CN110732805A - Cleaning-free soldering flux for high-density assembly parts and preparation method thereof - Google Patents
Cleaning-free soldering flux for high-density assembly parts and preparation method thereof Download PDFInfo
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- CN110732805A CN110732805A CN201811204961.9A CN201811204961A CN110732805A CN 110732805 A CN110732805 A CN 110732805A CN 201811204961 A CN201811204961 A CN 201811204961A CN 110732805 A CN110732805 A CN 110732805A
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- parts
- soldering flux
- mixing
- corrosion inhibitor
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
The invention provides a cleaning-free soldering flux for high-density assembly parts and a preparation method thereof, wherein the cleaning-free soldering flux comprises the following components in parts by weight: 4-9 parts of mercaptoethanol, 7-11 parts of an active agent, 30-40 parts of a film forming agent, 1-3 parts of potassium dichromate, 6-10 parts of a surfactant, 1-4 parts of zinc dihydrogen phosphate, 2.7-4.5 parts of sodium molybdate, 3-6 parts of triethanolamine, 5-11 parts of a corrosion inhibitor, 13-17 parts of ethylene glycol butyl ether, 8-12 parts of 1, 4-butanediol and 75-95 parts of deionized water. The soldering flux prepared by the invention has stable property, no delamination, good spreadability and low corrosivity, and can meet the requirements of industrial application.
Description
Technical Field
The invention relates to the field of soldering flux, in particular to a cleaning-free soldering flux for high-density assembly parts and a preparation method thereof.
Background
The invention provides no-clean soldering flux for high-density assembly parts and a preparation method thereof, wherein the obtained soldering flux has stable property, good spreadability and low corrosivity, and can meet the requirements of industrial application.
Disclosure of Invention
The technical problem to be solved is as follows:
the invention aims to provide kinds of no-clean soldering flux for high-density assembly parts and a preparation method thereof, and the obtained soldering flux has stable property, no delamination, good spreadability and low corrosivity and can meet the requirements of industrial application.
The technical scheme is as follows:
the invention provides a cleaning-free soldering flux for high-density assembly parts, which comprises the following components in parts by weight:
4-9 parts of mercaptoethanol,
7-11 parts of an active agent,
30-40 parts of film-forming agent,
1-3 parts of potassium dichromate,
6-10 parts of surfactant,
1-4 parts of zinc dihydrogen phosphate,
2.7 to 4.5 portions of sodium molybdate,
3-6 parts of triethanolamine,
5-11 parts of corrosion inhibitor,
13-17 parts of ethylene glycol butyl ether,
8-12 parts of 1, 4-butanediol,
75-95 parts of deionized water.
Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3.
Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing alkylphenol ethoxylates, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6.
Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing aluminum chloride and potassium fluoride according to a ratio of 2: 0.8.
Preferably, the high-density assembly part is a no-clean soldering flux, and the film forming agent is organosilicon modified acrylic resin.
The invention also provides a preparation method of the cleaning-free soldering flux for the high-density assembly part, which comprises the following preparation steps:
(1) mixing 7-11 parts of an active agent and 30-40 parts of a film forming agent uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 75-95 parts of deionized water, 6-10 parts of a surfactant, 13-17 parts of butyl cellosolve and 8-12 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 4-9 parts of mercaptoethanol, 1-3 parts of potassium dichromate, 2.7-4.5 parts of sodium molybdate and 5-11 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 3-6 parts of triethanolamine and 1-4 parts of zinc phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
Has the advantages that:
(1) the soldering flux prepared by the invention has stable property, no delamination, good spreadability and low corrosivity, and can meet the requirements of industrial application.
(2) The mercaptoethanol is added in the corrosion inhibitor, so that the corrosion inhibitor can be adsorbed to the surface of metal to form an ordered self-assembled film, and a good corrosion inhibition effect is achieved.
(3) The addition of the components with the slow release effect can play a good protection role and reduce the corrosion of the residues after welding on elements.
(4) The invention selects the ethylene glycol monobutyl ether and the 1, 4-butanediol to be compounded as the solvent, has proper viscosity, ensures that all components can be uniformly dispersed, and can play a good role in protecting the welding surface.
Detailed Description
The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the invention in any way.
Example 1
(1) Uniformly mixing 11 parts of an active agent and 30 parts of organic silicon modified acrylic resin, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 95 parts of deionized water, 6 parts of a surfactant, 17 parts of butyl cellosolve and 8 parts of 1, 4-butanediol, and stirring for 20min until uniformly mixing;
(2) and (2) continuously adding 9 parts of mercaptoethanol, 1 part of potassium dichromate, 4.5 parts of sodium molybdate and 5 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 6 parts of triethanolamine and 1 part of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Example 2
(1) Mixing 7 parts of an active agent and 40 parts of organic silicon modified acrylic resin uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 75 parts of deionized water, 10 parts of a surfactant, 13 parts of butyl cellosolve and 12 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 4 parts of mercaptoethanol, 3 parts of potassium dichromate, 2.7 parts of sodium molybdate and 11 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 3 parts of triethanolamine and 4 parts of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Example 3
(1) Mixing 10 parts of an active agent and 34 parts of organic silicon modified acrylic resin uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 90 parts of deionized water, 7 parts of a surfactant, 16 parts of butyl cellosolve and 9 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 8 parts of mercaptoethanol, 1.5 parts of potassium dichromate, 3.8 parts of sodium molybdate and 6 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 5 parts of triethanolamine and 2 parts of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Example 4
(1) Mixing 8 parts of an active agent and 36 parts of organic silicon modified acrylic resin uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 80 parts of deionized water, 9 parts of a surfactant, 14 parts of butyl cellosolve and 11 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 5 parts of mercaptoethanol, 2.5 parts of potassium dichromate, 3.4 parts of sodium molybdate and 10 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 4 parts of triethanolamine and 3 parts of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Example 5
(1) Mixing 9 parts of an active agent and 35 parts of organic silicon modified acrylic resin uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 85 parts of deionized water, 8 parts of a surfactant, 15 parts of butyl cellosolve and 10 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 6.5 parts of mercaptoethanol, 2 parts of potassium dichromate, 3.6 parts of sodium molybdate and 8 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 4.5 parts of triethanolamine and 2.5 parts of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Comparative example 1
This comparative example differs from example 1 in the active agent. Specifically, the method comprises the following steps:
(1) uniformly mixing 11 parts of an active agent and 30 parts of organic silicon modified acrylic resin, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 95 parts of deionized water, 6 parts of a surfactant, 17 parts of butyl cellosolve and 8 parts of 1, 4-butanediol, and stirring for 20min until uniformly mixing;
(2) and (2) continuously adding 9 parts of mercaptoethanol, 1 part of potassium dichromate, 4.5 parts of sodium molybdate and 5 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 6 parts of triethanolamine and 1 part of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 3:2: 2; the surfactant is formed by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6; the corrosion inhibitor is prepared by mixing aluminum chloride and potassium fluoride according to the ratio of 2: 0.8.
Comparative example 2
This comparative example differs from example 1 in that it does not contain a corrosion inhibitor. Specifically, the method comprises the following steps:
(1) uniformly mixing 11 parts of an active agent and 30 parts of organic silicon modified acrylic resin, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 95 parts of deionized water, 6 parts of a surfactant, 17 parts of butyl cellosolve and 8 parts of 1, 4-butanediol, and stirring for 20min until uniformly mixing;
(2) and (2) continuously adding 9 parts of mercaptoethanol, 1 part of potassium dichromate, 4.5 parts of sodium molybdate and 5 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 6 parts of triethanolamine and 1 part of zinc dihydrogen phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
The active agent is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3; the surfactant is prepared by mixing alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6.
The no-clean fluxes prepared in examples 1 to 5 and comparative examples 1 to 2, which were applied to high-density assembled parts, were subjected to a performance test using an SWB-2 wetting force meter for a wetting performance test.
Appearance, physical stability test: stirring the soldering flux for a few minutes, then sealing and freezing to 6 ℃, keeping for 1 hour, observing whether layered crystals are separated out or not, judging that the surface is qualified if the phenomena do not occur, then exposing the soldering flux in a 45 ℃ oven, keeping for 1 hour, observing whether the layer is separated out or not, and judging that the surface is qualified if the layer is not separated out.
And (3) a corrosion test adopts a weight loss measurement method, a copper sheet and Sn3Ag2.8Cu solder are respectively immersed in the soldering flux, 10% of water is added, the water bath at 50 ℃ is carried out, the treatment is carried out for 40h, 80h and 130h respectively, the treated copper sheet is taken out, cleaned and dried, and the initial weight of the copper sheet is weighed. As a result, weight loss per unit area (mg/cm)2) And (4) showing.
The test results are given in the following table:
TABLE 1
TABLE 2
According to test results, the cleaning-free soldering flux applied to high-density assembled parts, prepared by the method, has the advantages of good stability, good wetting effect and low corrosivity, and can meet the use requirements. The formula in example 5 is the best formula in the invention, and the soldering flux prepared according to the formula in example 5 has the advantages of 0.76s of wetting time, 6.87mN of wetting force and lower corrosiveness to copper sheets and Sn3Ag2.8Cu solders.
From the test results of comparative example 1 and example 1, it can be seen that H in the carboxyl group of the organic acid+Neutralization reaction with copper oxide to generate weak acid salts, which can be dissolved in generated water, thereby enabling better contact between the solder ball and the copper and good wetting between the soldering flux and the copper plate, when the ratio of butanediamine, DL-malic acid and anhydrous citric acid is 2:1:3, the wetting property of the soldering flux is best, and the corrosion is low, as measured by comparative example 2 and example 2Test results show that the aluminum chloride and the potassium fluoride are added, so that potassium, fluorine and nitrogen elements exist on the surface of the device, the oxide on the surface of the device can be stripped, a compact film is formed, and the surface of the device is not oxidized.
Claims (6)
1. The cleaning-free soldering flux for the high-density assembly part is characterized by comprising the following components in parts by weight:
4-9 parts of mercaptoethanol,
7-11 parts of an active agent,
30-40 parts of film-forming agent,
1-3 parts of potassium dichromate,
6-10 parts of surfactant,
1-4 parts of zinc dihydrogen phosphate,
2.7 to 4.5 portions of sodium molybdate,
3-6 parts of triethanolamine,
5-11 parts of corrosion inhibitor,
13-17 parts of ethylene glycol butyl ether,
8-12 parts of 1, 4-butanediol,
75-95 parts of deionized water.
2. The no-clean flux for high-density assembly parts according to claim 1, wherein the active agent is a mixture of ammonium succinate, DL-malic acid and anhydrous citric acid in a weight ratio of 2:1: 3.
3. The no-clean soldering flux for high-density assembly parts according to claim 1, wherein the surfactant is prepared by mixing alkylphenol ethoxylate, sodium fatty alcohol polyoxyethylene sulfonate and sucrose ester according to a ratio of 1.1:2: 2.6.
4. The no-clean flux for high-density assembled parts according to claim 1, wherein the corrosion inhibitor is a mixture of aluminum chloride and potassium fluoride in a ratio of 2: 0.8.
5. The no-clean flux for high-density assembled parts according to claim 1, wherein the film-forming agent is silicone modified acrylic resin.
6. The preparation method of the cleaning-free soldering flux for the high-density assembly part is characterized by comprising the following preparation steps of:
(1) mixing 7-11 parts of an active agent and 30-40 parts of a film forming agent uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 75-95 parts of deionized water, 6-10 parts of a surfactant, 13-17 parts of butyl cellosolve and 8-12 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;
(2) and (2) continuously adding 4-9 parts of mercaptoethanol, 1-3 parts of potassium dichromate, 2.7-4.5 parts of sodium molybdate and 5-11 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 3-6 parts of triethanolamine and 1-4 parts of zinc phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811204961.9A CN110732805A (en) | 2018-10-16 | 2018-10-16 | Cleaning-free soldering flux for high-density assembly parts and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811204961.9A CN110732805A (en) | 2018-10-16 | 2018-10-16 | Cleaning-free soldering flux for high-density assembly parts and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112743259A (en) * | 2021-01-25 | 2021-05-04 | 苏州柯仕达电子材料有限公司 | Cleaning-free soldering flux |
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