CN110682004A - Laser lettering process for epoxy resin high-frequency cable end - Google Patents
Laser lettering process for epoxy resin high-frequency cable end Download PDFInfo
- Publication number
- CN110682004A CN110682004A CN201910945660.XA CN201910945660A CN110682004A CN 110682004 A CN110682004 A CN 110682004A CN 201910945660 A CN201910945660 A CN 201910945660A CN 110682004 A CN110682004 A CN 110682004A
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- China
- Prior art keywords
- cable
- epoxy resin
- resin high
- cable end
- frequency
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Abstract
The invention provides a laser lettering process for an epoxy resin high-frequency cable end; and (3) cleaning the operation table and the cable after editing the identification by using a computer, clamping the cable on the operation table, setting laser parameters to carve characters on the cable, removing burrs on the cable after carving characters, and warehousing. By the process, the cable is prevented from moving during processing, the epoxy resin is controlled to be melted in a large area, the phenomena of local atomization, vaporization, smoke generation and the like of the epoxy resin are reduced, the phenomena of fuzzy handwriting and double images are avoided, and the qualified rate is improved.
Description
Technical Field
The invention relates to a laser lettering process for an epoxy resin high-frequency cable end.
Background
The cable head is made of epoxy resin; the softening point is 58-93 deg.C, smoke is generated at 200 deg.C, carbonization is started at 300 deg.C, and the material is completely melted into ash at more than 400 deg.C. The temperature of the laser lettering light spot is very high, so that lettering local epoxy resin can be melted instantly, the following problems are often caused in the lettering process, the epoxy resin is damaged, the handwriting is fuzzy, and the qualification rate is not high:
1. because the size of the processing table is small, and the length of the cable is about 5m, the cable is easy to move and not easy to fix, the lettering position is deviated, and double images occur;
2. because the epoxy resin is rough and uneven, fuzzy handwriting and double images occur;
3. parameters are not easy to control, and the epoxy resin is easy to melt in a large area, so that the quality of the head is unqualified; (ii) a
5. Parameters are not optimized, so that phenomena of local atomization, vaporization, smoking and the like of the epoxy resin seriously cause fuzzy handwriting.
Disclosure of Invention
In order to solve the technical problem, the invention provides a laser lettering process for an end of an epoxy resin high-frequency cable.
The invention is realized by the following technical scheme.
The invention provides a laser lettering process for an epoxy resin high-frequency cable end; the method comprises the following steps:
s1, editing the mark by using a computer;
s2, cleaning an operation table and a cable;
s3, clamping the cable on an operation table;
s4, setting laser parameters to carve characters on the cable;
s5, removing burrs on the cable;
and S6, warehousing.
The specific steps of S2 are as follows:
s21, cleaning the operation table top by using industrial scouring pad;
s22, polishing the epoxy resin surface of the cable by using a No. 300 water sand leather;
and S23, wiping the surfaces of the operating platform and the cable with cleaning liquid obtained by absorbent cotton, and naturally drying.
The clamping step in the S3 is as follows: and placing the cable head between the movable jaw and the fixed jaw of the vice on the operating table, adjusting the screw rod of the vice to lock the cable, and then fixing the vice by using the baffle.
The laser parameters in the step S4 are as follows:
processing number: 5-7;
speed mm/s: 285-300;
power%: 55-60 parts;
frequency KHZ: 18 to 20.
And in the S4, after the computer parameters are set, a sample piece is used for trial engraving, and the cable is processed after the handwriting is clear and beautiful.
The specific steps of S5 are as follows:
s51, polishing the marked mark by using a 300# metallographic abrasive skin;
and S52, wiping the lettering marks with cleaning liquid of absorbent cotton, and naturally drying.
The cleaning solution is absolute ethyl alcohol.
The invention has the beneficial effects that: by the process, the cable is prevented from moving during processing, the epoxy resin is controlled to be melted in a large area, the phenomena of local atomization, vaporization, smoke generation and the like of the epoxy resin are reduced, the phenomena of fuzzy handwriting and double images are avoided, and the qualified rate is improved.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view of a cable clamp configuration of the present invention;
Detailed Description
The technical solution of the present invention is further described below, but the scope of the claimed invention is not limited to the described.
A laser lettering process for an epoxy resin high-frequency cable end; the method comprises the following steps:
s1, editing the mark by using a computer;
s2, cleaning an operation table and a cable;
s3, clamping the cable on an operation table;
s4, setting laser parameters to carve characters on the cable;
s5, removing burrs on the cable;
and S6, warehousing.
The specific steps of S2 are as follows:
s21, cleaning the operation table top by using industrial scouring pad;
s22, polishing the epoxy resin surface of the cable by using a No. 300 water sand leather;
and S23, wiping the surfaces of the operating platform and the cable with cleaning liquid obtained by absorbent cotton, and naturally drying.
The clamping step in the S3 is as follows: and placing the cable head between the movable jaw and the fixed jaw of the vice on the operating table, adjusting the screw rod of the vice to lock the cable, and then fixing the vice by using the baffle.
The laser parameters in the step S4 are as follows:
the number of processing and the number of lettering passes: 5-7;
speed mm/s: 285-300;
power%: 55-60 parts;
frequency KHZ: 18 to 20.
And in the S4, after the computer parameters are set, a sample piece is used for trial engraving, and the cable is processed after the handwriting is clear and beautiful.
The specific steps of S5 are as follows:
s51, polishing the marked mark by using a 300# metallographic abrasive skin;
and S52, wiping the lettering marks with cleaning liquid of absorbent cotton, and naturally drying.
The cleaning solution is absolute ethyl alcohol.
Example (b):
(1) editing: and (3) carrying out identification editing by using a computer, and meeting the requirements of technical conditions and drawings:
(2) cleaning of
① cleaning the operation table with clean industrial scouring pad;
② grinding the surface of epoxy resin with No. 300 water sand leather;
③ wiping with clean absorbent cotton dipped with anhydrous ethanol, epoxy resin, tool and fixture, and air drying;
(3) clamping: according to the clamping of fig. 2, the cable is guaranteed to be fixed and not to deviate:
① cable head is arranged between the movable jaw and the fixed jaw of the bench vice;
② the cable head is fixed by adjusting the screw of the bench vice;
③ the baffle is placed behind the fixed jaw of the bench vice to reinforce the bench vice, the baffle is made of 1Cr18Ni10Ti, and after use, the baffle is sealed by oiled paper.
(4) Setting parameters
①, the processing number (number of lettering passes) is 5-7;
②, the speed is mm/s, 285-300;
③ power% is 55-60;
④ KHZ frequency of 18-20
(5) Previewing: the identification content, the identification size and the identification position meet the technical conditions;
(6) trial engraving: firstly, a sample piece is used for trial engraving, and the handwriting is clear and attractive;
(7) lettering: formally engraving characters on the product;
(8) deburring:
① grinding 300# metallographic sand to form lettering marks;
② wiping the lettering mark with clean absorbent cotton dipped with anhydrous alcohol, and air drying.
Note that: in the laser lettering process, necessary protective articles must be worn:
wearing laser protective glasses;
the eye does not look directly at the laser beam;
wear the dust mask.
(9) Warehousing: independently packaging with cable paper, and warehousing.
The method comprises the following steps: the phenomena of vaporization, atomization and smoking are greatly reduced, the writing is clear, no double image is generated, the appearance is attractive, and the percent of pass reaches 90%.
Claims (7)
1. A laser lettering process for an epoxy resin high-frequency cable end is characterized by comprising the following steps: the method comprises the following steps:
s1, editing the mark by using a computer;
s2, cleaning an operation table and a cable;
s3, clamping the cable on an operation table;
s4, setting laser parameters to carve characters on the cable;
s5, removing burrs on the cable;
and S6, warehousing.
2. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 1, wherein: the specific steps of S2 are as follows:
s21, cleaning the operation table top by using industrial scouring pad;
s22, polishing the epoxy resin surface of the cable by using a No. 300 water sand leather;
and S23, wiping the surfaces of the operating platform and the cable with cleaning liquid obtained by absorbent cotton, and naturally drying.
3. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 1, wherein: the clamping step in the S3 is as follows: and placing the cable head between the movable jaw and the fixed jaw of the vice on the operating table, adjusting the screw rod of the vice to lock the cable, and then fixing the vice by using the baffle.
4. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 1, wherein: the laser parameters in the step S4 are as follows:
number of processes (number of passes of lettering): 5-7;
speed mm/s: 285-300;
power%: 55-60 parts;
frequency KHZ: 18 to 20.
5. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 1, wherein: and in the S4, after the computer parameters are set, a sample piece is used for trial engraving, and the cable is processed after the handwriting is clear and beautiful.
6. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 1, wherein: the specific steps of S5 are as follows:
s51, polishing the marked mark by using a 300# metallographic abrasive skin;
and S52, wiping the lettering marks with cleaning liquid of absorbent cotton, and naturally drying.
7. The epoxy resin high-frequency cable end laser lettering process as claimed in claim 2 or 6, wherein: the cleaning solution is absolute ethyl alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910945660.XA CN110682004A (en) | 2019-09-30 | 2019-09-30 | Laser lettering process for epoxy resin high-frequency cable end |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910945660.XA CN110682004A (en) | 2019-09-30 | 2019-09-30 | Laser lettering process for epoxy resin high-frequency cable end |
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| Publication Number | Publication Date |
|---|---|
| CN110682004A true CN110682004A (en) | 2020-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910945660.XA Pending CN110682004A (en) | 2019-09-30 | 2019-09-30 | Laser lettering process for epoxy resin high-frequency cable end |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975212A (en) * | 2020-08-25 | 2020-11-24 | 贵州航天电子科技有限公司 | Cavity laser lettering machining tool and machining method |
| CN114054968A (en) * | 2021-11-16 | 2022-02-18 | 贵州航天电子科技有限公司 | Lettering and paint embedding method for thin plate disc-shaped hard aluminum bottom plate part |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101007455A (en) * | 2006-01-24 | 2007-08-01 | 上海市激光技术研究所 | Laser method and device for carving print wheel |
| US20140139608A1 (en) * | 2006-07-10 | 2014-05-22 | Lazare Kaplan International, Inc. | System and method for gemstone microinscription |
| CN107731426A (en) * | 2017-12-05 | 2018-02-23 | 高峰 | A kind of novel cable printing device |
| CN108500470A (en) * | 2018-04-03 | 2018-09-07 | 温州大学瓯江学院 | One kind being based on CO2The silver-colored layout piece manufacture craft of laser engraving machine |
| CN110102904A (en) * | 2019-04-03 | 2019-08-09 | 大族激光科技产业集团股份有限公司 | The laser marking method and system of watchcase character |
-
2019
- 2019-09-30 CN CN201910945660.XA patent/CN110682004A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101007455A (en) * | 2006-01-24 | 2007-08-01 | 上海市激光技术研究所 | Laser method and device for carving print wheel |
| US20140139608A1 (en) * | 2006-07-10 | 2014-05-22 | Lazare Kaplan International, Inc. | System and method for gemstone microinscription |
| CN107731426A (en) * | 2017-12-05 | 2018-02-23 | 高峰 | A kind of novel cable printing device |
| CN108500470A (en) * | 2018-04-03 | 2018-09-07 | 温州大学瓯江学院 | One kind being based on CO2The silver-colored layout piece manufacture craft of laser engraving machine |
| CN110102904A (en) * | 2019-04-03 | 2019-08-09 | 大族激光科技产业集团股份有限公司 | The laser marking method and system of watchcase character |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111975212A (en) * | 2020-08-25 | 2020-11-24 | 贵州航天电子科技有限公司 | Cavity laser lettering machining tool and machining method |
| CN114054968A (en) * | 2021-11-16 | 2022-02-18 | 贵州航天电子科技有限公司 | Lettering and paint embedding method for thin plate disc-shaped hard aluminum bottom plate part |
| CN114054968B (en) * | 2021-11-16 | 2023-11-14 | 贵州航天电子科技有限公司 | Method for engraving and paint embedding of thin-plate disc-shaped hard aluminum bottom plate part |
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Application publication date: 20200114 |
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