited by other external hardware resources. Meanwhile, sound and optical signal on the missile are detected and designed on the control circuit board, and sound and optical signal states are sent in a communication mode, so that a product testing cable structure is simplified, and later-stage system expansion is facilitated.
The test system directly selects a stepping motor driving chip and a control chip, and realizes motor driving control under the control of a main control chip. The mode occupies small volume, is convenient to control, and can easily complete the driving of the two stepping motors.
The internal connection relation of each test unit is decomposed during design, so that the wiring harness can be manufactured independently for each connector connecting cable, and the structure of the box body is not depended on. The inconvenient welded connector adopts the mode of PCB board switching, converts the connector into the connector that facilitates the use, and each connector relation of connection is simple, has reduced the wiring degree of difficulty of denso personnel, has improved assembly efficiency.
Drawings
The invention is described in further detail with reference to the figures and the detailed description.
FIG. 1 is a schematic structural diagram of a test system according to an embodiment of the present invention;
FIG. 2 is a functional block diagram of a launch mechanism test system in an embodiment of the present invention;
FIG. 3 is a schematic block diagram of a missile performance testing system according to an embodiment of the invention;
fig. 4 is a schematic structural view of a turntable control unit in an embodiment of the present invention;
FIG. 5 is a functional block diagram of a turret control unit in an embodiment of the invention;
fig. 6 is a communication network diagram of a turntable control unit in an embodiment of the present invention;
FIG. 7 is a schematic diagram of internal power processing circuitry in an embodiment of the invention;
FIG. 8 is a schematic diagram of a turntable control unit master control circuit in an embodiment of the present invention;
fig. 9 is a flowchart of an internal program of the turntable control unit in the embodiment of the present invention;
FIG. 10 is a flow chart illustrating the internal power down detection interrupt of the turntable control unit in an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a missile performance testing unit in an embodiment of the invention;
FIG. 12 is an electrical schematic block diagram of a missile performance testing unit in an embodiment of the invention;
FIG. 13 is a schematic diagram of the internal power processing circuitry of the missile performance test unit in an embodiment of the invention;
FIG. 14 is a schematic diagram of a master control circuit of a missile performance test unit in an embodiment of the invention;
FIG. 15 is a schematic diagram of a conduction test in an embodiment of the present invention;
FIG. 16 is a schematic diagram of a conduction measurement of a missile performance test unit in an embodiment of the invention;
FIG. 17 is a schematic diagram of the acousto-optic control circuit of the missile performance test unit in the embodiment of the invention;
18a-18b are schematic diagrams of missile performance test unit signal processing circuitry in an embodiment of the present invention;
FIG. 19 is a schematic diagram of a missile performance test unit spin-up and power supply circuit in an embodiment of the invention;
FIG. 20 is a schematic diagram of a current detection circuit of a missile performance test unit in an embodiment of the invention;
FIGS. 21a-21b are schematic diagrams of a missile performance test unit self-test circuit in an embodiment of the invention;
FIG. 22 is a flowchart of the internal program of the missile performance testing unit in the embodiment of the invention;
FIG. 23 is a flowchart of an internal power-down detection interrupt routine of the missile performance test unit in an embodiment of the present invention;
FIG. 24 is a schematic view showing the entire structure of a test unit of the launching mechanism in the embodiment of the present invention;
FIG. 25 is an electrical schematic block diagram of a firing mechanism test unit in an embodiment of the present invention;
FIG. 26 is a schematic diagram of internal power processing circuitry in an embodiment of the invention;
FIG. 27 is a schematic diagram of a master control circuit of a test unit of the launching mechanism in an embodiment of the present invention;
FIG. 28 is a schematic diagram of a circuit for measuring conduction of a test unit of the launching mechanism in an embodiment of the present invention;
FIG. 29 is a schematic diagram of an insulation measurement circuit of a test unit of the launching mechanism in an embodiment of the invention;
FIG. 30 is a schematic diagram of a power supply and analog load circuit for the test unit of the launching mechanism in an embodiment of the present invention;
FIG. 31 is a schematic diagram of a current sensing circuit of a test unit of the launching mechanism in an embodiment of the invention;
FIGS. 32a-32b are schematic diagrams of signal processing circuitry of a test unit of the firing mechanism in an embodiment of the present invention;
33a-33b are schematic diagrams of a self-test circuit for a firing mechanism test unit in an embodiment of the present invention;
FIG. 34 is a flowchart of the internal process of the test unit of the launching mechanism in the embodiment of the present invention;
FIG. 35 is a flowchart of an internal power down detection interrupt routine of the launch mechanism test unit in an embodiment of the present invention;
fig. 36 is a schematic view of the entire structure of a target simulation turntable in the embodiment of the present invention;
fig. 37 is a diagram showing a mounting structure of a control circuit board inside a target simulation turn table in the embodiment of the present invention;
FIGS. 38a-38d are schematic diagrams of a target simulation turret control circuit board in an embodiment of the invention;
FIG. 39 is a schematic view of a rotary assembly in an embodiment of the present invention;
FIG. 40 is a schematic diagram of the collimator light path in an embodiment of the present invention;
FIG. 41 is a schematic view of the overall structure of an air supply device in an embodiment of the present invention;
FIG. 42 is a schematic view showing the structure of a gas cylinder holder in the embodiment of the present invention;
FIG. 43 is a block diagram of system software components in an embodiment of the invention;
wherein: 1. a system box body; 2. a computer measurement and control unit; 3. a turntable control unit; 4. a conductive elastic energy test unit; 5. a launching mechanism test unit; 6. a target simulation turntable; 7. a gas cylinder; 8. a gas cylinder support; 9. a turntable control unit box; 10. a missile performance test unit box body; 11. the launching mechanism tests the unit box; 12. a launching mechanism mounting plate; 13. and an upper cover plate.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only partial embodiments of the present invention, rather than complete embodiments.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and one skilled in the art may make similar reference without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As shown in FIG. 1, the embodiment of the invention discloses missile testing systems, which comprise a system box body 1, wherein a computer measurement and control unit placing grid, a rotary table control unit placing grid, a missile performance testing unit placing grid, a launching mechanism testing unit placing grid, a target simulation rotary table placing grid, a gas cylinder placing grid, a gas circuit accessory placing grid, a gas cylinder support placing grid, a matching connection cable placing grid and a rotary table accessory placing grid are arranged in the system box body, a computer measurement and control unit 2 is positioned in the computer measurement and control unit placing grid, a rotary table control unit 3 is positioned in the rotary table control unit placing grid, a missile performance testing unit 4 is positioned in the missile performance testing unit placing grid, a launching mechanism testing unit 5 is positioned in the launching mechanism testing unit placing grid, a target simulation rotary table 6 is positioned in the target simulation rotary table placing grid, a gas cylinder 7 is positioned in the gas cylinder placing grid, a gas circuit accessory is positioned in the gas circuit accessory placing grid, a gas cylinder support 8 is positioned in the gas cylinder support placing grid, a matching connection cable is positioned in the matching connection cable placing grid, an accessory is positioned in the target simulation rotary table placing grid, a missile performance testing unit placing grid is matched with the gas cylinder support placing grid, and a missile performance testing unit 5 is matched with the gas source testing unit 2 and the gas cylinder testing unit.
A notebook is used as a main body of the computer measurement and control unit, and the computer measurement and control unit 2 is used as an upper computer of the system to realize the functions of hardware function control, data acquisition, system maintenance and database management of each part in the system; the computer measurement and control unit is communicated with the turntable control unit or the transmitting mechanism test unit through a USB interface, so that data transmission is realized.
As shown in fig. 3, the schematic block diagram of the missile performance testing system is shown, in which the ac power input interface of the turntable control unit and the ac power input interface of the missile performance test are connected to an ac power socket through an ac power connection line, and the ac power input interface of the computer measurement and control unit is connected to the ac power socket through a power adapter; the direct current input interface of the turntable control unit and the direct current input interface of the missile performance testing unit are connected with the power input end of the direct current power supply module through a direct current power supply cable; the computer measurement and control unit is connected with the turntable control unit through a serial port, and the turntable control unit is bidirectionally connected with the target simulation turntable through a turntable control interface for data interaction; the rotary table control unit is connected with the missile performance testing unit in a bidirectional mode through a data acquisition interface to perform data interaction; the missile performance testing unit is connected with a data acquisition interface of a missile on the target simulation turntable; the gas cylinder is connected with the inflating adapter through a pipeline, and a gas source is provided for missile refrigeration through gas in the gas cylinder.
The missile performance testing system comprises the following testing processes:
1) and taking the computer measurement and control unit, the rotary table control unit, the missile performance test unit, the target simulation rotary table, the gas cylinder and related accessories out of the storage and transportation box, and correctly unfolding on an operation table.
2) And the turntable control unit and the missile performance testing unit are connected through a data acquisition cable.
3) And connecting the target simulation rotary table with a rotary table control interface of a rotary table control unit through a rotary table control cable.
4) And the turntable control unit is connected into a USB interface of the computer measurement and control unit through a USB data line.
5) The turntable control unit and the missile performance testing unit are connected into a mains supply through an alternating current power line, and can also be connected into a 24V direct current power supply (the output current is greater than 12A) through a direct current power supply cable.
6) And operating missile testing software on the computer measurement and control unit to complete the self-inspection of the missile testing unit and the rotary table unit.
7) After self-checking is completed, the missile is placed on a target simulation rotating platform according to requirements, a sound pick-up is placed at a missile buzzer, and a barrel light detection sensor is clamped into a light source on a sighting device.
8) The end of a cylinder test cable is inserted into a missile test unit product interface, and two connectors at the other end are respectively connected into a launch control interface and a test interface of a missile.
9) The gas cylinder is connected into the gas supply interface through the gas pipe and the gas charging head.
10) And on the test software, entering a conduction test interface, clicking a conduction test button to complete the static resistance conduction test of the missile, automatically storing data after the test is completed, giving a conclusion whether the conduction is qualified, failing to conduct the test, not entering an electrical property test interface, and entering the electrical property test interface after the conduction test is qualified.
11) Opening a gas cylinder valve , clicking a start button on an electrical performance test interface to start an electrical performance test, sequentially completing the electrical performance parameter tests according to a software flow, automatically storing data after the test is completed, and simultaneously giving a conclusion whether the electrical performance parameter is qualified.
12) After the test is complete, the cylinder valve is closed.
As shown in FIG. 4, the turntable control unit comprises a turntable control unit box 9, an aluminum structural frame is adopted in the box, five surfaces of the box are bent and welded by aluminum plates and then riveted with the aluminum structural frame, a sealing strip is installed on the sixth surface of the box by aluminum plates and then installed with the frame by screws, the number of the splicing surfaces of the box is reduced by adopting the box structure, the later sealing is facilitated, and the effects of moisture resistance and salt mist resistance are achieved.
As shown in fig. 5, the th ac input interface is embedded in the box body 9 of the turntable control unit, the th ac input interface is connected with the 1 th switch power input end through the 0 th power switch, the 2 th switch power output end is connected with inputs of the 3 th power processing circuit, the th dc power socket is embedded in the box body 9 of the turntable control unit, the th dc power socket is connected with the other inputs of the th power processing circuit, the th power processing circuit output end is divided into three paths, the th path is connected with the power connection terminal of the turntable control interface, the second path is connected with the power voltage detection interface of the th main control chip module, the third path is connected with the power input end of the CAN communication chip, the main control chip module is connected with the CAN communication chip in a bidirectional manner, the CAN communication chip is connected with the turntable control interface of the target simulation, the USB interface and the data acquisition interface are embedded in the box body of the turntable control chip module, the CAN communication chip is connected with the missile control interface through the USB interface conversion interface, the switch module is connected with the CNT data acquisition interface of the CNT acquisition module, and the switch interface of the switch connector, and the switch interface of the missile data acquisition module are connected with the CNT data acquisition interface conversion connector.
TABLE 1 turntable control unit external interface
Figure BDA0002246581180000081
Watch 2 turntable control unit matching external cable
Serial number Cable name Interface type Specification/model
1 AC power line Three-core 220V/10A 3m
2 DC power line Y11B-1207 TK-Red, Black copper nose 3m
3 USB line A type male head-B type male head 1.5m
4 Turntable control line Y11B-1208TK-Y11B-1208TK 15m
5 Data acquisition line J36A-52TK-J36A-52TK 1.5m
The alternating current power line and the USB line are manufactured by adopting standard goods shelf products, the direct current power line, the turntable control line, the data acquisition line AFK-250 and the AFKP-250 high-temperature conducting wire, the tail part of the cable is sleeved with a green nylon wire sleeve, the supporting cable of the turntable control unit is placed in the storage and transportation box along with the turntable control unit , and the total weight of the supporting cable is not more than 3 Kg.
Internal cable connection: in order to improve the reliability of the turntable control unit and reduce the wiring complexity of the electric fitting, the connection relation and the connection mode of the internal cable are optimized, and the assembly and debugging efficiency is improved. The SISI-68 core plug of the data acquisition card is switched into a socket of a J30J-37 core through a circuit board, and the node is connected into a data acquisition interface on the box body by adopting a lead wire carried by the J30J-37 core plug. 2.54 double-row pins led out by the data acquisition card DO and DI are switched into a socket with J30J-15 cores through a circuit board, and the nodes are connected into a data acquisition interface on the box body by adopting a lead wire carried by a J30J-15 core plug. After the sockets and the switches are installed on the box body and are made into independent wire bundles, the sockets and the switches are installed on the box body, the sockets and the switches are connected inside the box body through connectors, the condition that the sockets and the switches are directly connected with each other through wires is eliminated, and assembly is facilitated.
TABLE 3 internal patch cable
Serial number Cable name Interface type Remarks for note
1 AC power supply switching cable Three-core power socket-3-core connector AFK-250 0.75
2 Switch adapter cable Switch-3 core connector AFK-250 0.75
3 DC power supply switching cable Y11B-1207ZJ-4 core connector AFK-250 0.75
4 Turntable control switching cable Y11B-1208ZJ-7 core connector AFK-250 0.75
5 Switch power supply output cable U-shaped terminal-6-core connector AFK-250 0.75
6 Data acquisition switching cable J36A-52ZJ-J30J-37TJ With wire
7 USB data patch cord B-type female seat (with mounting hole) -B-type male head Male 90 degree right angle
8 Data acquisition card power supply cable 2-core connector-2-core connector AFK-250 0.3
The internal work flow is that a turntable control unit receives a control command of an upper computer (a computer measurement and control unit) through a data acquisition card, part of the command directly passes through an IO port of the data acquisition card to realize rear-end hardware operation, part of the command is forwarded to a target simulation turntable through a main control chip to realize communication with the target simulation turntable, and the data acquisition card returns a value acquired by an AD port to the upper computer to be processed.
As shown in FIG. 6, the internal communication loop is formed by the communication between the turntable control unit and the computer measurement and control unit through a USB interface, the communication between the turntable control unit and the target simulation turntable through a CAN interface, and the communication between the turntable control unit and the missile performance test unit through an IO port, a communication command of upper computer software is transmitted to a data acquisition card of the turntable control unit through a USB data line, groups of IO of the data acquisition card are communicated with a main control chip inside the turntable control unit through a simulation SPI interface, the main control chip is connected with the CAN communication interface inside the target simulation turntable through the CAN interface to realize the communication with the target simulation turntable, and groups of IO of the data acquisition card are communicated with the main control chip inside the missile performance test unit through the simulation SPI interface to complete the IO expansion inside the missile performance test unit and realize the control of an internal hardware circuit.
The principle of the internal power supply processing circuit is shown in fig. 7, the th power supply processing circuit includes a +24V power supply module, a +12V power supply module and a +5V power supply module, the +24V power supply module includes a relay K3, a coil of the relay K3 is connected with a +24V power supply output end of a th switching power supply, a normally closed contact of a single-pole double-throw switch of the K3 is connected with the +24V power supply output end of a dc power supply module, a normally open contact of the single-pole double-throw switch of the K3 is connected with a +24V power supply output end of a th switching power supply, a common contact of the single-pole double-throw switch of the K3 is divided into three paths, a th path is the +24V power supply output end, a second path is grounded through a capacitor C18, and a third path;
the +12V power supply module comprises a connector P, wherein a pin 1 and a pin 2 of the connector P are connected with a +24V power supply output end of a second switching power supply, a pin 3 and a pin 4 of the P are grounded, the pin 1 and the pin 2 of the P are divided into three paths, the third path is grounded through a capacitor C, the second path is grounded through a capacitor C, the third path is connected with a power supply input end of a 24V-to-12V power supply conversion chip U, the pin 1 of the U is grounded, the pin 3 of the U is connected with 0 normally open contact of a double-pole double-throw switch of a relay K, the pin 4 of the U is connected with the other 1 normally open contact of the double-pole double-throw switch of the relay K, the coil end of the K is connected with the +24V power supply output end of the second switching power supply, the other end of the K is grounded, the normally closed contact of the K double-pole double-throw switch is connected with the +12V power supply output end of the second switching power supply, the other contact of the K double-pole double-throw switch is grounded, the other normally closed contact of the K double-pole double-throw switch is grounded, the common terminal of the K double-pole double-throw switch is divided into four paths, the;
the +5V power supply module comprises a voltage conversion chip U4, a pin 1 of the U4 is divided into three paths, a pin 3 of the U4 is grounded through a capacitor C4, a pin two of the second path is grounded through a capacitor C4, a pin 1 of the U4 is grounded through a pin +12V power supply output end of the DC power supply module, a pin 3 of the U4 is connected with 4 normally closed contacts of a double-pole double-throw switch of the relay K4, another pin 4 of the double-pole double-throw switch of the relay K4 is grounded, a pin 1 of the U4 is grounded through a pin 24 of the U4 to be connected with an output end of a +24V power supply module of a switch power supply of the 4, a pin 3 of the U4 is connected with 4 normally open contacts of the double-pole double-throw switch of the relay K4, a pin 5 of the U4 is connected with another 4 normally open contacts of the double-pole double-throw switch of the relay K4, the U4 is connected with another 4 normally open contact of the common-pole double-throw switch of the relay K4, the power supply module is grounded through a capacitor C4, a capacitor C4R, a pin 4, a pin 3 of the third path is connected with a third path of the third path, a power supply output end of the third path of the capacitor C4, a common-pole double-.
When the turntable control unit is powered by the external +24V power supply, the power supply is converted into two groups of power supplies of +12V and +5V and three groups of power supplies for the internal circuit and the target simulation turntable after being processed by the internal circuit.
The power supply switching of an internal power supply and an external power supply is realized by adopting three relays, the relays all adopt 24V relays, and a relay coil is connected with an external power supply loop. The power supplied by the internal power supply is sent to the back-end circuit for processing through normally closed contacts of relays K1, K2 and K3; when the external power supply supplies power, the normally open contact of the relay is closed, and the external power supply is connected to the back-end circuit for processing. When an external direct current power supply supplies power, in order to improve the adaptability of the power supply, a 24V input DC-DC module is adopted to realize power supply conversion, and the DC-DC module has voltage input in a wide range of 19-36V and can better adapt to the change of the external power supply.
As shown in fig. 8, the peripheral circuit of the main control chip includes an AT90CAN32 type main control chip U7, pin 30 of U7 is connected to pin 1 of TD501MCANFD type CAN bus chip U8 through resistor R18, pin 31 of the main control chip U7 is connected to pin 2 of U8 through resistor R17, pin 3 of U8 is grounded, pin 4 of U8 is connected to +5V power supply, pin 5 of U8 is suspended, pin 6 and pin 7 of U8 are bus connection terminals, pin 48 of the main control chip U7 is divided into two paths, pin is grounded through resistor R12, the second path is connected to the base of triode Q1 through resistor R11, the emitter of Q1 is grounded, the collector of Q1 is connected to the ground terminal of buzzer LS1, and the power supply input terminal of the buzzer 1 is connected to power supply with power supply of + LS 12V.
The main control chip is powered by a +5V power supply, IO10, IO11 and II3 of the data acquisition card are respectively connected with PB2, PB1 and PB3 ports of the main control chip, and the three ports realize data transmission of the data acquisition card and the main control chip through an analog SPI communication mode. The main control chip is connected with the CAN interface module through CAN control interfaces PD5 and PD6 to realize CAN communication with the target simulation turntable. The EPPROM of the main control chip utilizes 30 bytes to store the control unit of the rotary table, and accumulates the running time, the self-checking qualified times, the self-checking unqualified times, the testing times and the last three testing times.
A data acquisition card: the data acquisition card is a core component of the system, is responsible for system hardware control and data acquisition functions, and needs to have more resources to meet the requirements of the system hardware and software.
The data acquisition card is connected with the computer measurement and control unit through a USB interface. The data acquisition card, AD is 16 bits, the total sampling rate is 500KS/s, 32 high-density channels and 4MS (sampling point) hardware FIFO meet the requirements of real-time acquisition and transmission; 1 channel counter/pulse generator (timer) to generate digital pulse waveform and realize rich counting function; 16-channel low-speed 16-bit DA can be used in occasions requiring various control voltages; the data acquisition card also supports 12-way DI and 12-way DO.
The power supply is externally arranged to reduce the output power consumption of the USB interface of the computer measurement and control unit, the software supports VC, VB and Labview, the Windows operating system is supported, and the resources can meet the requirements of software and hardware.
32 AD channels, 2 DA channels, 10 DO channels, 3 DI channels and 1 pulse generator of the data acquisition card are led out through the data acquisition interface, and the extension requirements of various portable air defense missile test units can be met.
The switching power supply adopts a switching power supply and filtering mode to provide power for an internal control circuit of the turntable control unit and a target simulation turntable, the input voltage of the switching power supply is 220V alternating current, two-way output is adopted, -way 24V voltage output is used for the target simulation turntable, the output current is not less than 4A, and -way 12V voltage output is used for the internal control circuit, and the current is not less than 2A.
The switch power supply adopts a CEA series power supply with built-in surge suppression and filter circuits produced by Beijing force-bearing power supply company Limited, the output voltage is 12&24V, the output current is 3.33&4.58A, and the total output power is 150W. The power supply has the characteristics of wide voltage input range, wide input frequency noise filter, quick dynamic response, input surge suppression circuit, convenient terminal appearance mode, conformity with UL1950 and IEC950 safety regulations and the like. The output voltage stabilization precision is +/-1%, the voltage regulation rate is +/-0.2%, the load regulation rate is +/-0.5%, and the temperature change rate is +/-0.02%/DEG C. The power supply has two specifications of industrial grade and military grade, and MTBF is greater than 500000 hrs. The industrial grade working temperature range is-25 ℃ to +85 ℃, and the storage temperature range is-45 ℃ to +105 ℃. The military-grade working temperature range is-40 ℃ to +85 ℃, and the storage temperature range is-55 ℃ to +105 ℃. According to the requirement of the environmental adaptability of the system, the requirement can be met by selecting an industrial power supply, and the upgrading requirement can be met by purchasing an military power supply when the environmental adaptability needs to be improved in the later stage.
A DC-DC module: in order to facilitate field use, a 24V direct-current power supply input interface is additionally arranged on the turntable control unit, power conversion is carried out inside the turntable control unit through two DC-DC modules, a +12V power supply and a +5V power supply are provided, and an external direct-current power supply can be used for supplying power under the condition that an alternating-current power supply cannot be normally provided. The power module has a wide voltage input range of 18-36V, a pi-type filter is arranged in an input end, the voltage output precision is +/-1%, the full-load output power is 10W, the conversion efficiency is greater than 80%, and the metal shell is adopted for heat dissipation, so that the use requirement can be met. The DC-DC module has a working temperature range of-40 ℃ to +85 ℃ and a storage temperature range of-40 ℃ to +125 ℃, has good shielding anti-interference performance and electromagnetic compatibility, and can meet the environmental adaptability requirement provided by the system. The MTBF of the DC-DC module is 200000h, and the reliability requirement of the system can be met.
And temperature acquisition, namely utilizing a temperature sensor with LM75 being height IIC interfaces to directly convert the temperature into a digital signal within the temperature range of-55 ℃ to +125 ℃ and realize the precision of 0.125 ℃, wherein the main control chip directly reads the data in an internal register through an IIC bus and can operate 4 data registers through the IIC to set different working modes.
The timing clock adopts DS1302 as a real-time clock chip of a turntable control unit, the DS1302 is real-time clock circuits with high performance, low power consumption and RAM (random access memory) which are released by DALLAS company of America, can time the year, month, day, week, hour, minute and second, has a leap year compensation function, has the working voltage of 2.5V-5.5V, adopts a three-wire interface to synchronously communicate with a CPU, and can transmit a clock signal or RAM data of a plurality of bytes times in a burst mode.
The controller adopts an AT90CAN32 singlechip as a main controller, the singlechip is a low-power-consumption 8-bit CMOS microcontroller based on an enhanced AVR RISC structure, and the AT90CAN32 is characterized in that a 32K-byte system programmable Flash, a 1K-byte missile PROM, a 2K-byte SRAM, 53 universal I/O port lines, 32 universal working registers, three-output comparison or 16-bit PWM output, a programmable serial USART, a two-wire serial interface facing bytes, a 10-bit 8-path ADC, a programmable watch dog timer with an in-chip oscillator, SPI serial ports, the working voltage is 2.7-5.5V, the working temperature range is-40 ℃ to +85 ℃, and CAN controllers CAN meet the use requirements.
Connector assembly: the direct-current power supply interface and the rotary table control interface adopt Y11 series circular electric connectors, the electric connectors conform to GJB101A-1997 standard, and the electric connectors are suitable for electric signal connection of strategic weapon systems, space satellite systems, aviation and navigation transportation tools, communication and detection systems and the like. The inner bayonet type locking circular electric connector has the advantages of quick connection and quick separation, small volume, light weight and the like. The contact is the welding formula, and the casing has sealed, dustproof and rain-proof performance. The installation mode adopts flange type installation. Connect the connector logarithm 2 ~ 61 cores, can satisfy actual demand.
The environmental conditions for use of the Y11 series circular electrical connector were as follows, operating temperature: -55 ℃ to 125 ℃; relative humidity: the relative humidity is 90-95% at 40 ℃; rain-proof: the rainfall is 5 mm/min; mechanical life: the inserting and pulling times are more than or equal to 500; the rated current of a 1mm diameter contact pin is 5A; the rated current of a 1.5mm diameter contact pin is 10A; the insulation resistance is not lower than 20 MOmega under the moist and rain condition; the environmental conditions of the product can meet the use requirements.
The external data acquisition interface adopts a J36A-52ZJ rectangular electric connector, the series of electric connectors execute Q/HD20038-2007 detailed specifications, belong to instrument type electric connectors, have the advantages of small volume, high density, complete specifications, double-insurance locking structures, high reliability and the like, the termination form adopts a welding type structure, and is widely applied to the connection of electric signals inside an equipment instrument cabin in the industries of aerospace, aviation, weaponry, ships, communication, computers and the like.
The use environment conditions of the J36A series rectangular electric connector are as follows: -55 ℃ to 125 ℃; relative humidity: the relative humidity is 90-95% at 40 ℃; mechanical life: plugging and unplugging are more than or equal to 500 times; the rated current of the contact pin is 5A; the insulation resistance is not lower than 50M omega under the humid condition; the withstand voltage is not lower than 500V under the humid condition; the environmental condition of the product can meet the use requirement.
The internal switching and signal transmission adopt a J30J series dimensional rectangular electric connector, the connector conforms to GJB2446 standard, and an aluminum alloy shell and various aluminum alloy tail clamps are adopted; by adopting the twisted wire type contact pin, the number of contact points of a single contact element reaches 7, and the contact reliability of the product is improved.
The using environmental conditions and the working temperature of the J30J series micro-rectangular electric connector are as follows: -55 ℃ to 125 ℃; relative humidity: the relative humidity is 90-95% at 40 ℃; mechanical life: plugging and unplugging are more than or equal to 500 times; the rated current of the contact pin is 3A; the contact resistance is not more than 10m omega; the insulation resistance is not lower than 5000M omega; the medium withstand voltage is 800V; the environmental condition of the product can meet the use requirement.
The internal software design is that the program in the main control chip is compiled by C language, and is developed by AVR Studio integrated development environment, the development environment comprises compiler, debugging function, serial and parallel download function, JTAG ICE simulation and other functions, and series basic functions of compilation language, software simulation, chip program download, chip hardware simulation and the like, and the internal software design can be used together with any model high-level language compiler to complete the development and debugging of high-level language products and can run under Win7 system.
And after the power-on initialization is finished, the main control chip reads the last running time storage data of the internal missile PROM and performs accumulated storage.
And a singlechip in the turntable control unit executes a temperature and voltage self-checking program, and carries out alarm prompt if the self-checking is abnormal. The self-checking is normal, and after a normal prompt tone is sent, the command of the upper computer is waited.
And the main control program waits for the command of the upper computer software and executes the corresponding control program according to the command.
The flow of the internal program of the turret control unit is shown in fig. 9. The external interrupt of the main chip is connected with a power failure detection circuit, when the external power failure occurs and the external interrupt is triggered, an interrupt program is entered, and a continuous operation time reading and storing program is executed to finish data storage. The program flow is shown in fig. 10.
The missile performance testing unit is internally provided with a switching power supply, a DC-DC conversion circuit, a control circuit board, a lifting module and the like, is connected with the missile performance testing unit through a barrel testing cable, provides an excitation signal for work, and simultaneously inputs a feedback signal into an internal signal processing circuit; the signal processing circuit is connected with the turntable control unit through a data acquisition cable, receives the control of the turntable control unit, and transmits the signal processed by the signal processing circuit into the turntable control unit for analog-digital conversion to complete the control and data acquisition functions of the cylinder.
The missile performance test unit has an overall structure as shown in fig. 11, an internal rotation starting module is installed on a main control circuit board to realize rotation starting control of the barrel, and a circuit on the main control circuit board completes functions of power supply, control, signal processing, communication and the like of the barrel. The control and signal output port on the circuit board is led out to the data acquisition interface through the connector. Ports on the cartridge are switched to the circuit board receptacles by connectors. The cabinet is painted with GY06 color, and the side of the equipment is printed with marks such as name, development and production unit, etc.
The missile performance testing unit comprises a missile performance testing unit box body 10, as shown in fig. 12, a second alternating current input interface is internally embedded on the missile performance testing unit box body 10 and is connected with power input ends of DC-DC conversion circuits through a second power switch, channels of the output end of the DC-DC conversion circuit are connected with the input end of a second power processing circuit, the second channels of the output end of the DC-DC conversion circuit are connected with the power input end of a start-up module, a second direct current power socket is embedded on the missile performance testing unit box body 10 and is connected with the other input ends of the DC-DC conversion circuit, the output end of the second power processing circuit is divided into a plurality of channels and provides working power for units needing power supply in the missile performance testing unit through the second power processing circuit, a second main control chip module is respectively connected with a conduction measuring circuit, a signal self-detection circuit, a signal processing circuit and a data acquisition processing circuit, the missile performance testing unit is connected with a missile performance testing unit box body through a bidirectional data acquisition control interface, the bidirectional data acquisition control circuit is connected with a data acquisition control circuit, and a bidirectional data acquisition control interface selection circuit, and a bidirectional data acquisition control circuit are connected with the missile performance testing unit box body 10 through a bidirectional data acquisition control interface, and a bidirectional test control circuit, and a bidirectional data acquisition circuit, the bidirectional data acquisition control interface selection circuit, and a bidirectional test control circuit, the missile acquisition control circuit is connected with the missile.
TABLE 5 missile Performance test Unit interface
Figure BDA0002246581180000161
Table 6 missile performance test unit matched external cable
Serial number Cable name Interface type Specification/model
1 AC power line Three-core 220V/10A 3m
2 DC power line Y11B-1207 TK-Red, Black copper nose 3m
3 Cylinder test cable Y11B-2041TK-YQ49-30TJ 15m
The alternating current power line adopts a standard goods shelf product, the direct current power line and the cylinder test cable adopt AFK-250 and AFKP-250 high-temperature wires for cable manufacturing, the tail part of the cable is sleeved with a green nylon wire sleeve, the missile performance test unit matched cable is placed in a storage and transportation box along with the test unit , and the total weight of the matched cable is not more than 3 Kg.
And internal cable connection, namely, in order to improve the reliability of the missile performance testing unit, reduce the wiring complexity of an electric device, optimize the connection relation and the connection mode of the internal cable and improve the assembly and debugging efficiency, a 52-core connector of a data acquisition port is divided into two plugs, 15-core plugs are connected onto a circuit board assembly to provide an IO control interface, 37-core plugs are connected onto the circuit board assembly to acquire analog quantity, signals of a product interface are divided into two plugs, 25-core plugs mainly lead out conducting nodes, -core plugs mainly lead out electrical performance nodes, the two plugs are respectively connected onto sockets corresponding to the circuit board assembly, all the sockets and switches mounted on the box body are manufactured after independent cables are manufactured, the sockets and the switches are mounted on the box body, the internal cables are connected through connectors, and the condition that all the sockets and the switches are directly connected through wires is eliminated, so that the assembly is convenient.
TABLE 7 internal patch cable
Figure BDA0002246581180000171
The main control chip in the missile performance testing unit receives a serial communication command of the turntable control unit through the data acquisition interface, the command is converted into a relay control signal, the circuit board is combined under the action of the control signal, the internal power supply provides voltage required by the upper part and the inside of the testing unit, the power supply, the gyroscope and other actions are controlled and completed, and the signal processing circuit sequentially completes the functions of starting current, stable current detection and signal detection.
A self-checking signal source generating circuit and a self-checking switching circuit are designed on the circuit assembly, and self-checking signals can be sequentially sent into each signal channel according to a program under the indirect control of upper computer software, so that internal self-checking work is completed. The connection condition of the current product cable can be detected during self-checking, and when the cable connection is detected, the display frame is put forward to prompt an operator to ensure that the tested object is not connected.
The master control chip is connected with a clock chip, the clock chip is automatically timed after being powered on, the master control chip stores the last test time and accumulates and stores the test time when the machine is started every time, and meanwhile, the EPPROM storage device in the master control chip accumulates and self-tests and tests, so that the device reliability can be conveniently counted and analyzed in the later period.
The principle of the internal power supply processing circuit is shown in fig. 13, the second power supply processing circuit comprises a +5V direct-current power supply module, a +12V direct-current power supply module and a +3.3V direct-current power supply module, wherein the +5V direct-current power supply module comprises a VRB24S05 type direct-current voltage conversion chip U1, 2 feet of the U1 are divided into three paths, a path is connected with a +24V direct-current power supply output end of a second switching power supply, a second path is grounded through a capacitor C6, a third path is grounded through a capacitor C4, 3 feet of the chip U1 are connected with normally open contacts of a double-pole double-throw switch in a relay K1, 5 feet of the chip U1 are connected with another normally open contacts of a double-pole double-throw switch in a relay K1, normally closed contacts of the double-pole double-throw switch in the relay K1 are connected with the internal +5V power supply, normally closed contacts of the double-pole double-throw switch in the relay K1 are grounded, a third path of the common-pole double-throw switch, a third path of the relay K865V switch is connected with the internal +5V power supply output end of an internal +5V power supply module, a third path of a third switch, a third path of the relay K2 is connected with a third path of;
the +12V direct-current power supply module comprises a VRB24S12 type direct-current voltage conversion chip U2, wherein a pin 1 of the U2 is grounded, a pin 2 of the U2 is connected with a +24V direct-current power supply, a pin 3 of the U2 is divided into three paths, the path is the output end of the +12V direct-current power supply, the second path is grounded through a capacitor C8, and the third path is grounded through a capacitor C7;
the +3.3V direct-current power supply module comprises a 24S05-6W type direct-current voltage conversion chip U5, wherein a pin 1 of the U5 is grounded, a pin 2 of the U5 is connected with a +24V direct-current power supply, a pin 5 of the U5 is grounded, a pin 3 of the U5 is divided into four paths, a path is a +5V power supply output end, a path is grounded through a capacitor C23, a path third is connected with a capacitor C21, a path fourth is connected with a pin 3 of an AMS1117-3.3V type power supply chip U6, a pin 1 of the U6 is grounded, a pin 2 of the U6 is divided into a path , a path is grounded through a capacitor C24, a path C22 is grounded through a capacitor C22, and a path third is a 3.3V power supply.
The missile performance testing unit can be powered by an external alternating current power supply or a 24V direct current power supply, an internal direct current power supply processing part consists of two parts, and a power supply selection circuit comprises: the power supply switching of an internal power supply and an external power supply is realized by adopting three relays, the relays all adopt 24V relays, and a relay coil is connected with an external power supply loop. When the test unit supplies power by using an external 24V power supply, the power supply selection relay is closed, the 24V power supply is sent into the DC-DC module and converted into a +20V, -20V and +5V power supply circuit meeting the requirements, and the power supply is supplied for the test unit. The DC-DC module has voltage input in a wide range of 19-36V and can be well adapted to the change of an external power supply. When the test unit uses the internal switch power supply to supply power, the power supply selection relay does not act, and the +20V, the-20V and the +5V power supplies output by the switch power supply power for the test unit. The power supply conversion circuit: the +24V input voltage or the +20V input voltage is used for converting +/-12V, +5V and +3.3V voltage required by the circuit board combination through the DC-DC module for the circuit board combination.
The peripheral circuit of the main control chip is shown in fig. 14, the second main control chip module includes an AT90CAN32 type main control chip U21, ports PB1 and PB2 of the U21 are connected with a DO port of the data acquisition card through a data acquisition cable, ports PB3 are connected with a DI port of the data acquisition card, data transmission is achieved with upper computer software through an analog SPI communication format, four MC1413 type relay driving chips are connected with IO ports of the main control chip U21 through HC245 buffers respectively, control over relays is achieved, and the main control chip U21 achieves initialization configuration and clock reading of a clock chip through ports PF4, PF5 and PF 6.
The PB1 and PB2 ports of the main control chip are connected with a DO port of the data acquisition card through a data acquisition cable, the PB3 is connected with a DI port of the data acquisition card, and data transmission is achieved through an analog SPI communication format and upper computer software. The relay driving chip MC1413 is connected with the IO port of the main control chip through the buffer 74HC245, so as to control the relay. The master control chip realizes the initialization configuration and clock reading of the clock chip through PF4, PF5 and PF6 ports. The EPPROM of the main control chip stores the accumulated running time, the self-checking qualified times, the self-checking unqualified times, the testing times and the last three testing times of the missile performance testing unit by using 30 bytes. The description of the data stored in the EPPROM is shown in table 8.
TABLE 8 missile PROM memory data in missile performance test unit
Figure BDA0002246581180000191
Figure BDA0002246581180000201
The conduction measurement circuit: the conduction measuring circuit mainly adopts the measurement principle of Fluke45 to realize 11 conduction resistance tests.
Fluke45 conduction measurement principle: the Fluke45 resistance circuit schematic is shown in fig. 15.
The resistance measurement adopts a ratio resistance technology, voltage sources are connected with a reference resistor (A1Z1) and a resistor to be measured in series, and because the current passing through all the resistors is the same, the resistance value of the resistor to be measured depends on the ratio of the voltage drop on the reference resistor and the resistor to be measured.
In the analog measurement process, different voltage sources and reference resistances are switched according to different measuring ranges, and the specific relationship table is shown in table 9:
TABLE 9 Fluke conduction measurement Range
Sequence of steps Measuring range Voltage source A1Z1 reference resistor
1 100Ω/300Ω 3V 1KΩ
2 1000Ω/3KΩ 1.3V 10.01
3 10KΩ/30KΩ 1.3V 100.5
4 100KΩ/300KΩ 1.3V 1MΩ
5 1000KΩ/3MΩ/10MΩ 1.3V 10MΩ
6 30MΩ 3V 10MΩ
7 100MΩ/30MΩ 3V 10MΩ
According to the conduction test technical requirements and test results, a conduction test range is divided into 3 grades, the th grade is 100 omega/300 omega grade, the second grade is 10K omega/30K omega, the third grade is 100K omega/300K omega, and 11 conduction project tests can be realized, voltage generated by a DA channel of a data acquisition card is used as a voltage source of the conduction test, corresponding reference resistors are switched by a route selection relay, a tested loop is connected in series into a measurement loop through the route switching relay, analog quantity voltages are read at a voltage source end and the high end of the tested loop, and a ratio method is used for calculation, so that the resistance value of the tested loop can be obtained, and the specific circuit is shown in FIG. 16.
The measurement process control relationship is shown in table 10:
TABLE 10 missile Performance test Unit internal conduction measurement control
Figure BDA0002246581180000211
As shown in fig. 16, the conduction test circuit includes a reference voltage module, a standard resistor selection module, and a channel switching relay module, a DA output voltage of the data acquisition card is connected to an input terminal DA0 of the reference voltage module, the DA0 is divided into four paths, a path is grounded via a capacitor C15, a second path is grounded via a capacitor C14, a third path is grounded via a backward diode D3, a fourth path is connected to a non-inverting input terminal of a TL072 type low noise amplifier U4A via a resistor R1, an inverting input terminal of the U4A is connected to an output terminal of the U4A, a power input terminal of the U4A is divided into three paths, a path is connected to a +5V power supply, a second path is grounded via a capacitor C5, and a third path is grounded via a capacitor C3;
the input end of the standard resistor selection module is divided into three paths, the th path is divided into two paths after passing through a standard resistor R6, the th path is connected with normally open contacts of a double-pole double-throw switch in a relay K14, the second path is connected with the other normally open contacts of the double-pole double-throw switch in a relay K14, two normally closed contacts of the double-pole double-throw switch in the relay K14 are suspended, public contacts of the double-pole double-throw switch in the relay K14 are connected with the other public contacts, the end of a coil of the relay K14 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K14 is connected with driving output ends of the MC1413 type relay driving chip;
the second path of the input end of the standard resistor selection module is divided into two paths after passing through a standard resistor R14, the path is connected with normally open contacts of a double-pole double-throw switch in a relay K18, the second path is connected with the other normally open contacts of the double-pole double-throw switch in the relay K18, two normally closed contacts of the double-pole double-throw switch in the relay K18 are suspended, common contacts of the double-pole double-throw switch in the relay K18 are connected with the other common contacts, end of a coil of the relay K18 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K18 is connected with driving output ends of the MC1413 type relay driving chip;
the third path of the input end of the standard resistor selection module is divided into two paths after passing through a standard resistor R26, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K22, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in the relay K22, two normally closed branch contacts of the double-pole double-throw switch in the relay K22 are suspended, common contacts of the double-pole double-throw switch in the relay K22 are connected with the other common contacts, end of a coil of the relay K22 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K22 is connected with driving output ends of the MC1413 type relay driving chip;
the channel switching relay module comprises an infrared information module, a th reference module, an ultraviolet information module, a steering control module, a second reference module, a missile in-place information module, a +5V power module, a +20V power module, an angular position sensor module, a rotation signal module and a-20V power module, wherein the infrared information module comprises a relay K4, two normally closed branch contacts of a double-pole double-throw switch in the relay K4 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K4 are connected with a signal output end of an infrared information processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K4 are grounded, common contacts of the double-pole double-throw switch in the relay K4 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K4 are grounded, a +12V end of a coil in the relay K4 is connected with an MC 36 driving relay driving chip of the other end of the power supply in the K4;
the reference module comprises a relay K5, two normally closed branch contacts of a double-pole double-throw switch in the relay K5 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K5 are connected with a signal output end of a reference voltage circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K5 are grounded, common contacts of the double-pole double-throw switch in the relay K5 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K5 are grounded, of a coil in the relay K5 is connected with a +12V power supply, and the other end of the coil in the relay K5 is connected with driving output ends of the MC1413 type relay driving chip;
the ultraviolet information module comprises a relay K11, two normally closed branch contacts of a double-pole double-throw switch in the relay K11 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K11 are connected with a signal output end of an ultraviolet information processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K11 are grounded, common contacts of the double-pole double-throw switch in the relay K11 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K11 are grounded, a end of a coil in the relay K11 is connected with a +12V power supply, and the other end of the coil in the relay K11 is connected with driving output ends of the MC1413 type relay driving chip;
the second reference module comprises a relay K12, two normally closed branch contacts of a double-pole double-throw switch in the relay K12 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K12 are connected with a signal output end of a second reference voltage circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K12 are grounded, common contacts of the double-pole double-throw switch in the relay K12 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K12 are grounded, ends of a coil in the relay K12 are connected with a +12V power supply, and the other ends of the coil in the relay K12 are connected with driving output ends of the MC1413 type relay driving chip;
the second steering control module comprises a relay K6, two normally closed branch contacts of a double-pole double-throw switch in the relay K6 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K6 are connected with a signal output end of a second steering control signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K6 are grounded, common contacts of the double-pole double-throw switch in the relay K6 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K6 are grounded, end of a coil in the relay K6 is connected with a +12V power supply, and the other end of the coil in the relay K6 is connected with driving output ends of the MC1413 type relay driving chip;
the missile on-site module comprises a relay K15, two normally closed branch contacts of a double-pole double-throw switch in the relay K15 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K15 are connected with a signal output end of a missile on-site signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K15 are grounded, common contacts of the double-pole double-throw switch in the relay K15 are connected with an input end of the standard resistor selection module, common contacts of the double-pole double-throw switch in the relay K15 are grounded, end of a coil in the relay K15 is connected with a +12V power supply, and the other end of the coil in the relay K15 is connected with driving output ends of the MC1413 type relay driving chip;
the +5V power supply module comprises a relay K16, two normally closed branch contacts of a double-pole double-throw switch in the relay K16 are suspended, normally open branch contacts of a double-pole double-throw switch in the relay K16 are connected with the output end of the +5V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K16 are grounded, common contacts of the double-pole double-throw switch in the relay K16 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K16 are grounded, end of a coil in the relay K16 is connected with the +12V power supply, and the other end of the coil in the relay K16 is connected with driving output ends of the MC1413 type relay driving chip;
the +20V power supply module comprises a relay K17, two normally closed branch contacts of a double-pole double-throw switch in the relay K17 are suspended, normally open branch contacts of a double-pole double-throw switch in the relay K17 are connected with the output end of the +20V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K17 are grounded, common contacts of the double-pole double-throw switch in the relay K17 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K17 are grounded, ends of coils in the relay K17 are connected with the +12V power supply, and the other ends of the coils in the relay K17 are connected with driving output ends of the MC1413 type relay driving chip;
the angular position sensor module comprises a relay K19, two normally closed branch contacts of a double-pole double-throw switch in the relay K19 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K19 are connected with a signal output end of an angular position signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K19 are grounded, common contacts of the double-pole double-throw switch in the relay K19 are connected with an input end of the standard resistor selection module, common contacts of the double-pole double-throw switch in the relay K19 are grounded, end of a coil in the relay K19 is connected with a +12V power supply, and the other end of the coil in the relay K19 is connected with driving output ends of an MC1413 type relay driving chip;
the start-up signal module comprises a relay K20, two normally closed branch contacts of a double-pole double-throw switch in the relay K20 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K20 are connected with a signal output end of a start-up signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K20 are grounded, common contacts of the double-pole double-throw switch in the relay K20 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K20 are grounded, end of a coil in the relay K20 is connected with a +12V power supply, and the other end of the coil in the relay K20 is connected with driving output ends of the MC1413 type relay driving chip;
the-20V power supply module comprises a relay K21, two normally closed branch contacts of a double-pole double-throw switch in the relay K21 are suspended, normally open branch contacts of a double-pole double-throw switch in the relay K21 are connected with the output end of the-20V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K21 are grounded, common contacts of the double-pole double-throw switch in the relay K21 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K21 are grounded, end of a coil in the relay K21 is connected with the +12V power supply, and the other end of the coil in the relay K21 is connected with driving output ends of the MC1413 type relay driving chip.
The DA output voltage of the data acquisition card is transmitted to the AD26 for confirmation, the accuracy and the stability of the output voltage are ensured, and the resistance value of the tested loop can be obtained through conversion of the AD26 and the AD27 according to a formula. The conduction measurement circuit independently occupies 14 IO ports of the main control chip, 1 DA channel and 2 AD channels of the data acquisition card.
And (3) sound and light control: in the master control combination, the sound and light control of the cylinder is realized by using a relay, as shown in fig. 17, after the relay is closed, the 14 th point (sound signal) of the emission control interface is connected into a +20V power supply, and a buzzer sounds; and (4) connecting a 15 th point (optical signal) of the emission control interface into GND, and lighting an optical signal indicator lamp.
The signal processing circuit mainly comprises an operational amplifier and a peripheral circuit, and mainly completes the upper 12 paths of signal processing according to the requirements of test items, namely infrared information signals, infrared program control signals, ultraviolet information signals, ultraviolet program control signals, reference , reference II, head raising instructions, guide signals,
Figure BDA0002246581180000261
Angle signal, tracking signal, rudder control signal 2, angular rate feedback, etc.
As shown in fig. 18a-18b, the signal processing circuit includes a guiding signal processing module, a head-up command information processing module, an infrared information processing module, an ultraviolet information processing module, an infrared program control information processing module, an ultraviolet program control information processing module, a tracking signal processing module, an angle signal processing module, a th reference signal processing module, a second reference signal processing module, an angular rate feedback signal processing module, and a steering signal processing module, wherein an input terminal of the signal processing module is connected with a corresponding output terminal of the main control chip through the conduction test circuit, or an input terminal of the signal processing module is connected with a signal output terminal of a corresponding signal acquisition module, a signal input terminal of the guiding signal processing module is divided into two paths, a third path is connected with a non-inverting input terminal of a low noise operational amplifier through a resistor R25, a second path is grounded through a resistor R28, an inverting input terminal of the low noise operational amplifier is connected with a signal output terminal of the low noise operational amplifier, a power output terminal of the low noise operational amplifier is divided into three paths, a third path is connected with a +12V power supply, a second path is grounded through a capacitor C5, a third path is connected with a signal processing circuit through a capacitor C32, a third path is connected with a signal processing circuit, a third path is divided into a third path, a signal processing circuit is divided into a third path is divided into a similar to a signal processing circuit, a third path is divided into.
The run-up and power supply circuit comprises an upper power supply control circuit and a run-up module, the upper power supply is controlled by a general-military-grade relay, the run-up module adopts a run-up circuit board produced by limited responsibility company of Shanghai Linke electronic technology and entrusted by 804 to realize the run-up control of the missile, and the run-up process is ensured to be caused by a detection vehicle matched with the run-up and power supply circuit, and the schematic diagram is shown in fig. 19.
And the missile +20V, -20V and +5V power supply control is realized through K2, K9 and K3 in the starting circuit. Start module port definitions are shown in Table 11:
TABLE 11 missile Performance test Unit spin-Up Module Specification
Pin number Reference numerals Description of the function Remarks for note
1 +20V Providing positive power to a cranking circuit
2 GND Ground wire
3 -20V Providing negative power supply for a cranking circuit
4 Q1 Cranking output 1
5 Q2 Cranking output 2
6 Uout2 Test signal output
7 Uin2 Test signal input
8 Uout1 Cranking frequency output
9 Uin1 Angular position sensor input
10 QC Spin-up cut-off signal
11 +12V Internal control circuit power supply
12 QZKZ Cranking cut control
The current detection circuit adopts a current sensor of the Honeywell to realize the current detection of the upper +20V, 20V and +5V power supply loops, and the detection current range is 0-6A. And the output end is sent to an AD channel of the data acquisition card for analog-to-digital conversion after being processed by the operational amplifier. The specific circuit is shown in fig. 20.
As shown in fig. 20, the current detection circuit includes a +20V current detection circuit, a-20V current detection circuit, and a +5V current detection circuit, the current detection circuit employs a current sensor to achieve current detection of +20V, and +5V power supply loops, an output terminal of the current detection circuit is processed by an operational amplifier and then sent to an AD channel of a data acquisition card for analog-to-digital conversion, the +20V current detection circuit includes a CSNE151-100 type current acquisition chip U9, a pin 1 of the U9 is a +20V current sampling input terminal, a pin 9 of the U9 is divided into three paths, a third is connected to a-12V power supply, a second path is grounded via a capacitor C45, a third path is grounded via a capacitor C47, a pin 10 of the U9 is divided into three paths, a third path is connected to a +12V power supply, a third path is grounded via a capacitor C40, a third path is grounded via a capacitor C41, a pin 11 of the U41 is divided into three paths, a third path is grounded via a resistor R41, a second path is grounded, a third path is connected to a non-phase resistor R41, a third path is connected to a non-phase resistor C41, a non-C41, a third path is connected to a non-C41, a non-phase resistor C41, a non-C41 is connected to a non-C41, a non-C41 is connected to a non-C41, a non.
A communication module: the communication module is internally connected with the main control chip and is controlled by the main control chip, the external communication interface is connected with the upper CAN interface, the upper data is analyzed under the program control of the main control chip, and the target capture state CAN be judged through data analysis. The master control chip completes serial port communication with the data acquisition card through the simulation SPI interface, and finally data are forwarded to the upper computer for display.
The self-checking circuit is characterized in that two pins in a product cable plug are in short circuit, when the plug is inserted into a product socket, an AD28 pin of a data acquisition card can detect constant voltage, whether the cable is connected or not is judged in the mode, a confirmation prompt is given during self-checking, whether the combination performance of an internal power supply and a circuit board of a unit is normal or not is judged by the self-checking circuit, and whether the connection relation of internal leads is normal or not is detected by the self-checking circuit to ensure that the equipment state is intact before the missile performance test is carried out, the internal self-checking mainly comprises six parts of power supply self-checking, current detection circuit self-checking, starting module self-checking, conducting measurement circuit self-checking, signal processing circuit self-checking and communication module self-checking, each path of power supply voltage is divided into a range of-10V to +10V through a resistor, the voltage is sent to an AD port of the data acquisition card to carry out analog-to-digital conversion, when the current detection circuit and the starting module carry out self-checking, a power supply circuit is closed, a K10 and a K20 is closed to connect an analog load into a power supply and starting circuit, an OC1 pulse output port of a master control chip, an analog output waveform 1A, a waveform output circuit is output in a.
When the conduction measuring circuit is subjected to self-checking, the relays K23, K24, K25 and K26 are closed, loops of each test item are in short circuit, the short circuit state of each loop is measured through the closed range selection relay and the closed channel selection relay, and the working state of the conduction testing circuit is judged. When the signal processing circuit performs self-checking, the relays K25 and K26 are closed, the OC2A of the main control chip generates a square wave of 100HZ, after processing, a bipolar waveform with the amplitude of +/-8V and the frequency of 100HZ is generated and sent to each signal processing circuit, and a corresponding AD input channel for data acquisition can detect a waveform meeting requirements. The communication module can complete self-checking whether internal initialization configuration is completed or not through the main control chip. A self-test circuit schematic is shown in fig. 21a-21 b.
As shown in fig. 21a-21b, the self-checking circuit includes a switch switching circuit and a self-checking signal processing circuit, the self-checking signal processing circuit includes a resistor R82, the terminal of the resistor R82 is the signal input terminal of the self-checking signal processing circuit, the signal input terminal is connected to the OC2A pin of the main control chip, the other terminal of the resistor R82 is connected to the non-inverting input terminal of the TL072 type operational amplifier U25A, the inverting input terminal of the U25A is connected to two paths, the third A circuit is connected to ground through the resistor R A, the second path is connected to the +12V power supply through the resistor R A, the power input terminal of the U25A is connected to the non-inverting input terminal of the TL072 type operational amplifier U25, the third path is connected to ground through the capacitor C A, the third path is connected to the-12V power supply, the second path is connected to ground through the capacitor C106, the third path is connected to ground through the capacitor C36105, the output terminal of the U25 is connected to the non-inverting input terminal of the switch A, the non-inverting input terminal of the resistor R072 type operational amplifier U A, the non-inverting input terminal of the resistor R A is connected to the non-inverting input terminal of the second path A, the non-inverting input terminal of the resistor R A, the non-inverting input terminal of the resistor R A;
the input end of the th switch switching circuit is divided into six paths, and is respectively connected with six normally-open contacts of a th pole double-throw switch in a relay K25, six normally-closed contacts of a th pole double-throw switch in the relay K25 are respectively connected with a signal output end of a data acquisition card, six common contacts of a th pole double-throw switch in the relay K25 are respectively connected with the input end of a corresponding signal processing module, of a coil in the relay K25 is connected with a +12V power supply, and the other end of the coil in the relay K25 is connected with driving output ends of the MC1413 type relay driving chip;
the input end of the second switch switching circuit is divided into six paths, and the six paths are respectively connected with six normally open contacts of a second six-pole double-throw switch in a relay K26, six normally closed contacts of the second six-pole double-throw switch in the relay K26 are respectively connected with a signal output end of a data acquisition card, six common contacts of the second six-pole double-throw switch in the relay K26 are respectively connected with the input end of a corresponding signal processing module, of a coil in the relay K26 is connected with a +12V power supply, and the other end of the coil in the relay K26 is connected with driving output ends of an MC1413 type relay driving chip.
Switching power supply: in order to reduce the size and weight of the power supply, a switching power supply and filtering mode is adopted to provide power for the internal control circuit of the turntable control unit and the target simulation turntable. The input voltage of the switching power supply is 220V alternating current, three power supplies of +20V, 20V and 5V are output and used by the missile performance testing unit, and meanwhile, the power supply is provided for the missile. The output voltage of the switching power supply is +/-20V & +5V, and the +/-20V output current is not less than 6A; the +5V output current is not less than 2A. The power supply has the characteristics of wide voltage input range, wide input frequency noise filter, quick dynamic response, input surge suppression circuit, convenient terminal appearance mode, conformity with UL1950 and IEC950 safety regulations and the like. The output voltage stabilization precision is +/-1%, the voltage regulation rate is +/-0.2%, the load regulation rate is +/-1%, and the temperature change rate is +/-0.02%/DEG C.
The power supply has two specifications of industrial grade and military grade, and MTBF is greater than 500000 hrs. The industrial grade working temperature range is-25 ℃ to +85 ℃, and the storage temperature range is-45 ℃ to +105 ℃. The military-grade working temperature range is-40 ℃ to +85 ℃, and the storage temperature range is-55 ℃ to +105 ℃.
A DC-DC module: the power module has a wide voltage input range of 18-36V, the voltage output precision is +/-1%, the output current is greater than 6A, the conversion efficiency is greater than 85%, and the metal shell is adopted for heat dissipation, so that the use requirement can be met. The DC-DC module has a working temperature range of-40 ℃ to +85 ℃ and a storage temperature range of-40 ℃ to +125 ℃, has good shielding anti-interference performance and electromagnetic compatibility, and can meet the environmental adaptability requirement provided by the system. The MTBF of the DC-DC module is 200000h, and the reliability requirement of the system can be met.
The timing clock and turntable control unit uses DS1302 as the timing chip.
The main controller is like the turntable control unit , and an AT90CAN32 singlechip is used as the main controller, so that the use requirement CAN be met.
The connector adopts the type of the connector and the serial of the turntable control unit, adopts a power supply interface of a direct current power supply, adopts a Y11 series circular electric connector, adopts a J36A-52ZJ rectangular electric connector for an external data acquisition interface, and adopts a J30J series dimensional rectangular electric connector for internal switching and signal transmission.
A current sensor: the CSNE151-100 is used as a current detection sensor which is a multi-range and small-volume current sensor and can measure direct current, alternating current or pulsating current based on the magnetic compensation principle. The primary side circuit and the secondary side circuit are electrically insulated. The power supply with 12V is adopted, the linearity is better than 0.2 percent, the input range of 6A is selected, the output current of the full range of the secondary side is 24mA, the working temperature range is minus 40 ℃ to plus 85 ℃, and the use requirement can be met.
The operational amplifier is characterized in that the circuit combination adopts TL074 and TL072 operational amplifiers to process signals, the series of operational amplifiers are input operational amplifiers which are provided with high-voltage bipolar transistors in a monolithic integrated circuit and have the characteristics of high slew rate, low input bias and offset current and low offset voltage temperature coefficient, the TL07X series has the characteristics of low harmonic distortion, low noise and the like, so that the operational amplifier is very suitable for high fidelity and audio preamplifier application, and the operational amplifier can bear the temperature ranging from-40 ℃ to +85 ℃ by selecting an SOP packaging form.
A relay: the circuit combination totally adopts four series of relays. The large-current power supply at the input end adopts an ohm dragon G5 LE-124V high-power relay, the rated contact current of the relay is 10A, the coil voltage is 24V, the coil power is about 400mW, the contact resistance of the contact is less than 100m omega, and the working temperature range is-40 ℃ to +85 ℃. The power supply and the starting and stopping control adopt Guizhou space electric appliances, common military grade JZC-078M/012-01 relays, the product has 1/2 crystal cover with 5A (2 conversion) load capacity and dual in-line relays, the external dimension, the installation mode and the leading-out end type of the product accord with the regulations of the national military standard and the foreign military relay series, and the product can be used for signal transmission and line switching in the industries of aviation, aerospace and the like. The relay contact is 2Z, a 12V power supply is adopted for supplying power, the contact resistance is less than 50m omega, the action time is less than 6ms, the power consumption of a coil is not more than 1.2W, the service life is2 ten thousand times, the working temperature range is-65 ℃ to +85 ℃, the relative humidity reaches 95% at 40 ℃, and the use requirement can be met.
In order to realize multi-loop self-checking and reduce the number of relays, a JRC-105M ultra-small sealed electromagnetic relay is adopted in a circuit combination, the product is an 1/2 crystal cover series electromagnetic relay with 6 groups of conversion contacts, the external dimension, the installation mode and the leading-out terminal type of the product accord with the regulations of national military standards and foreign military relay series, and the product can be used for signal transmission and line switching in the industries of aviation, aerospace and the like. The relay contact is 6Z in form, a 12V power supply is adopted for supplying power, the contact resistance is less than 50m omega, the action time is less than 5ms, the power consumption of a coil is not more than 1.8W, the service life is 1 ten thousand times, the working temperature range is minus 55 ℃ to plus 85 ℃, the relative humidity reaches 95% at 40 ℃, and the use requirement can be met.
In order to realize the selection of a conduction channel, a G6A type micro relay of an ohm dragon is adopted to realize the channel switching, the relay has strong electromagnetic interference resistance and can realize high-density packaging; the impact voltage resistance is 1500 V.FCC specification mark, and high voltage resistance is realized; the gold clad double contact, and low contact vibration, can exert high contact reliability. The coil voltage is 12V, the coil rated current is 15mA, the maximum value of the contact current is 2A, the mechanical life is more than 1 hundred million times, and the use environment temperature is-40 ℃ to +70 ℃.
Designing internal software: the program in the main control chip is written by adopting C language and developed by using AVR Studio integrated development environment. The internal program flow of the missile performance testing unit is shown in figure 22.
And after the power-on initialization is finished, the main control chip reads the last running time storage data of the internal missile PROM and performs accumulated storage. And the master control program waits for the command of the upper computer software and executes the corresponding control program according to the command. The external interrupt of the main chip is connected with a power failure detection circuit, when the external power failure triggers the external interrupt, an interrupt program is entered, continuous operation time reading and storing programs are executed, data storage is completed, and an interrupt flow chart is shown in fig. 23.
As shown in fig. 2, the launching mechanism test system comprises a computer measurement and control unit 2 and a launching mechanism test unit 5, the computer measurement and control unit 2 is connected with an alternating current power supply through a power adapter, the launching mechanism test unit is connected with the alternating current power supply through an alternating current power supply connecting wire, the launching mechanism test unit 5 is connected with a direct current power supply unit through a direct current power supply connecting wire, and the launching mechanism test unit 5 is used for receiving control commands transmitted by the computer measurement and control unit, so that the missile launching mechanism performance test is completed.
The working flow of the launching mechanism testing system is as follows:
1) and taking the computer measurement and control unit and the launching mechanism test unit out of the storage box, and correctly unfolding on an operation table.
2) The test unit of the transmitting mechanism is connected into a mains supply through an alternating current power line, and can also be connected into a 24V direct current power supply (the output current is more than 5A) through a direct current power supply cable.
3) And operating the test software of the launching mechanism on the computer measurement and control unit to complete the self-check of the launching mechanism test unit.
4) And after the self-checking is finished, installing the launching mechanism on the launching mechanism test unit as required.
5) And clicking a start button, starting testing according to the flow, and completing corresponding actions by an operator in a matching way according to software prompts in the testing process.
6) And after the test is finished, storing the test result and giving a conclusion whether the test result is qualified.
Launching mechanism test unit:
and the launching mechanism testing unit is used for completing the performance test of the missile launching mechanism. Because the launching mechanism test unit and the missile performance test unit are relatively independent, the data acquisition card is independently arranged in the launching mechanism test unit and is directly connected with the computer measurement and control unit.
The overall structure of the launching mechanism test unit is shown in fig. 24, the overall structure of the case and the turntable control unit is the same, the overall size of the missile performance test unit is 330 x 225 x 110mm (without a handle), the weight is no more than 8 Kg., the launching mechanism mounting plate is directly placed on the upper cover plate of the case and can be directly used for mounting the launching mechanism, the mounting plate is provided with an inclination angle sensor, the launching mechanism mounting plate is fixed on the upper cover plate through a locking device, in the test process, the locking device is released, the launching mechanism can be inclined, the performance of the inclination angle sensor in the launching mechanism can be tested, the test unit is internally provided with a power supply, a data acquisition card, a main control circuit board, an insulating test circuit board and other functional circuits for realizing conduction and electrical performance test, the case is sprayed with the color of GY06, and the side of the device is printed with marks such as.
, the testing unit of the launching mechanism comprises a box body 11 of the testing unit of the launching mechanism, a mounting plate 12 of the launching mechanism is fixed on an upper cover plate 13 through a locking device and is used for mounting the tested launching mechanism, the upper cover plate 13 can rotate up and down, an inclination angle sensor is arranged on the mounting plate, the launching mechanism can be inclined by releasing the locking device in the testing process and is used for testing the performance of the inclination angle sensor inside the launching mechanism;
as shown in fig. 25, a third ac input interface is embedded in the box of the launch mechanism test unit, the third ac input interface is connected to the power input terminal of a third switching power supply through a third power switch, the output terminal of the third switching power supply is connected to power input terminals of a second DC-DC conversion circuit, channels of the output terminal of the second DC-DC conversion circuit are connected to the input terminal of a third power processing circuit, a second channel of the output terminal of the second DC-DC conversion circuit is connected to the power input terminal of a data acquisition card, a third DC power socket is embedded in the box of the launch mechanism test unit, the third DC power socket is connected to another input terminals of the second DC-DC conversion circuit, the output terminal of the third power processing circuit is divided into a plurality of channels, the third power processing circuit provides operating power for other units requiring power supply in the launch mechanism test unit, the third main control chip module is connected to the launch mechanism test unit through a second conduction electrical connection line, the second power socket is connected to a second control signal acquisition module, the second test unit is connected to a second launch mechanism test unit through a second communication connection interface, the launch mechanism test unit is connected to a second bidirectional communication interface, the launch mechanism test unit is connected to a second control unit, the launch mechanism test unit is connected to the launch mechanism, the launch mechanism test unit, the second control unit, the launch mechanism test unit is connected to the launch mechanism, the second control unit is connected to the test unit, the second control unit, the test unit is connected to the second control unit, the launch mechanism, the second control unit is connected to the second control unit, the test unit is connected to the test unit, the test unit.
External interface of meter 12 launching mechanism test unit
Sequence of steps Interface Interface function Connecting object Remarks for note
1 AC power supply 220V power input interface 220V alternating current power supply
2 Direct current power supply DC power supply input interface +24V DC power supply Y11B-1207ZJ
3 Launch and control interface Connecting and launching mechanism Launching mechanism YQ49-30ZK
4 USB interface Go through with upper computer software Computer measurement and control unit B type female seat
Matching with an external cable:
external interface of meter 13 launching mechanism test unit
Serial number Cable name Interface type Specification/model
1 AC power line Three-core 220V/10A 3m
2 DC power line Y11B-1207 TK-Red, Black copper nose 3m
3 USB line A type male head-B type male head 1.5m
The alternating current power line and the USB line are made of standard shelf products, the direct current power line is made of AFK-250 high-temperature wires, the tail of the cable is sleeved with a green nylon wire sleeve, the matched cable of the emission mechanism test unit is placed in the storage and transportation box along with the test unit , and the total weight of the matched cable is not more than 1 Kg.
Internal cable connection: in order to improve the reliability of the test unit of the launching mechanism and reduce the wiring complexity of the electric fitting, the connection relation and the connection mode of the internal cable are optimized, and the assembly and debugging efficiency is improved. DI and DO leading-out ports of the data acquisition card are converted into 21-core sockets through the circuit board, and the 21-core sockets are connected to the 21-core sockets of the circuit board assembly through 21-core plugs to provide IO control interfaces. The 68-core acquisition interface of the data acquisition card is switched into a 37-core socket through the circuit board and is connected to the 37-core socket on the circuit board assembly through a plug to acquire analog quantity. The insulation test circuit board is connected with the circuit board combination through an independent wire harness, and control signals and high-voltage signals are transmitted. The power supply wiring harness of the internal DC-DC circuit is independently manufactured and connected to the circuit board combination. After the sockets and the switches are installed on the box body and are made into independent wire bundles, the sockets and the switches are installed on the box body, the sockets and the switches are connected inside the box body through connectors, the condition that the sockets and the switches are directly connected with each other through wires is eliminated, and assembly is facilitated.
Watch 14 internal patch cable
Serial number Cable name Interface type Remarks for note
1 AC power supply switching cable Three-core power socket-3-core connector AFK-250 0.75
2 Switch adapter cable Switch-3 core connector AFK-250 0.75
3 DC power supply switching cable Y11B-1207ZJ-6 core connector AFK-250 0.75
4 Control interface switching cable J30J-37TJ-YQ49-30 TJ-tilt angle sensor AFK-250 0.75
5 Switch power supplyOutgoing cable U-shaped terminal-8-core connector AFK-250 0.75
6 Insulated circuit board signal wire J30J-15TJ-J30J-15TJ With wire
7 Data acquisition card IO cable J30J-21TJ-J30J-21TJ
8 Data acquisition card AD cable J30J-37TJ-J30J-37TJ
9 Insulated voltage transmission line 3-core connector-3-core connector
10 Circuit board combined power supply cable 1 J30J-15TJ-8 core connector With wire
11 USB data patch cord B type female seat (with an)hole-installing-B type male head Male 90 degree right angle
12 Data acquisition card power supply cable 2-core connector-2-core connector AFK-250 0.3
Internal work flow: the transmitting mechanism testing unit receives a control command of the upper computer through the data acquisition card, carries out serial communication with the main control chip through an IO port of the data acquisition card, forwards the command to the main control chip, and the main control chip converts the command into a corresponding action signal or a CAN communication command. The circuit board combination is under the effect of control signal, and the required voltage in launching mechanism and the test unit is provided by internal power supply, and control launching mechanism accomplishes the test of activator, simulation run-up function, run-up electric current, steady speed electric current, signal detection, Can communication function and manual and automatic transmission flow test, and main control chip passes through CAN communication module and receives the data that transmitter inside CAN interface sent to forward to the host computer and handle.
A self-checking signal source generating circuit and a self-checking switching circuit are designed on the circuit assembly, and self-checking signals can be sequentially sent into each signal channel according to programs under the control of upper computer software, so that internal self-checking work is completed.
The master control chip is connected with a clock chip, the clock chip is automatically timed after being powered on, the master control chip stores the last test time and accumulates and stores the test time when the machine is started every time, and meanwhile, the EPPROM storage device in the master control chip accumulates and self-tests and tests, so that the device reliability can be conveniently counted and analyzed in the later period.
The principle of the internal power supply processing circuit is shown in fig. 26, the third power supply processing circuit comprises a +5V and +3.3V power supply conversion circuit and a +12V power supply conversion circuit, the +5V and +3.3V power supply conversion circuit comprises a VRB24S05-6W type power supply conversion chip U2, a2 pin of the U2 is connected with a +24V power supply, a1 pin of the U2 is grounded, a 3 pin of the U2 is connected with 2 normally open contacts of a double-pole double-throw switch in a relay K2, a 5 pin of the U2 is connected with the other 2 normally open contacts of the double-pole double-throw switch in the relay K2, a2 normally closed contact of the double-pole double-throw switch in the relay K2 is connected with an internal +5V power supply, another 2 contacts of the double-pole double-throw switch in the relay K2 are grounded, a2 common contact of the double-pole double-throw switch in the relay K2 is connected with the ground, a2 common contact of the relay K2, a common switch is connected with a fourth switch via a p-pole double-throw switch, a p switch in the relay K2C switch, a third switch is connected with a p 2C 3C, a third switch is connected with a third switch, a third;
the +12V power conversion circuit comprises a VRB24S12-10W power conversion chip U3, wherein a pin 1 of U3 is grounded, a pin 2 of U3 is connected with a +24V power supply, a pin 5 of U3 is grounded, a pin 3 of U3 is divided into three paths, a path is a +12V power output end, the second path is grounded through a capacitor C10, and the third path is grounded through a capacitor C9.
The launching mechanism testing unit can be powered by an external alternating current power supply or a 24V direct current power supply, and the internal direct current power supply processing part consists of two parts.
A power supply selection circuit: the power supply switching of an internal power supply and an external power supply is realized by adopting three relays, the relays all adopt 24V relays, and a relay coil is connected with an external power supply loop. When the test unit supplies power by using an external 24V power supply, the power supply selection relay is closed, the 24V power supply is sent into the DC-DC module and converted into a +20V, -20V and +5V power supply circuit meeting the requirements, and the power supply is supplied for the test unit. The DC-DC module has voltage input in a wide range of 19-36V and can be well adapted to the change of an external power supply. When the test unit uses the internal switch power supply to supply power, the power supply selection relay does not act, and the +20V, the-20V and the +5V power supplies output by the switch power supply power for the test unit.
The power supply conversion circuit: the +24V input voltage or the +20V input voltage is used for converting +/-12V, +5V and +3.3V voltage required by the circuit board combination through the DC-DC module for the circuit board combination.
The main control circuit comprises a main control chip, a data acquisition card, a main control chip peripheral circuit, a third main control chip module and a host computer drive chip, wherein the main control chip receives a communication command sent by a data acquisition card IO and converts a serial port command into a relay control signal, the main control chip completes generation of a self-checking waveform and reading of a clock signal, the main control chip peripheral circuit is shown in fig. 27, the third main control chip module comprises an AT90CAN32 type main control chip U21, a PB5 port and a PB6 port of U21 are connected with a DO port of the data acquisition card through a data acquisition cable, a PB7 port of U21 is connected with a DI port of the data acquisition card and realizes data transmission with host computer software through an analog SPI 8293 communication format, the four MC1413 type relay drive chips are respectively connected with the IO port of the main control chip through 74HC 829245 type buffers to realize control of a relay, and the.
The PB5 and PB6 ports of the main control chip are connected with a DO port of the data acquisition card through a data acquisition cable, the PB7 is connected with a DI port of the data acquisition card, and data transmission is achieved through an analog SPI communication format and upper computer software. The relay driving chip MC1413 is connected with the IO port of the main control chip through the buffer 74HC245, so as to control the relay. The master control chip realizes the initialization configuration and clock reading of the clock chip through the ports PA0, PA1 and PA 2. The EPPROM of the main control chip stores the cumulative running time, the self-checking qualified times, the self-checking unqualified times, the testing times and the final three testing times of the testing unit of the launching mechanism by using 30 bytes.
A communication module: the communication module is internally connected with the main control chip and is controlled by the main control chip, the external communication interface is connected with the CAN interface of the transmitting mechanism, the data of the transmitting mechanism is analyzed under the program control of the main control chip, and the transmitting state of the transmitting mechanism CAN be judged through data analysis. The master control chip completes serial port communication with the data acquisition card through the simulation SPI interface, and finally data are forwarded to the upper computer for displaying.
The method comprises the steps of conducting a measuring circuit, conducting the measuring circuit by adopting the same conduction principle in a missile performance testing unit, testing according to the conduction testing technical requirement and the testing result of a launching mechanism, dividing the conduction testing range into 4 grades, wherein the th grade is 100 omega/300 omega grade, the second grade is 10K omega/30K omega, the third grade is 100K omega/300K omega, and the fourth grade is 1000K omega/3M omega/10M omega, so that 15 conduction item tests of the missile launching mechanism can be realized.
As shown in fig. 28, the second conduction test circuit includes a reference voltage module, a standard resistor selection module, and a plurality of channel switching relay modules, a DA output voltage of the data acquisition card is connected to an input terminal DA0 of the reference voltage module, the DA0 is divided into four paths, a path is grounded via a capacitor C13, a second path is grounded via a capacitor C12, a third path is grounded via a backward diode D3, a fourth path is grounded via a resistor R4 and a non-inverting input terminal of a TL072 type low noise amplifier U4A, an inverting input terminal of the U4A is connected to an output terminal of the U4A, a power input terminal of the U4A is divided into three paths, a path is connected to a +5V power supply, a second path is grounded via a capacitor C7, and a third path is grounded via a capacitor C5, a grounded terminal of the U4A is grounded, an output terminal of the U4A is divided into two paths, a path is grounded via a capacitor C11, and a second path is connected to an input terminal of the;
the input end of the standard resistor selection module is divided into five paths, the th path is divided into two paths after passing through a standard resistor R10, the th path is connected with normally-open contacts of a double-pole double-throw switch in a relay K15, the second path is connected with the other normally-open contacts of the double-pole double-throw switch in the relay K15, two normally-closed contacts of the double-pole double-throw switch in the relay K15 are suspended, public contacts of the double-pole double-throw switch in the relay K15 are connected with the other public contacts, the end of a coil of the relay K15 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K15 is connected with driving output ends of an MC1413 type relay driving chip;
the second path is divided into two paths after passing through a standard resistor R23, the path is connected with normally open contacts of a double-pole double-throw switch in a relay K20, the second path is connected with the other normally open contacts of the double-pole double-throw switch in the relay K20, the two normally closed contacts of the double-pole double-throw switch in the relay K20 are suspended, common contacts of the double-pole double-throw switch in the relay K20 are connected with the other common contacts, end of a coil of the relay K20 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K20 is connected with driving output ends of the MC1413 type relay driving chip;
the third path is divided into two paths after passing through a standard resistor R33, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K24, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in the relay K24, two normally closed branch contacts of the double-pole double-throw switch in the relay K24 are suspended, common contacts of the double-pole double-throw switch in the relay K24 are connected with the other common contacts, end of a coil of the relay K24 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K24 is connected with driving output ends of the MC1413 type relay driving chip;
the fourth path is divided into two paths after passing through a standard resistor R34, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K25, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in the relay K25, the two normally closed branch contacts of the double-pole double-throw switch in the relay K25 are suspended, common contacts of the double-pole double-throw switch in the relay K25 are connected with the other common contacts, end of a coil of the relay K25 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K25 is connected with driving output ends of the MC1413 type relay driving chip;
the fifth path is connected with normally closed contacts of a double-pole double-throw switch in a relay K16, the other normally closed contacts of the double-pole double-throw switch in K16 are grounded, normally open branch contacts of the double-pole double-throw switch in K16 are connected with a live wire L, the other normally open branch contacts of the double-pole double-throw switch in K16 are connected with a neutral wire N, ends of a coil in K16 are connected with a +12V power supply, the other ends of the coil in the relay K16 are connected with driving output ends of an MC1413 type relay driving chip, two common contacts of the double-pole double-throw switch in the relay K16 are respectively connected with two common contacts of relays of a plurality of channel switching relay modules, the two normally closed branch contacts of the relays of the channel switching relay modules are suspended, the normally open branch contacts of the relays of the channel switching relay modules are connected with signal input ends of a signal processing circuit, and the other normally open branch contacts of the relays of the channel switching relay modules are grounded.
Meter 16 firing mechanism test unit continuity measurement control
The DA output voltage is sent to the AD24 for confirmation, the accuracy and the stability of the output voltage are ensured, and the resistance value of the tested loop can be obtained through conversion of the results of AD24 and AD25 according to a formula. The conduction measurement circuit independently occupies 21 IO ports of the main control chip, 1 DA channel and 2 AD channels of the data acquisition card.
Insulation test circuit: the insulation test circuit adopts an isolated structural design, the voltage is tested by using a 100V high-voltage power module product, a high-precision AD conversion chip is adopted inside the insulation test circuit for voltage acquisition, and the insulation resistance is calculated by using a ratio method, wherein the specific circuit is shown in FIG. 29.
As shown in fig. 29, the insulation test circuit includes a power conversion module and an analog-to-digital conversion module, the power conversion module includes a VRB1212YMD-6WR dc power conversion chip U, pin 1 of the U is grounded, pin 2 of the U is connected to +20V power, pin 3 of the U is divided into four paths, wherein the output terminal of the +12V power is connected to two common contacts of a double-pole double-throw switch in a relay K, the second path is grounded via a capacitor C, the third path is grounded via a capacitor C, the fourth path is connected to the +12V power input terminal of an AD7609 type digital conversion chip U, pin 5 of the U is grounded, two normally closed contacts of the double-pole double-throw switch in the relay K are suspended, two normally closed contacts of the double-pole double-throw switch in the relay K are connected to the positive electrode of a diode D, the terminal of a coil in the relay K is connected to +20V power, the other terminal of the coil is connected to driving output terminals of an MC 3 type relay driving chip, the negative electrode of the diode D is normally open, the second path is grounded via a capacitor C, the third path is connected to the ground via a variable resistor R1413, the pin 400, the variable resistor R-ground, the pin of the RW-ground terminal of the RW-3R 6, and the variable resistor R-ground;
the device comprises a U4, a relay K3, a relay K3, two normally closed branch contacts of a double-pole double-throw switch, a relay K3, another common contacts of the double-pole double-throw switch in a relay K3, another common contacts of the double-pole double-throw switch in the relay K3, a normally open branch contacts of the double-pole double-throw switch in the relay K3, another 843 normally open branch contacts of a coil in the relay K3, another common contacts of the double-pole double-throw switch in the relay K1413, a 4 common contact in a third relay K4, two normally closed branch contacts of the double-pole double-throw switch in the relay K4, another 4 common contacts of the double-pole double-throw switch in the relay K4, another 14172 common contacts of the double-pole double-throw switch in the relay K4, another 4 normally closed branch contacts of the double-pole double-throw switch in the relay K4, a 4 normally closed branch contact of the relay K4, a 4 and another 4, a 4 normally open branch contact of the relay K4, wherein the normally closed branch contacts of the relay K4 are connected with another 4 and a 4, and a 4;
the input end of the range switching module is connected with two common contacts of a double-pole double-throw switch in a relay K2, normally closed branch contacts of the double-pole double-throw switch in the relay K2 are divided into four paths, a path is connected with another normally closed branch contacts of the double-pole double-throw switch in the relay K2, a second path is grounded through a resistor R16, a third path is grounded through a capacitor C23, a fourth path is connected with an end of a resistor R15, normally open branch contacts of the double-pole double-throw switch in the relay K2 are divided into three paths, a path is connected with another normally open branch contact of the double-pole double-throw switch in the relay K , a second path is grounded through a resistor R , a third path is grounded through a capacitor C , the other end of the resistor R is divided into three paths, the path is connected with a +12V power supply through a diode D , the second path is grounded through a diode D , a third path is connected with a non-phase operational amplifier U072 type operational amplifier U72, the inverting input end of the resistor U is connected with an output end of the inverter , and the inverting circuit , the inverting circuit is connected with an output end of the inverting circuit of the inverter;
the analog-to-digital conversion module comprises an AD7609 type analog-to-digital conversion chip U3, wherein a pin 1 of the U3 IS connected with a +5V power supply, a pin 2 of the U3 IS grounded, a pin 3 of the U3 IS connected with a +5V power supply through a resistor R6, a pin 4 of the U3 IS connected with a +5V power supply through a resistor R5, a pin 5 of the U3 IS grounded, a pin 6 of the U3 IS connected with a +5V power supply through a resistor R4, a pin 7 of the U3 IS connected with a +5V power supply through a resistor R3, a pin 8 of the U3 IS connected with a pin 2 of an IS281-4GB type optical coupling module U7, pins 9 and 10 of the U3 are connected with a pin 4 of an IS281-4GB type optical coupling module U7, a pin 11 of the U3 IS connected with a pin 6 of an IS281-4GB optical coupling module U7, and a pin 12 of the U3 IS connected with a pin 281-4GB optical coupling; the 13 feet of the U3 are connected with the 2 feet of the IS281-4GB type optical coupling module U9, the 14 feet of the U3 are connected with the 4 feet of the IS281-4GB type optical coupling module U9, the 15 feet of the U3 are connected with the 6 feet of the IS281-4GB type optical coupling module U9, and the 24 feet of the U3 are connected with the 8 feet of the IS281-4GB type optical coupling module U9.
Relay K1 realizes high-voltage module power supply control, and relay K2 realizes the range switching. The relays K3 and K4 realize self-checking of an insulation test circuit, and the optocouplers U7 and U9 realize data port isolation. The insulation circuit mainly realizes the insulation resistance test between the 17 th ground plus or minus 20V ground and the ground plus or minus 5V ground in the conduction table.
Power supply circuit and analog load circuit: the power supply circuit and the analog load circuit comprise a transmitting mechanism power supply control circuit and an analog load circuit, the power supply is controlled by adopting a common military relay, and a high-power resistor is used as an analog load and is connected into a swing loop. The specific circuit is shown in fig. 30.
The transmitting mechanism testing unit further comprises a current detection circuit, the current detection circuit adopts a current sensor of the HONEYWELL to realize current detection of the +20V and-20V power supply loops, and the detection current range is 0-6A. And the output end is subjected to operational amplifier processing and then is sent to an AD channel of a data acquisition card for analog-to-digital conversion. The specific circuit is shown in fig. 31.
As shown in fig. 31, the current detection circuit includes a +20V current detection circuit and a-20V current detection circuit, the current detection circuit employs a current sensor to achieve current detection of +20V and-20V power supply loops, an output terminal of the current detection circuit is processed by an operational amplifier and then sent to an AD channel of a data acquisition card to perform analog-to-digital conversion, the +20V current detection circuit includes a CSNE151-100 type current acquisition chip U9, a pin 1 of the U9 is a +20V current sampling input terminal, a pin 9 of the U9 is divided into three, a pin is connected to a-12V power supply, a second path is connected to ground via a capacitor C6353, a third path is connected to ground via a capacitor C47, a pin 10 of the U9 is divided into three paths, a pin is connected to a +12V power supply, a second path is connected to ground via a capacitor C40, a third path is connected to ground via a capacitor C41, a pin 11 of the U41 is divided into three paths, a third path is connected to ground via a resistor R41, a second path is connected to ground via a capacitor C41, a pin 41 is connected to a pin 366 of a non-C366 is connected to ground, and a pin 41 is connected to a pin 366C 41, and a pin 41 is connected to a pin 41, and a pin 41 is connected to a pin 366 is connected to a pin 41, and.
A signal processing circuit: the signal processing circuit independently occupies 12 AD channels of the data acquisition card, mainly comprises an operational amplifier and a peripheral circuit, and mainly completes 12 paths of signal processing including an upper activation signal, a starting signal, an angular position sensor signal, an acoustic signal, an optical signal, a starting cut, a gas cylinder activation, a battery activation, a stop pin and engine ignition, a cylinder identification signal 1, a cylinder identification signal 2 and a cylinder identification signal 3 according to the requirements of test items. The specific circuit is shown in fig. 32a-32 b.
As shown in fig. 32a-32b, the signal processing circuit includes an upper activation signal processing module, a rotation-starting signal processing module, an angular position sensor signal processing module, an acoustic signal processing module, an optical signal processing module, a rotation-starting and cutting-off signal processing module, a gas cylinder activation signal processing circuit, a battery activation signal processing circuit, a pin and engine ignition signal processing circuit, a -th cylinder identification signal processing circuit, a second cylinder identification signal processing circuit and a third cylinder identification signal processing circuit, the signal processing circuit includes an operational amplifier and a peripheral circuit connected thereto, the angular position sensor signal processing module includes a resistor R37, a terminal of the resistor R37 is a signal input terminal of the angular position sensor signal processing module, a signal input terminal of the angular position sensor signal processing module is connected to a signal output terminal of the angular position sensor, another terminal of the resistor R37 is connected to ground via a resistor R39, the second circuit is connected to an in-phase input terminal of a TL-type operational amplifier U8A, a phase-inverted terminal of the U8 is connected to a signal input terminal of the angular position sensor, a second terminal R is connected to a power supply, a second terminal , a resistor R8672 is connected to ground via a resistor R72, a resistor R8672, a second circuit is connected to a power supply terminal , a resistor R72 is connected to a power supply terminal , a resistor R72, a resistor R8672, a resistor R72 is connected to a resistor R72, a resistor R72 + ground terminal is connected to a resistor , a resistor R8672.
A self-checking circuit: the self-checking circuit is used for testing whether the combination performance of the internal power supply and the circuit board of the unit is normal or not and simultaneously detecting whether the connection relation of the internal lead is normal or not. And ensuring that the equipment state is intact before the performance test of the transmitter mechanism is carried out. The internal self-checking mainly comprises seven parts, namely power supply self-checking, current detection circuit self-checking, power supply and analog load circuit self-checking, conduction measurement circuit self-checking, insulation measurement circuit self-checking, signal processing circuit self-checking and communication module self-checking according to composition conditions.
And dividing the voltage of each power supply into a range of-10V to +10V through a resistor, and sending the voltage to an AD port of the data acquisition card for analog-to-digital conversion. When the current detection circuit and the analog load are subjected to self-detection, the power supply relay is closed, and the analog load is connected into the power supply loop by closing the K4 to measure the output signal of the current sensor. When the conduction test circuit is subjected to self-checking, the relays K32, K33, K34 and K35 are closed, loops of each test item are in short circuit, the short circuit state of each loop is measured through the closed range selection relay and the closed channel selection relay, and the working state of the conduction test circuit is judged. And the insulation measuring circuit is connected with the standard resistor by closing a K3 or K4 relay, so that the self-checking work of the insulation circuit is completed. When the signal processing circuit performs self-checking, the relays K33, K34 and K35 are closed, the OC2A of the main control chip generates a square wave of 100HZ, after processing, a bipolar waveform with the amplitude of +/-8V and the frequency of 100HZ is generated and sent to each signal processing circuit, and a corresponding AD input channel for data acquisition can detect the waveform meeting the requirements. The communication module can complete self-checking whether internal initialization configuration is completed or not through the main control chip. A self-test circuit schematic is shown in fig. 33a-33 b.
As shown in fig. 33a-33b, the self-test circuit of the signal self-test circuit includes a switching circuit and a self-test signal processing circuit, the self-test signal processing circuit includes a resistor R86, an end of the resistor R86 is a signal input end of the self-test signal processing circuit, the signal input end is connected to an OC2A pin of the main control chip, another end of the resistor R86 is connected to a non-inverting input end of a TL072 type operational amplifier U26A, an inverting input end of the resistor R26A is connected to two paths, a third A path is connected to ground through a resistor R A, a second path is connected to a +12V power supply through a resistor R A, a power input end of the resistor R A is connected to three paths, a third A path is connected to a +12V power supply, a third path is connected to ground through a capacitor C A, a ground end of the resistor R A is connected to a non-12V power supply, a third path is connected to a ground through a capacitor C104, a non-inverting input end of the resistor R A, a non-inverting input end of the resistor R072 type operational amplifier R A is connected to a non-inverting input end of the resistor R A, the resistor R072 type operational amplifier R A, the non-inverting input end of the resistor R A, the resistor R A is connected to a non-inverting input end of the resistor R A, the resistor R072 type operational amplifier R072;
the input end of the th switch switching circuit is divided into five paths and is respectively connected with five normally open contacts of a th pole double-throw switch in a relay K33, five normally closed contacts of a th pole double-throw switch in the relay K33 are respectively connected with a signal output end of a data acquisition card, five common contacts of a th pole double-throw switch in the relay K33 are respectively connected with the input end of a corresponding signal processing module, end of a coil in the relay K33 is connected with a +12V power supply, and the other end of the coil in the relay K33 is connected with driving output ends of the MC1413 type relay driving chip;
the input end of the second switch switching circuit is divided into six paths, and the six paths are respectively connected with six normally open contacts of a second six-pole double-throw switch in a relay K34, six normally closed contacts of the second six-pole double-throw switch in the relay K34 are respectively connected with a signal output end of a data acquisition card, six common contacts of the second six-pole double-throw switch in the relay K34 are respectively connected with the input end of a corresponding signal processing module, of a coil in the relay K34 is connected with a +12V power supply, and the other end of the coil in the relay K34 is connected with driving output ends of an MC1413 type relay driving chip.
The launching mechanism test unit adopts main devices, a turntable control unit and devices in the missile performance test unit.
Designing internal software: the program in the main control chip is written by adopting C language and developed by using AVR Studio integrated development environment. The internal program flow of the launching mechanism test unit is shown in fig. 34. After the electrification initialization is finished, the main control chip reads the last running time storage data of the internal missile PROM and carries out accumulated storage. And the main control program waits for the command of the upper computer software and executes the corresponding control program according to the command.
The external interrupt of the main chip is connected with a power failure detection circuit, when the external power failure triggers the external interrupt, an interrupt program is entered, continuous operation time reading and storing programs are executed, data storage is completed, and an interrupt flow chart is shown in fig. 35.
Target simulation turntable: the main material of the target simulation turntable is aviation aluminum plate, so that the target simulation turntable is firm and light, and the whole target simulation turntable is designed by a foldable structure, so that the storage space is saved; and a control circuit board is arranged at the bottom of the target simulation turntable to realize turntable motion control and light source control. The structure of the target simulation turntable body is shown in fig. 36.
And the control circuit board in the target simulation turntable receives a control signal sent by the upper computer through a turntable control cable, so that the control of the rotating speed and the light source is realized. The collimator tube generates infrared and ultraviolet light sources meeting the requirements, the difference between the infrared and ultraviolet light sources and the axis is 7 degrees, the infrared and ultraviolet light sources are placed on a rotating main body component in front of the missile, the rotating main body component consists of a transmission component, a front support component and an extension component, wherein the transmission component adopts the multi-stage speed reduction transmission of a micro stepping motor and is assembled with a target simulator part to simulate the movement of a target; the rear adjusting support adopts a bevel gear transmission mode, and automatic light focusing can be realized through a stepping motor. The wavelength of the ultraviolet light source is 365 nm-380 nm, the wavelength of the infrared light source is 3-5 um, and the luminous power can be adjusted; an optical system: the caliber of the exit port is 75mm, the light passes through (D) phi 66mm, and the central blind area is not more than phi 20;
watch 17 turntable control unit external interface
Figure BDA0002246581180000471
Watch 18 turntable control unit external interface
Figure BDA0002246581180000472
The collimator cable is made of AFK-250, the tail of the cable is sleeved with a green nylon yarn sleeve, and the collimator cable is placed at the bottom of the turntable control unit and stored along with the turntable control cable .
The control circuit board is mounted inside the turntable as shown in fig. 37. The control circuit board is provided with a power circuit, a master control circuit, a communication circuit, an infrared light source control circuit, an ultraviolet light source control power supply, a light blocking mechanism control circuit, a sound detection circuit, an optical signal indication detection circuit, a stepping motor drive circuit, a limit switch detection circuit and the like.
The power circuit adopts an isolated DC-DC module to provide +12V and +5V working power for the control circuit board; the communication circuit is matched with the main control circuit to receive the control command sent by the turntable control unit, and simultaneously, the communication circuit is controlled by the main control circuit to send power supply voltage information and collected acousto-optic signal information to the turntable control unit; the brightness control of the light source is realized by the way that the infrared and ultraviolet light source control circuits simultaneously regulate the current; the light blocking mechanism is used for realizing the shielding and opening of the light source; the sound and light detection circuit is used for detecting sound signals and light indicator light signals sent by the buzzer; the limit switch detection circuit realizes the detection of the electrical limit of the left side and the right side of the rotary table and realizes the reversing of the rotary table; the stepping motor driving circuit realizes the driving control of the rotating mechanism motor and the lifting mechanism motor;
the target simulation turntable 6 comprises a target simulation turntable main body 15 and a control circuit board 16 positioned in the main body, as shown in fig. 38a-38d, the control circuit board comprises a main control module, the main control module uses an AT90CAN type main control chip U, pins 18-19, pins 25-26, pins 32-34, pins 43 and pins 45-51 of the U are suspended, pins 5 and 15 of the U are connected with a computer measurement and control unit, pin 11 of the U is connected with pin 10 of a TMC429-SOP type stepper motor control chip U, pin 16 of a TMC260-PA type horizontal stepper motor drive chip U and pin 16 of a TMC260-PA type vertical stepper motor drive chip U through a resistor R, pin 12 of the U is connected with pin 11 of the U, pin 15 of the U and pin 15 of the U through a resistor R, pin 13 of the U is connected with pin 12 of the U, pin 14 of the VCC, pin 14 of the U and pin 19 of the U, pin 19 of the U is connected with a resistor R, pin 19 of the resistor R is connected with a resistor R, pin 42 of the transistor of the U is connected with a resistor R, a resistor R is connected with a resistor R, a pin 19 of the transistor of the U is connected with a transistor of the transistor U, a resistor R19 of the transistor U is connected with a transistor Q, a resistor R is connected with a resistor R19 of the transistor U, a transistor U is connected with a transistor U, a transistor U19, a transistor U is connected with a transistor U, a transistor Q19 of the transistor Q, a resistor R19 of the transistor Q, a transistor Q19 of the transistor Q is connected with a transistor Q, a resistor R19 of the transistor Q, a resistor R19 of the transistor Q is connected with a transistor of the transistor Q;
the pin 61 of the U2 is divided into three paths, the path is grounded through a capacitor C10, the second path is grounded through a resistor R8, the third path is connected with a end of the resistor R7, the other end of the resistor R7 is divided into two paths, the path is a +20V power output end, the second path is connected with a pin 2 of a WRB2405S-3WR2 type voltage conversion chip U1, a pin 6 of the U1 is grounded, a pin 5 of the U1 is divided into four paths, the path is grounded through a capacitor C5, the second path is grounded through a capacitor C6, the third path is connected with a end of the resistor R4, the fourth path is a power output end, and the other end of the resistor R4 is grounded through a light emitting diode LED 1;
a pin 60 of the U2 is connected to a end of a resistor R6, another end of the resistor R6 is divided into three paths, a 0 th path is connected to a moving end of a variable resistor R5, a second path is connected to a collector of a triode Q1, a third path is grounded via a capacitor C8, another 1 end of the resistor R5 is divided into five paths via a resistor R1, a path is grounded via a capacitor C2, a second path is grounded via a capacitor C3, a third path is connected to a end of a resistor R2, a fourth path is connected to an end of the resistor R3, a fifth path is connected to VCC via a power supply, an emitter of the triode Q1 is grounded, a base of the triode Q1 is divided into two paths, a path is grounded via a capacitor C9, a second path is connected to a end of the capacitor C7 and another end of the resistor R2, another end of the resistor R3 is connected to another audio output terminal of the capacitor C7 and then connected to an audio signal acquisition module;
the 15 feet of the U3 are connected with the 42 feet of the U5, the 16 feet of the U3 are connected with the 41 feet of the U5, the 17 feet of the U3 are connected with the 42 feet of the U6, and the 23 feet of the U3 are connected with the 41 feet of the U6.
The main structure of the rotary table comprises a front support assembly and an extension assembly, the front support and the rear support are V-shaped, the body can be placed conveniently, stably and reliably, the rear support is of a worm and gear structure and can be self-locked when ascending and descending to any position, the rear support is in two light focusing modes, is in manual light focusing and electric automatic light focusing, the light focusing requirements can be met, the V-shaped blocks of the front support and the rear support are in parallelogram principle, namely the V-shaped blocks can be in line contact with the body when the supports ascend and descend to the light focusing, the stability of the light focusing body is kept, the rotary table adopts a scheme of fixing the collimator to rotate by the body, the safety of the body is guaranteed, the rotary mechanism is driven by a large gear reduction ratio (1:125), and the stability and the reliability of the uniform rotation of the collimator are.
A rotating component: the rotating assembly comprises a light pipe bracket and a collimator, the light pipe bracket is detachably designed, namely, the storage space is saved when the light pipe bracket is retracted, the bracket rotates upwards for 7 degrees and is adjustable, the height of the bracket can be adjusted along with the rotation of 7 degrees, the caliber of the collimator is still aligned with the optical axis of the collimator after the bracket rotates for 7 degrees, and the main structure of the rotating assembly is shown in figure 39.
A turntable accessory: the rotary table accessory comprises a rotary table base plate, a steel chisel, a steel wire rope and the like, when the rotary table accessory is unfolded for use in the field, the rotary table base plate is placed at the top of the packing box, and after the rotary table is unfolded, the rotary table is fixed on the box cover through four hooks on the periphery of the rotary table by utilizing 4 groups of the steel wire rope and the steel chisel. And meanwhile, the accessory also comprises an expansion screw, and the rotary table can be fixed on a cement table through the expansion screw.
An air source device: the gas source unit is mainly used for filling high-purity nitrogen or argon through a gas cylinder to provide a gas source for missile refrigeration. 2 composite winding gas cylinders are adopted to fill argon gas, a pressure reducing valve and a pressure gauge are arranged, and the composite winding gas cylinders are connected with the ground energy source interface of the missile through a gas filling pipe. And meanwhile, the adapter is arranged, so that the inflation tube can be conveniently connected with other general nitrogen and argon refrigeration air sources. The main structure is composed of a gas cylinder, a pressure reducing valve, a gas cylinder bracket, a gas pipe and an inflation adapter, as shown in fig. 40.
A gas cylinder bracket: the gas cylinder support is spliced by adopting a simple support, the support part is supported by a triangle according to the principle of convenient disassembly and assembly and space saving, and the normally-disassembled part is provided with a butterfly screw, so that the gas cylinder support is convenient and reliable, and is shown in figure 41.
The CT80-12Z interface matched with the gas-electric interface is adopted by the inflation head, the middle gas pipe in the inflation head is welded by brazing, then the hole is matched by bending, and the sealing cover is locked by a copper strip and a screw, so that the fastening is reliable. The joint is connected with an ultrahigh pressure air pipe in a matching way, as shown in figure 42.
Trachea and annex: comprises a gas cylinder joint, a pressure reducing valve, a pressure gauge, an ultrahigh pressure inflating hose and the like. The pressure relief valve is attached to the ultrahigh-pressure gas-filled hose connector, so that high-pressure gas in the pipeline can be discharged when ice blockage occurs, and the disassembly is convenient.
WINDOWS 7 is an operating system developed by Microsoft corporation, is an operating platform most applied to at present, has better safety, stability and instantaneity, and takes the condition of a pre-installed system of a current computer and the reliability of communication into consideration, so the WINDOWS 7 is selected as the operating system.
The method comprises the steps of selecting a software development tool, selecting VB.net as development languages based on a net platform application program launched by Microsoft in 2002, and also being development languages recommended by Microsoft in the utmost, and selecting VB.net to rapidly develop a user interactive object-oriented application program based on a windows operating system in view of the development of the net platform and a measurementmodulo control library, wherein the measurementmodulo can beautify the appearance of the application program and provide various professional control pieces to provide convenience and stability for program development.
Designing measurement and control software: the software includes a plurality of modules, such as an interface main program, a function module subprogram, and a test module subprogram, and a structural frame diagram of the software is shown in fig. 43.
Software design flow: the whole functions of the test software are mainly divided into a missile test function, a launching mechanism test function, a system maintenance function, a data management function, a help function, quitting and the like, all the functions are split according to the test requirements, the software requirement specification is compiled, and the software program is compiled according to all the requirements.
Software engineering management: in the process of software development, engineering management is carried out according to the requirements of company software development management system files, software developers compile software development plans, organize and implement software development and test work, compile software requirement specifications and software detailed design specifications related design documents, and coordinate system joint test and acceptance work.
Software configuration management: the test equipment has the advantages that the software development environment is Visual studio2010, the software is VB.NET, the operating system is Win7, and the test equipment is compiled by matching with the office component, so that the test equipment is friendly in interface, convenient to operate, high in robustness and complete in function. NET writes the program control part, office subassembly realizes printing and database function.
Software quality guarantee: according to the software requirement specification and the software detailed design specification, the software design process is carefully implemented, each module unit of the software is tested and verified for many times, and the tested product is used for testing for many times, so that the software design of the product is ensured to meet the requirements.
The self-checking system has a perfect self-checking system, and can fully self-check each functional circuit, the system can timely and ready determine the hardware state of the system through the self-checking program of the upper computer, and ensure that the system state is good when testing, when the self-checking is executed, the self-checking system does not need external excitation or measuring equipment, but only utilizes software and hardware in an electronic system or equipment to complete the built-in testing function, and does not influence the working performance of the equipment due to built-in testing, according to the self-checking design analysis, the equipment fault detection rate is more than 98%, and the fault can be specifically positioned to a certain signal channel.
Fault diagnosis and positioning:
the traditional fault diagnosis mode mainly depends on the sensory organs of experts or maintenance personnel, personal experience or simple maintenance equipment, and the quality of equipment maintenance is directly related to the experience of the maintenance personnel. In order to improve the fault diagnosis efficiency and shorten the maintenance time, the self-checking software of the detection system is provided with a fault diagnosis function, and an expert system is applied to the field of fault diagnosis, so that common testing and maintenance personnel can obtain abundant expert experience, and the fault diagnosis and maintenance efficiency is improved.
The expert system mainly comprises a knowledge base, an interpreter, a fault database, a man-machine interface and the like, fault modes on a test site are various, the reasons of faults are complex, simple fault modes can correspond to two or even more reasons, simultaneously, the reasons under different fault modes are also possibly partially the same, fault modes can also cause other fault modes, the relationship interleaving and the mutual influence make diagnosis very difficult, so that the fault modes of equipment need to be analyzed in detail, simple and effective integral models are established in the analyzed fault modes of the equipment to reflect the effect logic relationship among the faults.
The failure tree analysis method is kinds of figure deduction method, it analyzes various factors (including hardware, software environment, artificial factors, etc.) which may cause system failure, draws logic block diagram (i.e. failure tree, kinds of tree logic cause and effect relationship diagram), it uses defined event, logic and other symbols to describe the cause and effect relationship between various events in the system, then makes the failure events occurred in the system to be analyzed gradually and refined from whole to part according to tree branch, in order to identify basic failure, determine failure cause, failure influence and occurrence probability, etc.
The knowledge can be obtained through equipment fault symptom information sources (mainly self-test, detection test and test personnel entry). Through the technical approach, the test software of the detection system can give diagnosis suggestions to equipment faults or misoperation, and automatically prompts an operator to replace the replaceable unit or improve the operation method.
The structural design of the fully-sealed test unit is that the main body framework of the box body of the turntable control unit, the missile performance test unit and the launching mechanism test unit is sealed, only panels are reserved for internal structural installation, the number of detachable parts is reduced, the panels and the box body can be sealed through sealing strips, and the environmental adaptability of the system is effectively improved.
The upper computer + the lower computer control mode: the system adopts a mode of program control of the upper computer and the lower computer, and reduces the dependence of the system on the upper computer software and the hardware resources of the data acquisition card. The system functions are divided, the upper computer software is responsible for overall flow control, data processing and display, and the lower computer program is responsible for control inside the unit; the mode is convenient for later-stage system expansion, main control work inside the new test unit is realized by an internal lower computer program, data transmission is completed through a communication interface and a data acquisition card in the turntable control unit, and the hardware dependence on a common unit (turntable control) is reduced. And in the later expansion process, the rotary table control unit can meet the system requirement.
Real-time tilt detection mode: the traditional inclination angle measuring device of the launching mechanism forms a fixed inclination angle by adjusting the inclination angle of a mechanical structure, is used for testing an inclination angle sensor in the launching mechanism, and is adjusted in the horizontal condition before testing, so that the structure and the operation are complex. This application, on the mounting panel of launching mechanism, install inclination and detect the chip, when carrying out the inside angular transducer capability test of launching mechanism, utilize external inclination to detect chip real-time detection launching mechanism's inclination, contrast with inside launching mechanism angular transducer output data, reach the test purpose.
Independent turntable control mode: a control circuit board is placed in the new target simulation rotary table, and the rotary table control part is removed from a public unit (rotary table control unit), so that the internal structure of the rotary table control unit is simplified, the internal interference of a driving part on a system is reduced, and the test stability is improved. The rotation speed adjustment, the light source adjustment and other control functions of the rotary table are realized in a communication mode, and the control of the rotary table is realized by an internal control circuit board and is not limited by other external hardware resources. Meanwhile, sound and light signal detection on the missile is designed and controlled on the circuit board, and sound and light signal states are sent in a communication mode, so that a product testing cable structure is simplified, and later-stage system expansion is facilitated.
Chip-level motor drive: traditional motor drive adopts the mode of external driver to go on, and is bulky, is not convenient for install in the less place of volume. The detection system directly selects a stepping motor driving chip and a control chip, and realizes motor driving control under the control of a main control chip. The mode occupies small volume, is convenient to control, and can easily complete the driving of the two stepping motors.
The design of the dual-mode common-aperture target source comprises that a traditional infrared target source and an ultraviolet target source are two independent target sources, the light sources need to be replaced when the dual-mode common-aperture target source is used, and a common ultraviolet light source is generally a black body or an ultraviolet lamp bulb plus optical fibers, has larger volume and is not suitable for the requirement of test use.
Possess multiple security design, ensure test product and personnel's safety: the short-circuit point on the cable design, multiple means such as signal connection line that can cut off on the cable when having adopted reliable power supply control relay, self-checking increase the security, can ensure by survey product and operating personnel's safety.
Independent internal cabling relationships: the internal connection relation of each test unit is decomposed during design, so that the wiring harness can be manufactured independently for each connector connecting cable, and the structure of the box body is not relied on. The inconvenient welded connector adopts the mode of PCB board switching, converts the connector into the connector that facilitates the use, and each connector connection relation is simple, has reduced the wiring degree of difficulty of the personnel of denso, has improved assembly efficiency. After the wiring harness is independently manufactured, the wiring harness can be directly installed in the box body to be connected, so that the wiring harness is convenient to disassemble and assemble, and the reliability and the maintainability are improved.
Perfect inside self-checking circuit: the self-checking circuit with perfect internal design of each unit can complete the confirmation of the state through the internal self-checking circuit, and the system fault detection rate is more than 98%.
The method has the following capability of self fault diagnosis of the test equipment: the detection system adopts a modular design method, simplifies equipment composition and the number of printed boards, and makes fault diagnosis possible according to self-detection results. The test software is added with the capability of diagnosing the self fault of the test equipment, and prompts are given according to the test result. The measures of adjustment and detection which can be carried out on the spot on the printed board or the module which is required to be replaced and possibly caused by misoperation are automatically provided for operators in a man-machine conversation mode, the system repair time is shortened, and the workload of after-sale service is reduced.
Humanized software design with operation guide interface: a wizard program is designed on the software operation interface, and an operator can sequentially complete the work of equipment expansion, cable connection, equipment self-checking, product placement, performance testing and data management according to the guidance of the wizard program. The process can help operators to be familiar with the operation of the equipment, and meanwhile, the probability of manual operation errors can be reduced through visual picture indication, so that the integrity of the equipment is ensured.

Claims (9)

  1. The system is characterized by comprising a system box body (1), wherein a computer measurement and control unit placing grid, a rotary table control unit placing grid, a missile performance testing unit placing grid, a launching mechanism testing unit placing grid, a target simulation rotary table placing grid, a gas cylinder placing grid, a gas circuit accessory placing grid, a gas cylinder support placing grid, a matching connection cable placing grid and a rotary table accessory placing grid are arranged in the system box body, a computer measurement and control unit (2) is located in the computer measurement and control unit placing grid, a rotary table control unit (3) is located in the rotary table control unit placing grid, a missile performance testing unit (4) is located in the missile performance testing unit placing grid, a launching mechanism testing unit (5) is located in the launching mechanism testing unit placing grid, a target simulation rotary missile simulating rotary table placing grid is located in a target missile simulating rotary table placing grid, a gas cylinder (7) is placed in the gas cylinder placing grid, a gas circuit accessory is located in the gas circuit accessory placing grid, a gas cylinder support (8) is located in the gas cylinder support placing grid, a matching connection cable is located in the target simulation rotary missile simulating rotary table placing grid, a gas source is located in the gas cylinder placing grid, and a computing mechanism testing unit (2) is matched with the testing unit.
  2. 2. The missile testing system of claim 1, wherein: a notebook is used as a main body of the computer measurement and control unit, and the computer measurement and control unit (2) is used as an upper computer of the system to realize the functions of hardware function control, data acquisition, system maintenance and database management of each part in the system; the computer measurement and control unit is communicated with the turntable control unit or the transmitting mechanism test unit through a USB interface, so that data transmission is realized.
  3. 3. The missile testing system of claim 1, wherein: the alternating current power supply input interface of the turntable control unit and the alternating current power supply input interface of the missile performance test are connected with an alternating current power supply socket through an alternating current power supply connecting wire, and the alternating current power supply input end interface of the computer measurement and control unit is connected with the alternating current power supply socket through a power supply adapter; the direct current input interface of the turntable control unit and the direct current input end interface of the missile performance testing unit are connected with the power supply input end of the direct current power supply module through a direct current power supply cable; the computer measurement and control unit is connected with the turntable control unit through a serial port, and the turntable control unit is bidirectionally connected with the target simulation turntable through a turntable control interface to perform data interaction; the rotary table control unit is in bidirectional connection with the missile performance testing unit through a data acquisition interface to perform data interaction; the missile performance testing unit is connected with a data acquisition interface of a missile on the target simulation turntable; the gas cylinder is connected with the inflating adapter through a pipeline, and a gas source is provided for missile refrigeration through gas in the gas cylinder.
  4. 4. The missile testing system of claim 3, wherein the turret control unit comprises a turret control unit housing (9), a th ac input interface is embedded in the turret control unit housing (9), a th ac input interface is connected to a 1 th switching power input via a 0 th power switch, an output of the 2 th switching power is connected to inputs of a 3 th power processing circuit, a th dc power socket is embedded in the turret control unit housing (9), the th dc power socket is connected to another inputs of the th power processing circuit, an output of the th power processing circuit is divided into three paths, the th power terminal is connected to a power terminal of the turret control interface, a second path is connected to a power voltage detection interface of the th main control chip, a third path is connected to a power input of the CAN communication chip, the main control chip module is connected to the CAN communication chip, the communication chip is connected to the turret control interface, the missile simulation control interface is connected to the target data acquisition control module via a USB data acquisition interface, the acquisition control interface is connected to the USB data acquisition control unit via a USB port, and a USB data conversion interface, the USB data acquisition control interface is connected to the USB data acquisition control unit via a CNT acquisition card/control interface, and a USB data conversion interface;
    the power supply processing circuit comprises a +24V power supply module, a +12V power supply module and a +5V power supply module, wherein the +24V power supply module comprises a relay K3, a coil of the relay K3 is connected with a +24V power supply output end of a switching power supply, a normally closed contact of a K3 single-pole double-throw switch is connected with the +24V power supply output end of a direct-current power supply module, a normally open contact of a K3 single-pole double-throw switch is connected with the +24V power supply output end of a switching power supply, a common contact of the K3 single-pole double-throw switch is divided into three paths, the path is the +24V power supply output end, the second path is grounded through a capacitor C18, and the third path is grounded through a capacitor C16;
    the +12V power supply module comprises a connector P, wherein a pin 1 and a pin 2 of the connector P are connected with a +24V power supply output end of a third switching power supply, a pin 3 and a pin 4 of the P are grounded, the pin 1 and the pin 2 of the P are divided into three paths, the first path is grounded through a capacitor C, the second path is grounded through a capacitor C, the third path is connected with a power supply input end of a 24V-to-12V power supply conversion chip U, the pin 1 of the U is grounded, the pin 3 of the U is connected with 0 normally open contact of a double-pole double-throw switch of a relay K, the pin 4 of the U is connected with the other 1 normally open contact of the double-pole double-throw switch of the relay K, the coil end of the K is connected with the +24V power supply output end of the second switching power supply, the other end of the K is grounded, the normally closed contact of the K double-pole double-throw switch is connected with the +12V power supply output end of the second switching power supply, the other normally closed contact of the K is grounded, the K double-pole double-throw switch is connected with the K, the K-pole double-throw switch, the common terminal of the K is divided into four paths;
    the +5V power supply module comprises a voltage conversion chip U4, wherein 1 pin of the U4 is divided into three paths, the third path is grounded through a capacitor C4, the second path is grounded through a capacitor C4, the third path is connected with the +12V power supply output end of the direct current power supply module, 4 pins of the U4 are grounded, 3 pins of the U4 are connected with 4 normally closed contacts of a double-pole double-throw switch of the relay K4, the other 4 normally closed contacts of the double-pole double-throw switch of the relay K4 are grounded, 1 pin of the U4 is grounded, 2 pins of the U4 are connected with the output end of the +24V power supply module of a switch K4 power supply, 3 pins of the U4 are connected with 4 normally open contacts of the double-pole double-throw switch of the relay K4, 5 pins of the U4 are connected with the other 4 normally open contacts of the double-pole double-throw switch of the relay K4, a 5 pin of the U4 is connected with the other 4 normally open contacts of the double-pole double-throw switch of the relay K4, the common power supply output end of the third path is grounded, the third path is connected with the third path C4 of the third path C4, the third path is grounded C4, the third path is connected with the third path of the C4, the third path of the third;
    the main control chip module comprises an AT90CAN32 type main control chip U7, wherein a pin 30 of the U7 is connected with a pin 1 of a TD501MCANFD type CAN bus chip U8 through a resistor R18, a pin 31 of the main control chip U7 is connected with a pin 2 of the U8 through a resistor R17, a pin 3 of the U8 is grounded, a pin 4 of the U8 is connected with a +5V power supply, a pin 5 of the U8 is suspended, pins 6 and 7 of the U8 are bus connection ends, a pin 48 of the main control chip U7 is divided into two paths, a pin is grounded through a resistor R12, a second path is connected with a base electrode of a triode Q1 through a resistor R11, an emitter of the Q1 is grounded, a collector of the Q1 is connected with a grounding end of a buzzer LS1, and a power supply input end of the buzzer LS1 is connected with a +12V power supply;
    the switch power supply adopts a CEA series power supply with built-in surge suppression and filter circuits produced by Beijing force-bearing power supply Limited, the input voltage is alternating current 220V, two paths of outputs are used, paths of 24V voltage outputs are used for a target simulation turntable, the output current is not less than 4A, the other paths of 12V voltage outputs are used for an internal control circuit, and the current is not less than 2A;
    the turntable control unit further comprises a temperature sensor, the temperature sensor is in bidirectional connection with the th main control chip module through an IIC interface and is used for collecting temperature information of the turntable control unit, the th main control chip module further comprises a timing clock, the timing clock uses a real-time clock chip with DS1302 as the turntable control unit, and the th main control chip module uses an AT90CAN32 single chip microcomputer as the main control chip.
  5. 5. The missile testing system of claim 1, wherein the missile performance testing unit comprises a missile performance testing unit box body (10), a second alternating current input interface is internally embedded in the missile performance testing unit box body (10), the second alternating current input interface is connected with power input ends of a DC-DC conversion circuit through a second power switch and a second switching power supply, a second path of an output end of an DC-DC conversion circuit is connected with an input end of a second power supply processing circuit, a second path of an output end of a DC-DC conversion circuit is connected with a power input end of a start-up module, a second direct current power supply socket is embedded in the missile performance testing unit box body (10), the second direct current power supply socket is connected with other input ends of the DC-DC conversion circuit, an output end of the second power supply processing circuit is divided into a plurality of paths, a second main control chip module provides a working power supply for a unit needing power supply in the missile performance testing unit through the second power supply processing circuit, a second main control chip module is respectively connected with a missile performance testing circuit, a signal processing circuit and a missile acquisition circuit, the missile performance testing unit is connected with a self-detection circuit through a bidirectional data acquisition control acquisition circuit, and a bidirectional data acquisition control circuit, the bidirectional data acquisition circuit is connected with the missile performance testing unit box body through a bidirectional communication interface, and a bidirectional data acquisition control circuit, the bidirectional data acquisition control circuit, and a bidirectional test data acquisition circuit, the bidirectional data acquisition circuit is connected with the bidirectional data acquisition circuit, and a bidirectional test data acquisition circuit, the bidirectional test unit is connected with the bidirectional test unit.
  6. 6. The missile testing system of claim 5, wherein the second power processing circuit comprises a +5V DC power module, a +12V DC power module and a +3.3V DC power module, wherein the +5V DC power module comprises a VRB24S05 type DC voltage conversion chip U1, a 2-pin of the U1 is divided into three paths, a -pin of the U1 is connected with a +24V DC power output end of the second switching power supply, a second path of the U is grounded through a capacitor C6, a third path of the U is grounded through a capacitor C4, a 3-pin of the U1 is connected with normally open contacts of a double-pole double-throw switch in a relay K1, a 5-pin of the U1 is connected with the other normally open contacts of a double-pole double-throw switch in a relay K1, normally closed contacts of the double-pole double-throw switch in the relay K1 are connected with an internal +5V power supply, a -pole double-throw contact in the relay K1 is grounded, a third path of the DC power supply is connected with an internal +5V power supply coil 865V power supply, a third path of the DC power supply is grounded coil 865, a third path of the VRB 8428, a third path of the DC power supply is connected with a third switch, a third path of the third path of;
    the +12V direct-current power supply module comprises a VRB24S12 type direct-current voltage conversion chip U2, wherein a pin 1 of the U2 is grounded, a pin 2 of the U2 is connected with a +24V direct-current power supply, a pin 3 of the U2 is divided into three paths, the path is the output end of the +12V direct-current power supply, the second path is grounded through a capacitor C8, and the third path is grounded through a capacitor C7;
    the +3.3V direct-current power supply module comprises a 24S05-6W type direct-current voltage conversion chip U5, a pin 1 of the U5 is grounded, a pin 2 of the U5 is connected with a +24V direct-current power supply, a pin 5 of the U5 is grounded, a pin 3 of the U5 is divided into four paths, a path is a +5V power supply output end, a path B is grounded through a capacitor C23, a path III is connected with a capacitor C21, a path IV is connected with a pin 3 of an AMS1117-3.3V type power supply chip U6, a pin 1 of the U6 is grounded, a pin 2 of the U6 is divided into three paths, a path is grounded through a capacitor C24, a path B is grounded through a capacitor C22, and a path III is a 3.3V power supply output end;
    the second main control chip module comprises an AT90CAN32 type main control chip U21, ports PB1 and PB2 of the U21 are connected with a DO port of a data acquisition card through a data acquisition cable, a PB3 is connected with a DI port of the data acquisition card, and data transmission is realized with upper computer software through a simulation SPI communication format, four MC1413 type relay driving chips are respectively connected with IO ports of the main control chip U21 through 74HC245 buffers to realize control of relays, and the main control chip U21 realizes initialization configuration and clock reading of a clock chip through ports PF4, PF5 and PF 6;
    the conduction test circuit comprises a reference voltage module, a standard resistor selection module and a channel switching relay module, wherein DA output voltage of a data acquisition card is connected with an input end DA0 in the reference voltage module, the DA0 is divided into four paths, a path is grounded through a capacitor C15, a second path is grounded through a capacitor C14, a third path is grounded through a backward diode D3, a fourth path is connected with a non-inverting input end of a TL072 type low noise amplifier U4A through a resistor R1, an inverting input end of the U4A is connected with an output end of the U4A, a power input end of the U4A is divided into three paths, a path is connected with a +5V power supply, a second path is grounded through a capacitor C5, a third path is grounded through a capacitor C3, a grounding end of the U4 9648 is grounded, an output end of the U4A is divided into two paths, a path is grounded through a capacitor C13, and a second path is connected with an;
    the input end of the standard resistor selection module is divided into three paths, the th path is divided into two paths after passing through a standard resistor R6, the th path is connected with normally open contacts of a double-pole double-throw switch in a relay K14, the second path is connected with the other normally open contacts of the double-pole double-throw switch in the relay K14, two normally closed contacts of the double-pole double-throw switch in the relay K14 are suspended, public contacts of the double-pole double-throw switch in the relay K14 are connected with the other public contacts, the end of a coil of the relay K14 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K14 is connected with driving output ends of the MC1413 type relay driving chip;
    the second path of the input end of the standard resistor selection module is divided into two paths after passing through a standard resistor R14, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K18, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in a relay K18, two normally closed branch contacts of the double-pole double-throw switch in a relay K18 are suspended, common contacts of the double-pole double-throw switch in the relay K18 are connected with the other common contacts, end of a coil of the relay K18 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K18 is connected with driving output ends of the MC 3 type relay 387 driving chip;
    the third path of the input end of the standard resistor selection module is divided into two paths after passing through a standard resistor R26, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K22, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in a relay K22, two normally closed branch contacts of the double-pole double-throw switch in a relay K22 are suspended, common contacts of the double-pole double-throw switch in a relay K22 are connected with the other common contacts, a end of a coil of the relay K22 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K22 is connected with driving output ends of the MC 3 type relay 387 driving chip;
    the channel switching relay module comprises an infrared information module, a th reference module, an ultraviolet information module, a steering control module, a second reference module, a missile in-place information module, a +5V power module, a +20V power module, an angular position sensor module, a rotation-starting signal module and a-20V power module, wherein the infrared information module comprises a relay K4, two normally closed branch contacts of a double-pole double-throw switch in the relay K4 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K4 are connected with a signal output end of an infrared information processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K4 are grounded, common contacts of the double-pole double-throw switch in the relay K4 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K4 are grounded, end of a coil in the relay K4 is connected with a +12V power supply, and a end of the relay K4 is connected with a 1413 MC drive chip of the relay driving chip of the relay K ;
    the reference module comprises a relay K5, two normally closed branch contacts of a double-pole double-throw switch in the relay K5 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K5 are connected with a signal output end of a reference voltage circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K5 are grounded, common contacts of the double-pole double-throw switch in the relay K5 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K5 are grounded, of a coil in the relay K5 is connected with a +12V power supply, and the other of the coil in the relay K5 is connected with driving output ends of the MC1413 type relay driving chip;
    the ultraviolet information module comprises a relay K11, two normally closed branch contacts of a double-pole double-throw switch in the relay K11 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K11 are connected with a signal output end of an ultraviolet information processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K11 are grounded, common contacts of the double-pole double-throw switch in the relay K11 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K11 are grounded, ends of coils in the relay K11 are connected with a +12V power supply, and the other ends of the coils in the relay K11 are connected with driving output ends of the MC1413 type relay driving chip;
    the second reference module comprises a relay K12, two normally closed branch contacts of a double-pole double-throw switch in the relay K12 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K12 are connected with a signal output end of a second reference voltage circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K12 are grounded, common contacts of the double-pole double-throw switch in the relay K12 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K12 are grounded, a end of a coil in the relay K12 is connected with a +12V power supply, and the other end of the coil in the relay K12 is connected with driving output ends of the MC1413 type relay driving chip;
    the second steering control module comprises a relay K6, two normally closed branch contacts of a double-pole double-throw switch in the relay K6 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K6 are connected with a signal output end of a second steering control signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K6 are grounded, common contacts of the double-pole double-throw switch in the relay K6 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K6 are grounded, end of a coil in the relay K6 is connected with a +12V power supply, and the other end of the coil in the relay K6 is connected with driving output ends of the MC1413 type relay driving chip;
    the missile on-site module comprises a relay K15, two normally closed branch contacts of a double-pole double-throw switch in the relay K15 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K15 are connected with a signal output end of a missile on-site signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K15 are grounded, common contacts of the double-pole double-throw switch in the relay K15 are connected with an input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K15 are grounded, end of a coil in the relay K15 is connected with a +12V power supply, and the other end of the coil in the relay K15 is connected with driving output ends of the MC1413 type relay driving chip;
    the +5V power supply module comprises a relay K16, two normally closed branch contacts of a double-pole double-throw switch in the relay K16 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K16 are connected with the output end of the +5V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K16 are grounded, common contacts of the double-pole double-throw switch in the relay K16 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K16 are grounded, end of a coil in the relay K16 is connected with the +12V power supply, and the other end of the coil in the relay K16 is connected with driving output ends of the MC1413 type relay driving chip;
    the +20V power supply module comprises a relay K17, two normally closed branch contacts of a double-pole double-throw switch in the relay K17 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K17 are connected with the output end of the +20V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K17 are grounded, common contacts of the double-pole double-throw switch in the relay K17 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K17 are grounded, end of a coil in the relay K17 is connected with the +12V power supply, and the other end of the coil in the relay K17 is connected with driving output ends of the MC1413 type relay driving chip;
    the angular position sensor module comprises a relay K19, two normally closed branch contacts of a double-pole double-throw switch in the relay K19 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K19 are connected with a signal output end of an angular position signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K19 are grounded, common contacts of the double-pole double-throw switch in the relay K19 are connected with an input end of the standard resistor selection module, common contacts of the double-pole double-throw switch in the relay K19 are grounded, ends of coils in the relay K19 are connected with a +12V power supply, and the other ends of the coils in the relay K19 are connected with driving output ends of an MC1413 type relay driving chip;
    the starting and rotating signal module comprises a relay K20, two normally closed branch contacts of a double-pole double-throw switch in the relay K20 are suspended, normally open branch contacts of the double-pole double-throw switch in the relay K20 are connected with a signal output end of a starting and rotating signal processing circuit, the other normally open branch contacts of the double-pole double-throw switch in the relay K20 are grounded, common contacts of the double-pole double-throw switch in the relay K20 are connected with an input end of the standard resistor selection module, common contacts of the double-pole double-throw switch in the relay K20 are grounded, a end of a coil in the relay K20 is connected with a +12V power supply, and the other end of the coil in the relay K20 is connected with driving output ends of the MC1413 type relay driving chip;
    the-20V power supply module comprises a relay K21, two normally closed branch contacts of a double-pole double-throw switch in the relay K21 are suspended, normally open branch contacts of a double-pole double-throw switch in the relay K21 are connected with the output end of the-20V power supply, the other normally open branch contacts of the double-pole double-throw switch in the relay K21 are grounded, common contacts of the double-pole double-throw switch in the relay K21 are connected with the input end of the standard resistance selection module, common contacts of the double-pole double-throw switch in the relay K21 are grounded, end of a coil in the relay K21 is connected with the +12V power supply, and the other end of the coil in the relay K21 is connected with driving output ends of the MC1413 type relay driving chip;
    the signal processing circuit comprises a guide signal processing module, a head raising instruction information processing module, an infrared information processing module, an ultraviolet information processing module, an infrared program control information processing module, an ultraviolet program control information processing module, a tracking signal processing module, an angle signal processing module, a th reference signal processing module, a second reference signal processing module, an angular rate feedback signal processing module and a steering control signal processing module, wherein the input end of the signal processing module is connected with the corresponding output end of the main control chip through the conduction test circuit, or the input end of the signal processing module is connected with the signal output end of the corresponding signal acquisition module, the signal input end of the guide signal processing module is divided into two paths, the second path is connected with the non-inverting input end of the low-noise operational amplifier through a resistor R25, the second path is grounded through a resistor R865 28, the inverting input end of the low-noise operational amplifier is connected with the signal output end of the low-noise operational amplifier, the power output end of the low-noise operational amplifier is divided into three paths, the third path is connected with a +12V power supply, the third path is grounded through a capacitor C33, the third path is grounded through a capacitor C32, the power supply of the low-noise operational amplifier, the third path is connected with a guide signal processing circuit , the third path is divided into a similar to a guide signal processing circuit through a similar to a guide signal processing circuit, and a guide signal processing circuit through a resistor R35, wherein the grounding structure of the same as a guide signal processing module, and a;
    the missile performance testing unit further comprises a current detection circuit, the current detection circuit comprises a +20V current detection circuit, a-20V current detection circuit and a +5V current detection circuit, the current detection circuit adopts a current sensor to realize the current detection of a +20V, a-20V and a +5V power supply loop, the output end of the current detection circuit is processed by an operational amplifier and then sent to an AD channel of a data acquisition card for analog-to-digital conversion, the +20V current detection circuit comprises a CSNE151-100 type current acquisition chip U9, a pin 1 of the U9 is a +20V current sampling input end, a pin 9 of the U9 is divided into three paths, a second path is connected with a-12V power supply through a capacitor C45 to be grounded, a third path is grounded through a capacitor C47 to be grounded, a pin 10 of the U9 is divided into three paths, a third path is connected with a +12V power supply to be grounded, the third path is grounded through a capacitor C40 to be grounded, the third path is grounded through a capacitor C41 to be grounded, a pin 11 of the U41 to be grounded, a third path is connected with a non-phase resistor R41 to be grounded, a non-phase resistor C41 to be grounded, a non-41 to be connected with a non-phase resistor C41 to be grounded, a non-3C 41 to be grounded, a non-phase resistor C41 to be grounded, a non-3C 41 to be connected with a non-phase resistor C41 to be grounded, a non-C41 to be connected with a non-C41 to be grounded, a non-phase resistor C41 to be grounded, a non-C41 to be connected;
    the self-detection circuit comprises a switch switching circuit and a self-detection signal processing circuit, the self-detection signal processing circuit comprises a resistor R82, an end of the resistor R82 is a signal input end of the self-detection signal processing circuit, the signal input end is connected with an OC2A pin of a main control chip, the other end of the resistor R82 is connected with a non-inverting input end of a TL072 type operational amplifier U25A, an inverting input end of the U25A is divided into two paths, a third A path is grounded through a resistor R A, the second path is connected with a +12V power supply through a resistor R A, a power input end of the U25A is divided into three paths, the third path is grounded through a +12V power supply, the second path is grounded through a capacitor C A, the third path is connected with the-12V power supply, the second path is grounded through a capacitor C106, the third path is grounded through a capacitor C105, an output end of the U25 after passing through the resistor R A, the non-inverting input end of the circuit is connected with the non-inverting input end of the switch switching circuit A, the non-inverting input end of the switch circuit, the switch R A, the non-inverting input end of the switch circuit is connected with the switch circuit A, the non-inverting input end of the switch circuit A;
    the input end of the th switch switching circuit is divided into six paths, and is respectively connected with six normally open contacts of a th knife double-throw switch in a relay K25, six normally closed contacts of a th knife double-throw switch in the relay K25 are respectively connected with a signal output end of a data acquisition card, six public contacts of a th knife double-throw switch in the relay K25 are respectively connected with the input end of a corresponding signal processing module, end of a coil in the relay K25 is connected with a +12V power supply, and the other end of the coil in the relay K25 is connected with driving output ends of the MC1413 type relay driving chip;
    the input end of the second switch switching circuit is divided into six paths, and the six paths are respectively connected with six normally-open contacts of a second six-pole double-throw switch in a relay K26, six normally-closed contacts of the second six-pole double-throw switch in the relay K26 are respectively connected with a signal output end of a data acquisition card, six common contacts of the second six-pole double-throw switch in the relay K26 are respectively connected with the input end of a corresponding signal processing module, of a coil in the relay K26 is connected with a +12V power supply, and the other end of the coil in the relay K26 is connected with driving output ends of an MC1413 type relay driving chip.
  7. 7. The missile testing system of claim 1, wherein: the launching mechanism test system comprises a computer measurement and control unit (2) and a launching mechanism test unit (5), wherein the computer measurement and control unit (2) is connected with an alternating current power supply through a power adapter, the launching mechanism test unit is connected with the alternating current power supply through an alternating current power supply connecting wire, the launching mechanism test unit (5) is connected with a direct current power supply unit through a direct current power supply connecting wire, and the launching mechanism test unit (5) is used for receiving control commands transmitted by the computer measurement and control unit, so that the missile launching mechanism performance test is completed.
  8. 8. The missile testing system of claim 7, wherein: the launching mechanism testing unit comprises a launching mechanism testing unit box body (11), a launching mechanism mounting plate (12) is fixed on an upper cover plate (13) through a locking device and used for mounting a tested launching mechanism, the upper cover plate (13) can rotate up and down, an inclination angle sensor is arranged on the mounting plate, and the launching mechanism can be inclined by releasing the locking device in the testing process so as to test the performance of the inclination angle sensor in the launching mechanism; when the performance of the inclination angle sensor inside the launching mechanism is tested, the inclination angle of the launching mechanism is detected in real time by using an external inclination angle detection chip, and compared with data output by the inclination angle sensor inside the launching mechanism, so that the testing purpose is achieved;
    a third alternating current input interface is embedded into the box body of the transmitting mechanism test unit, the third alternating current input interface is connected with the power input end of a third power supply through a third power switch, the output end of the third power supply is connected with power input ends of a second DC-DC conversion circuit, the paths of the output end of the second DC-DC conversion circuit are connected with the input end of a third power supply processing circuit, the second path of the output end of the second DC-DC conversion circuit is connected with the power input end of a data acquisition card, the third path of the output end of the second DC-DC conversion circuit is connected with the power input end of an insulation test circuit board, a third DC power socket is embedded into the box body of the transmitting mechanism test unit, the third DC power socket is connected with the other input ends of the second DC-DC conversion circuit, the output end of the third power supply processing circuit is divided into a plurality of paths, the third power supply processing circuit provides working power for other units needing power supply in the transmitting mechanism test unit through the third power supply processing circuit, the third main control chip module is connected with a second conduction test unit through a second communication interface, a second communication interface module, a second control signal processing module is connected with a second transmission module, and a second control signal transmission module, the second control module is connected with a second transmission interface module, the transmitting mechanism test unit, the transmitting mechanism, the second transmission module, the second control module, the data processing module, the second transmission module, the second control module is connected with the second transmission module, the second control module, the second transmission module;
    the third power processing circuit comprises a +5V and +3.3V power conversion circuit and a +12V power conversion circuit, the +5V and +3.3V power conversion circuit comprises a VRB24S05-6W power conversion chip U2, a pin 2 of the U2 is connected with a +24V power supply, a pin 1 of the U2 is grounded, a pin 3 of the U2 is connected with normally open contacts of a double-pole double-throw switch in a relay K2, a pin 5 of the U2 is connected with normally open contacts of a double-pole double-throw switch in the relay K2, normally closed contacts 2 of the double-pole double-throw switch in the relay K2 are connected with an internal +5V power supply, normally closed contacts 2 of the double-pole double-throw switch in the relay K2 are grounded, common contacts of the double-pole double-throw switch in the relay K2 are grounded, a common contact 2 of the double-pole double-throw switch in the relay K2 is grounded, a common contact of a fourth common contact of a power supply 72, a power supply is connected with a fourth circuit of a power supply module, a power supply module is connected with a third power supply module, a power supply module with a power supply module, a power module;
    the +12V power conversion circuit comprises a VRB24S12-10W power conversion chip U3, wherein a pin 1 of U3 is grounded, a pin 2 of U3 is connected with a +24V power supply, a pin 5 of U3 is grounded, a pin 3 of U3 is divided into three paths, a path is a +12V power output end, the second path is grounded through a capacitor C10, and the third path is grounded through a capacitor C9;
    the third main control chip module comprises an AT90CAN32 type main control chip U21, a PB5 port and a PB6 port of the U21 are connected with a DO port of a data acquisition card through data acquisition cables, a PB7 port of the U21 is connected with a DI port of the data acquisition card, and data transmission is realized with upper computer software through an analog SPI communication format, four MC1413 type relay driving chips are respectively connected with IO ports of the main control chip through 74HC245 type buffers to realize control of relays, and the U21 realizes initialization configuration and clock reading of a clock chip through PA0, PA1 and PA2 ports;
    the second conduction test circuit comprises a reference voltage module, a standard resistor selection module and a plurality of channel switching relay modules, wherein DA output voltage of a data acquisition card is connected with an input end DA0 in the reference voltage module, the DA0 is divided into four paths, the th path is grounded through a capacitor C13, the second path is grounded through a capacitor C12, the third path is grounded through a reverse diode D3, the fourth path is connected with the non-inverting input end of a TL072 type low noise amplifier U4A through a resistor R4, the inverting input end of the U4A is connected with the output end of the U4A, the power supply input end of the U4A is divided into three paths, the th path is connected with a +5V power supply, the second path is grounded through a capacitor C7, the third path is grounded through a capacitor C5, the grounding end of the U4A is grounded, the output end of the U4A is divided into two paths, the th path is grounded through a capacitor C11, and the second path is;
    the input end of the standard resistor selection module is divided into five paths, the th path is divided into two paths after passing through a standard resistor R10, the th path is connected with normally open contacts of a double-pole double-throw switch in a relay K15, the second path is connected with the other normally open contacts of the double-pole double-throw switch in the relay K15, two normally closed contacts of the double-pole double-throw switch in the relay K15 are suspended, public contacts of the double-pole double-throw switch in the relay K15 are connected with the other public contacts, the end of a coil of the relay K15 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K15 is connected with driving output ends of the 141MC 3 type relay driving chip;
    the second path is divided into two paths after passing through a standard resistor R23, the path is connected with normally open contacts of a double-pole double-throw switch in a relay K20, the second path is connected with the other normally open contacts of the double-pole double-throw switch in the relay K20, two normally closed contacts of the double-pole double-throw switch in the relay K20 are suspended, common contacts of the double-pole double-throw switch in the relay K20 are connected with the other common contacts, end of coil of the relay K20 is connected with a 141 +12V direct-current power supply, and the other end of coil of the relay K20 is connected with driving output ends of the MC 3 type relay driving chip;
    the third path is divided into two paths after passing through a standard resistor R33, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K24, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in the relay K24, two normally closed branch contacts of the double-pole double-throw switch in the relay K24 are suspended, common contacts of the double-pole double-throw switch in the relay K24 are connected with the other common contacts, end of coil of the relay K24 is connected with a 141 +12V direct-current power supply, and the other end of coil of the relay K24 is connected with driving output ends of the MC 3 type relay driving chip;
    the fourth path is divided into two paths after passing through a standard resistor R34, the path is connected with normally open branch contacts of a double-pole double-throw switch in a relay K25, the second path is connected with the other normally open branch contacts of the double-pole double-throw switch in the relay K25, two normally closed branch contacts of the double-pole double-throw switch in the relay K25 are suspended, common contacts of the double-pole double-throw switch in the relay K25 are connected with the other common contacts, end of a coil of the relay K25 is connected with a +12V direct-current power supply, and the other end of the coil of the relay K25 is connected with driving output ends of the MC1413 type relay driving chip;
    the fifth path is connected with normally closed contacts of a double-pole double-throw switch in a relay K16, the other normally closed contacts of the double-pole double-throw switch in K16 are grounded, normally open contacts of the double-pole double-throw switch in K16 are connected with a live wire L, the other normally open contacts of the double-pole double-throw switch in K16 are connected with a zero line N, ends of a coil in K16 are connected with a +12V power supply, the other ends of the coil in the relay K16 are connected with driving output ends of an MC1413 type relay driving chip, two common contacts of the double-pole double-throw switch in the relay K16 are respectively connected with two common contacts of a plurality of channel switching relay module relays, the two normally closed contacts of the channel switching relay module relays are suspended, the normally open contacts of the channel switching relay module relays are connected with signal input ends of a signal processing circuit, and the normally open contacts of the channel switching relay module relays are grounded;
    the insulation test circuit comprises a power supply conversion module and an analog-digital conversion module, wherein the power supply conversion module comprises a VRB1212YMD-6WR type direct current power supply conversion chip U, a pin 1 of the U is grounded, a pin 2 of the U is connected with a +20V power supply, a pin 3 of the U is divided into four paths, wherein the output end of the +12V power supply is connected with two common contacts of a double-pole double-throw switch in a relay K, the second path is grounded through a capacitor C, the third path is grounded through a capacitor C, the fourth path is connected with the +12V power supply input end of an AD7609 type digital conversion chip U, a pin 5 of the U is grounded, two normally closed branch contacts of the double-pole double-throw switch in a relay K of a trial relay K are suspended, two normally open branch contacts of the double-pole double-throw switch in the relay K are connected with the anode of a diode D, the end of the relay K is connected with the +20V power supply, the other end of the coil is connected with the driving output end of an MC1413 type relay driving chip, the cathode of the diode D is divided into a third path is grounded through a capacitor C, the third path is connected with the ground of the high-voltage variable resistor U-RW-3, the ground of the variable resistor U-RW-3, and the variable resistor R-U is connected with the ground, the ground terminal of the RW-U, the RW-3;
    the 5 feet of the U4 are divided into three paths, the path is connected with the power supply end of a high-voltage module, the second path is connected with common contacts of a double-pole double-throw switch in a relay K3, two normally closed branch contacts of the double-pole double-throw switch in the relay K3 are suspended, the other common contacts of the double-pole double-throw switch in the relay K3 are grounded, normally open branch contacts of the double-pole double-throw switch in the relay K3 are connected with the other 2 normally open branch contacts through a resistor R25, 3 of a coil in the relay K3 is connected with a +20V power supply, the other of the normally open branch contacts is connected with driving output ends of an MC 3 type relay driving chip, the third path is connected with 4 common contacts of a double-pole double-throw switch in the relay K4, two normally closed branch contacts of the double-pole double-throw switch in the relay K4 are suspended, the other normally open branch contacts 4 of the normally open branch contacts of the double-pole double-throw switch in the relay K4 are connected with 4, and the normally open branch contacts 14172 of the relay K4 are connected with the MC4 driving chip 4 and the normally open branch contacts of the relay K4 and the;
    the input end of the range switching module is connected with two common contacts of a double-pole double-throw switch in a relay K2, normally closed branch contacts of the double-pole double-throw switch in the relay K2 are divided into four paths, a path is connected with another normally closed branch contacts of the double-pole double-throw switch in the relay K2, a second path is grounded through a resistor R16, a third path is grounded through a capacitor C23, a fourth path is connected with an end of a resistor R15, normally open branch contacts of the double-pole double-throw switch in the relay K2 are divided into three paths, a path is connected with another normally open branch contact of the double-pole double-throw switch in the relay K , a second path is grounded through a resistor R , a third path is grounded through a capacitor C , the other end of the resistor R is divided into three paths, the path is connected with a +12V power supply through a diode D , the second path is grounded through a diode D , a third path is connected with a non-phase operational amplifier U072 type operational amplifier U72, the inverting input end of the resistor U is connected with an output end of the inverter , and the inverting circuit , the inverting circuit is connected with an output end of the inverting circuit of the inverter;
    the analog-to-digital conversion module comprises an AD7609 type analog-to-digital conversion chip U3, wherein a pin 1 of the U3 IS connected with a +5V power supply, a pin 2 of the U3 IS grounded, a pin 3 of the U3 IS connected with a +5V power supply through a resistor R6, a pin 4 of the U3 IS connected with a +5V power supply through a resistor R5, a pin 5 of the U3 IS grounded, a pin 6 of the U3 IS connected with a +5V power supply through a resistor R4, a pin 7 of the U3 IS connected with a +5V power supply through a resistor R3, a pin 8 of the U3 IS connected with a pin 2 of an IS281-4GB type optical coupling module U7, pins 9 and 10 of the U3 are connected with a pin 4 of an IS281-4GB type optical coupling module U7, a pin 11 of the U3 IS connected with a pin 6 of an IS281-4GB optical coupling module U7, and a pin 12 of the U3 IS connected with a pin 281-4GB optical coupling; the 13 feet of the U3 are connected with the 2 feet of the IS281-4GB type optical coupling module U9, the 14 feet of the U3 are connected with the 4 feet of the IS281-4GB type optical coupling module U9, the 15 feet of the U3 are connected with the 6 feet of the IS281-4GB type optical coupling module U9, and the 24 feet of the U3 are connected with the 8 feet of the IS281-4GB type optical coupling module U9;
    the test unit of the emission mechanism further comprises a current detection circuit, the current detection circuit comprises a +20V current detection circuit and a-20V current detection circuit, the current detection circuit adopts a current sensor to realize the current detection of a +20V power supply loop and a-20V power supply loop, the output end of the current detection circuit is processed by an operational amplifier and then sent to an AD channel of a data acquisition card for analog-to-digital conversion, the +20V current detection circuit comprises a CSNE151-100 type current acquisition chip U9, a pin 1 of the U9 is a +20V current sampling input end, a pin 9 of the U9 is divided into three paths, a third is connected with a-12V power supply, a second path is grounded by a capacitor C45, a third path is grounded by a capacitor C47, a pin 10 of the U9 is divided into three paths, a second path is connected with the +12V power supply, a third path is grounded by a capacitor C40, a third path is grounded by a capacitor C41, a pin 11 of the U41 is divided into three paths, a third path is grounded by a resistor R41, a third path is grounded by a non-phase resistor R41, a non-phase resistor C41, a non-41 is connected with a non-phase resistor C41, a non-3 circuit is connected with a non-3 circuit, a non-phase resistor C41, a non-3 circuit is connected with a non-3 circuit, a non-3 circuit is connected with a non-41, a non-;
    the signal processing circuit comprises an operational amplifier and a peripheral circuit connected with the operational amplifier, the angular position sensor signal processing module comprises a resistor R37, the end of the resistor R37 is the signal input end of the angular position sensor signal processing module, the signal input end of the angular position sensor signal processing module is connected with the signal output end of the angular position sensor, the other end of the resistor R37 is connected with two paths, the second path is connected with the ground through a resistor R39, the third path is connected with the in-phase end of a TL type operational amplifier U8A, the reverse phase input end of the U8A is connected with the signal output end of the angular position sensor, the second path is connected with the ground through a resistor R35, the second path is connected with the ground through a resistor R39, the third path is connected with the in-phase end of a TL type operational amplifier U8U A, the second path is connected with the power supply output end of the power supply V8672, the second path is connected with the power supply V8672, the power supply V72 is connected with the ground through a resistor R8672, the power supply V72 is connected with the power supply V , the power supply V72, the power supply V is connected with the ground, the power supply V is connected with the power supply V , the power;
    the self-checking circuit of the signal self-checking circuit comprises a switch switching circuit and a self-checking signal processing circuit, the self-checking signal processing circuit comprises a resistor R86, an end of the resistor R86 is a signal input end of the self-checking signal processing circuit, the signal input end is connected with an OC2A pin of a main control chip, the other end of the resistor R86 is connected with a non-inverting input end of a TL072 type operational amplifier U26A, an inverting input end of the U26A is divided into two paths, a third A path is grounded through a resistor R A, the second path is connected with a +12V power supply through a resistor R A, a power input end of the U26A is divided into three paths, a third A path is grounded through a capacitor C A, a ground end of the U26A is divided into three paths, the ground end of the third path is connected with the +12V power supply through a capacitor C A, a third path is grounded through a capacitor C A, a ground end of the U26A is divided into three paths, an output end of the U72 is connected with the second path through a resistor TL, the non-inverting input end of the switch switching circuit A, the circuit is connected with the non-inverting input end of the switch circuit A, the non-inverting input end of the switch circuit A, the switch circuit is connected with the non-inverting input end of the switch circuit A, the non-inverting input end of the switch circuit A, the switch;
    the input end of the th switch switching circuit is divided into five paths and is respectively connected with five normally open contacts of a th double-pole double-throw switch in a relay K33, five normally closed contacts of a th double-pole double-throw switch in the relay K33 are respectively connected with the signal output end of a data acquisition card, five common contacts of a th double-pole double-throw switch in the relay K33 are respectively connected with the input end of a corresponding signal processing module, end of a coil in the relay K33 is connected with a +12V power supply, and the other end of the coil in the relay K33 is connected with driving output ends of the MC1413 type relay driving chip;
    the input end of the second switch switching circuit is divided into six paths, and the six paths are respectively connected with six normally-open contacts of a second six-pole double-throw switch in a relay K34, six normally-closed contacts of the second six-pole double-throw switch in the relay K34 are respectively connected with a signal output end of a data acquisition card, six common contacts of the second six-pole double-throw switch in the relay K34 are respectively connected with the input end of a corresponding signal processing module, of a coil in the relay K34 is connected with a +12V power supply, and the other end of the coil in the relay K34 is connected with driving output ends of an MC1413 type relay driving chip.
  9. 9. The missile test system according to claim 1, wherein the target simulation turret (6) comprises a target simulation turret body (15) and a control circuit board (16) located in the body, the control circuit board comprises a main control module, the main control module is suspended by using an AT90CAN type main control chip U, pins 1 to 4, pins 6 to 10, pins 18 to 19, pins 25 to 26, pins 32 to 34, pin 43 and pin 45 to 51 of the U, pins 5 and 15 of the U are connected to a computer measurement and control unit, pin 11 of the U is connected to pin 10 of a TMC429-SOP type stepping motor control chip U, pin 16 of a TMC260-PA type horizontal stepping motor drive chip U and pin 16 of a TMC260-PA type vertical stepping motor drive chip U through a resistor R, pin 12 of the U is connected to pin 11 of the U, pin 15 of the U and pin 15 of the U through a resistor R, pin 13 of the U is connected to pin 12 of the VCC, pin 14 of the U, pin 14, pin 42 of the U is connected to a resistor R, pin 19 of the U is connected to a transistor U, pin 19 of the U is connected to a resistor R and a transistor Q of the U is connected to a transistor U, a resistor R is connected to a transistor Q of the transistor U19, a resistor R is connected to a transistor U19, a resistor R of the transistor U19, a resistor R is connected to a transistor U19 of the transistor U19, a transistor U is connected to a transistor U19, a transistor U19 is connected to a transistor U19, a transistor U19 is connected to a transistor U19, a transistor U19 to a transistor U terminal of the resistor R42, a transistor U19 to;
    the 61 pin of the U2 is divided into three paths, the path is grounded through a capacitor C10, the second path is grounded through a resistor R8, the third path is connected with a end of the resistor R7, the other end of the resistor R7 is divided into two paths, the path is a +20V power output end, the second path is connected with a2 pin of a WRB2405S-3WR2 type voltage conversion chip U1, the 6 pin of the U1 is grounded, the 5 pin of the U1 is divided into four paths, the path is grounded through a capacitor C5, the second path is grounded through a capacitor C6, the third path is connected with a end of the resistor R4, the fourth path is a power output end, and the other end of the resistor R4 is grounded through a light emitting diode LED 1;
    a pin 60 of the U2 is connected to a end of a resistor R6, another end of the resistor R6 is divided into three paths, a 0 th path is connected to a moving end of a variable resistor R5, a second path is connected to a collector of a triode Q1, a third path is grounded via a capacitor C8, another 1 end of the resistor R5 is divided into five paths via a resistor R1, a th path is grounded via a capacitor C2, a second path is grounded via a capacitor C3, a third path is connected to a end of a resistor R2, a fourth path is connected to an end of the resistor R3, a fifth path is grounded via a power supply VCC, an emitter of the triode Q1 is grounded, a base of the triode Q1 is divided into two paths, a th path is grounded via a capacitor C9, the second path is respectively connected to a end of the capacitor C7 and another end of the resistor R2, another end of the resistor R3 is connected to another end of the capacitor C7 and then connected to an audio signal acquisition module;
    the 15 feet of the U3 are connected with the 42 feet of the U5, the 16 feet of the U3 are connected with the 41 feet of the U5, the 17 feet of the U3 are connected with the 42 feet of the U6, and the 23 feet of the U3 are connected with the 41 feet of the U6.
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