CN110719724B - Efficient heat dissipation device for PCB chassis - Google Patents
Efficient heat dissipation device for PCB chassis Download PDFInfo
- Publication number
- CN110719724B CN110719724B CN201911148378.5A CN201911148378A CN110719724B CN 110719724 B CN110719724 B CN 110719724B CN 201911148378 A CN201911148378 A CN 201911148378A CN 110719724 B CN110719724 B CN 110719724B
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- plate
- cooling
- cold
- cold row
- groove
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- 230000017525 heat dissipation Effects 0.000 title abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 123
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 106
- 238000009423 ventilation Methods 0.000 claims description 20
- 241000883990 Flabellum Species 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 239000000498 cooling water Substances 0.000 description 10
- 238000007599 discharging Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-efficiency heat dissipation device of a PCB (printed circuit board) chassis, relates to the technical field of network information equipment, and aims to solve the problems of single heat dissipation method and poor heat dissipation effect in the prior art. The water cooling assembly comprises a cold row fixing plate, a first cold row is arranged on the cold row fixing plate, the first cold row is attached to the cold row fixing plate, a second cold row is arranged on one side of the first cold row, a third cold row is arranged on one side of the second cold row, the shapes and the sizes of the first cold row, the second cold row and the third cold row are set to be consistent, a third cold row water outlet pipe is arranged on the third cold row, the third cold row water outlet pipe is fixedly connected with the third cold row, a cooling plate water inlet plate is arranged at the rear end of the third cold row water outlet pipe, and a water tank is arranged inside the cooling plate water inlet plate.
Description
Technical Field
The invention relates to the technical field of network information equipment, in particular to a high-efficiency heat dissipation device of a PCB (printed circuit board) chassis.
Background
The PCB, chinese name is printed circuit board, also known as the printed circuit board, is important electronic component, is the support body of electronic components, is the carrier that electronic components electrically connects, because there are numerous electronic components on the PCB circuit board, and through the arrangement of the heat conduction layer, make these electronic components separate into each cell respectively, a plurality of electronic components in each cell constitute the relatively independent functional unit of function, that is, each cell corresponds a functional unit, each functional unit plays its own performance when the work, realize respective function, then PCB technique is also used in the electronic equipment field extensively, but current PCB machine case is liable to produce a large amount of heat and is piled up after long-time work, is liable to cause the damage to the equipment in the PCB machine case.
The existing PCB chassis heat dissipation devices all have the problems of single heat dissipation method and poor heat dissipation effect; therefore, the development of an efficient heat dissipation device for a PCB chassis is urgently needed in the market to help people solve the existing problems.
Disclosure of Invention
The invention aims to provide a high-efficiency heat dissipation device for a PCB chassis, which is used for solving the problems of single heat dissipation method and poor heat dissipation effect in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a high-efficient heat abstractor of PCB quick-witted case, includes the water-cooling subassembly, the water-cooling subassembly includes cold row fixed plate, be provided with first cold row on the cold row fixed plate, first cold row is laminated with cold row fixed plate, one side of first cold row is provided with the cold row of second, one side of the cold row of second is provided with the cold row of third, first cold row, the cold row of second and the cold row shape size of third set up to unanimous, be provided with the cold outlet pipe of discharging of third on the cold row of third, the cold outlet pipe of discharging of third and the cold row fixed connection of third, the rear end of discharging the outlet pipe of discharging of third is provided with the cooling plate inlet board, the inside of cooling plate inlet board is provided with the basin.
Preferably, the rear end of cooling plate water inlet plate is provided with the cooling plate, cooling plate water inlet plate and cooling plate fixed connection, the inside of cooling plate is provided with the circulation flume, and circulation flume and basin intercommunication, one side of cooling plate lower extreme is provided with the fixed block, fixed block and cooling plate fixed connection, the opposite side of cooling plate is provided with the connecting plate, cooling plate and connecting plate fixed connection, one side of connecting plate is provided with the cooling plate water outlet plate, the inside of cooling plate water outlet plate is provided with the basin, and the circulation flume intercommunication that sets up in basin and the cooling plate, be provided with first cold inlet tube of arranging on the cooling plate water outlet plate, first cold inlet tube of arranging and first cold row fixed connection.
Preferably, one side of the first cold water inlet pipe is provided with a first cold water outlet pipe, the first cold water outlet pipe is fixedly connected with the first cold water outlet pipe, the rear end of the first cold water outlet pipe is provided with a cooling component, a cooling groove is formed in the cooling component, the diameter of the cooling groove is consistent with that of the first cold water outlet pipe, a second cold water inlet pipe is arranged on the cooling component, one side of the second cold water inlet pipe is provided with a second cold water outlet pipe, the lower end of the second cold water outlet pipe is provided with a circulating water pump, and the front end of the circulating water pump is provided with a third cold water inlet pipe.
Preferably, the rear end of circulating water pump is provided with the backplate, the backplate sets up to the rectangular plate, backplate and cold row fixed plate fixed connection, be provided with the CD-ROM drive on the backplate, CD-ROM drive and backplate fixed connection, one side of CD-ROM drive is provided with the forced air cooling subassembly.
Preferably, the air cooling assembly comprises a fan outer frame, a fixing bolt is arranged on the fan outer frame, the fixing bolt penetrates through the fan outer frame, the air cooling assembly is connected with the supporting plate through the fixing bolt, a connecting strip is arranged at the lower end of the fan outer frame, the connecting strip is fixedly connected with the fan outer frame, a fan main body is arranged at the rear end of the connecting strip, the fan main body is fixedly connected with the connecting strip, and an anti-collision ring is arranged on the fan main body.
Preferably, the inside of anticollision circle is provided with the swivel post, the swivel post sets up to the cylinder, be provided with the flabellum on the swivel post, the flabellum is provided with a plurality ofly, a plurality of the flabellum is the circumference arrangement as the center with the centre of a circle of swivel post, one side of flabellum is provided with the wiring board, be provided with the swivel post hole on the wiring board, and the diameter of swivel post hole slightly is greater than the swivel post, be provided with the wiring groove on the wiring board, the degree of depth of wiring groove sets up to the half of wiring board thickness, the rear end of fan main part is provided with the fixed strip, fixed strip and fan frame fixed connection.
Preferably, the upper end of water-cooling subassembly is provided with the device roof, be provided with the ventilation groove on the device roof, the ventilation groove sets up to the rectangular channel, be provided with the ash board that falls in the ventilation groove, be provided with a plurality of ventilation holes on the ash board that falls, one side of device roof lower extreme is provided with the backup pad, the backup pad sets up to "L" form, the backup pad is provided with four, four the backup pad sets up in the four corners department of device roof, device roof and device roof fixed connection, the lower extreme of backup pad is provided with the device bottom plate, backup pad and device bottom plate fixed connection.
Preferably, the device bottom plate is provided with a mounting groove, the mounting groove is set to the rectangle, the degree of depth of mounting groove sets to half device bottom plate thickness, the front end of mounting groove one side is provided with the spread groove, the spread groove is provided with four, four the spread groove sets up in the four corners department of device bottom plate, the inside of spread groove is provided with the connecting hole, the connecting hole sets to circularly, the connecting hole sets up the center department at the spread groove, the degree of depth of connecting hole sets to half of mounting groove degree of depth.
Compared with the prior art, the invention has the beneficial effects that:
1. According to the invention, through the arrangement of the water cooling component and the air cooling component, when a user uses the efficient heat dissipation device of the PCB chassis, the problem of poor heat dissipation effect can be fundamentally solved through the double heat dissipation modes of the water cooling component and the air cooling component, and meanwhile, the user can self-define a proper scheme for use through various heat dissipation modes, so that the use pressure of the user can be relieved to a certain extent;
2. According to the invention, through the arrangement of the ventilation groove, the ash falling plate and the wiring groove, when a user uses the efficient heat dissipation device of the PCB chassis, the cooling air generated by the air cooling assembly can be smoothly dissipated from the ventilation groove through the mutual matching of the ventilation groove and the ash falling plate, dust accompanying is avoided, the use comfort of the user can be improved to a certain extent, and meanwhile, the wiring groove is arranged, so that the user can install the wiring more conveniently when the air cooling assembly is installed.
Drawings
Fig. 1 is a block diagram of a high-efficiency heat dissipating device for a PCB chassis according to the present invention;
fig. 2 is a bottom view structural diagram of a high-efficiency heat dissipating device for a PCB chassis according to the present invention;
FIG. 3 is an internal block diagram of a water cooling module according to the present invention;
FIG. 4 is a block diagram of an air cooling assembly of the present invention;
Fig. 5 is a bottom view of the air cooling module of the present invention.
In the figure: 1. a device base plate; 2. a mounting groove; 3. a connecting groove; 4. a connection hole; 5. a support plate; 6. a device top plate; 7. a ventilation groove; 8. an ash falling plate; 9. a water cooling assembly; 10. a cold row fixing plate; 11. a first cold row; 12. a second cold row; 13. a third cold row; 14. a third cold discharge water outlet pipe; 15. a cooling plate water inlet plate; 16. a cooling plate; 17. a fixed block; 18. a connecting plate; 19. a cooling plate water outlet plate; 20. a first cold row water inlet pipe; 21. a first cold discharge water outlet pipe; 22. the cooling component is to be cooled; 23. a second cold row water inlet pipe; 24. a second cold discharge water outlet pipe; 25. a circulating water pump; 26. a third cold row water inlet pipe; 27. a back plate; 28. an optical drive; 29. an air cooling assembly; 30. a fan outer frame; 31. a fixing bolt; 32. a connecting strip; 33. a fan main body; 34. an anti-collision ring; 35. a rotating column; 36. a fan blade; 37. a wiring board; 38. wiring grooves; 39. and fixing strips.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-5, an embodiment of the present invention is provided: the utility model provides a high-efficient heat abstractor of PCB quick-witted case, including water-cooling assembly 9, water-cooling assembly 9 includes cold row fixed plate 10, be provided with first cold row 11 on the cold row fixed plate 10, first cold row 11 is laminated with cold row fixed plate 10, one side of first cold row 11 is provided with second cold row 12, one side of second cold row 12 is provided with third cold row 13, first cold row 11, second cold row 12 and third cold row 13 shape size set up to unanimously, be provided with third cold row outlet pipe 14 on the third cold row 13, third cold row outlet pipe 14 and third cold row 13 fixed connection, the rear end of third cold row outlet pipe 14 is provided with cooling plate water inlet plate 15, the inside of cooling plate water inlet plate 15 is provided with the basin, the user can be through first cold row 11, second cold row 12 and third cold row 13 carries out cooling many times to the cooling water, thereby guarantee that the cooling water all keeps at suitable temperature when the water pipe is removed.
Further, the rear end of cooling plate inlet plate 15 is provided with cooling plate 16, cooling plate inlet plate 15 and cooling plate 16 fixed connection, the inside of cooling plate 16 is provided with the circulation flume, and circulation flume and basin intercommunication, one side of cooling plate 16 lower extreme is provided with fixed block 17, fixed block 17 and cooling plate 16 fixed connection, the opposite side of cooling plate 16 is provided with connecting plate 18, cooling plate 16 and connecting plate 18 fixed connection, one side of connecting plate 18 is provided with cooling plate outlet plate 19, the inside of cooling plate outlet plate 19 is provided with the basin, and the circulation flume intercommunication that sets up in cooling plate 16, be provided with first cold inlet tube 20 on the cooling plate outlet plate 19, first cold inlet tube 20 and first cold outlet tube 11 fixed connection, the equipment of placing on the cooling plate 16 can be cooled down through the circulation flume that cooling plate 16 inside set up.
Further, one side of the first cold row water inlet pipe 20 is provided with a first cold row water outlet pipe 21, the first cold row water outlet pipe 21 is fixedly connected with the first cold row 11, the rear end of the first cold row water outlet pipe 21 is provided with a component 22 to be cooled, a cooling groove is formed in the component 22 to be cooled, the diameter of the cooling groove is consistent with that of the first cold row water outlet pipe 21, a second cold row water inlet pipe 23 is arranged on the component 22 to be cooled, one side of the second cold row water inlet pipe 23 is provided with a second cold row water outlet pipe 24, the lower end of the second cold row water outlet pipe 24 is provided with a circulating water pump 25, the front end of the circulating water pump 25 is provided with a third cold row water inlet pipe 26, and circulating water cooling of the water cooling component 9 can be realized through the effect of the circulating water pump 25.
Further, the rear end of circulating water pump 25 is provided with backplate 27, and backplate 27 sets up to the rectangular plate, backplate 27 and cold row fixed plate 10 fixed connection are provided with CD-ROM drive 28 on the backplate 27, and CD-ROM drive 28 and backplate 27 fixed connection, and one side of CD-ROM drive 28 is provided with forced air cooling subassembly 29, can be through the setting of backplate 27, conveniently wait to cool down the installation of subassembly 22.
Further, the air cooling assembly 29 includes the fan frame 30, be provided with fixing bolt 31 on the fan frame 30, fixing bolt 31 runs through the fan frame 30, the air cooling assembly 29 passes through fixing bolt 31 with backup pad 5 to be connected, the lower extreme of fan frame 30 is provided with connecting strip 32, connecting strip 32 and fan frame 30 fixed connection, the rear end of connecting strip 32 is provided with fan main part 33, fan main part 33 and connecting strip 32 fixed connection are provided with crashproof circle 34 on the fan main part 33, can be through the setting of air cooling assembly 29, come diversified this PCB quick-witted case high-efficient heat abstractor's heat dissipation means.
Further, the inside of buffer stop 34 is provided with the column 35, the column 35 sets up to the cylinder, be provided with flabellum 36 on the column 35, flabellum 36 is provided with a plurality of, a plurality of flabellums 36 are arranged as the circumference with the centre of a circle of column 35, one side of flabellum 36 is provided with the wiring board 37, be provided with the column hole on the wiring board 37, and the diameter of column hole slightly is greater than the column 35, be provided with wiring groove 38 on the wiring board 37, the degree of depth of wiring groove 38 sets up to the half of wiring board 37 thickness, the rear end of fan main part 33 is provided with fixed strip 39, fixed strip 39 and fan frame 30 fixed connection can dispel the heat to the inside of this high-efficient heat abstractor of PCB quick-witted case through a plurality of flabellums 36.
Further, the upper end of water-cooling module 9 is provided with device roof 6, be provided with ventilation groove 7 on the device roof 6, ventilation groove 7 sets up to rectangular channel, be provided with the ash board 8 that falls in the ventilation groove 7, be provided with a plurality of ventilation holes on the ash board 8 that falls, one side of device roof 6 lower extreme is provided with backup pad 5, backup pad 5 sets up to "L" form, backup pad 5 is provided with four, four backup pads 5 set up in the four corners department of device roof 6, device roof 6 and device roof 6 fixed connection, the lower extreme of backup pad 5 is provided with device bottom plate 1, backup pad 5 and device bottom plate 1 fixed connection can be through the setting of ventilation groove 7 and ash board 8 for the cooling wind that air cooling module 29 produced can be smooth dispel from ventilation groove 7, and can not produce the dust and accompany.
Further, be provided with mounting groove 2 on the device bottom plate 1, mounting groove 2 sets up to the rectangle, the degree of depth of mounting groove 2 sets up to half of device bottom plate 1 thickness, the front end of mounting groove 2 one side is provided with spread groove 3, spread groove 3 is provided with four, four spread groove 3 settings are in the four corners department of device bottom plate 1, the inside of spread groove 3 is provided with connecting hole 4, connecting hole 4 sets up to circularly, connecting hole 4 sets up in the center department of spread groove 3, the degree of depth of connecting hole 4 sets up to half of mounting groove 2 degree of depth, can realize this high-efficient heat abstractor and the connection of quick-witted case through connecting hole 4.
Working principle: when in use, a user firstly checks the high-efficiency heat dissipation device of the whole PCB chassis, after confirming that the checking is correct, the user positions the high-efficiency heat dissipation device through the mounting groove 2 on the device bottom plate 1, after the positioning is finished, the connection between the chassis and the high-efficiency heat dissipation device is finished through the connecting holes 4 in the connecting groove 3, the number of the air cooling components 29 is selected through the number of internal devices, the connection between the supporting plate 5 and the air cooling components 29 is finished through the fixing bolts 31 after selecting the proper number of the air cooling components 29, after confirming the connection is finished, the components 22 to be cooled are sequentially arranged on the back plate 27, meanwhile, the display card and the power supply are arranged at the upper end and the lower end of the cooling plate 16, after confirming the installation is finished, the power supply is connected, enough circulating cooling water is introduced into the water pump, and the high-efficiency heat dissipation device can be started to be used, after the PCB chassis is used for a long time, A large amount of heat accumulation can be generated in the PCB case, cooling water can be introduced into the third cold row water inlet pipe 26 through the circulating water pump 25 for cooling under the action of the third cold row 13, the cooled cooling water can enter the third cold row water outlet pipe 14 under the action of gravity and enter the cooling plate water inlet plate 15 through the third cold row water outlet pipe 14, the display cards and the batteries at the upper end and the lower end of the cooling plate 16 are cooled through the water grooves and the circulating water grooves arranged in the cooling plate water inlet plate 15, the fixed block 17 and the cooling plate 16, meanwhile, the cooled cooling water can enter the first cold row 11 through the first cold row water inlet pipe 20 for secondary cooling, the cooled cooling water can enter the first cold row water outlet pipe 21 for cooling a component 22 to be cooled, and after cooling is finished, the cooled cooling water enters the second cold row 12 through the second cold row water inlet pipe 23 for tertiary cooling, after the cooling is finished, the cooling water enters the circulating water pump 25 through the second cooling water discharging pipe 24, namely, one-time water cooling is finished, when a user needs the air cooling assembly 29 to work, the rotary column 35 can drive the fan blades 36, so that the inside and outside flow velocity change is generated, the heat dissipation of the inside of the PCB chassis is realized, in the air cooling process, the cooling air generated by the air cooling assembly 29 can be smoothly dissipated from the ventilation groove 7 through the mutual cooperation of the ventilation groove 7 and the ash falling plate 8, dust is not generated, and meanwhile, the arrangement of the wiring groove 38 can facilitate the installation of the air cooling assembly 29 by the user.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The utility model provides a PCB machine case heat abstractor, includes water-cooling assembly (9), its characterized in that: the water cooling assembly (9) comprises a cold row fixing plate (10), a first cold row (11) is arranged on the cold row fixing plate (10), the first cold row (11) is attached to the cold row fixing plate (10), a second cold row (12) is arranged on one side of the first cold row (11), a third cold row (13) is arranged on one side of the second cold row (12), the shapes and the sizes of the first cold row (11), the second cold row (12) and the third cold row (13) are consistent, a third cold row water outlet pipe (14) is arranged on the third cold row (13), the third cold discharge water pipe (14) is fixedly connected with the third cold row (13), the rear end of the third cold discharge water pipe (14) is connected with a cooling plate water inlet plate (15), a water tank is arranged in the cooling plate water inlet plate (15), a cooling plate (16) is arranged at the rear end of the cooling plate water inlet plate (15), the cooling plate water inlet plate (15) is fixedly connected with the cooling plate (16), a circulating water tank is arranged in the cooling plate (16) and is communicated with the water tank, a fixed block (17) is arranged at one side of the lower end of the cooling plate (16), the fixed block (17) is fixedly connected with the cooling plate (16), the other side of the cooling plate (16) is provided with a connecting plate (18), the cooling plate (16) is fixedly connected with the connecting plate (18), one side of the connecting plate (18) is provided with a cooling plate water outlet plate (19), the inside of the cooling plate water outlet plate (19) is provided with a water tank, the water tank is communicated with a circulating water tank arranged in the cooling plate (16), the cooling plate water outlet plate (19) is provided with a first cold discharge water inlet pipe (20), the first cold discharge water inlet pipe (20) is fixedly connected with a first cold discharge water outlet pipe (21) arranged on one side of the first cold discharge water inlet pipe (20), the first cold discharge water pipe (21) is fixedly connected with the first cold row (11), the rear end of the first cold discharge water pipe (21) is connected with a cooling component (22) to be cooled, a cooling groove is formed in the cooling component (22), the diameter of the cooling groove is consistent with that of the first cold discharge water pipe (21) and enables the rear end of the first cold discharge water pipe (21) to be communicated with the cooling groove, a second cold discharge water inlet pipe (23) is connected to the cooling component (22) to be cooled, a second cold discharge water outlet pipe (24) is arranged on one side of the second cold discharge water pipe (23), a circulating water pump (25) is connected to the lower end of the second cold discharge water outlet pipe (24), the front end of the circulating water pump (25) is connected with a third cold-discharge water inlet pipe (26), the rear end of the circulating water pump (25) is provided with a backboard (27), the backboard (27) is provided with a rectangular plate, the backboard (27) is fixedly connected with a cold-discharge fixing plate (10), an optical drive (28) is arranged on the backboard (27), the optical drive (28) is fixedly connected with the backboard (27), one side of the optical drive (28) is provided with an air cooling component (29), the air cooling component (29) comprises a fan outer frame (30), a fixing bolt (31) is arranged on the fan outer frame (30), the fixing bolt (31) penetrates through the fan outer frame (30), the upper end of the water cooling assembly (9) is provided with a device top plate (6), one side of the lower end of the device top plate (6) is provided with a supporting plate (5), the supporting plate (5) is in an L shape, the four supporting plates (5) are arranged at four corners of the device top plate (6), the supporting plate (5) is fixedly connected with the device top plate (6), the lower end of the supporting plate (5) is provided with a device bottom plate (1), the supporting plate (5) is fixedly connected with the device bottom plate (1), the air cooling assembly (29) is connected with the supporting plate (5) through fixing bolts (31), the lower end of the fan outer frame (30) is provided with connecting strips (32), the fan is characterized in that the connecting strip (32) is fixedly connected with the fan outer frame (30), a fan main body (33) is arranged at the rear end of the connecting strip (32), the fan main body (33) is fixedly connected with the connecting strip (32), and an anti-collision ring (34) is arranged on the fan main body (33).
2. The PCB chassis heat sink of claim 1, wherein: the inside of anticollision circle (34) is provided with swivel post (35), swivel post (35) are set up to the cylinder, be provided with flabellum (36) on swivel post (35), flabellum (36) are provided with a plurality of, a plurality of flabellum (36) are the circumference with the centre of a circle of swivel post (35) as the center and arrange, one side of flabellum (36) is provided with walks line board (37), be provided with swivel post hole on walk line board (37), and the diameter of swivel post hole slightly is greater than swivel post (35), be provided with on walk line board (37) and walk line groove (38), the degree of depth of walk line groove (38) sets up to walk half of line board (37) thickness, the rear end of fan main part (33) is provided with fixed strip (39), fixed strip (39) and fan frame (30) fixed connection.
3. The PCB chassis heat sink of claim 1, wherein: the device is characterized in that a ventilation groove (7) is formed in the top plate (6), the ventilation groove (7) is a rectangular groove, an ash falling plate (8) is arranged in the ventilation groove (7), and a plurality of ventilation holes are formed in the ash falling plate (8).
4. A PCB chassis heat sink according to claim 3, wherein: be provided with mounting groove (2) on device bottom plate (1), mounting groove (2) set up to the rectangle, the degree of depth of mounting groove (2) sets up to half of device bottom plate (1) thickness, the front end of mounting groove (2) one side is provided with spread groove (3), spread groove (3) are provided with four, four spread groove (3) set up the four corners department at device bottom plate (1), the inside of spread groove (3) is provided with connecting hole (4), connecting hole (4) set up to circularly, connecting hole (4) set up the center department at spread groove (3), the degree of depth of connecting hole (4) sets up to half of mounting groove (2) degree of depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148378.5A CN110719724B (en) | 2019-11-21 | 2019-11-21 | Efficient heat dissipation device for PCB chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148378.5A CN110719724B (en) | 2019-11-21 | 2019-11-21 | Efficient heat dissipation device for PCB chassis |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110719724A CN110719724A (en) | 2020-01-21 |
| CN110719724B true CN110719724B (en) | 2024-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911148378.5A Active CN110719724B (en) | 2019-11-21 | 2019-11-21 | Efficient heat dissipation device for PCB chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110719724B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211064013U (en) * | 2019-11-21 | 2020-07-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
| KR20050120557A (en) * | 2004-09-18 | 2005-12-22 | 박재호 | Computer cooling case using the liquid refrigerant |
| CN104516451A (en) * | 2015-01-15 | 2015-04-15 | 鲁奎 | Multifunctional computer case |
| CN204347742U (en) * | 2015-01-23 | 2015-05-20 | 常州信息职业技术学院 | A kind of computer water-cooling cabinet |
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| CN107179810A (en) * | 2017-07-11 | 2017-09-19 | 合肥哨商信息技术有限公司 | A kind of computer cabinet with radiating purification function |
| CN109240473A (en) * | 2018-11-26 | 2019-01-18 | 华研科技（大连）有限公司 | A kind of computer water-cooling radiating device and method |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211064013U (en) * | 2019-11-21 | 2020-07-21 | 苏州市惠利盛电子科技有限公司 | High-efficient heat abstractor of PCB machine case |
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