CN110690017B - Improved alloy resistor - Google Patents
Improved alloy resistor Download PDFInfo
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- CN110690017B CN110690017B CN201910981235.6A CN201910981235A CN110690017B CN 110690017 B CN110690017 B CN 110690017B CN 201910981235 A CN201910981235 A CN 201910981235A CN 110690017 B CN110690017 B CN 110690017B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
Abstract
The invention relates to the field of resistor devices, and discloses an improved alloy resistor which is characterized in that a plurality of resistor discs are installed and fixed by mutually matching a U-shaped conducting strip, a mica gasket, a first porcelain piece, a lead screw and a second porcelain piece, so that the defects of time and labor waste caused by welding of iron discs in a traditional connection mode are overcome. The europium-doped monosilane mica modified resistance chip adopted by the invention adopts the europium-doped monosilane mica, which is beneficial to the dispersion of various components, improves the microstructure of the resistance chip and prolongs the service life of the resistance chip under high current. The improved alloy resistor disclosed by the invention has the advantages of convenience in installation, good portability, simplicity in operation, low production cost and convenience in popularization and use.
Description
Technical Field
The invention relates to the field of resistance devices, in particular to an improved alloy resistor.
Background
The resistor is a current limiting element, and after the resistor is connected in a circuit, the resistance value of the resistor is fixed, generally two pins, and the resistor can limit the current passing through a branch connected with the resistor. The variable resistor is called a fixed resistor, and the variable resistor is called a potentiometer or a variable resistor. Ideally the resistor is linear, i.e. the instantaneous current through the resistor is proportional to the applied instantaneous voltage. A variable resistor for voltage division. On the exposed resistor body, one to two movable metal contacts are pressed. The contact location determines the resistance between either end of the resistor and the contact. 201780014512.5 discloses a resistor 1 including a resistor substrate 21 having a resistor 13 and a pair of electrodes 17a, 17b formed on an insulating substrate 15, wherein the upper surface and the side surfaces of the resistor substrate 21 are covered with an insulating sheathing material 3, and one end portions of wire harnesses 7a, 7b are connected to the electrodes 17a, 17b, respectively, and extend to the outside through the sheathing material 3, wherein the resistor 1 is configured such that the electrodes 17a, 17b are formed avoiding the end portions of the insulating substrate 15, and joint portions for joining the one end portions of the wire harnesses 7a, 7b to the pair of electrodes 17a, 17b are disposed at positions where the creepage distance from the joint portions to the end portions of the bottom surface of the insulating substrate 15 is a predetermined distance or more. According to such a configuration, it is possible to provide a resistor in which the creepage distance between the conductive portion of the resistor and the metal case to which the resistor is attached is ensured. 201610056007.4 discloses a resistor device. The resistance device includes: a substrate; a first resistor body disposed on a top surface of the substrate; and a second resistor body provided on the bottom surface of the substrate. The invention can reduce the occupied area of the resistor when the resistor is applied to the PCB. 201820362771.9 to propose a resistor. The resistor includes a substrate and a resistance element. The impedance component is arranged on the substrate and comprises a plurality of impedance particles, and each impedance particle comprises a first core layer and a first coating layer coating the first core layer; the two conductive terminals are arranged on the substrate and are respectively connected with two sides of the impedance component, the two conductive terminals are respectively provided with a plurality of conductive particles, and each conductive particle comprises a second core layer and a second coating layer coating the second core layer. The utility model discloses a can accord with the harmful substance requirement that harmful substance forbidden restriction instruction (RoHS) stipulated among the motor electronic product, its resistance Temperature Coefficient (TCR) is also lower.
The existing resistor connecting mode adopts iron sheet welding, is troublesome to install, wastes time and labor, is poor in portability, and in addition, the existing resistor disc is easy to break and damage under the action of large current, so that the improved alloy resistor is provided.
Disclosure of Invention
In order to solve the above problems, the present invention provides an improved alloy resistor.
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85-95 parts of zinc oxide powder, 0.1-0.8 part of cobaltous oxide, 0.4-1.2 parts of nickel oxide, 0.1-0.5 part of niobium oxide, 0.6-1.5 parts of bentonite, 0.05-0.4 part of copper oxide and 0.03-0.3 part of bismuth trioxide into a ball mill, adding 120 parts of ethanol, 160 parts of 250-350r/min, carrying out ball milling and mixing for 30-60min, then adding 0.5-5 parts of europium-doped monosilane mica, continuing ball milling for 60-180min, drying the slurry at 80-100 ℃ for 1-5h after ball milling and mixing is finished, and obtaining dry powder; and then adding 5-10 parts of pure water, uniformly mixing, pressing into a resistance card blank by using a forming machine, drying the resistance card blank at the temperature of 120-plus-150 ℃, sintering at the temperature of 700-plus-800 ℃ for 30-90min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100-plus-1300 ℃ and carrying out heat preservation sintering for 60-120min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
according to the mass parts, 15-30 parts of strontium stearate, 5-12 parts of polyethylene glycol borate, 2-9 parts of perfluoroalkyl silyl mica, 2-9 parts of tin fluosilicate and 0.001-0.1 part of tris [ N, N-bis (trimethylsilane) amine ] europium are placed in a container, rapidly stirred and mixed for 20-30min at the temperature of 130-150 ℃, then cooled to room temperature and crushed into powder, and the europium-doped silyl mica can be obtained.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The improved alloy resistor disclosed by the invention has the beneficial effects that: through U-shaped conducting strip, mica gasket, porcelain spare one, lead screw and porcelain spare two use of mutually supporting to the realization is installed fixedly a plurality of resistance cards, solves traditional connected mode and adopts the iron sheet welding, drawback that wastes time and energy. The europium-doped monosilane mica modified resistance chip adopted by the invention adopts the europium-doped monosilane mica, which is beneficial to the dispersion of various components, improves the microstructure of the resistance chip and prolongs the service life of the resistance chip under high current. The improved alloy resistor disclosed by the invention has the advantages of convenience in installation, good portability, simplicity in operation, low production cost and convenience in popularization and use.
The sheet particle size of the perfluoroalkyl silyl mica is small, the sheet particle size is in a folded state, and van der Waals interaction force exists between the tris [ N, N-bis (trimethylsilane) amine ] europium and the mica, so that the tris [ N, N-bis (trimethylsilane) amine ] europium can be coated on the surface of the perfluoroalkyl silyl mica to play a role in physical modification. As a good compatilizer, the compatibility of the perfluoroalkyl silyl mica with zinc oxide is improved, and the prepared resistance card is not easy to crack and damage under the action of large current.
Drawings
Fig. 1 is a front view of an improved alloy resistor according to the present invention.
Fig. 2 is a top view of an improved alloy resistor according to the present invention.
Fig. 3 is a side view of an improved alloy resistor according to the present invention.
Fig. 4 is an enlarged view of a partial structure of an improved alloy resistor according to the present invention.
FIG. 5 is a Fourier infrared spectrum of a sample of europium-doped monosilane mica prepared in example 3.
Reference numbers in the figures: 1 resistor disc, 2U-shaped conducting strips, 3 mica gaskets, 4 porcelain pieces I, 5 lead screws, 6 porcelain pieces II, 7 bases, 9 connecting plates, 10 nuts and 11 screws.
Detailed Description
The invention is further illustrated by the following specific examples:
the stability of the parameters of the resistance card after the resistance card prepared by the embodiment is subjected to specified power frequency current is tested, and the method specifically comprises the following steps: before the tolerance test, measuring the average value of the direct current voltage at two ends of the resistance card when the direct current of 15mA flows through the resistance card, namely the average value of the direct current voltage before the tolerance test; the resistor disc can tolerate specified power frequency current for 10 minutes under the power frequency current of 250mA and 120 minutes under the power frequency current of 20mA in sequence; and cooling to room temperature after the test, and measuring the average value of the direct current voltage at two ends of the resistance chip when the direct current flows through the resistance chip at 15mA, namely the average value of the direct current voltage after the resistance chip is subjected to the test. And calculating the change of the through-current capacity and the residual voltage before and after the tolerance test, namely (the mean value of the direct current voltage after the tolerance test-the mean value of the direct current voltage before the tolerance test)/the mean value of the direct current voltage before the tolerance test multiplied by 100%.
Example 1
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing for 30min at a speed of 250r/min, then adding 0.5g of europium-doped silane mica, continuing ball milling for 60min, and drying the slurry at 80 ℃ for 1h after ball milling and mixing are finished to obtain dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
18g of strontium stearate, 7g of polyethylene glycol borate, 8g of perfluoroalkyl silyl mica, 6g of tin fluosilicate and 0.002g of tris [ N, N-bis (trimethylsilane) amine ] europium are placed in a container, rapidly stirred and mixed for 25min at the temperature of 140 ℃, then cooled to room temperature and crushed into powder, and the europium-doped silyl mica can be obtained.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 357J/cm3, and the residual voltage change before and after the endurance test is 1.17%.
Example 2
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 90g of zinc oxide powder, 0.4g of cobaltous oxide, 0.8g of nickel oxide, 0.3g of niobium oxide, 0.9g of bentonite, 0.2g of copper oxide and 0.13g of bismuth trioxide into a ball mill, adding 140g of ethanol, carrying out ball milling and mixing for 40min at a speed of 300r/min, then adding 2.5g of europium-doped silane mica, continuing ball milling for 120min, and drying the slurry at 90 ℃ for 3h after ball milling and mixing are finished to obtain dry powder; and then 8g of pure water is added, the mixture is uniformly mixed and then is pressed into a resistance card green body by a forming machine, the resistance card green body is dried at the temperature of 130 ℃, then is sintered at the temperature of 750 ℃ for 60min, is transferred into a hydrogen tube furnace after being sintered completely, is sintered for 90min by controlling the temperature of 1200 ℃, and is cooled to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
putting 15g of strontium stearate, 5g of polyethylene glycol borate, 2g of perfluoroalkyl silyl mica, 2g of tin fluorosilicate and 0.001g of tris [ N, N-bis (trimethylsilane) amine ] europium into a container, quickly stirring and mixing for 20min at 130 ℃, then cooling to room temperature and crushing into powder to obtain the europium-doped silyl mica.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The through-current capacity of the resistance card prepared by the experiment is 368J/cm3, and the residual voltage change before and after the endurance test is 0.92%.
Example 3
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 95g of zinc oxide powder, 0.8g of cobaltous oxide, 1.2g of nickel oxide, 0.5g of niobium oxide, 1.5g of bentonite, 0.4g of copper oxide and 0.3g of bismuth trioxide into a ball mill, adding 160g of ethanol, ball-milling and mixing for 60min at a speed of 350r/min, then adding 5g of europium-doped monosilane mica, continuing ball-milling for 180min, drying the slurry at 100 ℃ for 5h after ball-milling and mixing to obtain dry powder; and then adding 10g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 150 ℃, sintering at 800 ℃ for 90min, transferring into a hydrogen tube furnace after sintering, controlling the temperature at 1300 ℃, carrying out heat preservation sintering for 120min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
30g of strontium stearate, 12g of polyethylene glycol borate, 9g of perfluoroalkyl silyl mica, 9g of tin fluosilicate and 0.1g of tris [ N, N-bis (trimethylsilane) amine ] europium are placed in a container, rapidly stirred and mixed for 30min at the temperature of 150 ℃, then cooled to room temperature and crushed into powder, and the europium-doped silyl mica can be obtained.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 372J/cm3, and the residual voltage change before and after the endurance test is 0.87%.
FIG. 5 is a Fourier infrared spectrum of a sample of europium-doped monosilane mica prepared in example 3.
As can be seen from FIG. 1, the presence of an absorption peak of C ═ O of the ester group near 1731cm-1 and an absorption peak of C-O of the ester group near 1719cm-1 indicated that strontium stearate participated in the reaction; absorption peaks of fluorocarbon and silicon carbon exist near 1247 cm-1 and 1111cm-1, which indicates that the perfluoroalkyl silyl mica participates in the reaction; an absorption peak of boron and oxygen exists near 1454cm-1, which indicates that the polyethylene glycol borate participates in the reaction; an absorption peak of silicon nitrogen exists near 880cm-1, which indicates that tris [ N, N-bis (trimethylsilanyl) amine ] europium participates in the reaction.
Comparative example 1
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance chip is characterized by being a modified resistance chip.
The modified resistance card is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing at 250r/min for 30min, continuing ball milling for 60min, drying the slurry at 80 ℃ for 1h after ball milling and mixing are finished, and obtaining dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the modified resistance card.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 287J/cm3, and the residual voltage change before and after the endurance test is 2.71%.
Comparative example 2
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing for 30min at a speed of 250r/min, then adding 0.5g of europium-doped silane mica, continuing ball milling for 60min, and drying the slurry at 80 ℃ for 1h after ball milling and mixing are finished to obtain dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
7g of polyethylene glycol borate, 8g of perfluoroalkyl silyl mica, 6g of tin fluosilicate and 0.002g of tris [ N, N-bis (trimethylsilane) amine ] europium are put into a container, rapidly stirred and mixed for 25min at the temperature of 140 ℃, then cooled to room temperature and crushed into powder, thus obtaining the europium-doped silyl mica.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 330J/cm3, and the residual voltage change before and after the endurance test is 1.98%.
Comparative example 3
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing for 30min at a speed of 250r/min, then adding 0.5g of europium-doped silane mica, continuing ball milling for 60min, and drying the slurry at 80 ℃ for 1h after ball milling and mixing are finished to obtain dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
putting 18g of strontium stearate, 7g of polyethylene glycol borate, 6g of tin fluosilicate and 0.002g of tris [ N, N-bis (trimethylsilane) amine ] europium into a container, quickly stirring and mixing for 25min at 140 ℃, then cooling to room temperature and crushing into powder to obtain the europium-doped monosilane mica.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 322J/cm3, and the residual voltage change before and after the endurance test is 1.67.
Comparative example 4
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a monosilane mica modified resistance card.
The monosilane mica modified resistance chip is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing for 30min at a speed of 250r/min, then adding 0.5g of silane mica, continuing ball milling for 60min, and drying slurry at 80 ℃ for 1h after ball milling and mixing are finished to obtain dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the silane mica modified resistance card.
The preparation method of the monosilane mica comprises the following steps:
18g of strontium stearate, 7g of polyethylene glycol borate, 8g of perfluoroalkyl silyl mica and 6g of tin fluosilicate are put into a container, rapidly stirred and mixed for 25min at the temperature of 140 ℃, cooled to room temperature and then crushed into powder, thus obtaining the silyl mica.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The current capacity of the resistor disc prepared in the experiment is 329J/cm3, and the residual voltage change before and after the endurance test is 1.82%.
Comparative example 5
An improved alloy resistor comprises a base, wherein a connecting plate is detachably mounted at the upper end of the base, a plurality of resistor discs are fixed at the upper end of the connecting plate, the specifications of the resistor discs are the same, two lead screws are arranged and penetrate through the resistor discs, a first porcelain piece and a second porcelain piece are sequentially and alternately arranged between every two adjacent resistor discs, the specifications of the first porcelain piece and the second porcelain piece are the same, a mica gasket is arranged between each resistor disc and the first porcelain piece, a U-shaped conducting strip is arranged between each second porcelain piece and each adjacent two resistor discs, and the first porcelain piece, the second porcelain piece, the U-shaped conducting strip and the mica gasket are all sleeved on the lead screws; the resistance card is characterized by being a europium-doped monosilane mica modified resistance card.
The europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85g of zinc oxide powder, 0.1g of cobaltous oxide, 0.4g of nickel oxide, 0.1g of niobium oxide, 0.6g of bentonite, 0.05g of copper oxide and 0.03g of bismuth trioxide into a ball mill, adding 120g of ethanol, carrying out ball milling and mixing for 30min at a speed of 250r/min, then adding 0.5g of europium-doped silane mica, continuing ball milling for 60min, and drying the slurry at 80 ℃ for 1h after ball milling and mixing are finished to obtain dry powder; and then adding 5g of pure water, uniformly mixing, pressing into a resistance card green body by using a forming machine, drying the resistance card green body at 120 ℃, sintering at 700 ℃, sintering for 30min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100 ℃, carrying out heat preservation sintering for 60min, and cooling to obtain the europium-doped monosilane mica modified resistance card.
The preparation method of the europium-doped monosilane mica comprises the following steps:
putting 18g of strontium stearate, 7g of polyethylene glycol borate, 8g of perfluoroalkyl silyl mica and 0.002g of tris [ N, N-bis (trimethylsilane) amine ] europium into a container, quickly stirring and mixing for 25min at 140 ℃, then cooling to room temperature and crushing into powder to obtain the europium-doped silyl mica.
The connecting plate passes through screw and nut and the detachable connection of base.
The screw rod is detachably connected with the ceramic chip I through a locking nut.
The discharge capacity of the resistance card prepared in the experiment is 323J/cm3, and the residual voltage change before and after the endurance test is 1.55%.
Claims (3)
1. The utility model provides an improved generation alloy resistor, includes base (7) and lead screw (5), its characterized in that, connecting plate (9) are detachably installed to base (7) upper end, connecting plate (9) upper end is fixed with a plurality of resistance card (1), and a plurality of resistance card (1) specification homogeneous phase, lead screw (5) are equipped with two, two lead screw (5) all run through in a plurality of resistance card (1), and have set gradually ceramic (4), ceramic two (6) between two adjacent resistance card (1) in turn, ceramic (4) are the same with ceramic two (6) specification, be provided with mica shim (3) between resistance card (1) and ceramic (4), be provided with U-shaped conducting strip (2) between ceramic two (6) and two adjacent ceramic resistance card (1), ceramic (4), ceramic two (6) are well, The U-shaped conducting strip (2) and the mica gasket (3) are sleeved on the screw rod (5); the resistance card is characterized in that the resistance card is a europium-doped monosilane mica modified resistance card;
the europium-doped monosilane mica modified resistance card is prepared according to the following scheme:
putting 85-95 parts of zinc oxide powder, 0.1-0.8 part of cobaltous oxide, 0.4-1.2 parts of nickel oxide, 0.1-0.5 part of niobium oxide, 0.6-1.5 parts of bentonite, 0.05-0.4 part of copper oxide and 0.03-0.3 part of bismuth trioxide into a ball mill, adding 120 parts of ethanol, 160 parts of 250-350r/min, carrying out ball milling and mixing for 30-60min, then adding 0.5-5 parts of europium-doped monosilane mica, continuing ball milling for 60-180min, drying the slurry at 80-100 ℃ for 1-5h after ball milling and mixing is finished, and obtaining dry powder; then adding 5-10 parts of pure water, uniformly mixing, pressing into a resistance card blank by using a forming machine, drying the resistance card blank at the temperature of 120-plus-150 ℃, sintering at the temperature of 700-plus-800 ℃ for 30-90min, transferring into a hydrogen tube furnace after sintering is completed, controlling the temperature at 1100-plus-1300 ℃ and carrying out heat preservation sintering for 60-120min, and cooling to obtain the europium-doped monosilane mica modified resistance card;
the preparation method of the europium-doped monosilane mica comprises the following steps:
according to the mass parts, 15-30 parts of strontium stearate, 5-12 parts of polyethylene glycol borate, 2-9 parts of perfluoroalkyl silyl mica, 2-9 parts of tin fluosilicate and 0.001-0.1 part of tris [ N, N-bis (trimethylsilane) amine ] europium are placed in a container, rapidly stirred and mixed for 20-30min at the temperature of 130-150 ℃, then cooled to room temperature and crushed into powder, and the europium-doped silyl mica can be obtained.
2. An improved alloy resistor according to claim 1, wherein: the connecting plate (9) is detachably connected with the base (7) through a screw (11) and a nut (10).
3. An improved alloy resistor according to claim 1, wherein: u-shaped conducting strip (2), mica gasket (3), porcelain spare (4), lead screw (5) and porcelain spare two (6) use of mutually supporting, realize installing fixedly a plurality of resistance cards.
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Denomination of invention: An Improved Alloy Resistor Effective date of registration: 20221106 Granted publication date: 20220208 Pledgee: Bank of China Limited by Share Ltd. Pujiang County branch Pledgor: PUJIANG ZHAORI ELECTRIC APPLIANCE CO.,LTD. Registration number: Y2022330002979 |
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