CN110703680B - Intelligent device and method for producing semiconductor material foil - Google Patents

Intelligent device and method for producing semiconductor material foil Download PDF

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Publication number
CN110703680B
CN110703680B CN201911000225.6A CN201911000225A CN110703680B CN 110703680 B CN110703680 B CN 110703680B CN 201911000225 A CN201911000225 A CN 201911000225A CN 110703680 B CN110703680 B CN 110703680B
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foil
sides
groove
silicon
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CN110703680A (en
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郭志宏
张培林
武建军
柴利春
王志辉
张作文
纪永良
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Datong Xincheng New Material Co Ltd
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Datong Xincheng New Material Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/05Programmable logic controllers, e.g. simulating logic interconnections of signals according to ladder diagrams or function charts
    • G05B19/058Safety, monitoring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/10Plc systems
    • G05B2219/16Plc to applications
    • G05B2219/163Domotique, domestic, home control, automation, smart, intelligent house

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The invention discloses an intelligent device for producing semiconductor material foils, which comprises a manufacturing table, wherein a processing groove is formed in the top wall of the manufacturing table, a cutting blade is arranged in the processing groove, a mounting groove for accommodating a transmission shaft and a motor is formed in the inner side wall of the processing groove, a material receiving groove communicated with the processing groove is formed in the manufacturing table, a stretching rod and a material pushing plate are arranged in the inner cavity of the material receiving groove, four groups of side grooves are formed in the top wall of the manufacturing table and distributed on two sides of the side grooves, four groups of moving blocks are arranged and respectively located in the four groups of side grooves, and lifting rods are arranged in the four groups of side grooves. According to the intelligent device and method for producing the semiconductor material foil, the four groups of rotating shafts and the four groups of extrusion cylinders are arranged, and the four groups of extrusion cylinders are distributed on two sides of the cutting blade, so that two sides of the cut position of the silicon foil are kept horizontal under the action of the four groups of extrusion cylinders respectively, the cut silicon foil is relatively flat, and the cutting accuracy is higher.

Description

Intelligent device and method for producing semiconductor material foil
Technical Field
The invention belongs to the technical field of semiconductor foil production, and particularly relates to an intelligent device and method for producing a semiconductor material foil.
Background
In the production of semiconductor foils, there is an important step of cutting the produced silicon foil. The application field of the silicon foil is very wide, and the shadow of the silicon foil can be seen from daily life to industrial service industry. Therefore, the quality of silicon foil produced in a factory directly determines the quality of semiconductor foil.
When the silicon foil is cut by using the device, a motor is generally required to drive a cutting knife to rotate so as to cut the silicon foil. In the prior art, when silicon foils are cut, the silicon foils cannot be kept flat mostly, and the precision of the cut silicon foils is not high enough.
Disclosure of Invention
It is an object of the present invention to provide an intelligent device and method for producing a foil of semiconductor material that solves the problems set forth in the background above.
In order to achieve the purpose, the invention provides the following technical scheme: an intelligent device for producing semiconductor material foil comprises a manufacturing table, wherein a processing groove is formed in the top wall of the manufacturing table, a cutting blade is arranged in the processing groove, an installation groove for accommodating a transmission shaft and a motor is formed in the inner side wall of the processing groove, a material receiving groove communicated with the processing groove is formed in the manufacturing table, a stretching rod and a material pushing plate are arranged in the inner cavity of the material receiving groove, and a moving block, a first support and a second support are arranged on the top wall of the manufacturing table;
the top wall of the manufacturing table is provided with four groups of side grooves which are distributed on two sides of the manufacturing table, the moving block is provided with four groups of side grooves which are respectively positioned in the four groups of side grooves, lifting rods are respectively arranged in the four groups of side grooves, two ends of each lifting rod are respectively fixedly welded with two opposite sides of the side groove and the moving block, two sides of the processing groove are respectively provided with two groups of rotating shafts and two groups of extrusion cylinders, the two groups of extrusion cylinders on the same side are longitudinally distributed, and the rotating shafts and the extrusion cylinders are matched one by one;
first support and second support all are equipped with two sets ofly and distribute in the both sides of making the platform, and are two sets of be equipped with two sets of linking plate that are parallel to each other between the first support, and its both sides in opposite directions all opened has the spout, be equipped with slider and telescopic link in the spout, the both ends of telescopic link respectively with the roof of slider and the roof fixed weld of spout, two sets of linking plate both sides in opposite directions all are fixed to bond and have abrasive paper, and are two sets of be equipped with driving rod and sleeve between the second support, it installs distance sensor to keep away from telescopic one side of bench roof, still is equipped with the PLC board on it, distance sensor and motor all with PLC board electric connection.
Preferably, the side wall of the motor is fixedly welded with the side wall of the mounting groove in the treatment tank and is in transmission connection with the transmission shaft.
Preferably, one side of the transmission shaft, which is far away from the motor, is fixedly welded with the center of the side wall of the cutting blade, and the top of the cutting blade extends out of the processing groove.
Preferably, two ends of the stretching rod are respectively fixedly welded with the side wall of the inner cavity of the material receiving groove and one side of the material pushing plate, and an opening at one side of the inner cavity of the material receiving groove is formed in the side wall of the manufacturing table.
Preferably, the rotating shaft penetrates through two sides of the extrusion container and is fixedly welded with the extrusion container, and the rotating shaft is in transmission connection with the moving blocks on the two sides of the rotating shaft.
Preferably, two ends of one group of the connecting plate are fixedly welded with two opposite sides of the two groups of the first supports, and two ends of the other group of the connecting plate are fixedly welded with side walls of the two groups of the sliding blocks.
Preferably, the driving rod runs through the two sides of the sleeve and is in transmission connection with the two groups of second supports, and side baffles are fixedly welded on the two sides of the outer wall of the sleeve.
Preferably, the clamping groove has all been opened on the both sides of sleeve outer wall, be equipped with rigging board and two sets of springs in the clamping groove, the both ends of spring respectively with the lateral wall of rigging board and the inside wall fixed weld in clamping groove.
A method for producing a foil of semiconductor material, comprising the steps of:
s1, placing a silicon raw material required for manufacturing a semiconductor (silicon) foil into an industrial crucible, wherein the silicon raw material usually contains a small amount of impurities of phosphorus and boron;
s2, adjusting the position of the crucible in the closed shell, positioning and clamping the crucible, and enabling the distance between the lip surface of the quartz mouth at the lower part of the crucible and the surface of the casting mold to be 0.1-0.3 mm;
s3, clamping a quartz nozzle at the lower part of the crucible by using a mechanical structure;
s4, carrying out vacuum pumping operation on the sealed shell, and filling protective gas into the sealed shell after the sealed shell is determined to be vacuum;
s5, starting the casting mold to move directionally at a constant speed, and controlling the temperature of the surface of the casting mold through a liquid medium at 0-200 ℃ so as to keep the surface of the casting mold at a constant value lower than the solidification temperature of silicon;
s6, starting the high-frequency induction heater to work, enabling the high-frequency induction coil to heat the silicon raw material in the crucible to melt the silicon raw material, and then keeping the temperature of the silicon melt in the crucible at a constant value (1420-;
and S7, applying a constant pressure to the silicon melt in the crucible by using the protective gas rushed in before, wherein the constant pressure is in a range of 20-200 mm Hg, the pressure can enable the silicon melt to flow from the outlet of the quartz nozzle to the casting mold, the silicon melt forms a weld pool and is solidified into a silicon foil, and the silicon foil is conveyed out through the conveying device.
The invention has the technical effects and advantages that: according to the intelligent device and the method for producing the semiconductor material foil, the four groups of rotating shafts and the four groups of extrusion cylinders are arranged, and the four groups of extrusion cylinders are distributed on two sides of the cutting blade, so that two sides of the cut position of the silicon foil are kept horizontal under the action of the four groups of extrusion cylinders respectively, the silicon foil is relatively flat, and the cutting accuracy is higher; by arranging the material receiving groove, the stretching rod and the material pushing plate, after cutting is finished, the stretching rod is driven to extend to drive the material pushing plate to push scraps accumulated in the material receiving groove to the opening of the material receiving groove on the side wall of the manufacturing table, so that the trouble of manually cleaning the processing groove is eliminated; through the arrangement of the two groups of connecting plates and the two groups of abrasive paper, two surfaces of the cut silicon foil are respectively wiped by the two groups of abrasive paper, so that impurities such as scraps on the silicon foil can be removed, and the silicon foil is cleaner; through having set up driving rod and sleeve, utilize the sleeve rotatory along the driving rod, can roll up the silicon foil cover after the production on the sleeve, make the silicon foil be convenient for transport.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a vertical cross-sectional view of a manufacturing station of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A of FIG. 1 in accordance with the present invention;
FIG. 4 is a vertical cross-sectional view of a processing tank of the present invention;
FIG. 5 is a schematic structural view of the sleeve of the present invention;
FIG. 6 is a circuit diagram of the present invention.
In the figure: the device comprises a manufacturing table 1, a processing groove 2, a cutting blade 3, a transmission shaft 4, a motor 5, a material receiving groove 6, a stretching rod 7, a material pushing plate 8, a side groove 9, a lifting rod 10, a moving block 11, a rotating shaft 12, an extrusion cylinder 13, a first support 14, a sliding block 15, a telescopic rod 16, a connecting plate 17, abrasive paper 18, a second support 19, a transmission rod 20, a sleeve 21, a side baffle 22, a clamping groove 23, a spring 24, a binding plate 25 and a distance sensor 26.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an intelligent device for producing semiconductor material foils as shown in figures 1-6, which comprises a manufacturing table 1, wherein a processing groove 2 is formed on the top wall of the manufacturing table 1, a cutting blade 3 is arranged in the processing groove 2, the inner side wall of the processing groove is provided with a mounting groove for accommodating a transmission shaft 4 and a motor 5, a material receiving groove 6 communicated with the processing groove 2 is formed in the manufacturing table 1, a stretching rod 7 and a material pushing plate 8 are arranged in the inner cavity of the material receiving groove 6, a moving block 11, a first support 14 and a second support 19 are arranged on the top wall of the manufacturing table 1, the bottom wall of the first support 14 is fixedly welded with the top wall of the manufacturing table 1, and the second support 19 is directly placed on the top wall of the manufacturing table 1;
four groups of side grooves 9 are formed in the top wall of the manufacturing table 1 and distributed on two sides of the manufacturing table, four groups of moving blocks 11 are arranged in the four groups of side grooves 9 respectively, lifting rods 10 are arranged in the four groups of side grooves 9 respectively, two ends of each lifting rod 10 are fixedly welded with two opposite sides of the corresponding side groove 9 and the corresponding moving block 11 respectively, two groups of rotating shafts 12 and two groups of extrusion cylinders 13 are arranged on two sides of the processing tank 2 respectively, two groups of extrusion cylinders 13 on the same side of the processing tank are arranged longitudinally, and the rotating shafts 12 are matched with the extrusion cylinders 13 one by one;
the first support 14 and the second support 19 are both provided with two groups and distributed at two sides of the manufacturing table 1, two groups of parallel connection plates 17 are arranged between the two groups of first supports 14, two opposite sides of the first supports are both provided with sliding grooves, sliding blocks 15 and telescopic rods 16 are arranged in the sliding grooves, the sliding blocks 15 can slide in the sliding grooves under the work of the telescopic rods 16, the lifting rods 10 and the stretching rods 7 are all driven by electric power, two ends of the telescopic rods 16 are respectively fixedly welded with the top wall of the sliding blocks 15 and the top wall of the sliding grooves, two opposite sides of the two groups of connection plates 17 are respectively fixedly bonded with abrasive paper 18, a transmission rod 20 and a sleeve 21 are arranged between the two groups of second supports 19, one side, far away from the sleeve 21, of the top wall of the manufacturing table 1 is provided with a distance sensor 26, the type of the distance sensor 26 can be HC-SR04, the detection range is within 4.5m, and therefore, no object, therefore, whether the silicon foil exists on the manufacturing table 1 or not can be detected by using the distance sensor 26, a PLC board is further arranged on the distance sensor 26, the model of the PLC board can be S7-200 and can be installed on the side wall of the manufacturing table 1, the distance sensor 26 and the motor 5 are both electrically connected with the PLC board, when the silicon foil is close to the extrusion cylinder 13 and is placed on the distance sensor 26, namely when an external object passes through the working range of the distance sensor 26, the distance sensor 26 can transmit an electric signal to the PLC board, the PLC board transmits the electric signal to the motor 5 to enable the motor 5 to work, the trouble of manually driving the motor 5 is avoided, when the object cannot be detected in the working range of the distance sensor 26, the distance sensor transmits the electric signal to the PLC board, the PLC board controls the motor 5 to stop working after 10S, and the intelligent control over the motor 5 is.
Specifically, the side wall of the motor 5 is fixedly welded with the side wall of the mounting groove in the treatment tank 2, and is in transmission connection with the transmission shaft 4.
Specifically, one side of the transmission shaft 4, which is far away from the motor 5, is fixedly welded with the center of the side wall of the cutting blade 3, and the top of the cutting blade 3 extends out of the processing tank 2.
Specifically, the both ends of tensile pole 7 respectively with the lateral wall of receiving the 6 inner chambers of silo and the fixed welding in one side of scraping wings 8, receive the 6 inner chambers of silo wherein the opening of one side and offer on the lateral wall of manufacturing table 1, when tensile pole 7 shrink to the shortest, scraping wings 8 can be located between handling trough 2 and the sleeve 21, when telescopic link 7 extends the longest, it can drive scraping wings 8 and remove to receiving silo 6 and be located the opening on manufacturing table 1 lateral wall, scraping wings 8's outer wall and the four sides laminating of receiving the 6 inner chambers of silo to can promote the piece.
Specifically, the rotating shaft 12 penetrates through two sides of the extrusion container 13 and is fixedly welded with the extrusion container 13, the rotating shaft 12 is in transmission connection with the moving blocks 11 on the two sides of the rotating shaft, the distance between the outer walls of the two groups of extrusion containers 13 which are longitudinally arranged is 1mm (or is set to be other suitable values), the lifting rods 10 on the two sides of the rotating shaft 12 need to work simultaneously, and when the lifting rods 10 are contracted to the shortest, the extrusion container 13 is not in contact with the top wall of the manufacturing table 1.
Specifically, both ends of one of the engaging plates 17 are fixedly welded to opposite sides of the two first supporting seats 14, and both ends of the other engaging plate 17 are fixedly welded to side walls of the two sliders 15, as shown in fig. 3, the engaging plate 17 located at the upper side moves by the movement of the sliders 15 located at both sides thereof, and the engaging plate 17 located at the lower side remains stationary, so that both sides of the silicon foil are respectively contacted with and rubbed against the sandpaper on the two engaging plates 17 by engaging the space between the two engaging plates 17, thereby removing most of the debris therefrom.
Specifically, the driving rod 20 runs through the two sides of the sleeve 21, and is in transmission connection with the two groups of second supports 19, side baffles 22 are fixedly welded on the two sides of the outer wall of the sleeve 21, and the side baffles 22 are used for preventing the silicon foil from sliding off the side of the sleeve 21.
Specifically, both sides of the outer wall of the sleeve 21 are provided with clamping grooves 23, the clamping grooves 23 are internally provided with attaching plates 25 and two sets of springs 24, two ends of each spring 24 are fixedly welded with the side wall of the attaching plate 25 and the inner side wall of the clamping groove 23 respectively, and the two sets of springs 24 drive the attaching plates 25 to stretch into the clamping grooves 23 in a natural state, so that the springs 24 and the attaching plates 25 can be mutually matched to clamp silicon foils.
A method for producing a foil of semiconductor material, comprising the steps of:
s1, placing a silicon raw material required for manufacturing a semiconductor (silicon) foil into an industrial crucible, wherein the silicon raw material usually contains a small amount of impurities of phosphorus and boron;
s2, adjusting the position of the crucible in the closed shell, positioning and clamping the crucible, and enabling the distance between the lip surface of the quartz mouth at the lower part of the crucible and the surface of the casting mold to be 0.1-0.3 mm;
s3, clamping a quartz nozzle at the lower part of the crucible by using a mechanical structure;
s4, carrying out vacuum pumping operation on the sealed shell, and filling protective gas into the sealed shell after the sealed shell is determined to be vacuum;
s5, starting the casting mold to move directionally at a constant speed, and controlling the temperature of the surface of the casting mold through a liquid medium at 0-200 ℃ so as to keep the surface of the casting mold at a constant value lower than the solidification temperature of silicon;
s6, starting the high-frequency induction heater to work, enabling the high-frequency induction coil to heat the silicon raw material in the crucible to melt the silicon raw material, and then keeping the temperature of the silicon melt in the crucible at a constant value (1420-;
and S7, applying a constant pressure to the silicon melt in the crucible by using the protective gas rushed in before, wherein the constant pressure is in a range of 20-200 mm Hg, the pressure can enable the silicon melt to flow from the outlet of the quartz nozzle to the casting mold, the silicon melt forms a weld pool and is solidified into a silicon foil, and the silicon foil is conveyed out through the conveying device.
Specifically, firstly, a silicon foil original is placed on one side of the top wall of the manufacturing table 1 close to the material receiving groove 6, the silicon foil passes through between the two groups of extrusion cylinders 13, the silicon foil is prevented from shaking greatly under the restriction of the two groups of extrusion cylinders 13, when the distance sensor 26 detects an object, the motor 5 can work under the action of the PLC board and drive the transmission shaft 4 and the cutting blade 3 to run, when the silicon foil moves from one side of the top wall of the manufacturing table 1 to the other side, the silicon foil is contacted with the cutting blade 3 and cut, when the silicon foil moves towards one side close to the sleeve 21, the silicon foil passes through the other two groups of extrusion cylinders 13, namely, the silicon foil can be kept in a relatively stable state (and the heights of the four groups of moving blocks 11 are the same) when being cut, one side of the silicon foil is cut, the other side continues to move towards one side close to the sleeve 21, the two groups of, two sides of the silicon foil are respectively contacted with the two groups of abrasive paper 18, most fragments on the silicon foil can be removed, when the silicon foil is close to the sleeve 21, the two groups of attaching plates 25 are taken out from the two groups of clamping grooves 23, two sides of the head end of the silicon foil are respectively arranged in the two groups of clamping grooves 23, then the two groups of attaching plates 25 move in a natural state, the attaching plates 25 can be accommodated in the two groups of clamping grooves 23 to clamp the silicon foil, a person turns over the sleeve 21 to rotate the sleeve along the driving rod 20, finally, the whole silicon foil is sleeved and wound on the sleeve 21, and then the sleeve 21 (and the second support 19 and the like) is taken down to conveniently store and transport the silicon foil.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (8)

1. A method for producing a foil of semiconductor material using an intelligent apparatus, which apparatus comprises a manufacturing station (1), characterized in that: the top wall of the manufacturing table (1) is provided with a processing groove (2), a cutting blade (3) is arranged in the processing groove (2), the inner side wall of the processing groove is provided with a mounting groove for accommodating a transmission shaft (4) and a motor (5), a material receiving groove (6) communicated with the processing groove (2) is arranged in the manufacturing table (1), a stretching rod (7) and a material pushing plate (8) are arranged in the inner cavity of the material receiving groove (6), and the top wall of the manufacturing table (1) is provided with a moving block (11), a first support (14) and a second support (19);
four groups of side grooves (9) are formed in the top wall of the manufacturing table (1) and distributed on two sides of the manufacturing table, four groups of moving blocks (11) are arranged on the top wall of the manufacturing table and located in the four groups of side grooves (9), lifting rods (10) are arranged in the four groups of side grooves (9), two ends of each lifting rod (10) are fixedly welded with two opposite sides of the corresponding side groove (9) and the corresponding moving block (11), two groups of rotating shafts (12) and two groups of extrusion cylinders (13) are arranged on two sides of the processing groove (2), the two groups of extrusion cylinders (13) on the same side are longitudinally arranged, and the rotating shafts (12) are matched with the extrusion cylinders (13) one by one;
the automatic sand paper cutting machine is characterized in that the first support (14) and the second support (19) are provided with two groups and distributed on two sides of the manufacturing table (1), two groups of parallel connecting plates (17) are arranged between the two groups of first supports (14), two opposite sides of the two groups of connecting plates are provided with sliding grooves, sliding blocks (15) and telescopic rods (16) are arranged in the sliding grooves, two ends of each telescopic rod (16) are fixedly welded with the top wall of each sliding block (15) and the top wall of each sliding groove respectively, two opposite sides of the two groups of connecting plates (17) are fixedly bonded with sand paper (18), a transmission rod (20) and a sleeve (21) are arranged between the two groups of second supports (19), one side, far away from the sleeve (21), of the top wall of the manufacturing table (1) is provided with a distance sensor (26), a PLC (5) is further arranged on the distance sensor, and the distance sensor (26);
the method comprises the following steps:
s1, placing a silicon raw material required for manufacturing the semiconductor foil into an industrial crucible, wherein the silicon raw material usually contains a small amount of impurities of phosphorus and boron;
s2, adjusting the position of the crucible in the closed shell, positioning and clamping the crucible, and enabling the distance between the lip surface of the quartz mouth at the lower part of the crucible and the surface of the casting mold to be 0.1-0.3 mm;
s3, clamping a quartz nozzle at the lower part of the crucible by using a mechanical structure;
s4, carrying out vacuum pumping operation on the sealed shell, and filling protective gas into the sealed shell after the sealed shell is determined to be vacuum;
s5, starting the casting mold to move directionally at a constant speed, and controlling the temperature of the surface of the casting mold through a liquid medium at 0-200 ℃ so as to keep the surface of the casting mold at a constant value lower than the solidification temperature of silicon;
s6, starting the high-frequency induction heater to work, enabling the high-frequency induction coil to heat the silicon raw material in the crucible to melt the silicon raw material, and then keeping the temperature of the silicon melt in the crucible at a constant value (1420-;
and S7, applying a constant pressure to the silicon melt in the crucible by using the protective gas rushed in before, wherein the constant pressure is in a range of 20-200 mm Hg, the pressure can enable the silicon melt to flow from the outlet of the quartz nozzle to the casting mold, the silicon melt forms a weld pool and is solidified into a silicon foil, and the silicon foil is conveyed out through the conveying device.
2. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: the side wall of the motor (5) is fixedly welded with the side wall of the mounting groove in the processing groove (2) and is in transmission connection with the transmission shaft (4).
3. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: one side of the transmission shaft (4) far away from the motor (5) is fixedly welded with the center of the side wall of the cutting blade (3), and the top of the cutting blade (3) extends out of the processing groove (2).
4. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: two ends of the stretching rod (7) are respectively fixedly welded with the side wall of the inner cavity of the material receiving groove (6) and one side of the material pushing plate (8), and an opening at one side of the inner cavity of the material receiving groove (6) is formed in the side wall of the manufacturing table (1).
5. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: the rotating shaft (12) penetrates through two sides of the extrusion barrel (13) and is fixedly welded with the extrusion barrel (13), and the rotating shaft (12) is in transmission connection with moving blocks (11) on two sides of the rotating shaft.
6. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: two ends of one group of the connecting plate (17) are fixedly welded with two opposite sides of the two groups of the first supports (14), and two ends of the other group of the connecting plate (17) are fixedly welded with side walls of the two groups of the sliding blocks (15).
7. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: the driving rod (20) penetrates through two sides of the sleeve (21) and is in transmission connection with the two groups of second supports (19), and side baffles (22) are fixedly welded on two sides of the outer wall of the sleeve (21).
8. A method for producing a foil of semiconductor material using an intelligent device, according to claim 1, characterized in that: clamping grooves (23) are formed in two sides of the outer wall of the sleeve (21), an attaching plate (25) and two groups of springs (24) are arranged in the clamping grooves (23), and two ends of each spring (24) are fixedly welded with the side wall of the attaching plate (25) and the inner side wall of the corresponding clamping groove (23) respectively.
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