CN110684472A - Halogen-free flame-retardant epoxy resin adhesive film - Google Patents
Halogen-free flame-retardant epoxy resin adhesive film Download PDFInfo
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- CN110684472A CN110684472A CN201910958907.1A CN201910958907A CN110684472A CN 110684472 A CN110684472 A CN 110684472A CN 201910958907 A CN201910958907 A CN 201910958907A CN 110684472 A CN110684472 A CN 110684472A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/324—Alkali metal phosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/329—Phosphorus containing acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of photovoltaic cells, in particular to a halogen-free flame-retardant epoxy resin adhesive film which comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 2-8 parts of plasticizer, 1.2-3.6 parts of curing agent, 0.2-0.8 part of acidifier, 0.8-2.4 parts of halogen-free flame retardant, 0.4-0.8 part of antioxidant, 0.3-0.6 part of cross-linking agent and 1.2-3.6 parts of silane coupling agent; the flame retardant HS-ACM is added, so that the flame retardance of the epoxy resin adhesive film is improved, the epoxy resin adhesive film is environment-friendly and pollution-free, the HS-ACM is superfine azaphosphine white powder, belongs to a high-efficiency intumescent flame retardant, is nontoxic, odorless and tasteless, has the decomposition temperature higher than 240 ℃, is dehydrated into charcoal at high temperature, and releases nitrogen, carbon dioxide and water during combustion; in the invention, the acidifying agent is added, so that the solidification promoting effect is achieved, and the adhesion of the adhesive film to metal is increased.
Description
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to a halogen-free flame-retardant epoxy resin adhesive film.
Background
The epoxy resin adhesive has the characteristics of high bonding strength, high hardness, good rigidity, acid resistance, alkali resistance, oil resistance and organic solvent resistance and small curing shrinkage, is widely used in electronic products and photovoltaic modules, and is used as a packaging material, the epoxy resin adhesive is required to have flame retardant property, in order to enable the epoxy resin adhesive to have excellent flame retardant property, a flame retardant is usually required to be added into an epoxy resin adhesive film, the flame retardant usually comprises an inorganic flame retardant and a halogen-containing flame retardant, the inorganic flame retardant is added, although the flame retardant effect of the adhesive film can be improved, the cohesiveness of the adhesive film is also reduced, the halogen-containing flame retardant is added, acidic corrosive gas smoke containing hydrogen halide can be generated during combustion, and the requirement of environmental protection is not facilitated.
Disclosure of Invention
The purpose of the invention is: overcomes the defects in the prior art, and provides a halogen-free flame-retardant epoxy resin adhesive film which is safe and environment-friendly to use.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 2-8 parts of plasticizer, 1.2-3.6 parts of curing agent, 0.2-0.8 part of acidifier, 0.8-2.4 parts of halogen-free flame retardant, 0.4-0.8 part of antioxidant, 0.3-0.6 part of cross-linking agent and 1.2-3.6 parts of silane coupling agent.
Further, the plasticizer is one or more of dioctyl phthalate, di (2-ethylhexyl) phthalate, dicyclohexyl phthalate and butyl benzyl phthalate.
Furthermore, the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 2-3: 1.
Further, the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1:1-3: 2-4.
Further, the acidifier is one of phosphoric acid and sodium dihydrogen phosphate.
Furthermore, the halogen-free flame retardant is HS-ACM.
Further, the bisphenol A epoxy resin has an epoxy equivalent of 180-200.
Further, the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
Further, the cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
The technical scheme adopted by the invention has the beneficial effects that:
the halogen-free flame retardant HS-ACM is added, so that the flame retardance of the epoxy resin adhesive film is improved, the flame retardant is environment-friendly and pollution-free, the HS-ACM is superfine N-phosphine white powder, belongs to a high-efficiency intumescent flame retardant, is nontoxic, odorless and tasteless, has the decomposition temperature higher than 240 ℃, is dehydrated into charcoal at high temperature, and releases nitrogen, carbon dioxide and water during combustion.
The addition of the acidifying agent can play a role in promoting curing and increase the adhesion of the adhesive film to metal.
Detailed Description
The invention will now be further illustrated with reference to specific examples.
Example 1
A halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 2 parts of plasticizer, 1.2 parts of curing agent, 0.2 part of acidifier, 0.8 part of halogen-free flame retardant, 0.4 part of antioxidant, 0.3 part of cross-linking agent and 1.2 parts of silane coupling agent.
Wherein the plasticizer is dioctyl phthalate.
Wherein the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1:1: 2.
Wherein the acidifying agent is phosphoric acid.
Wherein the halogen-free flame retardant is HS-ACM.
Wherein the bisphenol A epoxy resin has an epoxy equivalent of 180.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
The cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
Example 2
A halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 3 parts of plasticizer, 1.5 parts of curing agent, 0.3 part of acidifier, 0.9 part of halogen-free flame retardant, 0.5 part of antioxidant, 0.4 part of cross-linking agent and 1.5 parts of silane coupling agent.
Wherein the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 2: 1.
Wherein the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1:1.5: 2.5.
Wherein the acidifying agent is phosphoric acid.
Wherein the halogen-free flame retardant is HS-ACM.
Wherein the bisphenol A epoxy resin has an epoxy equivalent of 190.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
The cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
Example 3
A halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 5 parts of plasticizer, 2.4 parts of curing agent, 0.5 part of acidifier, 1.6 parts of halogen-free flame retardant, 0.6 part of antioxidant, 0.5 part of cross-linking agent and 2.4 parts of silane coupling agent.
Wherein the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 2.5: 1.
Wherein the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1:2: 3.
Wherein the acidifying agent is sodium dihydrogen phosphate.
Wherein the halogen-free flame retardant is HS-ACM.
Wherein the bisphenol A epoxy resin has an epoxy equivalent of 180.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
The cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
Example 4
A halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 6 parts of plasticizer, 3.2 parts of curing agent, 0.6 part of acidifier, 2.1 parts of halogen-free flame retardant, 0.6 part of antioxidant, 0.5 part of cross-linking agent and 3.2 parts of silane coupling agent.
Wherein the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 2.8: 1.
Wherein the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1:1-3: 2-4.
Wherein the acidifying agent is sodium dihydrogen phosphate.
Wherein the halogen-free flame retardant is HS-ACM.
Wherein the bisphenol A epoxy resin has an epoxy equivalent of 180.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
The cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
Example 5
A halogen-free flame-retardant epoxy resin adhesive film comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 8 parts of plasticizer, 3.6 parts of curing agent, 0.8 part of acidifier, 2.4 parts of halogen-free flame retardant, 0.8 part of antioxidant, 0.6 part of cross-linking agent and 3.6 parts of silane coupling agent.
Wherein the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 3: 1.
Wherein the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate in a mass ratio of 1: 3: 4.
Wherein the acidifying agent is sodium dihydrogen phosphate.
Wherein the halogen-free flame retardant is HS-ACM.
Wherein the bisphenol A epoxy resin has an epoxy equivalent of 200.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
The cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumene peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the trimethylolpropane trimethacrylate to the auxiliary cross-linking curing agent is 6: 1.
The halogen-free flame retardant HS-ACM is added, so that the flame retardance of the epoxy resin adhesive film is improved, the flame retardant is environment-friendly and pollution-free, the HS-ACM is superfine N-phosphine white powder, belongs to a high-efficiency intumescent flame retardant, is nontoxic, odorless and tasteless, has the decomposition temperature higher than 240 ℃, is dehydrated into charcoal at high temperature, and releases nitrogen, carbon dioxide and water during combustion.
The addition of the acidifying agent can play a role in promoting curing and increase the adhesion of the adhesive film to metal.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. A halogen-free flame retardant epoxy resin adhesive film is characterized in that: the composition comprises the following components in parts by mass: 100 parts of bisphenol A epoxy resin, 50 parts of polyvinyl chloride resin, 2-8 parts of plasticizer, 1.2-3.6 parts of curing agent, 0.2-0.8 part of acidifier, 0.8-2.4 parts of halogen-free flame retardant, 0.4-0.8 part of antioxidant, 0.3-0.6 part of cross-linking agent and 1.2-3.6 parts of silane coupling agent.
2. The halogen-free flame retardant epoxy resin adhesive film according to claim 1, wherein: the plasticizer is one or more of dioctyl phthalate, di (2-ethylhexyl) phthalate, dicyclohexyl phthalate and butyl benzyl phthalate.
3. The halogen-free flame retardant epoxy resin adhesive film according to claim 2, wherein: the plasticizer is a mixture of dioctyl phthalate and di (2-ethylhexyl) phthalate, and the mass ratio of the dioctyl phthalate to the di (2-ethylhexyl) phthalate is 2-3: 1.
4. The halogen-free flame retardant epoxy resin adhesive film according to claim 1, wherein: the curing agent is a mixture of boron trifluoride glycerol, boron trifluoride aniline and triethanolamine diacetate with the mass ratio of 1:1-3: 2-4.
5. The halogen-free flame retardant epoxy resin adhesive film according to claim 1, wherein: the acidifier is one of phosphoric acid and sodium dihydrogen phosphate.
6. The halogen-free flame retardant epoxy resin adhesive film according to claim 1, wherein: the halogen-free flame retardant is HS-ACM.
7. The halogen-free flame retardant epoxy resin adhesive film according to claim 1, wherein: the bisphenol A epoxy resin has an epoxy equivalent of 180-200.
8. The multilayer fluorescent packaging adhesive film as claimed in claim 1, wherein: the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is an antioxidant 3114; the auxiliary antioxidant is an antioxidant IRGAFOS168, and the mass ratio of the auxiliary antioxidant to the IRGAFOS168 is 6: 1.
9. The fluorescent EVA adhesive film for packaging according to claim 1, wherein: the cross-linking agent comprises a main cross-linking curing agent and an auxiliary cross-linking curing agent, wherein the cross-linking curing agent is cumyl peroxide, the auxiliary cross-linking curing agent is trimethylolpropane trimethacrylate, and the mass ratio of the main cross-linking curing agent to the auxiliary cross-linking curing agent is 6: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910958907.1A CN110684472A (en) | 2019-10-10 | 2019-10-10 | Halogen-free flame-retardant epoxy resin adhesive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910958907.1A CN110684472A (en) | 2019-10-10 | 2019-10-10 | Halogen-free flame-retardant epoxy resin adhesive film |
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| CN110684472A true CN110684472A (en) | 2020-01-14 |
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| CN201910958907.1A Pending CN110684472A (en) | 2019-10-10 | 2019-10-10 | Halogen-free flame-retardant epoxy resin adhesive film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111204101A (en) * | 2020-03-31 | 2020-05-29 | 常州斯威克光伏新材料有限公司 | Packaging film for battery with high peel strength |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586519A (en) * | 2016-07-06 | 2018-01-16 | 中山国安火炬科技发展有限公司 | Halogen-free flameproof black epoxy glue composition and the method with its making electromagnetic shielding film |
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2019
- 2019-10-10 CN CN201910958907.1A patent/CN110684472A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586519A (en) * | 2016-07-06 | 2018-01-16 | 中山国安火炬科技发展有限公司 | Halogen-free flameproof black epoxy glue composition and the method with its making electromagnetic shielding film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111204101A (en) * | 2020-03-31 | 2020-05-29 | 常州斯威克光伏新材料有限公司 | Packaging film for battery with high peel strength |
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