CN110643289A - High-temperature-resistant flame-retardant adhesive film - Google Patents

High-temperature-resistant flame-retardant adhesive film Download PDF

Info

Publication number
CN110643289A
CN110643289A CN201910959657.3A CN201910959657A CN110643289A CN 110643289 A CN110643289 A CN 110643289A CN 201910959657 A CN201910959657 A CN 201910959657A CN 110643289 A CN110643289 A CN 110643289A
Authority
CN
China
Prior art keywords
flame
retardant
epoxy resin
adhesive film
diluent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910959657.3A
Other languages
Chinese (zh)
Inventor
吕松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU SIWEIKE PHOTOVOLTAIC NEW MATERIAL Co Ltd
Original Assignee
CHANGZHOU SIWEIKE PHOTOVOLTAIC NEW MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU SIWEIKE PHOTOVOLTAIC NEW MATERIAL Co Ltd filed Critical CHANGZHOU SIWEIKE PHOTOVOLTAIC NEW MATERIAL Co Ltd
Priority to CN201910959657.3A priority Critical patent/CN110643289A/en
Publication of CN110643289A publication Critical patent/CN110643289A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00Presence of polyolefin
    • C09J2423/005Presence of polyolefin in the release coating

Abstract

The invention relates to the technical field of photovoltaic cells, in particular to a high-temperature-resistant flame-retardant adhesive film, which comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 10-20 parts of activated flame-retardant diluent, 0.2-0.8 part of ultraviolet absorber, 0.8-2.4 parts of modified filler, 0.2-0.6 part of antioxidant and 0.2-0.5 part of cross-linking agent; the polyurethane modified phosphorus flame-retardant epoxy resin is adopted, and the reaction type flame-retardant epoxy resin is adopted, so that the flame-retardant effect is better than that of the traditional method in which a flame retardant is added into the epoxy resin, the flame-retardant grade can reach B1 grade, compared with brominated epoxy resin, the addition amount of the flame-retardant epoxy resin is lower, the phosphorus content in the phosphorus-containing epoxy resin can be up to 2%, the flame-retardant performance of the resin can be excellent, and the bromine content in the brominated epoxy resin can be up to 16%.

Description

High-temperature-resistant flame-retardant adhesive film
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to a high-temperature-resistant flame-retardant adhesive film.
Background
The epoxy resin adhesive has the characteristics of high bonding strength, high hardness, good rigidity, acid resistance, alkali resistance, oil resistance and organic solvent resistance and small curing shrinkage, is widely used in electronic products and photovoltaic modules, and is used as a packaging material, the epoxy resin adhesive is required to have flame retardant property, in order to enable the epoxy resin adhesive to have excellent flame retardant property, a flame retardant is usually required to be added into an epoxy resin adhesive film, the flame retardant usually comprises an inorganic flame retardant and a halogen-containing flame retardant, the inorganic flame retardant is added, although the flame retardant effect of the adhesive film can be improved, the cohesiveness of the adhesive film is also reduced, the halogen-containing flame retardant is added, acidic corrosive gas smoke containing hydrogen halide can be generated during combustion, and the requirement of environmental protection is not facilitated.
Disclosure of Invention
The purpose of the invention is: overcomes the defects in the prior art, and provides a high-temperature-resistant flame-retardant adhesive film which has high peel strength and is environment-friendly to use.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 10-20 parts of activated flame-retardant diluent, 0.2-0.8 part of ultraviolet absorber, 0.8-2.4 parts of modified filler, 0.2-0.6 part of antioxidant and 0.2-0.5 part of cross-linking agent.
Further, the polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin.
Further, the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2-3%.
Furthermore, the activated flame-retardant diluent is selected from one or more of HK-66C, JX-28 active flame-retardant epoxy diluent and JX-40 active flame-retardant epoxy diluent.
Furthermore, the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1: 1-3.
Further, the modified filler is montmorillonite or graphite modified by flame-retardant resin.
Further, the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphate antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphate antioxidant is 2: 1.
Further, the ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
Further, the crosslinking agent is one or more of divinylbenzene, diisocyanate and N, N-methylene bisacrylamide.
The technical scheme adopted by the invention has the beneficial effects that:
the polyurethane modified phosphorus flame-retardant epoxy resin is adopted, and the reaction type flame-retardant epoxy resin is adopted, so that the flame-retardant effect is better than that of the traditional method in which a flame retardant is added into the epoxy resin, the flame-retardant grade can reach B1 grade, compared with brominated epoxy resin, the addition amount of the flame-retardant epoxy resin is lower, the phosphorus content in the phosphorus-containing epoxy resin can be up to 2%, the flame-retardant performance of the resin can be excellent, and the bromine content in the brominated epoxy resin can be up to 16%.
The TPX film layer is adopted as the release film, so that the high-temperature resistance of the flame-retardant adhesive film is obviously improved, and the TPX film also has good release performance, very excellent adhesive resistance, high insulativity, acid and alkali resistance, chemical corrosion resistance and stress cracking resistance.
Detailed Description
The invention will now be further illustrated with reference to specific examples.
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 10-20 parts of activated flame-retardant diluent, 0.2-0.8 part of ultraviolet absorber, 0.8-2.4 parts of modified filler, 0.2-0.6 part of antioxidant and 0.2-0.5 part of cross-linking agent. The polyurethane modified phosphorus flame-retardant epoxy resin is adopted, and the flame-retardant effect is better than that of the traditional method in which a flame retardant is added into the epoxy resin because the reaction type flame-retardant epoxy resin is adopted.
As a preferred embodiment, the polyurethane modified flame retardant epoxy resin in this embodiment is a polyurethane modified phosphorus flame retardant epoxy resin, preferably, the phosphorus content in the polyurethane modified phosphorus flame retardant epoxy resin is 2 to 3%, and the phosphorus content in the phosphorus epoxy resin is lower than that in the brominated epoxy resin, and the phosphorus content in the phosphorus epoxy resin can be up to 2% to provide excellent flame retardant performance, while the bromine content in the brominated epoxy resin is up to 16%.
As a preferred embodiment, the activated flame-retardant diluent in the embodiment is one or more of HK-66C, JX-28 activated flame-retardant epoxy diluent and JX-40 activated flame-retardant epoxy diluent, and the activated flame-retardant diluent is matched with the flame-retardant epoxy resin for use, so that the flame-retardant property of the adhesive film is remarkably improved, and the preferred mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent in the embodiment has the mass ratio of 1: 1-3.
As a preferred embodiment, the modified filler in this embodiment is montmorillonite or graphite modified by flame retardant resin, and the filler modified by flame retardant resin is selected, so as to further improve the flame retardant property of the adhesive film.
As a preferred embodiment, the antioxidant in this embodiment is a mixture of phenolic antioxidant and triphenyl phosphite antioxidant, and the molar ratio is 2: 1.
As a preferred embodiment, the ultraviolet light absorber in this embodiment is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
As a preferred embodiment, the crosslinking agent in this embodiment is one or more selected from divinylbenzene, diisocyanate and N, N-methylenebisacrylamide.
Example 1
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 10 parts of activated flame-retardant diluent, 0.2 part of ultraviolet absorber, 0.8 part of modified filler, 0.2 part of antioxidant and 0.2 part of cross-linking agent.
The polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin, and the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2%.
Wherein the activated flame-retardant diluent is HK-66C.
Wherein the modified filler is montmorillonite modified by flame retardant resin.
Wherein the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphite antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphite antioxidant is 2: 1.
The ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1: 1.
Wherein the cross-linking agent is divinylbenzene.
Example 2
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 12 parts of activated flame-retardant diluent, 0.3 part of ultraviolet absorber, 0.9 part of modified filler, 0.3 part of antioxidant and 0.3 part of cross-linking agent.
Wherein the polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin, and the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2.3%.
Wherein the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1: 1.
Wherein the modified filler is montmorillonite modified by flame retardant resin.
Wherein the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphite antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphite antioxidant is 2: 1.
Wherein the ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
Wherein the cross-linking agent is divinylbenzene.
Example 3
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 15 parts of activated flame-retardant diluent, 0.5 part of ultraviolet absorber, 1.6 parts of modified filler, 0.4 part of antioxidant and 0.4 part of cross-linking agent.
Wherein the polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin, and the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2.5 percent.
Wherein the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1:2.
Wherein, the modified filler is graphite modified by flame retardant resin.
Wherein the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphite antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphite antioxidant is 2: 1.
Wherein the ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
Wherein the crosslinking agent is one or more of divinylbenzene, diisocyanate and N, N-methylene bisacrylamide.
Example 4
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 18 parts of activated flame-retardant diluent, 0.6 part of ultraviolet absorber, 2 parts of modified filler, 0.5 part of antioxidant and 0.4 part of cross-linking agent.
Wherein the polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin, and the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2.8 percent.
Wherein the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1: 2.5.
Wherein the modified filler is montmorillonite modified by flame retardant resin.
Wherein the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphite antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphite antioxidant is 2: 1.
Wherein the ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
Wherein the cross-linking agent is a mixture of divinylbenzene and N, N-methylene bisacrylamide, and the mass ratio of the mixture to the N, N-methylene bisacrylamide is 1:2.
Example 5
The high-temperature-resistant flame-retardant adhesive film comprises an upper TPX film layer, a modified epoxy resin adhesive film layer and a lower TPX film layer, wherein the epoxy resin adhesive film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 20 parts of activated flame-retardant diluent, 0.8 part of ultraviolet absorber, 2.4 parts of modified filler, 0.6 part of antioxidant and 0.5 part of cross-linking agent.
The polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin, and the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is percent by weight.
Wherein the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1: 3.
Wherein, the modified filler is graphite modified by flame retardant resin.
Wherein the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphite antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphite antioxidant is 2: 1.
Wherein the ultraviolet absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 2: 1.
Wherein the cross-linking agent is N, N-methylene bisacrylamide.
The flame retardant rating of examples 1-5 was tested to reach B1 rating.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (9)

1. A high temperature resistant flame retardant glue film is characterized in that: the composite film comprises an upper TPX film layer, a modified epoxy resin film layer and a lower TPX film layer, wherein the epoxy resin film layer comprises the following components in parts by mass: 100 parts of polyurethane modified flame-retardant epoxy resin, 10-20 parts of activated flame-retardant diluent, 0.2-0.8 part of ultraviolet absorber, 0.8-2.4 parts of modified filler, 0.2-0.6 part of antioxidant and 0.2-0.5 part of cross-linking agent.
2. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the polyurethane modified flame-retardant epoxy resin is polyurethane modified phosphorus flame-retardant epoxy resin.
3. The high temperature resistant flame retardant adhesive film according to claim 2, wherein: the phosphorus content in the polyurethane modified phosphorus flame-retardant epoxy resin is 2-3%.
4. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the activated flame-retardant diluent is one or more of HK-66C, JX-28 active flame-retardant epoxy diluent and JX-40 active flame-retardant epoxy diluent.
5. The high temperature resistant flame retardant adhesive film according to claim 4, wherein: the activated flame-retardant diluent is a mixture of HK-66C and JX-28 activated flame-retardant epoxy diluent, and the mass ratio of the activated flame-retardant diluent to the activated flame-retardant epoxy diluent is 1: 1-3.
6. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the modified filler is montmorillonite or graphite modified by flame-retardant resin.
7. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the antioxidant is a mixture of a phenol antioxidant and a triphenyl phosphate antioxidant, and the molar ratio of the phenol antioxidant to the triphenyl phosphate antioxidant is 2: 1.
8. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the ultraviolet light absorber is a mixture of phenyl ortho-hydroxybenzoate and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and the mass ratio of the phenyl ortho-hydroxybenzoate to the 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole is 1-2: 1.
9. The high temperature resistant flame retardant adhesive film according to claim 1, wherein: the cross-linking agent is one or more of divinylbenzene, diisocyanate and N, N-methylene bisacrylamide.
CN201910959657.3A 2019-10-10 2019-10-10 High-temperature-resistant flame-retardant adhesive film Pending CN110643289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910959657.3A CN110643289A (en) 2019-10-10 2019-10-10 High-temperature-resistant flame-retardant adhesive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910959657.3A CN110643289A (en) 2019-10-10 2019-10-10 High-temperature-resistant flame-retardant adhesive film

Publications (1)

Publication Number Publication Date
CN110643289A true CN110643289A (en) 2020-01-03

Family

ID=68993811

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910959657.3A Pending CN110643289A (en) 2019-10-10 2019-10-10 High-temperature-resistant flame-retardant adhesive film

Country Status (1)

Country Link
CN (1) CN110643289A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112677597A (en) * 2021-01-21 2021-04-20 宝燕工业科技(南通)有限公司 Flame-retardant high-temperature-resistant composite release film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102369229A (en) * 2009-04-01 2012-03-07 新日铁化学株式会社 Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102369229A (en) * 2009-04-01 2012-03-07 新日铁化学株式会社 Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
江蓉: "新型含磷阻燃环氧树脂的研制", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112677597A (en) * 2021-01-21 2021-04-20 宝燕工业科技(南通)有限公司 Flame-retardant high-temperature-resistant composite release film

Similar Documents

Publication Publication Date Title
US5364893A (en) Composition of polyepoxide and phosphorous-containing polyepoxide
FI107612B (en) Epoxy resin mixtures
CN102127289B (en) Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same
KR101843630B1 (en) Preparation method of dopo etherified phenol composition, flame retardant compounds and uses
CZ224795A3 (en) Mixtures of epoxy resins
TW297034B (en)
CZ70497A3 (en) Mixtures of expoxy resins for prepregs and sandwiches
WO2019072016A1 (en) Photovoltaic assembly bus-bar insulating tape, bus-bar containing same, and photovoltaic assembly
CN110760244A (en) Epoxy steel structure fireproof coating
CN100528949C (en) Low heat release and low smoke reinforcing fiber/epoxy composites
CN101508761A (en) Process for preparing phenolic resin containing nitrogen
CN110982465B (en) Efficient halogen-free flame-retardant epoxy adhesive and preparation method thereof
JP2014509334A (en) High heat resistant composition
US20110065838A1 (en) Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
CN111040670A (en) Adhesive, preparation method thereof and PET (polyethylene terephthalate) insulating adhesive film containing adhesive
CN110643289A (en) High-temperature-resistant flame-retardant adhesive film
AU2013298680B2 (en) High heat resistant composition
CN109438918A (en) A kind of fibre reinforced composites and preparation method thereof
EP0295496B1 (en) Method for protecting heat sensitive substrates from fire and excessive heat
CN111777912B (en) Flame-retardant and flexible epoxy resin composition and preparation method thereof
CN108485193B (en) Flame-retardant epoxy resin composition for electronic packaging material and preparation method thereof
CN109749165A (en) A kind of rubber for cable
CN114058278A (en) High-temperature-resistant insulating adhesive film and preparation method and application thereof
CN108484881B (en) Halogen-free flame-retardant epoxy resin and synthetic method thereof
CN115386067B (en) Epoxy resin for solvent-free thick coating type fireproof coating, preparation method and application thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200103