CN110714216A - Nickel-plated copper strip and preparation method thereof - Google Patents

Nickel-plated copper strip and preparation method thereof Download PDF

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CN110714216A
CN110714216A CN201910971735.1A CN201910971735A CN110714216A CN 110714216 A CN110714216 A CN 110714216A CN 201910971735 A CN201910971735 A CN 201910971735A CN 110714216 A CN110714216 A CN 110714216A
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nickel
electroplating
trivalent chromium
base material
pure copper
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陈小平
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Jiangyin Hongshun New Electronic Technology Co Ltd
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Jiangyin Hongshun New Electronic Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a nickel-plated copper strip and a preparation method thereof, wherein the nickel-plated copper strip is based on a pure copper base material, and an electroplated semi-gloss nickel layer and an electroplated chromium layer are sequentially arranged on the pure copper base material from inside to outside; the thickness of the electroplated semi-gloss nickel layer is 1-3 mu m; the thickness of the electroplated chromium layer is 0.03-0.05 μm. The method has the advantages of simple process flow, adoption of a trivalent chromium electroplating process during passivation, better covering capability and corrosion resistance of other passivation processes, low metal concentration, low carry-over loss, capability of greatly reducing the cost of wastewater treatment, low current density in use and higher efficiency than rack plating. The nickel-plated copper strip prepared by the method has excellent surface flatness and brightness, good wear resistance and corrosion resistance, and no blackening and discoloration of the surface.

Description

Nickel-plated copper strip and preparation method thereof
Technical Field
The invention relates to the technical field of battery manufacturing, in particular to a nickel-plated copper strip and a preparation method thereof.
Background
The traditional nickel-plated copper strip passivation adopts hexavalent chromium electroplating or other passivation processes, and the surface of the nickel-plated copper strip produced by the processes is easy to blacken and discolor; when hexavalent chromium is electroplated to passivate nickel-plated copper materials, the concentration of metal is high, the carrying-out loss is large, the cost of wastewater treatment is extremely high, and the environmental pollution is easily caused.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a nickel-plated copper strip which has better corrosion resistance, good surface flatness and good brightness and is difficult to blacken and discolor and a preparation method thereof.
The nickel-plated copper strip is based on a pure copper base material, and an electroplated semi-gloss nickel layer and an electroplated chromium layer are sequentially arranged on the pure copper base material from inside to outside; wherein the content of the first and second substances,
the pure copper base material is a strip material, the purity of the pure copper base material is more than or equal to 99.9 percent, and the thickness of the pure copper base material is 0.1-0.3 mm.
The thickness of the electroplated semi-gloss nickel layer is 1-3 mu m; the arrangement of the electroplated semi-gloss nickel layer can increase the brightness and the thickness of the plating layer and further improve the corrosion resistance.
The thickness of the electroplated chromium layer is 0.03-0.05 μm; the arrangement of the electroplating nameplate layer can improve the wear resistance and corrosion resistance of the plating layer and prevent the surface of a product from blackening and discoloring.
The invention relates to a preparation method of a nickel-plated copper strip, which comprises the following steps:
(1) carrying out pretreatment before electroplating on a pure copper base material, wherein the pretreatment before electroplating sequentially comprises the following steps: chemical oil removal, water washing, activation and water washing;
(2) the pure copper base material pretreated before electroplating is sequentially subjected to the following electroplating process: electroplating semi-gloss nickel, washing, activating, washing, electroplating trivalent chromium, washing and drying, wherein an electroplating semi-gloss nickel layer and an electroplating chromium layer are sequentially formed on the surface of the pure copper substrate.
Preferably, the solution for electroplating the semi-gloss nickel is as follows: a mixed solution containing 200-300mL/L nickel sulfamate and 20-30g/L boric acid; the technological parameters of the electroplated semi-gloss nickel are as follows: the reaction temperature is 45 ℃; pH of 2-2.5 and current density of 95A/dm2And the reaction time is 5-10 s.
Preferably, the solution for electroplating trivalent chromium is: comprises mixed liquid of 200-230mL/L trivalent chromium conductive agent, 50-60g/L trivalent chromium cylinder opening agent, 20mL/L trivalent chromium auxiliary agent and 15mL/L trivalent chromium wetting agent; the technical parameters of the trivalent chromium electroplating are as follows: the reaction temperature is 45 ℃; the pH value is 2.5-3,the current density is 140A/dm2And the reaction time is 5-10 s.
Preferably, the solution used in the chemical degreasing process is: the chemical degreasing temperature of the solution containing 50g/L of sodium hydroxide is 40-50 ℃, and the soaking time is 5-10 s.
Preferably, the solution used in the activation process is: the activating temperature of 8-12% sulfuric acid solution is 30-40 deg.C, and the activating time is 5-10 s.
The chemical degreasing cleaning and activating treatment can effectively remove oil stains on the surface of the pure copper base material, and activate and corrode the surface of the pure copper base material, so that the electroplated semi-gloss nickel layer and the pure copper base material have good bonding force, and due to the corrosion on the surface of the pure copper base material, the nucleation density is high, the nickel coating crystal grains are fine, and the structure is compact.
The water washing refers to spraying water on the pure copper base material treated in each step.
According to the invention, the nickel-plated copper strip with excellent surface flatness and brightness can be obtained by arranging the layers according to the above materials and the above sequence and thickness proportion, and the nickel-plated copper strip has good wear resistance and corrosion resistance, and the surface of the nickel-plated copper strip cannot become black and discolored.
The preparation process of the nickel-plated copper strip provided by the invention has the advantages that the process flow is simple, the trivalent chromium electroplating process is adopted during passivation, other passivation processes have better covering capability and better corrosion resistance, the metal concentration is low, the carry-over loss is small, the cost of wastewater treatment can be greatly reduced, the use current density is low, and the efficiency is higher than that of rack plating.
Drawings
FIG. 1 is a schematic structural view of a nickel-plated copper strip of the present invention;
FIG. 2 is a flow chart of the process for making the nickel-plated copper strip of the present invention.
Detailed Description
While the following is a description of the preferred embodiments of the present invention, it should be noted that those skilled in the art can make various modifications and improvements without departing from the principle of the embodiments of the present invention, and such modifications and improvements are considered to be within the scope of the embodiments of the present invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in a first aspect, the present invention provides a nickel-plated copper strip,
the nickel-plated copper strip comprises a pure copper base material 1, and a semi-gloss nickel plating layer 2 and a chromium plating layer 3 which are sequentially formed on the pure copper base material 1. The outer surface of the nickel-plated copper strip has excellent surface flatness and brightness due to the existence of the electroplated semi-gloss nickel layer 2 and the electroplated chromium layer 3, and the surface cannot become black and discolored.
In a second aspect, the invention provides a preparation process of the nickel-plated copper strip, which comprises the following steps:
(1) carrying out pretreatment before electroplating on a pure copper base material, wherein the pretreatment before electroplating sequentially comprises the following steps: chemical oil removal, water washing, activation and water washing;
(2) the pure copper base material pretreated before electroplating is sequentially subjected to the following electroplating process: electroplating semi-gloss nickel, washing, activating, washing, electroplating trivalent chromium, washing and drying, wherein an electroplating semi-gloss nickel layer and an electroplating chromium layer are sequentially formed on the surface of the pure copper substrate.
Specifically, referring to fig. 2, the preparation process includes the following steps:
and step S1, electroplating the pure copper substrate through the electroplating solution to form a metal coating on the pure copper substrate, wherein the metal coating sequentially comprises an electroplated semi-gloss nickel layer and an electroplated chromium layer.
The following pretreatment is carried out before electroplating:
step S11, chemical degreasing: putting the pure copper base material into a solution containing 50g/L of sodium hydroxide, soaking for 5-10s, and chemically removing oil at 40-50 ℃.
And step S111, washing, namely spraying water on the pure copper base material after chemical degreasing to prevent the pollution of the bath solution in the next step.
Step S12, activation: placing the pure copper base material after chemical degreasing in sulfuric acid solution with volume fraction of 8-12%, and activating for 5-10s at 30-40 ℃.
The chemical degreasing cleaning and activating treatment can effectively remove oil stains on the surface of the pure copper base material, and activate and corrode the surface of the pure copper base material, so that the electroplated semi-gloss nickel layer and the pure copper base material have good bonding force, and due to the corrosion on the surface of the pure copper base material, the nucleation density is high, the nickel coating crystal grains are fine, and the structure is compact.
And step S121, washing, namely spraying water on the activated pure copper base material to prevent the next step of bath solution from being polluted.
The electroplating comprises the following steps:
step S13, electroplating semi-gloss nickel: the electroplated semi-gloss nickel layer is formed by the reaction time of the mixed solution containing 200-300mL/L nickel sulfamate and 20-30g/L boric acid for 5-10s, so as to increase the brightness and prevent corrosion. Wherein the reaction temperature is 45 ℃; pH of 2-2.5 and current density of 95A/dm2。
And S131, washing, namely spraying water on the nickel-plated copper belt after the semi-gloss nickel treatment to prevent the next bath solution from being polluted.
Step S14, activation: the nickel-plated copper strip plated with semi-gloss nickel is placed in a sulfuric acid solution with the volume fraction of 8-12%, and is subjected to activation treatment for 5-10s at the activation temperature of 30-40 ℃.
And step S141, washing, namely spraying water on the activated nickel-plated copper belt to prevent the next bath solution from being polluted.
Step S15, electroplating trivalent chromium: the chromium layer is formed on the semigloss nickel layer by the reaction time of 5-10s of mixed liquid containing 200-230mL/L of trivalent chromium conductive agent, 50-60g/L of trivalent chromium cylinder opener, 20mL/L of trivalent chromium auxiliary agent and 15mL/L of trivalent chromium wetting agent, so that the wear resistance and the corrosion resistance are improved. Wherein the reaction temperature is 45 ℃; pH of 2.5-3 and current density of 140A/dm2. The trivalent chromium-added conductive agent comprises 75-77g/L boric acid, so that the conductivity of the solution is improved; the concentration of trivalent chromium in the cylinder opening agent added with the trivalent chromium is 10-20 g/L; the additive of trivalent chromium isA carrier for the brightener and to obtain a brightness of the coating.
And step S151, washing, namely spraying water on the nickel-plated copper strip treated by trivalent chromium to prevent the next bath solution from being polluted.
And step S15, drying after the trivalent chromium treatment and water washing are finished, and forming a metal plating layer on the surface of the nickel-plated copper strip.
The preparation process of the nickel-plated copper strip provided by the second aspect of the embodiment of the invention has the advantages of simple process flow, adoption of a trivalent chromium electroplating process during passivation, better covering capability and corrosion resistance of other passivation processes, low metal concentration, low carry-over loss, capability of greatly reducing the cost of wastewater treatment, low current density in use and higher efficiency than rack plating.
The following examples are intended to illustrate the invention in more detail. The embodiments of the present invention are not limited to the following specific embodiments. The present invention can be modified and implemented as appropriate within the scope of the main claim.
Example one
A preparation process of a nickel-plated copper strip comprises the following steps:
and step S1, electroplating the pure copper substrate through the electroplating solution to form a metal coating on the pure copper substrate, wherein the metal coating sequentially comprises an electroplated semi-gloss nickel layer and an electroplated chromium layer.
The following pretreatment is carried out before electroplating:
step S11, chemical degreasing: putting the pure copper substrate into a solution containing 50g/L of sodium hydroxide, soaking for 5s, and chemically removing oil at 40 ℃.
And step S111, washing, namely spraying water on the pure copper base material after chemical degreasing to prevent the pollution of the bath solution in the next step.
Step S12, activation: placing the pure copper base material after chemical degreasing in sulfuric acid solution with volume fraction of 8%, and performing activation treatment for 5s at the activation temperature of 30 ℃.
And step S121, washing, namely spraying water on the activated pure copper base material to prevent the next step of bath solution from being polluted.
The electroplating comprises the following steps:
step S13, electroplating semi-gloss nickel: the electroplated semigloss nickel layer is formed by reaction of a mixed solution containing 200mL/L nickel sulfamate and 20g/L boric acid for 5s, and is used for increasing the brightness and preventing corrosion. Wherein the reaction temperature is 45 ℃; pH of 2 and current density of 95A/dm2。
And S131, washing, namely spraying water on the nickel-plated copper belt after the semi-gloss nickel treatment to prevent the next bath solution from being polluted.
Step S14, activation: and (3) placing the nickel-plated copper strip electroplated with semi-gloss nickel in a sulfuric acid solution with the volume fraction of 8%, and performing activation treatment for 5s at the activation temperature of 30 ℃.
And step S141, washing, namely spraying water on the activated nickel-plated copper belt to prevent the next bath solution from being polluted.
Step S15, electroplating trivalent chromium: a chromium layer is formed on the semi-gloss nickel layer by the reaction time of 5s of mixed liquid containing 200mL/L of trivalent chromium conductive agent, 50g/L of trivalent chromium cylinder opening agent, 20mL/L of trivalent chromium auxiliary agent and 15mL/L of trivalent chromium wetting agent, so that the wear resistance and the corrosion resistance are improved. Wherein the reaction temperature is 45 ℃; the pH value is 2.5, and the current density is 140A/dm2. The trivalent chromium-added conductive agent comprises 75g/L boric acid, so that the conductivity of the solution is improved; the concentration of trivalent chromium in the cylinder opening agent added with the trivalent chromium is 10 g/L; the trivalent chromium additive is a carrier of the brightener and gives brightness to the coating.
And step S151, washing, namely spraying water on the nickel-plated copper strip treated by trivalent chromium to prevent the next bath solution from being polluted.
And step S15, drying after the trivalent chromium treatment and water washing are finished, and forming a metal plating layer on the surface of the nickel-plated copper strip.
The surface of the nickel-plated copper strip is flat and bright, wherein the thickness of the electroplated semi-gloss nickel layer is 1 μm, and the thickness of the electroplated chromium layer is 0.03 μm.
Example two
A preparation process of a nickel-plated copper strip comprises the following steps:
and step S1, electroplating the pure copper substrate through the electroplating solution to form a metal coating on the pure copper substrate, wherein the metal coating sequentially comprises an electroplated semi-gloss nickel layer and an electroplated chromium layer.
The following pretreatment is carried out before electroplating:
step S11, chemical degreasing: putting the pure copper substrate into a solution containing 50g/L of sodium hydroxide, soaking for 7s, and chemically removing oil at 45 ℃.
And step S111, washing, namely spraying water on the pure copper base material after chemical degreasing to prevent the pollution of the bath solution in the next step.
Step S12, activation: placing the pure copper base material after chemical degreasing in sulfuric acid solution with volume fraction of 10%, and performing activation treatment for 7s at the activation temperature of 35 ℃.
And step S121, washing, namely spraying water on the activated pure copper base material to prevent the next step of bath solution from being polluted.
The electroplating comprises the following steps:
step S13, electroplating semi-gloss nickel: the electroplated semigloss nickel layer is formed by reacting a mixed solution containing 220mL/L nickel sulfamate and 25g/L boric acid for 7s, and is used for increasing the brightness and preventing corrosion. Wherein the reaction temperature is 45 ℃; pH of 2 and current density of 95A/dm2。
And S131, washing, namely spraying water on the nickel-plated copper belt after the semi-gloss nickel treatment to prevent the next bath solution from being polluted.
Step S14, activation: and (3) placing the nickel-plated copper strip electroplated with semi-gloss nickel in a sulfuric acid solution with the volume fraction of 10%, and performing activation treatment for 7s at the activation temperature of 35 ℃.
And step S141, washing, namely spraying water on the activated nickel-plated copper belt to prevent the next bath solution from being polluted.
Step S15, electroplating trivalent chromium: a chromium layer is formed on the semi-gloss nickel layer through a mixed solution reaction time of 7s, wherein the mixed solution comprises 210mL/L of trivalent chromium conductive agent, 50g/L of trivalent chromium cylinder opening agent, 20mL/L of trivalent chromium auxiliary agent and 15mL/L of trivalent chromium wetting agent, and the wear resistance and the corrosion resistance are improved. Wherein the reaction temperature is 45 ℃; the pH value is 2.5, and the current density is 140A/dm2. The trivalent chromium-added conductive agent comprises 75g/L boric acid, so that the conductivity of the solution is improved; the concentration of trivalent chromium in the cylinder opening agent added with the trivalent chromium is 10 g/L; the additionThe trivalent chromium adjuvant is a carrier for the brightener and gives the coating brightness.
And step S151, washing, namely spraying water on the nickel-plated copper strip treated by trivalent chromium to prevent the next bath solution from being polluted.
And step S15, drying after the trivalent chromium treatment and water washing are finished, and forming a metal plating layer on the surface of the nickel-plated copper strip.
The surface of the nickel-plated copper strip is flat and bright, wherein the thickness of the electroplated semi-gloss nickel layer is 1.6 μm, and the thickness of the electroplated chromium layer is 0.03 μm.
EXAMPLE III
A preparation process of a nickel-plated copper strip comprises the following steps:
and step S1, electroplating the pure copper substrate through the electroplating solution to form a metal coating on the pure copper substrate, wherein the metal coating sequentially comprises an electroplated semi-gloss nickel layer and an electroplated chromium layer.
The following pretreatment is carried out before electroplating:
step S11, chemical degreasing: putting the pure copper substrate into a solution containing 50g/L of sodium hydroxide, soaking for 8s, and chemically removing oil at 45 ℃.
And step S111, washing, namely spraying water on the pure copper base material after chemical degreasing to prevent the pollution of the bath solution in the next step.
Step S12, activation: placing the pure copper base material after chemical degreasing in sulfuric acid solution with volume fraction of 10%, and performing activation treatment for 8s at the activation temperature of 40 ℃.
And step S121, washing, namely spraying water on the activated pure copper base material to prevent the next step of bath solution from being polluted.
The electroplating comprises the following steps:
step S13, electroplating semi-gloss nickel: the electroplated semigloss nickel layer is formed by reaction of mixed liquor containing 250mL/L nickel sulfamate and 25g/L boric acid for 8s, and is used for increasing the brightness and preventing corrosion. Wherein the reaction temperature is 45 ℃; the pH value is 2.3, and the current density is 95A/dm2。
And S131, washing, namely spraying water on the nickel-plated copper belt after the semi-gloss nickel treatment to prevent the next bath solution from being polluted.
Step S14, activation: and (3) placing the nickel-plated copper strip electroplated with semi-gloss nickel in a sulfuric acid solution with the volume fraction of 10%, and performing activation treatment for 8s at the activation temperature of 40 ℃.
And step S141, washing, namely spraying water on the activated nickel-plated copper belt to prevent the next bath solution from being polluted.
Step S15, electroplating trivalent chromium: and forming a chromium layer on the semi-gloss nickel layer by a mixed solution containing 220mL/L of trivalent chromium conductive agent, 55g/L of trivalent chromium cylinder opening agent, 20mL/L of trivalent chromium auxiliary agent and 15mL/L of trivalent chromium wetting agent for 8s, so that the wear resistance and the corrosion resistance are improved. Wherein the reaction temperature is 45 ℃; the pH value is 2.8, and the current density is 140A/dm2. The trivalent chromium-added conductive agent comprises 76g/L boric acid, so that the conductivity of the solution is improved; the concentration of trivalent chromium in the cylinder opening agent added with the trivalent chromium is 15 g/L; the trivalent chromium additive is a carrier of the brightener and gives brightness to the coating.
And step S151, washing, namely spraying water on the nickel-plated copper strip treated by trivalent chromium to prevent the next bath solution from being polluted.
And step S15, drying after the trivalent chromium treatment and water washing are finished, and forming a metal plating layer on the surface of the nickel-plated copper strip.
The surface of the nickel-plated copper strip is flat and bright, wherein the thickness of the electroplated semi-gloss nickel layer is 2.2 μm, and the thickness of the electroplated chromium layer is 0.04 μm.
Example four
A preparation process of a nickel-plated copper strip comprises the following steps:
and step S1, electroplating the pure copper substrate through the electroplating solution to form a metal coating on the pure copper substrate, wherein the metal coating sequentially comprises an electroplated semi-gloss nickel layer and an electroplated chromium layer.
The following pretreatment is carried out before electroplating:
step S11, chemical degreasing: putting the pure copper substrate into a solution containing 50g/L of sodium hydroxide, soaking for 10s, and chemically removing oil at 50 ℃.
And step S111, washing, namely spraying water on the pure copper base material after chemical degreasing to prevent the pollution of the bath solution in the next step.
Step S12, activation: placing the pure copper base material after chemical degreasing in sulfuric acid solution with volume fraction of 12%, and performing activation treatment for 10s at the activation temperature of 40 ℃.
And step S121, washing, namely spraying water on the activated pure copper base material to prevent the next step of bath solution from being polluted.
The electroplating comprises the following steps:
step S13, electroplating semi-gloss nickel: the electroplated semigloss nickel layer is formed by reaction of mixed liquor containing 300mL/L nickel sulfamate and 30g/L boric acid for 10s, and is used for increasing the brightness and preventing corrosion. Wherein the reaction temperature is 45 ℃; the pH value is 2.5, and the current density is 95A/dm2。
And S131, washing, namely spraying water on the nickel-plated copper belt after the semi-gloss nickel treatment to prevent the next bath solution from being polluted.
Step S14, activation: and (3) placing the nickel-plated copper strip electroplated with semi-gloss nickel in a sulfuric acid solution with the volume fraction of 12%, and performing activation treatment for 10s at the activation temperature of 40 ℃.
And step S141, washing, namely spraying water on the activated nickel-plated copper belt to prevent the next bath solution from being polluted.
Step S15, electroplating trivalent chromium: and forming a chromium layer on the semi-gloss nickel layer by a mixed solution containing 230mL/L of trivalent chromium conductive agent, 60g/L of trivalent chromium cylinder opening agent, 20mL/L of trivalent chromium auxiliary agent and 15mL/L of trivalent chromium wetting agent for 10s of reaction time, so that the wear resistance and the corrosion resistance are improved. Wherein the reaction temperature is 45 ℃; pH of 3 and current density of 140A/dm2. The trivalent chromium-added conductive agent comprises 77g/L boric acid, so that the conductivity of the solution is provided; the concentration of trivalent chromium in the cylinder opening agent added with the trivalent chromium is 20 g/L; the trivalent chromium additive is a carrier of the brightener and gives brightness to the coating.
And step S151, washing, namely spraying water on the nickel-plated copper strip treated by trivalent chromium to prevent the next bath solution from being polluted.
And step S15, drying after the trivalent chromium treatment and water washing are finished, and forming a metal plating layer on the surface of the nickel-plated copper strip.
The surface of the nickel-plated copper strip is flat and bright, wherein the thickness of the electroplated semi-gloss nickel layer is 3 μm, and the thickness of the electroplated chromium layer is 0.05 μm.
The nickel-plated copper strip samples prepared in the first to fourth embodiments of the invention are subjected to a hundred-grid test, the test result is 5B, and the acid salt spray test for 48 hours can reach the 9-grade standard. The nickel-plated copper strip obtained by the embodiment of the invention has good wear resistance and corrosion resistance.
The nickel-plated copper strip sample prepared in the first to fourth embodiments of the invention is placed into an electrolyte containing 1000ppm of water, and after being baked for one week at 85 ℃, the surface of the nickel-plated copper strip sample is free from blackening and copper exposure. The nickel-plated copper strip obtained by the embodiment of the invention can not blacken and discolor, and the metal plating layer is qualified.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims (6)

1. A nickel-plated copper strip is characterized in that a pure copper base material is taken as a base, and a semi-gloss nickel plating layer and a chromium plating layer are sequentially arranged on the pure copper base material from inside to outside;
the pure copper base material is a strip material, the purity of the pure copper base material is more than or equal to 99.9 percent, and the thickness of the pure copper base material is 0.1-0.3 mm;
the thickness of the electroplated semi-gloss nickel layer is 1-3 mu m;
the thickness of the electroplated chromium layer is 0.03-0.05 μm.
2. The preparation method of the nickel-plated copper strip is characterized by comprising the following steps:
(1) carrying out pretreatment before electroplating on a pure copper base material, wherein the pretreatment before electroplating sequentially comprises the following steps: chemical oil removal, water washing, activation and water washing;
(2) the pure copper base material pretreated before electroplating is sequentially subjected to the following electroplating process: electroplating semi-gloss nickel, washing, activating, washing, electroplating trivalent chromium, washing and drying, wherein an electroplating semi-gloss nickel layer and an electroplating chromium layer are sequentially formed on the surface of the pure copper substrate.
3. The preparation method according to claim 1, wherein the solution for electroplating semi-gloss nickel is: a mixed solution containing 200-300mL/L nickel sulfamate and 20-30g/L boric acid; the technological parameters of the electroplated semi-gloss nickel are as follows: the reaction temperature is 45 ℃; pH of 2-2.5 and current density of 95A/dm2And the reaction time is 5-10 s.
4. The method according to claim 1, wherein the solution for plating trivalent chromium is: comprises mixed liquid of 200-230mL/L trivalent chromium conductive agent, 50-60g/L trivalent chromium cylinder opening agent, 20mL/L trivalent chromium auxiliary agent and 15mL/L trivalent chromium wetting agent; the technical parameters of the trivalent chromium electroplating are as follows: the reaction temperature is 45 ℃; pH of 2.5-3 and current density of 140A/dm2And the reaction time is 5-10 s.
5. The method according to claim 1, wherein the solution used in the chemical degreasing process is: the chemical degreasing temperature of the solution containing 50g/L of sodium hydroxide is 40-50 ℃, and the soaking time is 5-10 s.
6. The method according to claim 1, wherein the solution used in the activation process is: the activating temperature of 8-12% sulfuric acid solution is 30-40 deg.C, and the activating time is 5-10 s.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111603682A (en) * 2020-06-28 2020-09-01 江苏鱼跃医疗设备股份有限公司 Improved ear vagus nerve stimulation instrument
CN113151873A (en) * 2021-04-27 2021-07-23 深圳市通之泰科技有限公司 Process method for improving electroplating corrosion resistance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111603682A (en) * 2020-06-28 2020-09-01 江苏鱼跃医疗设备股份有限公司 Improved ear vagus nerve stimulation instrument
CN111603682B (en) * 2020-06-28 2023-10-27 江苏鱼跃医疗设备股份有限公司 Improved ear vagus nerve stimulator
CN113151873A (en) * 2021-04-27 2021-07-23 深圳市通之泰科技有限公司 Process method for improving electroplating corrosion resistance

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