CN110702790B - Ultrasonic probe for remote acoustic distance detection - Google Patents
Ultrasonic probe for remote acoustic distance detection Download PDFInfo
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- CN110702790B CN110702790B CN201911098182.XA CN201911098182A CN110702790B CN 110702790 B CN110702790 B CN 110702790B CN 201911098182 A CN201911098182 A CN 201911098182A CN 110702790 B CN110702790 B CN 110702790B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/048—Marking the faulty objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
Abstract
The invention discloses an ultrasonic probe for remote acoustic detection, which comprises a probe body, wherein wafers on the probe body are arranged in a linear array; the center distance of the wafers is 0.6-1.5 mm, the number of the wafers is 8-32, the probe frequency is 1-6MHz, the width of the wafers is 0.6-1.2 mm, the height of the wafers is 16-20 mm, and the distance between the wafers is 0.1-0.3 mm. The ultrasonic probe with the structure improves the flaw detection sensitivity of axle defect detection and the flaw detection capability of axle defects (particularly surface defects), and has very important significance for preventing axle breakage accidents and ensuring driving safety. And the sound transmission detection capability and the material defect detection rate are improved. The invention can realize the detection of the whole axle by only adopting one remote acoustic range phased array probe, thereby improving the detection efficiency, saving the time and reducing the amount of manual labor.
Description
Technical Field
The invention relates to an ultrasonic probe for axle flaw detection.
Background
The nation gradually increases the investment to support the railway construction, and the railway investment construction is the key point for supervising and checking all places. With the rapid development of high speed and heavy load, the railway has become a business card, a new link for China to contact the world, and the export of railway equipment and technology is realized overseas. Especially, the running of high-speed rail provides a new test for traffic safety. The bogie key parts such as axles, bearings and other local positions bear larger stress, the detection process is required to be accelerated, the detection frequency is required to be high, the detection range is required to be enlarged, and higher technical requirements are provided for the field of railway nondestructive detection.
The axle is a key part for bearing the mass of the locomotive and the vehicle, and bears a plurality of complex stresses such as rotating bending, impact and the like during operation, and fatigue crack loss is a main failure mode of the axle. (the axle is relatively complicated in load bearing state during operation, and not only bears braking force and reaction force of wheels, but also bears impact load from a line and guide force acting on a wheel rim transversely when passing a curve, and in addition, the axle is easy to damage in the running process of a train due to the independent action or the combined action of loads such as axial force, radial force, shearing force, bending moment, torque and the like which are different in size at each matching part of the axle.)
The method is mainly characterized in that flaw detection of axles of existing locomotive in-service wheel sets at home and abroad is carried out by adopting a manual method and respectively using 4-5 conventional ultrasonic probes on two end faces of the axles, a process corresponding to each probe is called from a flaw detector once every time the probe is replaced, and the detection of one axle generally needs 20 minutes. In addition, by adopting the mode, for the axle which is not disassembled, probes cannot be placed at certain parts, so that flaw detection cannot be carried out.
At present, the common phased array ultrasonic technology is gradually adopted for manual or automatic detection, longitudinal waves and transverse waves of a phased array probe are used for detecting from the end face of an axle, the multi-angle and large-range scanning function can effectively solve the problems of large quantity, low coverage rate and the like of conventional ultrasonic probes, and the phased array probe is better used for axle detection. Because the phased array technology adopts the electronic control sound beam to scan, the rapid linear scanning or the fan-shaped scanning can be carried out under the condition of not moving or slightly moving the probe, and the detection efficiency is greatly improved.
However, in practical application, the axle has a long size, and the detection range of the commonly used phased array probe in the market is small, so that the axle detection capability is reduced, the detection signal-to-noise ratio is reduced, and the requirements of the existing axle detection process cannot be met. The difficulty in detecting the remote sound path part of the axle and how to improve the detection capability and the detection efficiency of the axle become the difficulties to be solved in the railway industry.
Disclosure of Invention
In view of the above, the present invention provides an ultrasonic probe for remote acoustic distance detection, which can perform full-coverage flaw detection on the whole axle by one probe installed on the end face of the axle.
In order to solve the technical problems, the technical scheme of the invention is as follows: an ultrasonic probe for remote acoustic distance detection comprises a probe body, wherein wafers on the probe body are arranged in a linear array; the center distance of the wafers is 0.6-1.5 mm, the number of the wafers is 8-32, the probe frequency is 1-6MHz, the width of the wafers is 0.6-1.2 mm, the height of the wafers is 16-20 mm, and the distance between the wafers is 0.1-0.3 mm.
Preferably, the wafer center-to-center distance is 1 mm.
Preferably, the number of the wafers is 16.
Preferably, the probe frequency is 2.5 MHz.
Preferably, the wafer has a width of 0.8mm and a height of 18 mm.
Preferably, the distance between the wafers is 0.2 mm.
As an improvement, the probe body comprises a probe shell, and the wafer is arranged in the probe shell; and connecting plates for fixing wedge blocks are arranged on two sides of the probe shell. The phased array probe can only realize-30 degrees longitudinal wave scanning without installing a wedge block, but can realize angular deflection (realize transverse wave scanning) after installing the wedge block, and the scanning angle range is larger, such as 30-75 degrees.
The invention has the advantages that: the ultrasonic probe with the structure improves the flaw detection sensitivity of axle defect detection and the flaw detection capability of axle defects (particularly surface defects), and has very important significance for preventing axle breakage accidents and ensuring driving safety. And the sound transmission detection capability and the material defect detection rate are improved. The invention can realize the detection of the whole axle by only adopting one remote acoustic range phased array probe, thereby improving the detection efficiency, saving the time and reducing the amount of manual labor.
Drawings
FIG. 1 is a schematic view of the present invention.
Fig. 2 is a schematic view of wafer layout.
Fig. 3 shows the case of acoustic beams for different wafer sizes.
Fig. 4 shows the case of acoustic beams at different frequencies.
Fig. 5 is a relationship between the number of wafers and the detection distance and sensitivity.
Fig. 6 illustrates the sound beam diffusivity for different excitation apertures.
Fig. 7 shows the acoustic beam characteristics for different wafer center-to-center distances and excitation apertures.
Fig. 8 shows that when the center-to-center distance (p) of the wafer is constant and the pitch (g) is increased, a grating lobe beam unique to the phased array probe is generated.
Fig. 9 is a graph showing the effect of varying the wafer center-to-center distance (p) when the excitation aperture (a) and the wafer pitch (g) are fixed.
Fig. 10 is a schematic diagram of the arrangement of the ultrasonic remote distance probe in the invention when detecting the axle and the ultrasonic sound path.
Fig. 11 is a schematic view of an ultrasonic sound path in the case of flaw detection by a conventional ultrasonic probe.
Fig. 12 is a schematic view of the wedge structure.
The labels in the figure are: 1 probe shell, 2 wafers and 3 connecting plates.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, the present invention will be further described in detail with reference to the following embodiments.
The noun explains:
(1) an ultrasonic probe: an ultrasonic probe is a device for generating and receiving ultrasonic waves, and is one of the most important components constituting an ultrasonic inspection system. The performance of the ultrasonic probe directly affects the characteristics of the emitted ultrasonic waves and the ultrasonic wave emission detection capability. The structure of the ultrasonic probe in the invention is similar to that of the existing ultrasonic probe, so the detailed description is not needed.
(2) Phased array: the array transducer is utilized to realize the control of the ultrasonic sound field by controlling the phase of the sound wave emitted by each array element.
(3) Array of wafers: phased arrays are wafer combinations that act as transducers, with three main array types: linear (line array), surface (two-dimensional matrix array) and circular (circular array). The phase switching in a phased array is controlled by an electronic system, with a pulse generator leading to each wafer. Besides effectively controlling the shape and direction of ultrasonic beams, phased arrays also achieve and perfect complex dynamic focusing and real-time scanning.
As shown in fig. 1, the present invention includes a probe body, on which wafers 2 are arranged in a linear array; the probe body comprises a probe shell 1, and the wafer 2 is arranged in the probe shell 1; and connecting plates 3 for fixing wedge blocks are arranged on two sides of the probe shell 1. The wedge configuration is shown in figure 11. The center distance of the wafers is 0.6-1.5 mm, the number of the wafers is 8-32, the probe frequency is 1-6MHz, the width of the wafers is 0.6-1.2 mm, the height of the wafers is 16-20 mm, and the distance between the wafers is 0.1-0.3 mm.
As shown in fig. 2, compared with the conventional phased array probe, the present invention is designed specifically for specific inspection requirements, such as the spacing between adjacent wafers, the width of the wafers themselves, the total number of wafers, the height of the wafers, and the distance between the wafers, and the above 5 parameters are described in detail below.
In fig. 2:
a (aperture), which is the total aperture in the active deflection direction, i.e. the excitation aperture, refers to the area of the virtual probe, i.e. the distance between the center of the wafer x the number of wafers-wafer.
H (height) is the wafer height or length. Since this dimension is a fixed dimension, its plane with the ultrasound axis is often referred to as the passive surface.
p (pitch) is the center-to-center distance between two adjacent wafers.
e (parameter width) is the width of a single wafer.
g (gap) is the distance between wafers.
1. The size of the wafer.
Wafer dimensions, i.e., wafer height (H) and width (e),
the wafer is a key parameter, and as the size is reduced, the diffusivity of the sound beam is enhanced, and the approach distance is reduced;
when the width size of the wafer is increased (more than or equal to lambda, lambda is the wavelength), a stronger side-lobe sound beam can appear in a sound field; in actual production, the minimum wafer width that can be processed is about 0.15mm to 0.20 mm. Fig. 3 shows the effect of wafer size on the acoustic beam with other conditions fixed. As a preferred option, the wafer has a width of 0.8mm and a height of 18 mm.
2. The wafer frequency.
Generally, the higher the frequency, the better the focusability and signal-to-noise ratio of the acoustic beam, but the near field distance increases, and at the same time, the penetration ability of the acoustic beam decreases, with other parameters being constant. Fig. 4 shows the variation of the approach distance at different frequencies. As an optimal choice, the frequency of the wafer is 2.5 MHz.
3. Number of wafers.
The number of wafers is a compromise parameter, usually determined by:
desired probe detection range and detection sensitivity;
acoustic beam focusing performance;
sound beam diffusing performance;
the electrical signal of the device triggers the delay performance;
and (4) cost.
Reducing the wafer size, increasing the number of wafers (n) and the excitation aperture (a) can help to increase the detection distance and sensitivity, while also effectively reducing the near field distance and reducing the side lobe beams. However, the manufacturing cost of such a probe can be high. Fig. 5 shows the relationship between the number of wafers and the detection distance and sensitivity. As a best option, the number of wafers is 16.
4. Wafer center-to-center distance (p).
The larger the wafer center-to-center distance, especially greater than λ, the stronger the side lobe beam produced and the beam focusability and near field distance increased. Therefore, if only the reduction of the side lobe beam intensity and the approach distance is considered, p must be reduced.
In general, the maximum excitation aperture (a max) is equal to the wafer center-to-center distance (p) × 16/32. When p decreases, the beam diffusivity increases, but the detection sensitivity decreases. Fig. 6 shows the beam diffusivity for different excitation apertures and fig. 7 shows the beam characteristics for different wafer center-to-center distances and excitation apertures. As a best option, the center-to-center distance of the wafers is 1 mm.
5. The distance between the wafers.
Typically, the spaces between the dies of a phased array probe are filled with an acoustically insulating material. When the wafer center-to-center distance (p) is constant and the distance (g) between wafers is increased, a grating lobe beams (grating lobes) specific to phased array probes is generated.
Besides the main sound beam field, if the phased array probe generates side lobe and grating lobe sound beams, the diffusivity of the main sound beams is seriously influenced, even in the detection process, multiple phantom signals are generated under the specific diffusion angle of the main sound beams, and the accurate positioning, quantification and the like of defects are seriously influenced.
Important principle for avoiding side lobe sound beam
When the wafer width (e) is more than or equal to lambda, a side lobe sound beam is generated;
when the wafer width (e) < lambda/2, the side lobe sound beam disappears;
when λ/2 < e < λ, the generation of side-lobe and grating-lobe beams depends on a combination of parameters such as focusing laws, wafer spacing, etc.
The effect of varying the center-to-center wafer spacing (p) when the excitation aperture (a) and the wafer spacing (g) are fixed is shown in fig. 8. As a best option, the distance between the wafers is 0.2 mm.
By combining the above parameters, the active aperture of the present invention can be derived by applying the above formula: the distance between the center of the wafer and the wafer is 1mm × 16-0.2mm, and 15.8 mm.
Fig. 9 is a schematic diagram of the arrangement of the ultrasonic remote distance probe in the invention when detecting the axle and the ultrasonic sound path.
Fig. 10 is a schematic view of an ultrasonic sound path in the case of flaw detection by a conventional ultrasonic probe.
By comparing the two figures, we can see that the invention has the following advantages compared with the prior art:
1. the method has the advantages that the defect effect of detecting the transverse hole in the near field and the far field is better, the gain is smaller, the signal to noise ratio is higher (one-time sound path), the gain can be smaller by 9-13 dB during near field detection, and the signal to noise ratio can be larger by 4-10; during far-field detection, the gain can be reduced by 14-18 dB, and the signal-to-noise ratio can be increased by 8-10.
2. The detection effect of the far-field detection surface defect is better (multiple sound paths), the detection gain is less than 59dB, and the signal-to-noise ratio is greater than 30.
3. Some far field site defects, a far-range probe can detect over a range of angles, which conventional probes cannot detect.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and should be considered to be within the scope of the invention.
Claims (2)
1. An ultrasonic probe for remote acoustic distance detection, comprising a probe body, characterized in that: the wafers on the probe body are arranged in a linear array; the center-to-center distance of the wafers was 1mm, the number of wafers was 16, the wafer frequency was 2.5MHz, the width of the wafers was 0.8mm, the height was 18mm, and the distance between the wafers was 0.2 mm.
2. An ultrasonic probe for remote acoustic testing in accordance with claim 1, wherein: the probe body comprises a probe shell, and the wafer is arranged in the probe shell; and connecting plates for fixing wedge blocks are arranged on two sides of the probe shell.
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