CN110721891A - Ultrasonic transducer processing method - Google Patents
Ultrasonic transducer processing method Download PDFInfo
- Publication number
- CN110721891A CN110721891A CN201911038659.5A CN201911038659A CN110721891A CN 110721891 A CN110721891 A CN 110721891A CN 201911038659 A CN201911038659 A CN 201911038659A CN 110721891 A CN110721891 A CN 110721891A
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- array elements
- ultrasonic transducer
- piezoelectric element
- processing method
- matching layer
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- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 239000002985 plastic film Substances 0.000 claims description 6
- 229920006255 plastic film Polymers 0.000 claims description 6
- -1 polyethylene Polymers 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000005266 casting Methods 0.000 abstract description 4
- 238000004382 potting Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses an ultrasonic transducer processing method, which comprises the following steps: s1 bonding the piezoelectric element and the matching layer; s2, dividing the piezoelectric element and the matching layer into a plurality of independent array elements; s2, separating two adjacent array elements by using a separating sheet, wherein the array elements and the separating sheet are closely arranged; s3, forming a backing connected into a whole by casting the same sides of the array elements; and S4, removing the separating sheet after the backing is solidified. The separating sheet is arranged between the two array elements, so that unnecessary connection between the two adjacent array elements in the backing connection process can be prevented, and the overall performance of the ultrasonic transducer is guaranteed.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to a processing method of an ultrasonic transducer.
Background
In a medical ultrasound imaging apparatus, an ultrasound transducer transmits and receives ultrasound waves. The common ultrasonic transducer comprises a piezoelectric element, a backing and a matching layer, wherein the piezoelectric element receives voltage excitation and vibrates to emit ultrasonic waves, and the piezoelectric element receives the ultrasonic waves and generates corresponding voltage between two stages; while the backing serves to reduce the vibration time of the piezoelectric element, the matching layer is intended to improve the transmission efficiency of ultrasonic waves. In order to improve the performance of ultrasonic waves, it is necessary to cut the piezoelectric element and the matching layer into a plurality of array elements, and to cut off the mutual connection, thereby reducing the influence between the adjacent array elements.
In general, the backing is manufactured by a potting or bonding method, and the potting is specifically performed by mixing a specific powder and a glue into a mixture having fluidity and performing potting. The gap between two array elements also can permeate backing material when filling, and bonding glue can permeate the gap when bonding, can produce new physical connection between the adjacent array elements, produces mutual influence between the adjacent array elements, reduces ultrasonic transducer's wholeness ability easily.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a method for processing an ultrasonic transducer is provided to eliminate the mutual influence between adjacent array elements.
In order to solve the technical problems, the invention adopts the technical scheme that: an ultrasonic transducer processing method comprises the following steps:
s1, bonding the piezoelectric element and the matching layer;
s2, dividing the piezoelectric element and the matching layer into a plurality of independent array elements;
s3, separating two adjacent array elements by using a separating sheet, wherein the array elements and the separating sheet are closely arranged;
s4, connecting the backing to the same side of the array elements;
and S5, removing the separating sheet.
The invention has the beneficial effects that: the separating sheet is arranged between the two array elements, so that unnecessary connection between the two adjacent array elements in the backing connection process can be prevented, and the overall performance of the ultrasonic transducer is guaranteed.
Drawings
FIG. 1 is a schematic diagram of a split array element according to the present invention;
FIG. 2 is a schematic diagram of a portion of an ultrasonic transducer of the present invention;
FIG. 3 is a schematic diagram of the structure of an ultrasonic transducer of the present invention;
fig. 4 is a flowchart of a method for processing an ultrasonic transducer according to a first embodiment of the present invention;
fig. 5 is a flowchart of a method for processing an ultrasonic transducer according to a second embodiment of the present invention;
fig. 6 is a flowchart of a processing method of an ultrasonic transducer according to a third embodiment of the present invention.
Description of reference numerals:
1. array elements;
11. a piezoelectric element;
12. a matching layer;
2. a separator;
3. a backing;
4. a lens;
5. an outgoing line;
6. and (5) a grinding wheel cutter.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: the separating sheet is arranged between the two array elements, so that unnecessary connection between the two adjacent array elements in the back lining connection process can be prevented.
Referring to fig. 1 to 6, a method for processing an ultrasonic transducer further includes the following steps:
s1, bonding the piezoelectric element and the matching layer;
s2, dividing the piezoelectric element and the matching layer into a plurality of independent array elements;
s3, separating two adjacent array elements 1 by using a separating plate 2, wherein the array elements 1 and the separating plate 2 are closely arranged;
s4, forming a backing 3 which is connected into a whole by casting the same side of the array elements 1;
s5, removing the separator sheet 2 after the backing 3 is solidified.
The working principle of the invention is briefly described as follows: in the backing connection process, a separating sheet is specially arranged between two adjacent array elements for completely separating the two adjacent array elements, so that the phenomenon that the two array elements are connected to influence the performance of the ultrasonic transducer is avoided.
From the above description, the beneficial effects of the present invention are: the separating sheet is arranged between the two array elements, so that unnecessary connection between the two adjacent array elements in the backing connection process can be prevented, and the overall performance of the ultrasonic transducer is guaranteed.
Further, step S4 is followed by step S40 of directly bonding or potting the lens 4 to the side of the matching layer 12 facing away from the piezoelectric element 11.
Further, step S10 is included before step S4, in which lead wires 5 are soldered to both poles of each piezoelectric element 11.
Further, step S10 is located before step S2, after step S2, or after step S3.
Further, in step S2, the bonded piezoelectric element and matching layer are cut by the grinding wheel cutter 6.
Further, the separating sheet 2 is a polyolefin plastic film.
Further, the polyolefin plastic film is a polyethylene film or a polypropylene film.
As can be seen from the above description, the surface energy of the separating sheet made of polyolefin thin film is very low, and the separating sheet is not easy to be bonded, so that the separating sheet can be conveniently removed from between the two array elements.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: an ultrasonic transducer processing method comprises the following steps:
s1, bonding the piezoelectric element and the matching layer;
s2, dividing the piezoelectric element and the matching layer into a plurality of independent array elements;
s3, separating two adjacent array elements 1 by using a separating plate 2, wherein the array elements 1 and the separating plate 2 are closely arranged;
s4, connecting the backing 3 to the same side of the array elements 1;
and S5, removing the separating sheet 2.
The array element comprises a piezoelectric element 11 and a matching layer 12 which are connected. Referring to fig. 3, the backing 3 connected to the same side of the array element 1 is formed by casting, or the backing 3 is bonded to the same side of the array element 1, and the separator 2 is removed after casting or bonding solidification.
Optionally, the piezoelectric element 11 is a piezoelectric ceramic or a piezoelectric crystal. The array element cutting device is characterized by further comprising a clamp, wherein the array elements 1 and the separating sheets 2 are closely arranged on the clamp, and the clamp can fix the positions of the array elements 1 and the separating sheets 2.
In this embodiment, step S4 is followed by step S40 of directly bonding or potting the lens 4 to the side of the matching layer 12 facing away from the piezoelectric element 11, preferably, the lens 4 is bonded to the side of the matching layer 12 facing away from the piezoelectric element 11.
Further, step S10 is included to solder lead wires 5 to both poles of each piezoelectric element 11, and it is easily understood that two lead wires 5 are connected to an external component.
Optionally, step S10 is performed before step S2, that is, before the array element 1 is cut, the lead wires 5 are respectively soldered to the two poles of the piezoelectric element 11, so that the processing efficiency of the lead wires 5 can be significantly improved.
In step S2, the grinding wheel cutter 6 is used to cut, and it is easy to understand that the grinding wheel cutters 6 with different widths can be selected to cut according to the actual requirement.
Optionally, the separating sheet 2 is a polyolefin plastic film; preferably, the polyolefin plastic film is a polyethylene film or a polypropylene film.
Example two
Referring to fig. 1, fig. 2, fig. 3 and fig. 5, a second embodiment of the present invention is different from the above embodiments in that: step S10 is performed between step S2 and step S3, that is, after the array element 1 is diced, the lead wires 5 are soldered to both poles of each piezoelectric element 11.
EXAMPLE III
Referring to fig. 1, fig. 2, fig. 3 and fig. 6, a third embodiment of the present invention is different from the above embodiments in that: step S10 is performed between step S3 and step S4, that is, after the array element 1 and the spacer 2 are closely arranged, the lead wires 5 are respectively soldered to both poles of each piezoelectric element 11.
In summary, in the processing method of the ultrasonic transducer provided by the invention, the separating sheet is arranged between the two array elements, so that the back lining or glue can be prevented from permeating into the gap between the adjacent array elements in the back lining connection process.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (7)
1. An ultrasonic transducer processing method is characterized in that: the method comprises the following steps:
s1, bonding the piezoelectric element and the matching layer;
s2, dividing the piezoelectric element and the matching layer into a plurality of independent array elements;
s3, separating two adjacent array elements by using a separating sheet, wherein the array elements and the separating sheet are closely arranged;
s4, connecting the backing to the same side of the array elements;
and S5, removing the separating sheet.
2. The ultrasonic transducer processing method according to claim 1, characterized in that: step S40 is further included after step S4, in which a lens is directly bonded or cast to a side of the matching layer facing away from the piezoelectric element.
3. The ultrasonic transducer processing method according to claim 1, characterized in that: step S10 is further included before step S4, in which lead wires are soldered to both poles of each piezoelectric element.
4. The ultrasonic transducer processing method according to claim 3, characterized in that: step S10 is located before step S2, after step S2, or after step S3.
5. The ultrasonic transducer processing method according to claim 1, characterized in that: in step S2, the bonded piezoelectric element and matching layer are cut with a grinding wheel cutter.
6. The ultrasonic transducer processing method according to claim 1, characterized in that: the separating sheet is a polyolefin plastic film.
7. The ultrasonic transducer processing method according to claim 6, characterized in that: the polyolefin plastic film is a polyethylene film or a polypropylene film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911038659.5A CN110721891B (en) | 2019-10-29 | 2019-10-29 | Ultrasonic transducer processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911038659.5A CN110721891B (en) | 2019-10-29 | 2019-10-29 | Ultrasonic transducer processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110721891A true CN110721891A (en) | 2020-01-24 |
| CN110721891B CN110721891B (en) | 2021-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911038659.5A Active CN110721891B (en) | 2019-10-29 | 2019-10-29 | Ultrasonic transducer processing method |
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Citations (16)
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| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN103315775A (en) * | 2013-06-28 | 2013-09-25 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array transducer and production method thereof |
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| CN106805994A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院深圳先进技术研究院 | ultrasonic probe and preparation method thereof |
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2019
- 2019-10-29 CN CN201911038659.5A patent/CN110721891B/en active Active
Patent Citations (16)
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| US20040100163A1 (en) * | 2002-11-22 | 2004-05-27 | Baumgartner Charles E. | Method for making electrical connection to ultrasonic transducer through acoustic backing material |
| CN101379871A (en) * | 2006-01-31 | 2009-03-04 | 松下电器产业株式会社 | Ultrasonic probe |
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| Publication number | Publication date |
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| CN110721891B (en) | 2021-11-05 |
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