CN110690645A - Laser array driving device and packaging method thereof - Google Patents
Laser array driving device and packaging method thereof Download PDFInfo
- Publication number
- CN110690645A CN110690645A CN201910992563.6A CN201910992563A CN110690645A CN 110690645 A CN110690645 A CN 110690645A CN 201910992563 A CN201910992563 A CN 201910992563A CN 110690645 A CN110690645 A CN 110690645A
- Authority
- CN
- China
- Prior art keywords
- laser
- laser array
- heat
- driving
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a laser array driving device and a packaging method thereof, wherein the device comprises: a bearing substrate, the surface of which is provided with a bonding pad; the laser array chip comprises n multiplied by n identical or different laser devices, wherein n is more than or equal to 1; the heat conducting film is arranged between the laser array chip and the bearing substrate; the laser driving module is connected with the laser array chip through an electrical connection structure; the heat insulation structure is arranged between the laser driving module piece and the bearing substrate; and the heat sink structure is connected with the bearing substrate. According to the laser array driving device and the packaging method thereof, three-dimensional stacking packaging is adopted, effective inter-chip heat dissipation is carried out through the heat conducting film, the laser array driving device has the advantages of being short in response time, high in integration level, high in reliability and the like, driving identity, emission power and space utilization rate are greatly improved compared with other driving and packaging methods, and therefore the laser array driving device has a wide application prospect in the fields of optical imaging, communication, interconnection, storage and the like.
Description
Technical Field
The invention relates to the field of optical devices, circuit driving and electronic packaging, in particular to a laser array driving device and a packaging method thereof.
Background
In recent years, with the continuous development of high-density and high-power semiconductor laser technology, the semiconductor laser technology has been widely applied in the fields of industry, military, scientific research, medical treatment, material treatment and the like. In order to further expand and extend the application field, the continuous improvement of the electro-optical performance and reliability of the device has become a necessary way for the current development of high-performance laser technology.
With the increasing scale and output power of semiconductor laser arrays, the driving difficulty is increased, and the generated heat is also increased. The electro-optic stability and the service life of the device are seriously influenced by a series of problems of response delay, increase of threshold current, reduction of slope efficiency and output power, red shift of wavelength and the like of the device. Therefore, it is important to improve the driving efficiency and the packaging level of the device to achieve stable electro-optical performance and improve the reliability of the device. In 2010, DanielM.Kuchta et al designed a high-speed 12-way optical driving circuit; kageyama Nobuto et al performed a great deal of research on laser devices prepared by packaging various metal solders in 2012, and proposed a filling structure without voids between chips, thereby reducing the thermal effect of the chip mounting layer. There is no associated high performance driver packaging approach for larger scale laser arrays.
The demand for high-performance large-scale semiconductor laser array chips is increasing, for example: larger array scale, higher light emitting power, faster response time and higher driving synchronization rate, higher reliability of package, and the like are required. Therefore, there is an urgent need to develop a driving and packaging method for a large-scale laser array with short response time, high integration level and high reliability.
Disclosure of Invention
Technical problem to be solved
The present invention provides a laser array driving apparatus and a packaging method thereof, which at least partially solve the above-mentioned technical problems.
(II) technical scheme
According to an aspect of the present invention, there is provided a laser array driving apparatus including:
a carrier substrate having a pad on a surface thereof;
the laser array chip comprises n multiplied by n identical or different laser devices, wherein n is more than or equal to 1;
the heat conducting film is arranged between the laser array chip and the bearing substrate;
the laser driving module is connected with the laser array chip through an electrical connection structure;
the heat insulation structure is arranged between the laser driving module and the bearing substrate; and
and the heat sink structure is connected with the bearing substrate.
In some embodiments of the present invention, the laser array driving apparatus further comprises:
and the micro-column is connected with the heat conducting film and the heat sink structure.
Further, in the laser array driving device:
in some embodiments, the carrier substrate is composed of a single layer or multiple layers of rigid or flexible resin material, semiconductor material, and metal material, and the pad material is copper, tin, or gold;
in some embodiments, the heat conducting film is a combination of metal, graphene, rubber, semiconductor material and one or more of heat conducting oil, grease and paste, and the heat conducting film has a graphical design consistent with the arrangement mode of the laser devices;
in some embodiments, the heat insulation structure is composed of one or more of a micro-nano porous material, a heat reflection coating or a vacuum structure, and the heat insulation structure has a graphical design in accordance with the module shape of the laser driving module;
in some embodiments, the electrical connection structure is located between the laser array chip, the laser driving module and the carrier substrate, and the connection mode of the electrical connection structure is wire bonding or flip chip bonding;
in some embodiments, the heat sink structure material is copper, tungsten, aluminum or an alloy thereof, and the micro-column material is metal or graphene;
in some embodiments, the laser driving module includes: the laser driving chip comprises an input buffer module, a main amplifying circuit, an output buffer module and a laser control chip, and comprises a first-level buffer to an n-level buffer, wherein each level of buffer respectively controls laser arrays with different response times, and n is larger than or equal to 1.
According to another aspect of the present invention, there is provided a packaging method of a laser array driving apparatus, including:
preparing a laser array chip and a laser driving module;
patterning a heat conduction material as a heat conduction film according to the arrangement mode of laser devices in the laser array chip;
patterning a heat insulating material as a heat insulating structure according to the module shape of the laser driving module;
arranging the patterned heat-conducting film on one surface of a bearing substrate with a bonding pad and correspondingly connecting the patterned heat-conducting film with the laser array chip;
the patterned heat insulation structure is arranged on the other surface of the bearing substrate and is correspondingly connected with the laser driving module;
the laser array chip and the bearing substrate are connected through an electrical connection structure, and the laser driving module and the bearing substrate are connected, so that the electrical connection between the laser array chip and the laser driving module is realized;
the bearing substrate is provided with micro-columns in a punching-electroplating-filling or layer-by-layer stacking mode, and the heat conducting membrane is connected with a heat sink structure through the micro-columns.
(III) advantageous effects
The invention discloses a laser array driving device and a packaging method thereof, which at least have one or part of the following beneficial effects:
(1) the laser array driving device adopts three-dimensional stacking packaging, has the characteristics of short response time, high integration level, high reliability and the like, and greatly improves the driving identity, the emission power and the space utilization rate compared with other driving and packaging methods, so the laser array driving device has wide application prospect in the fields of optical imaging, communication, interconnection, storage and the like;
(2) the bearing substrate is composed of multiple layers, the surface is provided with the bonding pad, and the micro-column penetrates through the board, so that the integration level of the packaging body is increased, the packaging size is reduced, and the space utilization rate is improved;
(3) the heat-conducting film is patterned on the plane of the substrate and is connected with the micro-columns in the substrate, so that the heat-conducting efficiency is improved, the temperature of a packaging body when the chip works is effectively reduced, and the reliability of a system is improved;
(4) the laser chip, the driving chip and the like are fixed on the front side and the back side of the same substrate in a stacking mode, so that the transmission path of electrical signals is shortened, the external interference is reduced, and the response speed of the chip is improved;
(5) the control chip carries out compensation according to the laser array and applies driving signals, and the signals are processed by the cache chip, so that the working delay of the chip can be reduced, and the stability of the working mode of the laser is ensured.
Drawings
FIG. 1 is a schematic cross-sectional view of a package structure of a laser array driver according to an embodiment of the present invention;
FIG. 2 is a schematic three-dimensional front and back view of the package structure of FIG. 1;
fig. 3 is a schematic diagram of a driving circuit of a laser array driving apparatus according to an embodiment of the invention.
In the figure:
1-large scale laser array chip 2-heat conducting film
3-carrier substrate 4-thermal insulation structure
5-laser driving module 6-electric connection structure
7-microcolumn 8-heat sink structure
9-laser driving chip 10-input buffer module
11-main amplifying circuit 12-output buffer module
13-laser control chip 14-multi-level cache structure
Detailed Description
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
Certain embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. Indeed, various embodiments of the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
In a first exemplary embodiment of the invention, a laser array driving apparatus is provided, please refer to fig. 1, which is a schematic cross-sectional structure diagram of the laser array driving apparatus provided in this embodiment, fig. 2 is a schematic three-dimensional front-back side diagram of the apparatus package shown in fig. 1, and fig. 3 is a schematic diagram of a laser driving module shown in fig. 1.
As shown in fig. 1 to fig. 3, the laser array driving apparatus provided in this embodiment includes: the large-scale laser array chip 1, the heat conducting film 2, the carrier substrate 3, the heat insulating structure 4, the laser driving module 5 and the heat sink structure 8, in some embodiments, the laser array driving device further includes a micro-column 7, wherein:
preferably, the laser array chip 1 comprises n × n same or different laser devices, wherein n is greater than or equal to 1;
the large-scale laser array chip 1 and the laser driving module 5 are in electrical communication through the electrical connection structure 6;
the heat insulation structure 4 is arranged between the laser driving module 5 and the bearing substrate 3;
the heat conducting film 2 is arranged between the laser array chip and the bearing substrate and is connected with a heat sink structure 8 at the bottom of the packaging body through a micro-column 7 to complete high-efficiency heat conduction;
the laser driving module 5 comprises a laser driving chip 9 and a laser control chip 13, wherein the laser driving chip 9 comprises an input buffer module 10, a main amplifying circuit 11 and an output buffer module 12, the laser control chip 13 comprises a multi-level buffer structure 14 formed by a first-level buffer to an n-level buffer, each level of buffer respectively controls the laser arrays with different response times, and n is larger than or equal to 1.
The following describes each component of the laser array driving apparatus provided in this embodiment in detail.
The carrier substrate 3 is formed of a single layer or a plurality of layers of rigid or flexible resin material, semiconductor material, and metal material, and silicon oxide, aluminum oxide, etc. may be added thereto to improve the strength and electrical properties of the substrate, and the metal layers between the plurality of layers of substrate are connected to the upper and lower surfaces of the substrate to form electrical connections. Preferably, the surface of the carrier substrate 3 has pads, and the stacked chips (i.e., the large-scale laser array chip 1 in this embodiment) are connected by the electrical connection structure 6, and the bonding method can be wire bonding or flip chip bonding according to different types of chips, and the pads are mostly made of copper, tin, gold, etc. with good electrical conductivity. The bearing substrate 3 can complete the connection of the microcolumns 7 in the substrate in the modes of punching, electroplating, filling or layer-by-layer superposition and the like, and the microcolumns 7 are made of metal with high thermal conductivity, graphene and the like.
The heat conducting film 2 is patterned according to different arrangement of each laser device in the large-scale laser array chip 1, the material of the heat conducting film 2 is one or combination of a plurality of materials such as metal, graphene, rubber, semiconductor material and coated heat conducting oil, grease, paste and the like, the compatibility of the electrical connection structure 6 and the bearing substrate 3 is enhanced through the structure of the patterned heat conducting film 2, the heat conducting efficiency is also increased, the solid heat conducting film can be patterned through integral forming or cutting, and the colloid or semisolid heat conducting film can be patterned through a screen printing process or a photoetching-stripping process.
Similarly, the heat insulation structure 4 is patterned according to the module shape of the laser driving module 5, the heat insulation structure 4 is composed of one or more of a micro-nano porous material, a heat reflection coating or a vacuum structure, heat generated when the laser array works is prevented from being transferred through the bearing substrate 3, and signal transmission delay or failure of the laser driving module 5 caused by high temperature is reduced.
The heat conducting film 2 is connected with a heat sink structure 8 at the bottom of the packaging body through a micro-column 7, the heat sink structure 8 is made of single or multiple alloys such as metal copper, tungsten, aluminum and the like, and has high thermal conductivity and low expansion coefficient, the temperature environment of the packaging body is maintained, and the stability of the system is improved.
The laser driving module 5 comprises a laser driving chip 9 and a laser control chip 13, wherein the laser driving chip 9 generates a driving signal, and the driving signal can be a voltage signal or a current signal according to different types of lasers. The laser driving chip 9 includes an input buffer module 10, a main amplifier circuit 11, and an output buffer module 12, and mainly functions to enable the laser coupling circuit to obtain a digital signal with a large enough swing amplitude to adjust and drive the laser to emit light. The input buffer module 10 performs impedance matching between the laser and the circuit to reduce input reflection; the main amplifying circuit 11 realizes the amplification of the driving signal with high gain and low noise, and the output buffer module 12 is usually a differential circuit, and transmits the high-speed driving signal to the off-chip load without loss, so as to reduce the interference between the driving signals. The laser control chip 13 is composed of multiple levels of cache structures 14, with the increase of the scale of the laser array, delay of driving signals can occur between single lasers, so that errors are generated in the laser array working in modes such as flash, the multiple levels of cache structures 14 select one level of cache to n levels of cache according to the scale of the laser array, wherein n is larger than or equal to 1, compensation calculation is carried out according to the scale of the laser array and the response time of the single laser, the multiple levels of cache structures 14 are set, and the laser array is driven after being processed by the cache chip in the laser control chip 13. For example: the single signal transmission line controls k laser subarrays, the signal response time of each laser subarray is t, the number n of buffer stages is k, and the signal delay of each buffer structure is (k-1) x t.
In a second exemplary embodiment of the present invention, a method for packaging a laser array driver is provided, and referring to fig. 1 to fig. 3 again, the following describes in detail an implementation of the method, including:
preparing a laser array chip 1 and a laser driving module 5, which are the general structure of the laser driving module 5 provided in this embodiment as shown in fig. 3, and the purpose of the invention is to receive an external control signal, process the external control signal by an internal circuit of the chip, and then apply a driving signal to the laser array, and the detailed description thereof is described in the first embodiment and is not repeated herein;
patterning a heat conduction material as a heat conduction film 2 according to the arrangement mode of laser devices in the laser array chip 1;
patterning a heat insulating material as the heat insulating structure 4 according to the module shape of the laser driving module 5:
arranging the patterned heat-conducting film 2 on one surface of a bearing substrate 3 with a bonding pad and correspondingly connecting the laser array chip 1;
the other surface of the bearing substrate 3 is provided with the patterned heat insulation structure 4 and is correspondingly connected with the laser driving module 5;
the laser array chip 1 and the carrier substrate 3 are connected through the electrical connection structure 6, and the laser driving module 5 and the carrier substrate 3, so as to realize the electrical connection between the laser array chip 1 and the laser driving module 5, it should be noted that the electrical connection structure in this embodiment is located between the laser array chip 1, the laser driving module 5 and the carrier substrate 3, but the specific connection mode is not limited thereto, as long as all connection modes of the electrical connection between the laser array chip 1 and the laser driving module 5 can be realized;
the method is characterized in that the micro-columns 7 are arranged on the bearing substrate 3 in a punching-electroplating-filling or layer-by-layer stacking mode, the heat conducting film 2 is connected with a heat sink structure 8 through the micro-columns 7, preferably, the heat sink structure 8 in the embodiment is in a hollow design mode, the heat sink structure 8 is just ensured to be not in contact with the laser driving module 5 in the hollow part of the heat sink structure 8, and the design mode is used for completing the design of a hollow packaging structure in a space and realizing high-performance driving.
The laser array driving device and the packaging method thereof comprise driving chips, control chips, a bearing substrate, a heat insulation structure, a heat conduction film, a micro-column and the like, wherein the chips are packaged in a three-dimensional stacking mode, and effective inter-chip heat dissipation is carried out through the heat conduction film. The invention has the characteristics of short response time, high integration level, high reliability and the like, and greatly improves the drive identity, the emission power and the space utilization rate compared with other drive and packaging methods, thereby having wide application prospect in the fields of optical imaging, communication, interconnection, storage and the like.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A laser array driver apparatus, comprising:
the surface of the bearing substrate is provided with a bonding pad;
the laser array chip comprises n multiplied by n identical or different laser devices, wherein n is more than or equal to 1;
the heat conduction film is arranged between the laser array chip and the bearing substrate;
the laser driving module is connected with the laser array chip through an electrical connection structure;
the heat insulation structure is arranged between the laser driving module and the bearing substrate; and
a heat sink structure connected with the carrier substrate.
2. The laser array driving apparatus according to claim 1, further comprising:
and the micro column is connected with the heat conducting film and the heat sink structure.
3. The laser array driving apparatus according to claim 1, wherein the laser driving module comprises:
the laser driving chip comprises an input buffer module, a main amplifying circuit and an output buffer module; and
the laser control chip comprises a first-level cache to an n-level cache, wherein each level of cache respectively controls laser arrays with different response times correspondingly, and n is larger than or equal to 1.
4. The laser array driving apparatus according to claim 1, wherein the carrier substrate is composed of a single layer or a plurality of layers of rigid or flexible resin material, semiconductor material, and metal material, and the pad material is copper, tin, or gold.
5. The laser array driving apparatus according to claim 1, wherein the thermal conductive film is a combination of one or more of metal, graphene, rubber, semiconductor material, and thermal conductive oil, grease, or paste, and has a patterned design conforming to an arrangement of the laser devices.
6. The laser array driving device according to claim 1, wherein the heat insulation structure is composed of one or more of a micro-nano porous material, a heat reflection coating or a vacuum structure, and the heat insulation structure has a graphical design conforming to a module shape of the laser driving module.
7. The laser array driving apparatus according to claim 1, wherein the electrical connection structure is located between the laser array chip, the laser driving module and the carrier substrate, and the electrical connection structure is connected by wire bonding or flip chip bonding.
8. The laser array driver of claim 1, wherein the heat sink structure material is copper, tungsten, aluminum or their alloys.
9. The laser array driving apparatus according to claim 2, wherein the micro-pillar material is metal or graphene.
10. A packaging method of a laser array driving device is characterized in that the laser array driving device adopts three-dimensional stacked packaging and comprises the following steps:
preparing a laser array chip and a laser driving module;
patterning a heat conduction material as a heat conduction film according to the arrangement mode of laser devices in the laser array chip;
patterning a heat insulating material as a heat insulating structure according to the module shape of the laser driving module;
arranging the patterned heat-conducting film on one surface of a bearing substrate with a bonding pad and correspondingly connecting the patterned heat-conducting film with the laser array chip;
the other surface of the bearing substrate is provided with the patterned heat insulation structure and is correspondingly connected with the laser driving module;
the laser array chip and the bearing substrate are connected through an electrical connection structure, and the laser driving module and the bearing substrate are connected, so that the electrical connection between the laser array chip and the laser driving module is realized;
arranging micro-columns on the bearing substrate in a punching-electroplating-filling or layer-by-layer stacking mode, and connecting the heat-conducting film with a heat sink structure through the micro-columns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992563.6A CN110690645B (en) | 2019-10-17 | 2019-10-17 | Laser array driving device and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910992563.6A CN110690645B (en) | 2019-10-17 | 2019-10-17 | Laser array driving device and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110690645A true CN110690645A (en) | 2020-01-14 |
| CN110690645B CN110690645B (en) | 2020-12-15 |
Family
ID=69113207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910992563.6A Active CN110690645B (en) | 2019-10-17 | 2019-10-17 | Laser array driving device and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110690645B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933812A (en) * | 2020-07-14 | 2022-01-14 | 上海禾赛科技有限公司 | Light source module of laser radar, laser radar and method for manufacturing light source module |
| WO2022041409A1 (en) * | 2020-08-26 | 2022-03-03 | 东南大学苏州研究院 | Laser having separately controllable vcsel units |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577263A (en) * | 2008-05-06 | 2009-11-11 | 南茂科技股份有限公司 | Chip packaging structure and chip packaging coiling tape |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| CN103579899A (en) * | 2013-11-21 | 2014-02-12 | 中国科学院半导体研究所 | Laser array heat sink module |
| US9057853B2 (en) * | 2009-02-20 | 2015-06-16 | The Hong Kong University Of Science And Technology | Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
-
2019
- 2019-10-17 CN CN201910992563.6A patent/CN110690645B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577263A (en) * | 2008-05-06 | 2009-11-11 | 南茂科技股份有限公司 | Chip packaging structure and chip packaging coiling tape |
| US9057853B2 (en) * | 2009-02-20 | 2015-06-16 | The Hong Kong University Of Science And Technology | Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| CN103579899A (en) * | 2013-11-21 | 2014-02-12 | 中国科学院半导体研究所 | Laser array heat sink module |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113933812A (en) * | 2020-07-14 | 2022-01-14 | 上海禾赛科技有限公司 | Light source module of laser radar, laser radar and method for manufacturing light source module |
| WO2022041409A1 (en) * | 2020-08-26 | 2022-03-03 | 东南大学苏州研究院 | Laser having separately controllable vcsel units |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110690645B (en) | 2020-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10459157B2 (en) | Optical emitter packages | |
| JP5223677B2 (en) | Semiconductor device | |
| US8786074B2 (en) | Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity | |
| KR101368524B1 (en) | Electronic Device and Manufacturing Method therefor | |
| KR20120079445A (en) | Substrate for electronic device and electronic device | |
| US8654541B2 (en) | Three-dimensional power electronics packages | |
| CN110690645B (en) | Laser array driving device and packaging method thereof | |
| US20220367431A1 (en) | Optoelectronic device package and method of manufacturing the same | |
| WO2015079551A1 (en) | Semiconductor device and information processing device | |
| CN111766664A (en) | Light emission assembly and optical module | |
| CN109727948B (en) | Packaging structure and chip mounting unit | |
| KR101148028B1 (en) | Method for manufacturing heat dissipation bulk of semiconductor device | |
| JP2008124072A (en) | Semiconductor device | |
| CN210200761U (en) | Flip-chip LED light source | |
| CN204669313U (en) | A kind of GaAs and LDMOS/GaN hybrid integrated microwave amplifier based on PCB technology | |
| WO2021047273A1 (en) | Flip-chip led light source | |
| CN111354691B (en) | Package substrate structure | |
| CN104883133A (en) | GaAs and LDMOS/GaN mixed integrated microwave amplifier based on PCB process | |
| CN110850531A (en) | Multi-channel optical module integrated structure with high-efficiency heat dissipation capacity and high integration level | |
| WO2018157314A1 (en) | Photoelectric hybrid package assembly | |
| KR20040086133A (en) | Semiconductor device | |
| CN117170047B (en) | High-speed optical module based on three-dimensional packaging form | |
| US9018759B2 (en) | Semiconductor package substrate and semiconductor package including the same | |
| CN212725950U (en) | Packaging structure of optical device | |
| CN116705726B (en) | Welding-free module packaging structure and double-sided heat dissipation module packaging structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |