CN110698752A - Conductive shielding film material, preparation method thereof and shielding data line - Google Patents
Conductive shielding film material, preparation method thereof and shielding data line Download PDFInfo
- Publication number
- CN110698752A CN110698752A CN201910949554.9A CN201910949554A CN110698752A CN 110698752 A CN110698752 A CN 110698752A CN 201910949554 A CN201910949554 A CN 201910949554A CN 110698752 A CN110698752 A CN 110698752A
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- parts
- film material
- shielding film
- conductive shielding
- conductive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910949554.9A CN110698752A (en) | 2019-10-08 | 2019-10-08 | Conductive shielding film material, preparation method thereof and shielding data line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910949554.9A CN110698752A (en) | 2019-10-08 | 2019-10-08 | Conductive shielding film material, preparation method thereof and shielding data line |
Publications (1)
Publication Number | Publication Date |
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CN110698752A true CN110698752A (en) | 2020-01-17 |
Family
ID=69197004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910949554.9A Pending CN110698752A (en) | 2019-10-08 | 2019-10-08 | Conductive shielding film material, preparation method thereof and shielding data line |
Country Status (1)
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CN (1) | CN110698752A (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1856844A (en) * | 2003-09-25 | 2006-11-01 | 陶氏环球技术公司 | Strippable semiconductive shield and compositions therefor |
CN102509573A (en) * | 2011-11-24 | 2012-06-20 | 无锡江南电缆有限公司 | Ultra-smooth semi-conductive shielding material for high-voltage direct-current cable |
CN105061879A (en) * | 2015-08-19 | 2015-11-18 | 成都鑫成鹏线缆材料有限公司 | Ethylene-vinyl acetate copolymer based thermoplastic semiconductive shielding material for conductor and preparation method of thermoplastic semiconductive shielding material |
CN109348719A (en) * | 2016-06-30 | 2019-02-15 | 陶氏环球技术有限责任公司 | The shield semiconductors of solderless wiring and protrusion |
CN109687246A (en) * | 2019-01-23 | 2019-04-26 | 深圳市晖耀电线电缆有限公司 | Super-strength tension is anti-to shake data line |
CN109777027A (en) * | 2019-01-10 | 2019-05-21 | 宁波市青湖弹性体科技有限公司 | A kind of halogen-free flame-retardant conductive elastomer and preparation method thereof for data line electromagnetic shielding |
CN110010275A (en) * | 2019-04-30 | 2019-07-12 | 深圳市傲基电子商务股份有限公司 | High shielding wire rod, data line and method for manufacturing wire |
-
2019
- 2019-10-08 CN CN201910949554.9A patent/CN110698752A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1856844A (en) * | 2003-09-25 | 2006-11-01 | 陶氏环球技术公司 | Strippable semiconductive shield and compositions therefor |
CN102509573A (en) * | 2011-11-24 | 2012-06-20 | 无锡江南电缆有限公司 | Ultra-smooth semi-conductive shielding material for high-voltage direct-current cable |
CN105061879A (en) * | 2015-08-19 | 2015-11-18 | 成都鑫成鹏线缆材料有限公司 | Ethylene-vinyl acetate copolymer based thermoplastic semiconductive shielding material for conductor and preparation method of thermoplastic semiconductive shielding material |
CN109348719A (en) * | 2016-06-30 | 2019-02-15 | 陶氏环球技术有限责任公司 | The shield semiconductors of solderless wiring and protrusion |
CN109777027A (en) * | 2019-01-10 | 2019-05-21 | 宁波市青湖弹性体科技有限公司 | A kind of halogen-free flame-retardant conductive elastomer and preparation method thereof for data line electromagnetic shielding |
CN109687246A (en) * | 2019-01-23 | 2019-04-26 | 深圳市晖耀电线电缆有限公司 | Super-strength tension is anti-to shake data line |
CN110010275A (en) * | 2019-04-30 | 2019-07-12 | 深圳市傲基电子商务股份有限公司 | High shielding wire rod, data line and method for manufacturing wire |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 518000 1st-4th floor, No.3, Shiao Village Second Industrial Zone, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Huiyao Electronic Co.,Ltd. Address before: 518000 Shenzhen, Guangdong Longhua New District, big wave street, big wave community rock group second industrial zone 3 1-4 floor. Applicant before: SHENZHEN SUNLIKE TECHNOLOGY Co.,Ltd. |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 518000 floors 1-4, No. 9, Tongfu estate industrial zone, Dalang community, Dalang street, Longhua District, Shenzhen, Guangdong Province Applicant after: Shenzhen Huiyao Electronic Co.,Ltd. Address before: 518000 1 / F-4 / F, No.3, second industrial zone, Shiao village, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Huiyao Electronic Co.,Ltd. |
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RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200117 |