CN110734683A - Preparation method of water-based inorganic high-temperature-resistant inorganic nano epoxy coating - Google Patents
Preparation method of water-based inorganic high-temperature-resistant inorganic nano epoxy coating Download PDFInfo
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 104
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229920006334 epoxy coating Polymers 0.000 title claims description 18
- 239000002002 slurry Substances 0.000 claims abstract description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000004593 Epoxy Substances 0.000 claims abstract description 28
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 28
- 239000000839 emulsion Substances 0.000 claims abstract description 17
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 12
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 12
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 239000013008 thixotropic agent Substances 0.000 claims description 32
- 239000002518 antifoaming agent Substances 0.000 claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 238000002156 mixing Methods 0.000 claims description 26
- 238000000227 grinding Methods 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 25
- 239000011230 binding agent Substances 0.000 claims description 24
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 20
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 15
- 229910021641 deionized water Inorganic materials 0.000 claims description 15
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 15
- -1 polysiloxane Polymers 0.000 claims description 12
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 239000007822 coupling agent Substances 0.000 claims description 10
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 10
- 239000002270 dispersing agent Substances 0.000 claims description 10
- 239000012153 distilled water Substances 0.000 claims description 10
- 239000012767 functional filler Substances 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 10
- 238000009210 therapy by ultrasound Methods 0.000 claims description 10
- 239000002562 thickening agent Substances 0.000 claims description 10
- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 claims description 10
- 238000009736 wetting Methods 0.000 claims description 10
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 10
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004111 Potassium silicate Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052912 lithium silicate Inorganic materials 0.000 claims description 3
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical class O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000012752 auxiliary agent Substances 0.000 abstract description 2
- 239000003085 diluting agent Substances 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 231100000331 toxic Toxicity 0.000 abstract description 2
- 230000002588 toxic effect Effects 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000006115 industrial coating Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a preparation method of aqueous inorganic high-temperature-resistant inorganic nano epoxy paint, which takes graphene slurry and aqueous epoxy emulsion as main raw materials, magnesium oxide and rare earth oxide are added for oxidation resistance, the high-temperature resistance is improved by steps, and the graphene aqueous epoxy static-conductive anticorrosive paint takes water and water-soluble auxiliary agent as diluents, has no other toxic and harmful organic solvents, and is safe and environment-friendly.
Description
Technical Field
The invention relates to the technical field of industrial coatings, in particular to a preparation method of waterborne inorganic high-temperature-resistant inorganic nano epoxy coatings.
Background
The nanometer particles have wide application prospect in the aspects of sintering, catalysis, sensing, ceramic toughening and the like of magnetic materials, electronic materials, optical materials and high-density materials.
In some special industries, for example, steel making, etc., high temperature resistant coatings are required.
The graphene based on the properties of the graphene is applied to the fields of reinforcing, wear-resistant coatings and the like by , shows great scientific research and practical utilization values, utilizes the characteristics of the graphene, and can play the roles of effectively preventing static electricity, resisting wear, preventing water, preventing corrosion, resisting high temperature and the like when added into the coating.
Disclosure of Invention
The invention aims to provide a preparation method of waterborne inorganic high-temperature-resistant inorganic nano epoxy coatings.
The invention adopts the following technical scheme.
The preparation method of the water-based inorganic high-temperature-resistant inorganic nano epoxy coating is characterized by comprising the following steps:
step S1, preparing a raw material, wherein the raw material consists of A, B two components;
the component A comprises the following components in parts by weight: 5-10% of distilled water, 5-10% of propylene glycol methyl ether, 5-10% of dipropylene glycol methyl ether, 0.5-0.75% of water-based dispersing agent, 0.05-0.15% of defoaming agent, 0.5-0.75% of water-based thixotropic agent, 2.5-5% of magnesium oxide, 5-10% of rare earth oxide, 2.5-5% of talcum powder, 2.5-5% of zinc phosphate, 2.5-5% of aluminum tripolyphosphate, 2.5-5% of precipitated barium sulfate, 1-2.5% of anti-settling agent, 0.1-0.2% of wetting and leveling agent, 0.5-1% of defoaming agent, 45-55% of water-based epoxy emulsion and 0.1-0.2% of thickening agent;
the component B comprises the following components in parts by weight: 10-30% of water-based inorganic silicate binder, 0.5-1% of polysiloxane coupling agent, 0.5-1.5% of graphene powder, 5-15% of nano functional filler, 0.5-1% of water-based thixotropic agent, 40-50% of deionized water, 0.5-1% of defoaming agent and 20-30% of water-based epoxy curing agent.
Step S2, preparing component A:
step S2.1, uniformly mixing distilled water, propylene glycol methyl ether, dipropylene glycol methyl ether, a water-based dispersant, a defoaming agent and a water-based thixotropic agent;
s2.2, dispersing the mixture prepared in the step S2.1 at 1000-1500 r/min, gradually adding magnesium oxide, rare earth oxide, talcum powder, zinc phosphate, aluminum tripolyphosphate and precipitated barium sulfate in the dispersing process, and then carrying out ultrasonic treatment for 50-70 minutes;
step S2.3, grinding the mixture uniformly stirred and dispersed in the step S2.2 to the fineness of less than 25 microns;
s2.4, continuously adding an anti-settling agent, a wetting and leveling agent, a defoaming agent and a water-based epoxy emulsion into the mixture ground in the step S2.3, uniformly stirring, and performing ultrasonic treatment for 50-70 minutes;
s2.5, continuously adding the thickening agent to adjust the viscosity, uniformly stirring, and filtering to obtain a component A;
step S3, preparing component B:
step S3.1, dispersing part of deionized water and polysiloxane coupling agent at a medium speed of 600-800 r/min, adding graphene powder and nano functional filler, dispersing at a high speed, dispersing by ultrasonic waves, placing the slurry in a nano grinder, and grinding at a high speed until the fineness of the slurry is lower than 25 microns to obtain water-based graphene slurry;
s3.2, mixing the aqueous inorganic silicate binder with part of deionized water, adding the aqueous thixotropic agent under the stirring condition, dispersing at 600-800 r/min, and then dispersing at a high speed of 1000-1500 r/min to prepare a dispersion slurry;
s3.3, mixing the dispersed slurry and the aqueous graphene slurry in a nano grinder, and grinding at a high speed of 2000-2500 r/min to prepare grinding slurry;
and step S3.4, mixing the grinding slurry, the defoaming agent and the water-based epoxy curing agent, and stirring at a medium speed to obtain the component B.
Step S4, mixing A, B components to prepare a finished product:
adding the component A mixed solution prepared in the step S2 into the component B in the step S3, wherein the component A comprises the following components in parts by weight according to A, B: the component B is 1: 2-4, and stirring for 0.5-1 h at 1000-1500 r/min to obtain the water-based inorganic high-temperature-resistant inorganic nano epoxy coating.
, the aqueous epoxy emulsion is prepared from at least of epoxy resin, Zhongnan Asia 128 resin and Xika resin.
, the water inorganic silicate binder is at least any of high temperature resistant nano modified inorganic sodium silicate binder, high temperature resistant nano modified inorganic potassium silicate binder or high temperature resistant nano modified inorganic lithium silicate binder.
, wherein the aqueous thixotropic agent is an aqueous organosilicon modified bentonite thixotropic agent or a fumed silica thixotropic agent.
, the nanometer function material is at least any of nanometer zinc oxide, nanometer titanium oxide, nanometer aluminum oxide or nanometer zirconium oxide.
The graphene composite material has the beneficial effects that 1, the graphene composite material can resist high temperature, water and a water-soluble auxiliary agent are used as diluents, other toxic and harmful organic solvents are not contained, the graphene composite material is safe and environment-friendly, and 2, the added magnesium oxide and the rare earth oxide have an anti-oxidation function and can resist high temperature in step .
Detailed Description
The invention is further described with reference to the following examples.
Example 1
The preparation method of the water-based inorganic high-temperature-resistant inorganic nano epoxy coating comprises the following steps:
step S1, preparing a raw material, wherein the raw material consists of A, B two components;
the component A comprises the following components in parts by weight: 10% of distilled water, 5% of propylene glycol methyl ether, 5% of dipropylene glycol methyl ether, 0.5% of water-based dispersant, 0.05% of defoaming agent, 0.5% of water-based thixotropic agent, 2.5% of magnesium oxide, 5% of rare earth oxide, 5% of talcum powder, 5% of zinc phosphate, 2.5% of aluminum tripolyphosphate, 2.5% of precipitated barium sulfate, 1% of anti-settling agent, 0.1% of wetting and leveling agent, 0.5% of defoaming agent, 54.75% of water-based epoxy emulsion and 0.1% of thickening agent;
the component B comprises the following components in parts by weight: 30% of water-based inorganic silicate binder, 0.5% of polysiloxane coupling agent, 0.5% of graphene powder, 5% of nano functional filler, 0.5% of water-based thixotropic agent, 43% of deionized water, 0.5% of defoaming agent and 20% of water-based epoxy curing agent.
Step S2, preparing component A:
step S2.1, uniformly mixing distilled water, propylene glycol methyl ether, dipropylene glycol methyl ether, a water-based dispersant, a defoaming agent and a water-based thixotropic agent;
s2.2, dispersing the mixture prepared in the step S2.1 at 1000r/min, gradually adding magnesium oxide, rare earth oxide, talcum powder, zinc phosphate, aluminum tripolyphosphate and precipitated barium sulfate in the dispersing process, and then carrying out ultrasonic treatment for 50 minutes;
step S2.3, grinding the mixture uniformly stirred and dispersed in the step S2.2 to the fineness of less than 25 microns;
s2.4, continuously adding an anti-settling agent, a wetting and leveling agent, a defoaming agent and water-based epoxy emulsion into the mixture ground in the step S2.3, uniformly stirring, and performing ultrasonic treatment for 50 minutes;
s2.5, continuously adding the thickening agent to adjust the viscosity, uniformly stirring, and filtering to obtain a component A;
step S3, preparing component B:
s3.1, dispersing part of deionized water and a polysiloxane coupling agent at a medium speed of 600r/min, adding graphene powder and a nano functional filler, dispersing at a high speed, dispersing by ultrasonic waves, and grinding the slurry in a nano grinder at a high speed until the fineness of the slurry is lower than 25 microns to prepare aqueous graphene slurry;
s3.2, mixing the aqueous inorganic silicate binder with part of deionized water, adding the aqueous thixotropic agent under the stirring condition, dispersing at 600r/min, and then dispersing at a high speed of 1000r/min to prepare a dispersion slurry;
s3.3, mixing the dispersed slurry and the aqueous graphene slurry in a nano grinder, and grinding at a high speed of 2000r/min to prepare grinding slurry;
and step S3.4, mixing the grinding slurry, the defoaming agent and the water-based epoxy curing agent, and stirring at a medium speed to obtain the component B.
Step S4, mixing A, B components to prepare a finished product:
adding the component A mixed solution prepared in the step S2 into the component B in the step S3, wherein the component A comprises the following components in parts by weight according to A, B: the component B is 1: 2, stirring for 0.5h at 1000r/min to obtain the water-based inorganic high-temperature-resistant inorganic nano epoxy coating.
The waterborne epoxy emulsion is prepared from epoxy resin, south Asia 128 resin.
The water-based inorganic silicate binder is a high-temperature-resistant nano modified inorganic sodium silicate binder.
The water-based thixotropic agent is a water-based organic silicon modified bentonite thixotropic agent.
The nano functional material is nano zinc oxide.
Example 2
The preparation method of the water-based inorganic high-temperature-resistant inorganic nano epoxy coating comprises the following steps:
step S1, preparing a raw material, wherein the raw material consists of A, B two components;
the component A comprises the following components in parts by weight: 5% of distilled water, 5% of propylene glycol methyl ether, 5% of dipropylene glycol methyl ether, 0.5% of water-based dispersant, 0.15% of defoaming agent, 0.5% of water-based thixotropic agent, 5% of magnesium oxide, 10% of rare earth oxide, 2.5% of talcum powder, 2.5% of zinc phosphate, 5% of aluminum tripolyphosphate, 5% of precipitated barium sulfate, 2.5% of anti-settling agent, 0.2% of wetting and leveling agent, 1% of defoaming agent, 49.95% of water-based epoxy emulsion and 0.2% of thickening agent;
the component B comprises the following components in parts by weight: 15% of water-based inorganic silicate binder, 1% of polysiloxane coupling agent, 1.5% of graphene powder, 15% of nano functional filler, 1% of water-based thixotropic agent, 40.5% of deionized water, 1% of defoaming agent and 25% of water-based epoxy curing agent.
Step S2, preparing component A:
step S2.1, uniformly mixing distilled water, propylene glycol methyl ether, dipropylene glycol methyl ether, a water-based dispersant, a defoaming agent and a water-based thixotropic agent;
s2.2, dispersing the mixture prepared in the step S2.1 at 1500r/min, gradually adding magnesium oxide, rare earth oxide, talcum powder, zinc phosphate, aluminum tripolyphosphate and precipitated barium sulfate in the dispersing process, and then carrying out ultrasonic treatment for 70 minutes;
step S2.3, grinding the mixture uniformly stirred and dispersed in the step S2.2 to the fineness of less than 25 microns;
s2.4, continuously adding an anti-settling agent, a wetting and leveling agent, a defoaming agent and water-based epoxy emulsion into the mixture ground in the step S2.3, uniformly stirring, and performing ultrasonic treatment for 70 minutes;
s2.5, continuously adding the thickening agent to adjust the viscosity, uniformly stirring, and filtering to obtain a component A;
step S3, preparing component B:
s3.1, dispersing part of deionized water and a polysiloxane coupling agent at a medium speed of 800r/min, adding graphene powder and a nano functional filler, dispersing at a high speed, dispersing by ultrasonic waves, and grinding the slurry in a nano grinder at a high speed until the fineness of the slurry is lower than 25 microns to prepare aqueous graphene slurry;
s3.2, mixing the aqueous inorganic silicate binder with part of deionized water, adding the aqueous thixotropic agent under the stirring condition, dispersing at 800r/min, and then dispersing at a high speed of 1500r/min to prepare a dispersion slurry;
s3.3, mixing the dispersed slurry and the aqueous graphene slurry in a nano grinder, and grinding at a high speed of 2500r/min to prepare grinding slurry;
and step S3.4, mixing the grinding slurry, the defoaming agent and the water-based epoxy curing agent, and stirring at a medium speed to obtain the component B.
Step S4, mixing A, B components to prepare a finished product:
adding the component A mixed solution prepared in the step S2 into the component B in the step S3, wherein the component A comprises the following components in parts by weight according to A, B: the component B is 1: 4, stirring at 1500r/min for 1h to obtain the water-based inorganic high-temperature-resistant inorganic nano epoxy coating.
The water-based epoxy emulsion is prepared from a cika resin.
The water-based inorganic silicate binder is a high-temperature-resistant nano modified inorganic potassium silicate binder.
The water-based thixotropic agent is a fumed silica thixotropic agent.
The nano functional material is nano alumina and nano zirconia.
Example 3
The preparation method of the water-based inorganic high-temperature-resistant inorganic nano epoxy coating comprises the following steps:
step S1, preparing a raw material, wherein the raw material consists of A, B two components;
the component A comprises the following components in parts by weight: 8% of distilled water, 8% of propylene glycol methyl ether, 5% of dipropylene glycol methyl ether, 0.5% of water-based dispersant, 0.15% of defoaming agent, 0.5% of water-based thixotropic agent, 4% of magnesium oxide, 8% of rare earth oxide, 4% of talcum powder, 4% of zinc phosphate, 4% of aluminum tripolyphosphate, 4% of precipitated barium sulfate, 2% of anti-settling agent, 0.15% of wetting and leveling agent, 1% of defoaming agent, 46.5% of water-based epoxy emulsion and 0.2% of thickening agent;
the component B comprises the following components in parts by weight: 20% of water-based inorganic silicate binder, 1% of polysiloxane coupling agent, 1% of graphene powder, 10% of nano functional filler, 1% of water-based thixotropic agent, 41% of deionized water, 1% of defoaming agent and 25% of water-based epoxy curing agent.
Step S2, preparing component A:
step S2.1, uniformly mixing distilled water, propylene glycol methyl ether, dipropylene glycol methyl ether, a water-based dispersant, a defoaming agent and a water-based thixotropic agent;
s2.2, dispersing the mixture prepared in the step S2.1 at 1250r/min, gradually adding magnesium oxide, rare earth oxide, talcum powder, zinc phosphate, aluminum tripolyphosphate and precipitated barium sulfate in the dispersing process, and then carrying out ultrasonic treatment for 60 minutes;
step S2.3, grinding the mixture uniformly stirred and dispersed in the step S2.2 to the fineness of less than 25 microns;
s2.4, continuously adding an anti-settling agent, a wetting and leveling agent, a defoaming agent and water-based epoxy emulsion into the mixture ground in the step S2.3, uniformly stirring, and performing ultrasonic treatment for 60 minutes;
s2.5, continuously adding the thickening agent to adjust the viscosity, uniformly stirring, and filtering to obtain a component A;
step S3, preparing component B:
s3.1, dispersing part of deionized water and a polysiloxane coupling agent at a medium speed of 700r/min, adding graphene powder and a nano functional filler, dispersing at a high speed, dispersing by ultrasonic waves, and grinding the slurry in a nano grinder at a high speed until the fineness of the slurry is lower than 25 microns to prepare aqueous graphene slurry;
s3.2, mixing the aqueous inorganic silicate binder with part of deionized water, adding the aqueous thixotropic agent under the stirring condition, dispersing at 700r/min, and then dispersing at 1250r/min at a high speed to prepare a dispersion slurry;
step S3.3, mixing the dispersed slurry and the aqueous graphene slurry in a nano grinder, and grinding at a high speed of 2250r/min to prepare grinding slurry;
and step S3.4, mixing the grinding slurry, the defoaming agent and the water-based epoxy curing agent, and stirring at a medium speed to obtain the component B.
Step S4, mixing A, B components to prepare a finished product:
adding the component A mixed solution prepared in the step S2 into the component B in the step S3, wherein the component A comprises the following components in parts by weight according to A, B: the component B is 1: 3, stirring at 1250r/min for 0.75h to obtain the water-based inorganic high-temperature-resistant inorganic nano epoxy coating.
The water-based epoxy emulsion is an emulsion formed by mixing epoxy resin, south Asia 128 resin and west Ka resin.
The water-based inorganic silicate binder is a high-temperature-resistant nano modified inorganic lithium silicate binder.
The water-based thixotropic agent is a water-based organic silicon modified bentonite thixotropic agent.
The nano functional material is a mixture of nano zinc oxide, nano titanium oxide and nano aluminum oxide.
It is to be noted and understood that various modifications and improvements can be made to the invention described in detail above without departing from the spirit and scope of the invention as claimed. Accordingly, the scope of the claimed subject matter is not limited by any of the specific exemplary teachings provided.
Claims (5)
1. The preparation method of the water-based inorganic high-temperature-resistant inorganic nano epoxy coating is characterized by comprising the following steps:
step S1, preparing a raw material, wherein the raw material consists of A, B two components;
the component A comprises the following components in parts by weight: 5-10% of distilled water, 5-10% of propylene glycol methyl ether, 5-10% of dipropylene glycol methyl ether, 0.5-0.75% of water-based dispersing agent, 0.05-0.15% of defoaming agent, 0.5-0.75% of water-based thixotropic agent, 2.5-5% of magnesium oxide, 5-10% of rare earth oxide, 2.5-5% of talcum powder, 2.5-5% of zinc phosphate, 2.5-5% of aluminum tripolyphosphate, 2.5-5% of precipitated barium sulfate, 1-2.5% of anti-settling agent, 0.1-0.2% of wetting and leveling agent, 0.5-1% of defoaming agent, 45-55% of water-based epoxy emulsion and 0.1-0.2% of thickening agent;
the component B comprises the following components in parts by weight: 10-30% of water-based inorganic silicate binder, 0.5-1% of polysiloxane coupling agent, 0.5-1.5% of graphene powder, 5-15% of nano functional filler, 0.5-1% of water-based thixotropic agent, 40-50% of deionized water, 0.5-1% of defoaming agent and 20-30% of water-based epoxy curing agent;
step S2, preparing component A:
step S2.1, uniformly mixing distilled water, propylene glycol methyl ether, dipropylene glycol methyl ether, a water-based dispersant, a defoaming agent and a water-based thixotropic agent;
s2.2, dispersing the mixture prepared in the step S2.1 at 1000-1500 r/min, gradually adding magnesium oxide, rare earth oxide, talcum powder, zinc phosphate, aluminum tripolyphosphate and precipitated barium sulfate in the dispersing process, and then carrying out ultrasonic treatment for 50-70 minutes;
step S2.3, grinding the mixture uniformly stirred and dispersed in the step S2.2 to the fineness of less than 25 microns;
s2.4, continuously adding an anti-settling agent, a wetting and leveling agent, a defoaming agent and a water-based epoxy emulsion into the mixture ground in the step S2.3, uniformly stirring, and performing ultrasonic treatment for 50-70 minutes;
s2.5, continuously adding the thickening agent to adjust the viscosity, uniformly stirring, and filtering to obtain a component A;
step S3, preparing component B:
step S3.1, dispersing part of deionized water and polysiloxane coupling agent at a medium speed of 600-800 r/min, adding graphene powder and nano functional filler, dispersing at a high speed, dispersing by ultrasonic waves, placing the slurry in a nano grinder, and grinding at a high speed until the fineness of the slurry is lower than 25 microns to obtain water-based graphene slurry;
s3.2, mixing the aqueous inorganic silicate binder with part of deionized water, adding the aqueous thixotropic agent under the stirring condition, dispersing at 600-800 r/min, and then dispersing at a high speed of 1000-1500 r/min to prepare a dispersion slurry;
s3.3, mixing the dispersed slurry and the aqueous graphene slurry in a nano grinder, and grinding at a high speed of 2000-2500 r/min to prepare grinding slurry;
step S3.4, mixing the grinding slurry, the defoaming agent and the water-based epoxy curing agent, and stirring at medium speed to obtain a component B;
step S4, mixing A, B components to prepare a finished product:
adding the component A mixed solution prepared in the step S2 into the component B in the step S3, wherein the component A comprises the following components in parts by weight according to A, B: the component B is 1: 2-4, and stirring for 0.5-1 h at 1000-1500 r/min to obtain the water-based inorganic high-temperature-resistant inorganic nano epoxy coating.
2. The method for preparing the aqueous inorganic high temperature resistant inorganic nano epoxy coating according to claim 1, wherein the aqueous inorganic silicate binder is at least any kinds of high temperature resistant nano modified inorganic sodium silicate binder, high temperature resistant nano modified inorganic potassium silicate binder or high temperature resistant nano modified inorganic lithium silicate binder.
3. The method for preparing the aqueous inorganic high temperature resistant inorganic nano epoxy coating according to claim 1, wherein the aqueous epoxy emulsion is prepared from at least of epoxy resins including 128 resins in south China Asia and west Ka resins.
4. The preparation method of the aqueous inorganic high temperature resistant inorganic nano epoxy coating according to claim 1, wherein the aqueous thixotropic agent is an aqueous organosilicon modified bentonite thixotropic agent or a fumed silica thixotropic agent.
5. The preparation method of the water-based inorganic high temperature resistant inorganic nano epoxy coating according to claim 1, wherein the nano functional material is at least any kinds of nano zinc oxide, nano titanium oxide, nano aluminum oxide or nano zirconium oxide.
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