CN110722261A - Laser processing system - Google Patents
Laser processing system Download PDFInfo
- Publication number
- CN110722261A CN110722261A CN201910533158.8A CN201910533158A CN110722261A CN 110722261 A CN110722261 A CN 110722261A CN 201910533158 A CN201910533158 A CN 201910533158A CN 110722261 A CN110722261 A CN 110722261A
- Authority
- CN
- China
- Prior art keywords
- laser
- robot
- irradiation
- output
- irradiation path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/005—Manipulators for mechanical processing tasks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1602—Programme controls characterised by the control system, structure, architecture
Abstract
The present invention provides a laser processing system, comprising: a robot; a laser emitting unit provided in the robot; an irradiation path calculation unit that calculates an irradiation path of the laser light emitted from the laser emission unit using information on the position of the robot; a determination unit that determines whether or not the calculated irradiation path passes through a preset irradiation-allowable area; and a laser output suppression unit that suppresses the output of the laser light emitted along the irradiation path to a second output lower than the first output for processing when the determination unit determines that the irradiation path does not pass through the irradiation-permitted region.
Description
Technical Field
The present invention relates to a laser processing system.
Background
A laser processing system is known in which a laser device and a galvano scanner are mounted on the tip of a robot arm (for example, see japanese patent application laid-open No. 2018-39039). Japanese patent application laid-open No. 2018-39039 discloses: "a control command to the galvano motor by the galvano scanner control unit is corrected by calculating a command correction value based on the acceleration of vibration obtained by an acceleration sensor provided at the tip of the robot arm so as to suppress a deviation of the laser irradiation position due to the vibration, and using the command correction value" (paragraph 0026).
Disclosure of Invention
A laser processing system such as that exemplified in japanese patent application laid-open No. 2018-39039 is becoming widespread, and a configuration is desired for the laser processing system in which safety is further taken into consideration so as not to cause a situation in which a laser beam is irradiated to an area that is not originally calculated due to an operation other than the assumption of a robot or the like.
An aspect of the present disclosure provides a laser processing system having: a robot; a laser emitting unit provided to the robot; an irradiation path calculation unit that calculates an irradiation path of the laser light emitted from the laser emission unit using information on the position of the robot; a determination unit that determines whether or not the calculated irradiation path passes through a preset irradiation-allowable area; and a laser output suppressing unit that suppresses an output of the laser light emitted along the irradiation path to a second output lower than a first output for processing when the determining unit determines that the irradiation path does not pass through the irradiation-allowable area.
Drawings
The objects, features and advantages of the present invention will become more apparent from the following description of the embodiments with reference to the accompanying drawings.
Fig. 1 is a block diagram showing an overall configuration of a laser processing system according to an embodiment.
Fig. 2 is a functional block diagram showing functions configured in the robot controller.
Fig. 3 is a diagram showing an example of the irradiation allowable area indicated by the irradiation allowable area information.
Fig. 4 is a diagram showing a state in which irradiation with the laser beam is stopped when it is determined that the calculated irradiation path of the laser beam passes outside the allowable irradiation region.
Fig. 5 is a flowchart showing the irradiation path determination and the laser output suppression processing.
Fig. 6 is a diagram showing an example in which the irradiation allowable area is constituted by two areas.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, corresponding constituent elements are denoted by common reference numerals. For easy understanding, the drawings may be modified in scale as appropriate. The embodiment shown in the drawings is an example for carrying out the present invention, and the present invention is not limited to the illustrated embodiment.
Fig. 1 is a block diagram showing an overall configuration of a laser processing system 100 according to an embodiment. As shown in fig. 1, the laser processing system 100 has: the robot 10, the robot controller 50 for controlling the robot 10, and the laser emitting unit 70 disposed at the tip of the arm 13 of the robot 10. In the present embodiment, the laser emitting unit 70 includes a laser device 20 and a Galvano scanner (Galvano scanner)40 attached to the tip end portion of the robot arm 13, and a Galvano scanner control unit 30 that controls driving of the laser device 20 and the Galvano scanner 40. The robot 10 is, for example, a vertical multi-axis robot. The robot controller 50 and the garcinor scanner controller 30 are connected via a network 60. For example, the galvano scanner 40 is a 2-axis type galvano scanner that scans the laser light L in two-dimensional directions, and includes motors corresponding to the 2 axes, respectively, and galvano mirrors attached to motor shafts of the motors, respectively. The galvano scanner control unit 30 synchronously controls the 2-axis motor of the galvano scanner 40 in accordance with the operation command described in the scanner operation program, and executes a two-dimensional scanning operation by the laser light L. In addition, the Garcinor scanner 40 is not limited to a 2-axis scanner, and may be a 1-axis or 3-axis scanner. The garcino scanner control unit 30 also has a function of controlling the laser device 20 (a function of adjusting on/off control and output of the laser device 20). The laser processing system 100 performs laser processing (welding, etc.) of a workpiece W such as an automobile body by irradiating laser light L while conveying the laser emitting portion 70 by the robot 10.
The robot 10 includes: a base 11, a robot arm 13, a plurality of shafts 12a to 12c, and servo motors (not shown) for driving the shafts. Robot controller 50 controls robot 10 in accordance with an operation command described in a robot operation program stored in a storage device of robot controller 50. The robot controller 50 can grasp the position of the robot 10 (for example, the position of the tip of the arm 13) based on, for example, configuration information (arm length, etc.) of the robot 10 and current position information from pulse encoders (position and velocity detectors) of servo motors provided at respective axes at both ends of the arm. The robot controller 50 also has information indicating the shape and position of the workpiece W. The laser device 20 is a variety of laser light sources including a laser medium, an optical resonator, an excitation source, and the like. The robot control device 50 is a general computer having a CPU, ROM, RAM, storage device, display, input/output device, and the like.
The laser processing system 100 having the above-described structure has the following functions: by calculating the irradiation path of the laser light L irradiated from the garcinor scanner 40 toward the workpiece W, the laser light L is prevented from being irradiated to the outside of the predetermined irradiation permission region. Fig. 2 is a functional block diagram showing functions configured in the robot control device 50 to achieve such a laser light suppression function. As an example, the functional blocks shown in fig. 2 are realized by a CPU, a storage device, and the like in the robot control device 50.
The laser irradiation path calculation section 151 has two calculation methods for calculating the irradiation path of the laser light L irradiated from the garcinor scanner 40 toward the workpiece W. Two calculation methods will be explained below.
(first calculation method)
The first calculation method is a method of calculating the irradiation path of the laser light L using the current position of the robot 10, the current position of the garcino scanner 40, and the like. The robot configuration information 121, the laser mounting position information 122, the galvano mirror configuration information 123, the output from the pulse encoder of each axis of the robot 10 (pulse encoder output (robot) 124), and the output from the pulse encoder of the drive axis of each mirror (mirror) of the galvano scanner 40 (pulse encoder output (mirror axis) 125) are input to the laser irradiation path calculation unit 151.
The robot configuration information 121 is robot configuration information such as the number of axes of the robot 10, the length of each arm, and the reduction ratio of each reducer, and is held in advance by the robot control device 50. The laser mounting position information 122 is information indicating the mounting position of the laser device 20, and is held in advance by the robot control device 50. The mounting position of the laser device 20 in a coordinate system (hereinafter also referred to as a robot coordinate system) based on the installation position of the robot 10 is grasped from the laser mounting position information 122. The galvano mirror configuration information 123 is configuration information of the galvano mirror such as the number of axes and arrangement of the drive shafts of the galvano mirror in the galvano scanner 40. Further, the galvano mirror structure information 123 includes a distance D between the laser device 20 and the galvano scanner 400. The galvano mirror structure information 123 is supplied from the galvano scanner control unit 30 to the laser irradiation path calculation unit 151. The pulse encoder output (robot) 124 is current position information from a pulse encoder (position/velocity detector) of a servo motor provided in each axis of the robot 10. The pulse encoder output (mirror axis) 124 is current position information from a pulse encoder (position-speed detector) of a motor provided on the drive axis of each mirror of the galvano scanner 40. The pulse encoder output (mirror axis) 124 is supplied from the galvano scanner 40 to the laser irradiation path calculation unit 151 via the galvano scanner control unit 30.
The laser irradiation path calculation unit 151 calculates the current position of the robot 10 (for example, the position of the tip of the robot arm 13 in the robot coordinate system) using the robot configuration information 121 and the pulse encoder output (robot) 124. The laser irradiation path calculation unit 151 obtains the mounting position of the laser device 20 in the robot coordinate system using the laser mounting position information 122. The laser irradiation path calculation unit 151 acquires the current position of the scanning operation using the galvano mirror configuration information 123 and the pulse encoder output (mirror axis) 124. The laser irradiation path calculation unit 151 can grasp the irradiation path (for example, the irradiation start point and the irradiation direction) of the laser beam L in the robot coordinate system by using the above information.
The storage unit 152 stores irradiation-allowable area information 152a, which is information on an area where passage of the laser light L on the surface of the workpiece W is allowable. As an example, fig. 3 shows a square irradiation allowable area 161 indicated by the irradiation allowable area information 152 a. When the irradiation permission region 161 is a quadrangular region as shown in fig. 3, the irradiation permission region information 152a may be coordinates (x1, y1, z1), (x2, y2, z2) of diagonal positions of the irradiation permission region 161 in the robot coordinate system. In addition, when the irradiation permitted region is a polygon, the irradiation permitted region information may be coordinates of each vertex of the polygon. Further, when the irradiation allowing region is a circle, the irradiation allowing region information may be a center coordinate and a radius of the circle. In addition, as an example, the following regions may be set as the irradiation permission region 161: the region including the processing point is considered to have no particular problem in terms of safety even if the laser light passes through the region.
The passage area determination unit 153 determines whether or not the laser light L passes through the irradiation permission area 161 based on the irradiation path of the laser light L supplied from the laser irradiation path calculation unit 151 and the irradiation permission area information 152a stored in the storage unit 152. When the passage area determination unit 153 determines that the laser light L is deviated from the irradiation permission area 161, it outputs a signal to the laser output suppression unit 154 to suppress the laser output of the laser device 20. For example, when it is determined that the laser light L is deviated from the irradiation permission region 161, the laser output suppression unit 154 reduces the laser output of the laser device 20 from the output level for processing to a level that is not problematic in terms of safety (or stops the laser output). FIG. 4 shows the laser beam irradiation path P calculated by the determination0The irradiation of the laser beam is stopped by allowing the irradiation region 161 to be outside. In addition, when the irradiation of the laser light is stopped, the operation of the robot 10 is also stoppedIt may be stopped.
According to the first calculation method, the irradiation path of the laser light L is grasped by actually measuring the current position of the robot 10 and the current position of the scanning operation of the garcino scanner 40, and therefore, it is possible to reliably prevent the laser light L from being irradiated outside the irradiation permission region when the robot 10 is not performing the calculated operation, or in an unexpected state.
(second calculation method)
The second calculation method is a method of calculating the irradiation path of the laser light L by the pre-read robot operation program 131 and the scanner operation program 133 of the garcinor scanner. As shown in fig. 2, the laser irradiation path calculation unit 151 acquires the robot operation program 131 stored in the robot controller 50. Thus, the laser irradiation path calculation unit 151 recognizes the position at the time earlier than the current time of the robot 10 from the operation command described in the robot operation program 131. The laser irradiation path calculation unit 151 acquires the scanner operation program 133 stored in the garcino scanner control unit 30. The laser irradiation path calculation unit 151 acquires the position of the scanning operation of the garcino scanner 40 at a time earlier than the current time from the operation command described in the acquired scanner operation program 133. With these pieces of information combined, the laser irradiation path calculation unit 151 can calculate the irradiation path of the laser light L earlier than the current time by using the robot configuration information 121, the laser mounting position information 122, and the galvano mirror configuration information 123.
As in the case of the first calculation method described above, the passage determination unit 153 determines whether or not the laser light L passes through the irradiation permission area 161 based on the irradiation path of the laser light L calculated by the second calculation method and the irradiation permission area information 152a stored in the storage unit 152. When the passage area determination unit 153 determines that the laser light L is deviated from the irradiation permission area 161, it outputs a signal to the laser output suppression unit 154 to suppress the laser output of the laser device 20. For example, when it is determined that the laser light L is deviated from the irradiation permission region 161, the laser output suppression unit 154 stops or reduces the laser output of the laser device 20 to a level that causes no problem in terms of safety.
According to the second calculation method, the irradiation path at a time earlier than the current time is grasped by the pre-reading of the robot operation program 131 or the like, and the irradiation of the laser light L can be stopped or the like when it is known that the laser light L passes outside the allowable irradiation region. When the robot is introduced into the production site, a scene in which the teaching point is corrected is assumed on the site. In many cases, it is difficult to perform operation verification by simulation in such a situation that teaching points are corrected on site. In this respect, according to the second calculation method described above, even when there is an error in correcting the teaching point on the spot, it is possible to reliably prevent the laser light from passing outside the irradiation permission region.
The laser irradiation path calculation unit 151 may calculate the irradiation path according to the calculation method of both the first calculation method and the second calculation method, and supply the calculation result to the passing area determination unit 153. In this case, the irradiation of the laser beam may be stopped when the irradiation path calculated by one of the first calculation method and the second calculation method is deviated from the irradiation allowable region. Fig. 5 is a flowchart showing the operation in such a case. The processing of fig. 5 is executed in parallel with the machining operation of the robot 10 under the control of the CPU of the robot control device 50. First, the irradiation path of the laser light is calculated by the first calculation method described above (step S11). Next, it is determined whether or not the irradiation path calculated by the first calculation method is within the irradiation allowable area (step S12). When it is determined that the irradiation path of the laser beam is outside the allowable irradiation region (no in S12), the output of the laser beam is suppressed (stopped, etc.) (step S15).
If it is determined in step S12 that the irradiation path of the laser light is within the irradiation-allowed region (S12: yes), the process proceeds to step S13, and the irradiation path of the laser light is calculated by the second calculation method described above (step S13). Next, in step S14, it is determined whether or not the irradiation path calculated by the second calculation method is within the irradiation allowable area. When it is determined that the irradiation path of the laser beam is outside the allowable irradiation region (no in S14), the output of the laser beam is suppressed (stopped, etc.) (step S15). When it is determined in step S14 that the irradiation path of the laser light is within the irradiation-allowed region (S14: yes), the process returns to step S11.
As a modification of the operation of fig. 5, when the robot operation program 131 is corrected, only the processing of calculating and determining the irradiation path by the first calculation method may be executed once (steps S13 and S14). The following may be configured: the laser irradiation path calculation unit 151 calculates an irradiation path by any one of the first calculation method and the second calculation method, and supplies the calculation result to the passing area determination unit 153.
As described above, according to the present embodiment, it is possible to reliably prevent the occurrence of a situation in which the laser beam is irradiated to an area that is not originally intended by an operation other than the assumption of the robot or the like. Even when the accuracy of verification in a simulation phase of a robot operation program or the like is not high, laser light can be prevented from being irradiated to an area which is not originally calculated.
While the embodiments of the present invention have been described above, it will be understood by those skilled in the art that various modifications and changes may be made without departing from the scope of the claims to be described below.
The structure of the laser processing system shown in the above embodiment is an example, and the present invention can be applied to various laser processing systems. For example, although the above embodiment is an example of the configuration in the case where the laser emitting portion 70 includes the galvano scanner 40, the present invention may be applied to a configuration in which the laser emitting portion 70 does not include the galvano scanner 40. In this case, the laser irradiation path calculation unit 151 may calculate the irradiation path of the laser using the robot configuration information 121, the laser mounting position information 122, and the pulse encoder output (robot) 124.
The present invention is also applicable to a laser processing system of a type in which laser light is guided through an optical fiber from a laser device separate from the robot 10 to a laser emitting portion at the tip of a robot arm.
In the configuration example of the laser processing system shown in fig. 1, the galvano scanner control unit that controls the galvano scanner 40 and the robot control device 50 that controls the robot 10 are separately provided, but the galvano scanner 50 and the robot 10 may be configured to be controlled by one control device.
In the example shown in fig. 3, only one irradiation allowable area is set, but a plurality of irradiation allowable areas may be set. In this case, the suppression value of the laser output when the irradiation path deviates from the region may be set to a different value for each region. For example, it can be set as: in the case of the first irradiation permission region, the output of the laser beam is reduced to a level at which there is no problem in safety when the irradiation path deviates from the region, and in the case of the second irradiation permission region, the output of the laser beam is stopped when the irradiation path deviates from the region.
Alternatively, as shown in fig. 6, the irradiation allowable area may be constituted by an irradiation allowable area a and an irradiation allowable area B including the irradiation allowable area a therein. In the example of fig. 6, the irradiation allowing regions A, B are all rectangular regions, the irradiation allowing region a has diagonal position coordinates (x21, y21, z21), (x22, y22, z22), and the irradiation allowing region B has diagonal position coordinates (x11, y11, z11), (x12, y12, z 12). In this case, the following operation can be realized.
(1) When the irradiation region of the laser beam is deviated from the allowable irradiation region a but within the allowable irradiation region B, the output of the laser beam is reduced to a level that causes no problem in terms of safety, and when the irradiation path returns to the allowable irradiation region a, the irradiation of the laser beam of the output for processing is resumed immediately.
(2) The output of the laser light is stopped when the irradiation area of the laser light deviates from the irradiation-allowed area B.
In order to solve the problem of the present disclosure, various embodiments and effects thereof can be provided as follows. In the following description, the number in parentheses corresponds to the reference symbol of the drawings of the present disclosure.
For example, a first aspect of the present disclosure is a laser processing system (100) having: a robot (10); a laser emission unit (70) provided to the robot (10); an irradiation path calculation unit (151) that calculates an irradiation path of the laser light emitted from the laser emission unit (70) using information on the position of the robot (10); a determination unit (153) that determines whether or not the calculated irradiation path passes through a preset irradiation-allowable area; and a laser output suppression unit (154) that suppresses the output of the laser light emitted along the irradiation path to a second output that is lower than the first output for processing when the determination unit (153) determines that the irradiation path does not pass through the irradiation-allowed region.
According to the first aspect, it is possible to reliably prevent the occurrence of a situation in which the laser beam is irradiated to an area that is not originally intended by an operation other than assumed by the robot or the like.
In addition, a second aspect of the present disclosure is the laser processing system (100) of the first aspect, wherein the laser emitting unit (70) has a scanner (40) that performs a scanning operation, and the irradiation path calculating unit (151) calculates the irradiation path using information of a position of the scanning operation of the scanner (40).
In addition, a third aspect of the present disclosure is the laser processing system (100) of the second aspect, wherein the scanner (40) includes a mirror that performs the scanning operation and a motor that drives the mirror, and the information on the position of the scanning operation includes information on a current position of the motor.
A fourth aspect of the present disclosure is the laser processing system (100) according to any one of the first to third aspects, wherein the robot (10) is a multi-axis robot, and the information on the position of the robot (10) includes information on the length of the arm between the axes of the multi-axis robot and information on the current position of the motor provided on the axis at each end of the arm.
In addition, according to a fifth aspect of the present disclosure, in addition to the laser processing system (100) according to any one of the first to third aspects, the information on the position of the robot (10) includes a command described in a robot operation program.
A sixth aspect of the present disclosure is the laser processing system (100) of the second aspect, wherein the information on the position of the scanning operation includes a command described in a scanner operation program.
A seventh aspect of the present disclosure is the laser processing system (100) of any one of the first to sixth aspects, wherein the laser output suppression unit (154) sets the second output to zero.
An eighth aspect of the present disclosure is the laser processing system (100) of any one of the first to seventh aspects, wherein the irradiation allowable region is formed of a plurality of regions, the second output is defined as a value different from each other in association with each of the plurality of regions, the determination unit (153) determines whether or not the irradiation path passes through each of the plurality of regions, and the laser output suppression unit (154) sets the second output to a value defined in association with any one of the plurality of regions determined when the determination unit (153) determines that the irradiation path does not pass through any one of the plurality of regions.
Claims (8)
1. A laser processing system is characterized by comprising:
a robot;
a laser emitting unit provided to the robot;
an irradiation path calculation unit that calculates an irradiation path of the laser light emitted from the laser emission unit using information on the position of the robot;
a determination unit that determines whether or not the calculated irradiation path passes through a preset irradiation-allowable area; and
and a laser output suppression unit configured to suppress an output of the laser light emitted along the irradiation path to a second output lower than a first output for processing when the determination unit determines that the irradiation path does not pass through the irradiation-allowable area.
2. The laser machining system of claim 1,
the laser emitting part is provided with a scanner for scanning operation,
the irradiation path calculation unit further calculates the irradiation path using position information of a scanning operation of the scanner.
3. The laser machining system of claim 2,
the scanner includes a mirror that performs the scanning operation and a motor that drives the mirror, and the position information of the scanning operation includes information of a current position of the motor.
4. The laser processing system according to any one of claims 1 to 3,
the robot is a multi-axis robot,
the information on the position of the robot includes information on the length of the robot arm between the axes of the multi-axis robot and the current position of the motor provided on the axes at both ends of the robot arm.
5. The laser processing system according to any one of claims 1 to 3,
the information on the position of the robot includes a command described in a robot operation program.
6. The laser machining system of claim 2,
the information on the position of the scanning operation includes a command described in a scanner operation program.
7. The laser processing system according to any one of claims 1 to 6,
the laser output suppression unit sets the second output to zero.
8. The laser processing system according to any one of claims 1 to 7,
the irradiation-allowed region is composed of a plurality of regions, the second output is defined to be a value different from each other in association with each of the plurality of regions,
the judging section judges whether or not the irradiation path passes through each of the plurality of regions,
when the determination unit determines that the irradiation path does not pass through any one of the plurality of regions, the laser output suppression unit sets the second output to a predetermined value associated with the determined region.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018122968 | 2018-06-28 | ||
| JP2018-122968 | 2018-06-28 | ||
| JP2019-083080 | 2019-04-24 | ||
| JP2019083080A JP6975198B2 (en) | 2018-06-28 | 2019-04-24 | Laser machining system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110722261A true CN110722261A (en) | 2020-01-24 |
| CN110722261B CN110722261B (en) | 2023-02-17 |
Family
ID=69150048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910533158.8A Active CN110722261B (en) | 2018-06-28 | 2019-06-19 | Laser processing system |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6975198B2 (en) |
| CN (1) | CN110722261B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112658491A (en) * | 2020-11-25 | 2021-04-16 | 珠海格力智能装备有限公司 | Control method and device of laser marking machine and laser marking machine |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7152646B2 (en) * | 2021-02-25 | 2022-10-13 | 株式会社安川電機 | LASER PROCESSING DEVICE, LASER PROCESSING SYSTEM, LASER PROCESSING METHOD |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1736652A (en) * | 2004-08-20 | 2006-02-22 | 发那科株式会社 | Laser processing robot system |
| JP2007030031A (en) * | 2005-07-29 | 2007-02-08 | Fanuc Ltd | Robot laser machining system |
| JP2007061856A (en) * | 2005-08-31 | 2007-03-15 | Keyence Corp | Laser beam machining apparatus and its focal position indicating method |
| CN101112735A (en) * | 2006-07-27 | 2008-01-30 | 株式会社其恩斯 | Laser processing device, laser processing condition setting device, method and program |
| JP2012218029A (en) * | 2011-04-08 | 2012-11-12 | Yaskawa Electric Corp | Robot system |
| CN106238908A (en) * | 2016-07-27 | 2016-12-21 | 肇庆市小凡人科技有限公司 | A kind of laser processing robot |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4792901B2 (en) * | 2005-09-30 | 2011-10-12 | 日産自動車株式会社 | Laser welding apparatus and method, and irradiation apparatus |
| JP2009214174A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Cutting device of waste electric appliance, and collecting method for recycling waste electric appliance using the cutting device |
| JP5608074B2 (en) * | 2010-12-28 | 2014-10-15 | 川崎重工業株式会社 | Laser processing system and control method thereof |
| WO2017051504A1 (en) * | 2015-09-25 | 2017-03-30 | パナソニックＩｐマネジメント株式会社 | Laser machining system |
-
2019
- 2019-04-24 JP JP2019083080A patent/JP6975198B2/en active Active
- 2019-06-19 CN CN201910533158.8A patent/CN110722261B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1736652A (en) * | 2004-08-20 | 2006-02-22 | 发那科株式会社 | Laser processing robot system |
| JP2007030031A (en) * | 2005-07-29 | 2007-02-08 | Fanuc Ltd | Robot laser machining system |
| JP2007061856A (en) * | 2005-08-31 | 2007-03-15 | Keyence Corp | Laser beam machining apparatus and its focal position indicating method |
| CN101112735A (en) * | 2006-07-27 | 2008-01-30 | 株式会社其恩斯 | Laser processing device, laser processing condition setting device, method and program |
| JP2012218029A (en) * | 2011-04-08 | 2012-11-12 | Yaskawa Electric Corp | Robot system |
| CN106238908A (en) * | 2016-07-27 | 2016-12-21 | 肇庆市小凡人科技有限公司 | A kind of laser processing robot |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112658491A (en) * | 2020-11-25 | 2021-04-16 | 珠海格力智能装备有限公司 | Control method and device of laser marking machine and laser marking machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020006437A (en) | 2020-01-16 |
| JP6975198B2 (en) | 2021-12-01 |
| CN110722261B (en) | 2023-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108628258B (en) | Scanner control device, robot control device, and remote laser welding robot system | |
| US10175684B2 (en) | Laser processing robot system and control method of laser processing robot system | |
| KR101023594B1 (en) | Laser processing robot control system, control method and control program medium | |
| EP1890240B1 (en) | Laser working apparatus and method of controlling laser working apparatus | |
| CN109014565B (en) | Laser processing apparatus | |
| CN109719386B (en) | Laser processing system | |
| CN110722261B (en) | Laser processing system | |
| JP5608074B2 (en) | Laser processing system and control method thereof | |
| KR101722916B1 (en) | 5-axis device fabricating surface continuously based on laser scanner and control method for the device | |
| KR102108403B1 (en) | Multi-axis Laser Manufacturing Machine | |
| US11154947B2 (en) | Laser processing system | |
| JP4467333B2 (en) | Laser processing apparatus and processing method | |
| CN109773335B (en) | Laser processing method, controller and robot system | |
| KR20170059179A (en) | Method for setting position of welding robot using laser pointer | |
| US20240123606A1 (en) | Teaching point generation device that generates teaching points on basis of output of sensor, and teaching point generation method | |
| CN111998812A (en) | Actual measurement device and recording medium having program recorded thereon | |
| JPH07200034A (en) | Device and method for controlling acceleration/ deceleration for working head | |
| KR0160705B1 (en) | Method for compensating arm deflection of gantry type handling robot | |
| JP4670911B2 (en) | Laser processing equipment | |
| US10058954B2 (en) | Laser processing device having gap control function and controller thereof | |
| JP2582807B2 (en) | Work line teaching method for industrial robots | |
| JP2019209444A (en) | Robot control device and robot control method | |
| US20230381890A1 (en) | Laser processing system and control method | |
| US20230158602A1 (en) | Teaching system and teaching method for laser machining | |
| JP2021186946A (en) | Sensor detection condition setting method, detection condition setting program and storage medium for storing program |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |