CN110708897A - Circuit board manufacturing method and circuit board - Google Patents
Circuit board manufacturing method and circuit board Download PDFInfo
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- CN110708897A CN110708897A CN201911000402.0A CN201911000402A CN110708897A CN 110708897 A CN110708897 A CN 110708897A CN 201911000402 A CN201911000402 A CN 201911000402A CN 110708897 A CN110708897 A CN 110708897A
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- plate body
- board
- circuit board
- forming
- protective layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body; forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer, the second plate body in the preset area and the first plate body are separated; through forming the protective layer between first plate body and second plate body to form the cutting seam through the edge in the method of laser cutting along presetting the region, so that second plate body, protective layer in the presetting region can separate with first plate body, and the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.
Description
Technical Field
The invention relates to the field of electronic equipment manufacturing, in particular to a circuit board and a manufacturing method thereof.
Background
With the continuous development of electronic communication technology, the requirement for the space of the circuit board is higher and higher. In order to reduce the space occupied by the circuit board, a stepped groove (british name Cavity) is generally disposed on the circuit board, and at least part of the electronic device is mounted in the stepped groove, so as to prevent the electronic device from being exposed outside the circuit board, and the volume is too large, and the space is occupied, so how to form the stepped groove on the circuit board becomes a hot point of research.
In the related art, the stepped groove is usually formed by cutting, specifically, a milling cutter cuts in a preset area on the circuit board to remove materials in the preset area, control the cutting depth of the milling cutter, and further form the stepped groove.
However, the stepped groove is formed by cutting with a milling cutter, and the sidewall of the stepped groove is rough, resulting in insufficient accuracy of the circuit board.
Disclosure of Invention
The invention provides a manufacturing method of a circuit board and the circuit board, and aims to solve the technical problem that the precision of the circuit board is insufficient due to the fact that the side wall of a stepped groove formed by cutting through a milling cutter is rough.
The invention provides a manufacturing method of a circuit board, which comprises the following steps:
forming a first plate body; forming a protective layer on the bottom surface of a second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
Further, after the protective layer is formed on the bottom surface of the second board body and the bottom surface of the second board body is attached to the top surface of the first board body, the method further includes: and connecting the first plate body and the second plate body.
Further, the connecting the first board body and the second board body comprises: the first plate body is provided with a first through hole, the second plate body is provided with a second through hole, the connecting piece is arranged in the first through hole and the second through hole in a penetrating mode, a first stopping portion abutting against the first plate body is formed at the first end of the connecting piece, and a second stopping portion abutting against the second plate body is formed at the second end of the connecting piece.
Further, the first stopper portion and/or the second stopper portion is formed by pressing the connecting member.
Further, the connecting the first board body and the second board body comprises: and heating the edges of the first plate body and the second plate body so as to melt part of the first plate body and part of the second plate body and form a connecting part at the junction position of the first plate body and the second plate body.
Further, said connecting said first board body and said second board body further comprises: a first metal layer is formed on a top surface of the second plate.
Further, after forming the first metal layer on the top surface of the second plate body, the method further includes: and forming a third plate body on the bottom surface of the first plate body, wherein a second metal layer is arranged on the bottom surface of the third plate body.
Further, the forming a third board body on the bottom surface of the first board body, after having a second metal layer on the bottom surface of the third board body, further includes: and forming a circuit pattern on the first metal layer and the second metal layer.
Further, the forming a first plate body includes: the first plate body is formed by forming a third metal layer on the insulating plate.
The present invention also provides a circuit board, comprising: the circuit board is manufactured according to the manufacturing method of the circuit board.
The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body; forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body; forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer, the second plate body in the preset area and the first plate body are separated; through forming the protective layer between first plate body and second plate body to form the cutting seam through the edge in the method of laser cutting along presetting the region, so that second plate body, protective layer in the presetting region can separate with first plate body, and the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Fig. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a circuit pattern and a first through hole formed on a top surface of a first board in the method for manufacturing a circuit board according to the embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a second through hole formed in a second board in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 4 is a schematic view illustrating a first board and a second board connected by a connecting member in the method for manufacturing a circuit board according to the embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a first metal layer formed on a top surface of a second board body, and a third board body and a second metal layer formed on a bottom surface of the first board body in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 6 is a schematic diagram illustrating a circuit pattern formed on the first metal layer and the second metal layer in the method for manufacturing a circuit board according to the embodiment of the invention;
fig. 7 is a schematic diagram after a cutting seam is formed by a laser cutting method in the manufacturing method of the circuit board according to the embodiment of the invention;
fig. 8 is a schematic diagram of the circuit board after a step groove is formed in the manufacturing method of the circuit board according to the embodiment of the invention.
Description of reference numerals:
1: a first plate body;
11: a first through hole;
12: a third metal layer;
2: a second plate body;
21: presetting an area;
22: a second through hole;
23: a first metal layer;
3: a protective layer;
4: cutting a seam;
5: a connecting member;
51: a first stopper portion;
52: a second stopper portion;
6: a circuit pattern;
7: a third plate body;
71: a second metal layer.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Fig. 1 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present invention; fig. 2 is a schematic diagram illustrating a circuit pattern and a first through hole formed on a top surface of a first board in the method for manufacturing a circuit board according to the embodiment of the present invention; fig. 3 is a schematic diagram illustrating a second through hole formed in a second board in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 4 is a schematic view illustrating a first board and a second board connected by a connecting member in the method for manufacturing a circuit board according to the embodiment of the present invention; fig. 5 is a schematic diagram illustrating a first metal layer formed on a top surface of a second board body, and a third board body and a second metal layer formed on a bottom surface of the first board body in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 6 is a schematic diagram illustrating a circuit pattern formed on the first metal layer and the second metal layer in the method for manufacturing a circuit board according to the embodiment of the invention; fig. 7 is a schematic diagram after a cutting seam is formed by a laser cutting method in the manufacturing method of the circuit board according to the embodiment of the invention; fig. 8 is a schematic diagram of the circuit board after a step groove is formed in the manufacturing method of the circuit board according to the embodiment of the invention. Reference is now made to fig. 1-8. A method of fabricating a circuit board according to an embodiment of the present application is described. As shown in fig. 1, the present embodiment provides a method for manufacturing a circuit board, including: forming a first plate body 1; forming a protective layer 3 on the bottom surface of the second plate body 2, and then attaching the bottom surface of the second plate body 2 to the top surface of the first plate body 1; the second plate body 2 is provided with a preset area 21, and the projection of the preset area 21 on the first plate body 1 is positioned in the projection of the protective layer 3 on the first plate body 1; the protective layer 3 and the second board body 2 in the predetermined area 21 are separated from the first board body 1 by forming the cutting seam 4 along the edge of the predetermined area 21 by a laser cutting method.
S101: forming a first plate body.
Referring to fig. 2, in particular, the first plate body 1 includes an insulating plate; the insulating plate is a hard plate formed by adopting a plurality of layers of base materials through lamination; the insulating plate may be various, for example, the insulating plate may be a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate, or an epoxy glass cloth laminate.
Alternatively, functional units such as circuit patterns 6, bonding pads, and via holes may be formed on the top surface of the first board body 1.
S102: forming a protective layer on the bottom surface of the second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body.
Referring to fig. 2 to 7, specifically, the protective layer 3 may be formed on the bottom surface of the second board body 2 by disposing an adhesive between the bottom surface of the second board body 2 and the protective layer 3, and the protective layer 3 corresponds to a position of the predetermined area 21 on the second board body 2, so that a projection of the predetermined area 21 on the first board body 1 is located within a projection of the protective layer 3 on the first board body 1; the first plate body 1 and the second plate body 2 are connected, and the bottom surface of the second plate body 2 is attached to the top surface of the first plate body 1 to fix the protective layer 3 between the first plate body 1 and the second plate body 2.
Alternatively, the protective layer 3 is required to prevent a hardened joint from being formed between the first board 1 and the second board 2 in the predetermined area 21 after a plurality of pressing processes. Illustratively, the protective layer 3 can resist a high temperature of more than 180 ℃ and a high pressure of more than 450 pounds Per Square Inch (PSI) for more than 90 minutes, so as to ensure that the protective layer 3 can prevent the formation of a hardened joint between the board body and the connecting layer of the predetermined area 21 after the first board body 1 and the second board body 2 in the predetermined area 21 are subjected to multiple pressing processes.
Alternatively, the material of the protection layer 3 may be various, for example, the protection layer 3 may be a cover film made of polyimide or PCB ink. Connecting force between protective layer 3 and the first plate body 1 is less to after forming cutting seam 4 along the edge of predetermineeing regional 21, protective layer 3, predetermine the second plate body 2 in regional 21 and separate with first plate body 1 easily, be convenient for take out from the ladder groove that forms with the protective layer 3 that cuts off and predetermine the second plate body 2 in regional 21.
Alternatively, the second plate body 2 may be made of polypropylene (PP) resin.
S103: and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
Referring to fig. 7 and 8, specifically, a cutting seam 4 is formed along the edge of the preset area 21 by a laser cutting method, and the cutting depth of the laser cutting is controlled so that the laser can completely penetrate through the second board body 2 and the protective layer 3, but not through the first board body 1, so that the protective layer 3, the second board body 2 in the preset area 21 and the first board body 1 are separated to form a stepped groove on the circuit board.
Alternatively, the laser may be CO2Laser or UV laser. CO 22The laser output beam has high optical quality, good coherence, narrow line width and stable work; the UV laser has short wavelength, high beam quality, high peak power, small focused light spot and high processing precision; by using CO2Laser or UV laser carries out the cutting, can be so that the roughness of the lateral wall of the ladder groove that forms through laser cutting is low to guarantee that the precision that forms the ladder groove is high.
Optionally, the first plate 1 located at the bottom of the stepped groove may be subjected to subsequent manufacturing processes such as solder mask, electrical measurement, and the like, so as to ensure the processing precision of the bottom of the stepped groove.
The invention provides a manufacturing method of a circuit board and the circuit board, wherein the manufacturing method comprises the steps of forming a first board body 1; forming a protective layer 3 on the bottom surface of the second plate body 2, and then attaching the bottom surface of the second plate body 2 to the top surface of the first plate body 1; the second plate body 2 is provided with a preset area 21, and the projection of the preset area 21 on the first plate body 1 is positioned in the projection of the protective layer 3 on the first plate body 1; forming a cutting seam 4 along the edge of the preset area 21 by a laser cutting method, so that the protective layer 3 and the second plate body 2 in the preset area 21 are separated from the first plate body 1; through forming protective layer 3 between first plate body 1 and second plate body 2 to form cutting seam 4 along the edge of predetermineeing regional 21 through the method of laser cutting, so that predetermineeing second plate body 2 in regional 21, protective layer 3 and can separate with first plate body 1, the ladder groove that forms compares with the ladder groove that forms through the mode of milling, and its lateral wall is more smooth, and then makes the precision of the circuit board that forms high.
As shown in fig. 4, the method further includes the steps of forming a protective layer 3 on the bottom surface of the second plate body 2, and then attaching the bottom surface of the second plate body 2 to the top surface of the first plate body 1: the first board body 1 and the second board body 2 are connected.
Specifically, first plate body 1 and second plate body 2 are connected to fixed first plate body 1, second plate body 2 and the position relation between the protective layer 3, avoid when adopting laser to cut, because of taking place the skew between first plate body 1, second plate body 2 and the protective layer 3 and influence the cutting accuracy.
Optionally, there may be a plurality of ways to connect the first board body 1 and the second board body 2, for example, a protective layer 3 is formed on the bottom surface of the second board body 2, and after the bottom surface of the second board body 2 is attached to the top surface of the first board body 1, the first board body 1 and the second board body 2 may be pressed together to connect the first board body 1 and the second board body 2.
According to the manufacturing method of the circuit board, the first board body 1 and the second board body 2 are connected, so that the position relation among the first board body 1, the second board body 2 and the protective layer 3 can be fixed, the problem that when laser is adopted for cutting, the cutting precision is influenced due to the fact that deviation occurs among the first board body 1, the second board body 2 and the protective layer 3 is avoided, and the processing precision of the stepped groove can be improved.
Referring to fig. 3-8, in one realisable form, connecting the first plate 1 and the second plate 2 comprises: the first plate body 1 is provided with a first through hole 11, the second plate body 2 is provided with a second through hole 22, the connecting piece 5 is arranged in the first through hole 11 and the second through hole 22 in a penetrating manner, a first stopping portion 51 abutting against the first plate body 1 is formed at the first end of the connecting piece 5, and a second stopping portion 52 abutting against the second plate body 2 is formed at the second end of the connecting piece 5.
Specifically, a first stop portion 51 abutting against the first board body 1 is formed at a first end of the connecting member 5, and a second stop portion 52 abutting against the second board body 2 is formed at a second end of the connecting member 5 of the first stop portion 51.
Optionally, a special laser burning mode can be adopted to form the first through hole 11 on the first plate body 1, so that the advantages of high operation efficiency and high processing precision are achieved; the first through hole 11 can also be formed in the first plate body 1 by mechanical drilling, so that the processing cost can be reduced.
Optionally, there may be a plurality of forming positions of the first through hole 11 on the first board 1, and the forming position of the first through hole 11 on the first board 1 needs to satisfy a requirement that does not affect the functional units such as via holes, conductive patterns, and solder pads formed on the circuit board.
Alternatively, the forming manner and the forming position of the second through hole 22 on the second plate body 2 may refer to the forming manner and the forming position of the first through hole 11 on the first plate body 1, and will not be described herein again.
Alternatively, the material of the connecting member 5 may be various, for example, the connecting member 5 may be a metal material such as copper, iron, and aluminum.
Optionally, a first sinking groove is formed at one end of the first through hole 11 away from the second plate body 2, the first blocking portion 51 is located in the first sinking groove, a second sinking groove is formed at one end of the second through hole 22 of the first plate body 1, and the second blocking portion 52 is located in the second sinking groove, so as to prevent two ends of the connecting member 5 from protruding out of the first plate body 1 and the second plate body 2 and occupying too much space.
According to the manufacturing method of the circuit board provided by the embodiment, the connecting piece 5 is arranged in the first through hole 11 and the second through hole 22 in a penetrating manner, the first stopping portion 51 and the second stopping portion 52 are formed at two ends of the connecting piece 5, so that the first board body 1 and the second board body 2 can be stably connected, the problem that when laser is used for cutting, the cutting precision is influenced due to the fact that deviation occurs among the first board body 1, the second board body 2 and the protective layer 3 is avoided, and the processing precision of the stepped groove can be improved.
Referring to fig. 3-8, further, the first stopper 51 and/or the second stopper 52 are formed by pressing the connecting member 5.
Specifically, the connecting member 5 may have various structures, for example, the connecting member 5 may have a cylindrical structure, and after the connecting member 5 is inserted into the first through hole 11 and the second through hole 22, a first stopper 51 abutting against the first plate body 1 and a second stopper 52 abutting against the second plate body 2 are sequentially formed at both ends of the connecting member 5 by pressing the connecting member 5; the connecting member 5 may also be a columnar structure having a boss at one end, that is, the boss at one end of the connecting member 5 is a first stopping portion 51 or a second stopping portion 52, after the connecting member 5 penetrates the first through hole 11 and the second through hole 22 through the end without the boss, the second stopping portion 52 or the first stopping portion 51 is formed at the end without the boss of the connecting member 5 by extruding the connecting member 5, so that the first stopping portion 51 abuts against the first plate body 1, and the second stopping portion 52 abuts against the second plate body 2, so as to stably connect the first plate body 1 and the second plate body 2. The first blocking portion 51 and/or the second blocking portion 52 can be formed by pressing the connecting member 5, so that the first board body 1 and the second board body 2 can be stably connected, and the first board body 1 and the second board body 2 connected by the connecting member 5 are convenient to operate and high in universality.
Alternatively, when the connecting member 5 has a cylindrical structure, the cross-sectional shape of the connecting member 5 may be various, for example, the cross-section of the connecting member 5 may be a regular shape such as a triangle, a square, a circle, and an ellipse, and the cross-section of the connecting member 5 may also be other irregular shapes.
In the manufacturing method of the circuit board provided by this embodiment, the first blocking portion 51 and/or the second blocking portion 52 can be formed by pressing the connecting member 5, so that the first board body 1 and the second board body 2 can be stably connected, and the first board body 1 and the second board body 2 connected by the connecting member 5 are convenient to operate and have strong versatility.
In other implementations, connecting the first board body 1 and the second board body 2 includes: the edges of the first plate body 1 and the second plate body 2 are heated so that a portion of the first plate body 1 and a portion of the second plate body 2 are melted and a joint is formed at the interface of the first plate body 1 and the second plate body 2.
Specifically, through the edge of heating first plate body 1 and second plate body 2, so that part first plate body 1 and part second plate body 2 melt, so that the edge at first plate body 1 and 2 juncture of second plate body forms connecting portion, connect first plate body 1 and second plate body 2 through the connecting portion that forms, the space that occupies is little, make first plate body 1 and second plate body 2 have more areas and can be used for forming functional unit such as conducting hole, conductive pattern and pad, so as to improve the circuit board utilization ratio, reduce the circuit board volume.
As shown in fig. 5 to 8, further, after connecting the first board body 1 and the second board body 2, the method further includes: a first metal layer 23 is formed on the top surface of the second plate body 2.
Specifically, the first metal layer 23 may be formed on the top surface of the second board body 2 by means of electroplating, and thereafter, so that the circuit pattern 6 can be formed on the top surface of the second board body 2; as shown in fig. 6, the present embodiment preferably forms the circuit pattern 6 on the first metal layer 23 by etching, so as to be used for connecting more electronic components.
Optionally, the first metal layer 23 is a copper layer.
In the manufacturing method of the circuit board provided by this embodiment, the first metal layer 23 is formed on the top surface of the second board body 2, so that the formed circuit board can form the multilayer circuit pattern 6, and the space of the circuit board is fully utilized for connecting more electronic components.
As shown in fig. 5 to 8, further, after forming the first metal layer 23 on the top surface of the second board body 2, the method further includes: a third plate 7 is formed on the bottom surface of the first plate 1, and the bottom surface of the third plate 7 has a second metal layer 71.
Specifically, the third plate 7 is an insulating plate, the third plate 7 may be formed on the bottom surface of the first plate 1 by a press-fit method, and the second metal layer 71 on the bottom surface of the third plate 7 may be formed by an electroplating method, so as to form a double-layer circuit board.
Referring to fig. 6, optionally, a circuit pattern 6 is formed on the second metal layer 71, and particularly, the circuit pattern 6 may be formed on the second metal layer 71 by etching, so as to increase the functional structure on the circuit board.
Optionally, a fourth board body may be formed on the bottom surface of the third board body 7 by pressing, and a fourth metal layer may also be provided on the bottom surface of the fourth board body to form a multilayer circuit board; the number of layers of the multilayer circuit board is not particularly limited, and can be set according to actual application needs.
Alternatively, the second metal layer 71 and the fourth metal layer may be copper layers.
In the manufacturing method of the circuit board provided in this embodiment, the third board body 7 having the second metal layer 71 on the bottom surface is formed on the bottom surface of the first board body 1, so that a double-layer circuit board having a stepped groove can be formed, and more electronic components can be connected to the circuit board.
As shown in fig. 2, further, forming the first plate body 1 includes: the first plate body 1 is formed by forming a third metal layer 12 on an insulating plate.
Specifically, the third metal layer 12 may be disposed on either side of the insulating plate, or on both sides of the insulating plate.
Optionally, the third metal layer 12 may also be formed with a circuit pattern 6; when the third metal layer 12 is formed on the top surface of the insulating board, and the circuit pattern 6 is partially formed within the projection of the predetermined area 21 on the first board body 1, after the bottom surface of the second board body 2 is attached to the top surface of the first board body 1, the protective layer 3 formed on the second board body 2 can cover the circuit pattern 6 in the projection of the preset area 21 on the first board body 1, the connection force between the protective layer 3 and the first board body 1 is always small, the cutting seam 4 is formed along the edge of the preset area 21 by a laser cutting method, the protective layer 3 and the second plate body 2 in the preset area 21 are easily separated from the first plate body 1, so that the circuit pattern 6 in the projection of the preset area 21 on the first plate body 1 can be prevented from being damaged in the step groove forming process, the side wall of the formed step groove is smooth, and the accuracy of the formed circuit board is improved.
Alternatively, the third metal layer 12 may be a copper layer.
Alternatively, the third metal layer 12 is formed on the insulating plate by means of electroplating.
Alternatively, the circuit pattern 6 is formed on the third metal layer 12 by means of etching.
According to the manufacturing method of the circuit board, the first board body 1 is formed by forming the third metal layer 12 on the insulating board, the protective layer 3 is formed between the first board body 1 and the second board body 2, the connection force between the protective layer 3 and the first board body 1 is small, the cutting seam 4 is formed along the edge of the preset area 21 by a laser cutting method, the protective layer 3 and the second board body 2 in the preset area 21 are easily separated from the first board body 1, the part, located in the projection of the preset area 21 on the first board body 1, of the first board body 1 can be prevented from being damaged in the step groove forming process, the side wall of the step groove formed in a laser cutting mode is smooth, and the accuracy of the formed circuit board is improved.
For example, when the method for manufacturing a circuit board provided by this embodiment is adopted, first, a third metal layer 12 is formed on the top surface of the insulating board to form a first board body 1; then, a cover film made of polyimide is used as a protective layer 3, the protective layer 3 is adhered to the bottom surface of the second plate body 2 through an adhesive, wherein the second plate body 2 is made of polypropylene (PP) resin, and then the bottom surface of the second plate body 2 is attached to the top surface of the first plate body 1 and is connected with the first plate body 1 and the second plate body; when the first plate body 1 and the second plate body are connected, firstly, a first through hole 11 is formed in the first plate body 1, a second through hole 22 is formed in the second plate body 2, the connecting piece 5 is arranged in the first through hole 11 and the second through hole 22 in a penetrating mode, then, in a mode of extruding the connecting piece 5, a first stopping part 51 which is abutted against the first plate body 1 is formed at the first end of the connecting piece 5, and a second stopping part 52 which is abutted against the second plate body 2 is formed at the second end of the connecting piece 5; thereafter, a first metal layer 23 is formed on the top surface of the second board body 2, a third board body 7 is formed on the bottom surface of the first board body 1, and a second metal layer 71 is provided on the bottom surface of the third board body 7; forming circuit patterns on the first metal layer 23 and the second metal layer 71 by etching; in addition, the second board body 2 is provided with a preset area 21, and the projection of the preset area 21 on the first board body 1 is positioned in the projection of the protective layer 3 on the first board body 1; finally, by CO2The protective layer 3 and the second plate body 2 are cut by laser along the edge of the preset area 21 to form a cutting seam 4, so that the protective layer 3 and the second plate body 2 in the preset area 21 are separated from the first plate body 1; the first plate body 1 positioned at the bottom of the stepped groove can be subjected to subsequent manufacturing processes such as welding prevention, electrical measurement and the like so as to finish the manufacturing of the stepped groove.
Referring to fig. 8, the present embodiment further provides a circuit board, including the circuit board manufactured by the above method for manufacturing a circuit board.
The circuit board that this embodiment provided, through forming protective layer 3 between first plate body 1 and second plate body 2 during the preparation to form cutting gap 4 along the edge of predetermineeing regional 21 through the method of laser cutting, so that predetermineeing second plate body 2 in regional 21, protective layer 3 and can separate with first plate body 1, the ladder groove that forms compares with the ladder groove that forms through the mode of milling, its lateral wall is more smooth, and then makes the precision height of the circuit board that forms.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "circumferential", and the like, are used to indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the invention and to simplify the description, and do not indicate or imply that the position or element referred to must have a particular orientation, be of particular construction and operation, and thus, are not to be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; may be mechanically coupled, may be electrically coupled or may be in communication with each other; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A method for manufacturing a circuit board is characterized by comprising the following steps:
forming a first plate body;
forming a protective layer on the bottom surface of a second plate body, and then enabling the bottom surface of the second plate body to be attached to the top surface of the first plate body; the second plate body is provided with a preset area, and the projection of the preset area on the first plate body is positioned in the projection of the protective layer on the first plate body;
and forming a cutting seam along the edge of the preset area by a laser cutting method, so that the protective layer and the second plate body in the preset area are separated from the first plate body.
2. The method for manufacturing a circuit board according to claim 1, wherein the forming a protective layer on the bottom surface of the second board body, and then attaching the bottom surface of the second board body to the top surface of the first board body further comprises: and connecting the first plate body and the second plate body.
3. The method of claim 2, wherein the connecting the first board body to the second board body comprises: the first plate body is provided with a first through hole, the second plate body is provided with a second through hole, the connecting piece is arranged in the first through hole and the second through hole in a penetrating mode, a first stopping portion abutting against the first plate body is formed at the first end of the connecting piece, and a second stopping portion abutting against the second plate body is formed at the second end of the connecting piece.
4. The method for manufacturing a circuit board according to claim 3, wherein the first stopper portion and/or the second stopper portion is formed by pressing the connecting member.
5. The method of claim 2, wherein the connecting the first board body to the second board body comprises: and heating the edges of the first plate body and the second plate body so as to melt part of the first plate body and part of the second plate body and form a connecting part at the junction position of the first plate body and the second plate body.
6. The method for manufacturing a circuit board according to claim 2, wherein the step of connecting the first board body and the second board body further comprises: a first metal layer is formed on a top surface of the second plate.
7. The method for manufacturing a circuit board according to claim 6, further comprising, after forming the first metal layer on the top surface of the second board body: and forming a third plate body on the bottom surface of the first plate body, wherein a second metal layer is arranged on the bottom surface of the third plate body.
8. The method for manufacturing a circuit board according to claim 7, wherein the forming a third board body on the bottom surface of the first board body, after the forming a second metal layer on the bottom surface of the third board body, further comprises: and forming a circuit pattern on the first metal layer and the second metal layer.
9. The method for manufacturing a circuit board according to any one of claims 1 to 8, wherein the forming of the first board body includes: the first plate body is formed by forming a third metal layer on the insulating plate.
10. A circuit board, comprising: a circuit board produced by the method for producing a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911000402.0A CN110708897A (en) | 2019-10-21 | 2019-10-21 | Circuit board manufacturing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911000402.0A CN110708897A (en) | 2019-10-21 | 2019-10-21 | Circuit board manufacturing method and circuit board |
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| CN110708897A true CN110708897A (en) | 2020-01-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911000402.0A Pending CN110708897A (en) | 2019-10-21 | 2019-10-21 | Circuit board manufacturing method and circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115515325A (en) * | 2021-06-22 | 2022-12-23 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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| CN2553162Y (en) * | 2002-07-05 | 2003-05-28 | 凯崴电子股份有限公司 | Fixing rivet for crimping circuit board with improved structure |
| CN102271463A (en) * | 2010-06-07 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102378474A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Fixing rivet used for circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2553162Y (en) * | 2002-07-05 | 2003-05-28 | 凯崴电子股份有限公司 | Fixing rivet for crimping circuit board with improved structure |
| CN102271463A (en) * | 2010-06-07 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102378474A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Fixing rivet used for circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115515325A (en) * | 2021-06-22 | 2022-12-23 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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