CN110678766B - Detection method of induction module, touch chip, touch screen and assembly method of touch screen - Google Patents
Detection method of induction module, touch chip, touch screen and assembly method of touch screen Download PDFInfo
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Abstract
A detection method of an induction module, a touch chip, a touch screen and an assembly method thereof are provided, wherein the detection method of the induction module comprises the steps of respectively carrying out suspension sampling on a plurality of mutually disjoint induction channels contained in the induction module to obtain first sampling data (301) of each induction channel; taking two induction channels as a group, and respectively carrying out mutual capacitance detection (302) on each group of induction channels, wherein the mutual capacitance detection comprises that one induction channel in each group of induction channels is coded and the other induction channel is sampled to obtain second sampling data of the other induction channel; wherein any one induction channel is at least contained in one group of induction channels; and for each induction channel with the second sampling data, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel. The induction module is detected based on the mutual capacitance detection principle, so that the detection cost is low, and the detection is simple and feasible.
Description
Technical Field
The application relates to the technical field of testing, in particular to a detection method of an induction module, a touch chip, a touch screen and an assembling method of the touch chip.
Background
The double-layer structure touch screen comprises two single-side modules which are pressed together; a plurality of induction channels which are arranged in sequence and do not intersect with each other are formed on each single-face module, the induction channels on each single-face module can be selectively used as RX channels or TX channels, and the induction channels on the two single-face modules are perpendicular to each other. Referring to fig. 1, the touch screen with a double-layer structure includes two single-sided modules; one single-side module comprises a single substrate 11 and an RX channel 12 engraved on the single substrate 11, the other single-side module comprises a single substrate 21 and a TX channel 22 engraved on the single substrate 21, and the two single-side modules are bonded through OCA optical cement 30 (the TX channel after being pressed is perpendicular to the RX channel), and then connected to a touch chip to form a double-layer touch screen; wherein, the monomer substrate is a monomer film material or a monomer glass cover plate.
The touch screen is detected before leaving the factory, and the touch screen can leave the factory only after the detection is qualified, for example, each induction channel has no open circuit phenomenon. For a touch screen with a double-layer structure, the following method is generally adopted: after two single-side module structures are pressed together, a mutual capacitance coding mode is used for detecting (an induction channel in one single-side module serves as a transmitting channel TX, and an induction channel in the other single-side module serves as a receiving channel RX), namely mutual capacitance matrix data is received by coding TX and sampling the RX channel, and the size of the mutual capacitance matrix data is judged, so that whether a TX channel or an RX channel is open-circuited is judged; and secondly, detecting each single-sided module by using a self-capacitance coding mode, namely configuring an iron plate equivalent to a system ground, and changing the size of a self-capacitance by changing the distance between the sensing channel and the system ground so as to quantify the self-capacitance difference to judge whether the sensing channel is open-circuited.
However, the inventors found that the prior art has at least the following problems: for the first mode, if the detection result is unqualified (at least one induction channel has an open circuit phenomenon), the whole double-layer structure touch screen (two single-side modules) can be reported to be abandoned, and the loss is high; for the second mode, an iron plate equivalent to a system ground needs to be additionally configured to assist in testing, the detection cost is high, the distance between the iron plate and the induction channel needs to be adjusted in the detection process, and the detection process is complicated.
Disclosure of Invention
Some embodiments of the present application provide a detection method for an induction module, a touch chip, a touch screen and an assembly method thereof, which are used for detecting the induction module based on a mutual capacitance detection principle, and have low detection cost and simple and easy operation; meanwhile, the method can be applied to detection of the single induction module in the double-layer structure touch screen, so that the single induction module with an open circuit phenomenon is removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
The embodiment of the application provides a detection method of a sensing module, which comprises the following steps: respectively carrying out suspended sampling on a plurality of mutually non-intersected induction channels contained in the induction module to obtain first sampling data of each induction channel; use two induction channel as a set of to carry out mutual capacity detection respectively to each group induction channel, mutual capacity detects and includes: coding one induction channel in each group of induction channels, and sampling the other induction channel to obtain second sampling data of the other induction channel, wherein any induction channel is at least contained in one group of induction channels; and for each induction channel with the second sampling data, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel.
The embodiment of the application also provides an assembling method of the double-layer touch screen, which comprises the following steps: providing a first single-side module for assembling a double-layer touch screen, and connecting the first single-side module to a touch chip; the touch chip detects the first single-sided module according to the detection method and obtains a detection result of whether the first single-sided module is open or not; if the detection result of the first single-sided module is that the open circuit phenomenon does not exist, providing a second single-sided module for assembling the double-layer structure touch screen, and connecting the second single-sided module to the touch chip; the touch chip detects the second single-sided module according to the detection method and obtains a detection result of whether the second single-sided module is open or not; and if the detection result of the second single-sided module is that the open circuit phenomenon does not exist, pressing the first single-sided module and the second single-sided module together to form the double-layer structure touch screen.
The embodiment of the application also provides a touch chip, wherein the touch chip is connected with the induction module, and the induction module comprises a plurality of induction channels which are sequentially arranged and do not intersect with each other; the touch chip includes: the device comprises a control unit, a coding unit, a sampling unit and an analysis unit; the control unit is used for respectively carrying out suspended sampling on a plurality of mutually disjoint induction channels contained in the induction module to obtain first sampling data of each induction channel; the control unit is used for controlling the coding unit to code one induction channel in each group of induction channels and controlling the sampling unit to sample the other induction channel to obtain second sampling data of the other induction channel, wherein any induction channel is at least contained in one group of induction channels; the analysis unit is used for obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel for each induction channel with the second sampling data.
The embodiment of the present application further provides a double-layer structure touch screen including: the touch control chip and the two single-sided modules are respectively connected to the touch control chip and pressed together.
Compared with the prior art, the method and the device have the advantages that firstly, all induction channels in the induction module are controlled to be in a suspended state, and suspended sampling is carried out on each induction channel to obtain first sampling data of each induction channel; then, two induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, so that second sampling data of each induction channel with the second sampling data are obtained; and finally, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the difference data of the second sampling data and the first sampling data of each induction channel. Namely, the induction module is detected based on the mutual capacitance detection principle, so that the detection cost is low, and the detection is simple and feasible; meanwhile, the method can be applied to detection of the single induction module in the double-layer structure touch screen, so that the single induction module with an open circuit phenomenon is removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
In addition, two induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, which specifically comprises the following steps: two adjacent induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels. In the embodiment, two adjacent induction channels are divided into a group, the distance between the adjacent induction channels is short, the signal-to-noise ratio is high, and the detection result is more accurate.
In addition, two adjacent induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, which specifically comprises the following steps: taking the ith induction channel and the (i + 1) th induction channel as a group, and respectively carrying out mutual capacitance detection on each group of induction channels; wherein, each induction channel is numbered in sequence according to the arrangement sequence, and i is 1, 2, 3, … …, n-1, n is the total number of induction channels. This embodiment provides an adjacent induction channel as a set of implementation, except arranging the induction channel at the head and the tail, each induction channel that is located in the middle all detects twice, and it is higher to detect the reliability.
In addition, any one induction channel is only contained in one group of induction channels; or, only one sensing channel in all the sensing channels is contained in two groups of sensing channels, and the rest sensing channels are contained in only one group of sensing channels. This embodiment provides another kind of adjacent induction channel as a set of implementation, and each group's induction channel only needs to carry out the single and detects comparatively simply and speed is very fast.
In addition, the mutual capacitance detection specifically comprises the steps of coding the previous induction channel in each group of induction channels and sampling the next induction channel to obtain second sampling data of the next induction channel; or, the next sensing channel in each group of sensing channels is coded, and the previous sensing channel is sampled to obtain second sampling data of the previous sensing channel. The embodiment provides a specific coding and sampling mode, and the second sampling data of each sensing channel except the first sensing channel can be obtained at the moment, so that the detection result is more accurate.
In addition, to each induction channel that has the second sampled data, according to the second sampled data and the first sampled data of each induction channel, obtain the detection result whether response module has the open circuit phenomenon, specifically include: for each induction channel with the second sampling data, obtaining a second characteristic value of the induction channel according to the second sampling data of the induction channel, and obtaining a first characteristic value of the induction channel according to the first sampling data of the induction channel; calculating a difference value between a first characteristic value of the induction channel and a second characteristic value of the induction channel, and taking the difference value as a detection value corresponding to the induction channel; judging whether the detection value corresponding to at least one induction channel is smaller than a preset threshold value corresponding to the group of the induction channels or not in the detection values corresponding to the induction channels; if yes, judging that the detection result of the induction module is that an open circuit phenomenon exists; if not, the detection result of the induction module is judged to be that the open circuit phenomenon does not exist. The embodiment provides a specific method for judging whether an open circuit phenomenon exists in a sensing module.
In addition, the method is applied to the touch chip, and the induction module is connected to the touch chip. In this embodiment, utilize touch chip to accomplish the detection, convenient and fast more.
In addition, the induction module is a single-side module in a double-layer touch screen. The embodiment provides a specific scene applied by the detection method; the single induction module with the open circuit phenomenon can be removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
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One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic diagram of a two-layer structure touch screen according to the prior art;
FIG. 2 is a flowchart illustrating a method for detecting a sensing module according to a first embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a sensing module connected to a touch chip according to a first embodiment of the present disclosure;
FIG. 4 is a flowchart illustrating a method for detecting a sensing module according to a second embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating a sensing module connected to a touch chip according to a second embodiment of the present disclosure, wherein the sensing module includes an ith sensing channel and an (i + 1) th sensing channel as a group;
fig. 6 is a schematic diagram illustrating a sensing module connected to a touch chip according to a second embodiment of the present disclosure, wherein only one sensing channel of the sensing module is included in two sensing channels, and the rest sensing channels are included in only one sensing channel;
fig. 7 is a schematic diagram illustrating a sensing module connected to a touch chip according to a second embodiment of the present disclosure, wherein any one sensing channel of the sensing module is only included in one sensing channel group;
FIG. 8 is a flowchart illustrating a method for detecting a sensing module according to a third embodiment of the present disclosure;
FIG. 9 is a detailed flowchart of an assembling method of a dual-layer touch screen according to a fourth embodiment of the present application;
FIG. 10 is a block diagram illustrating a touch chip according to a fifth embodiment of the present application;
fig. 11 is a block diagram illustrating a touch chip according to a seventh embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, some embodiments of the present application will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The first embodiment of the present application relates to a detection method of a sensing module, which is applied to a touch chip, wherein the touch chip is connected to the sensing module to detect whether an open Circuit phenomenon exists in the sensing module, and a Flexible Printed Circuit (FPC) extending from the sensing module and the touch chip is pressed together. However, the sensing module can be detected by a special testing tool, and the sensing module is connected to the testing tool. It should be noted that, because the touch screen can be formed after the sensing module and the touch chip are assembled together, the touch chip is connected to the sensing module and the sensing module is detected by the touch chip, when the detection result of the sensing module is that there is no open circuit, it indicates that the touch screen (finished product) is qualified, and the touch screen is connected to the touch chip after the detection is not successful, which is very convenient and fast.
In this embodiment, the induction module includes many induction channels that arrange in proper order and each other non-intersect, and the induction module can be the single face module in the bilayer structure touch-sensitive screen, perhaps is the induction module in the monolayer structure touch-sensitive screen. In the present embodiment, the structure of a touch screen with a double-layer structure, such as a touch screen with a double-layer Indium Tin Oxide (ITO) circuit, can refer to fig. 1.
A specific flow of the detection method of the sensing module of this embodiment is shown in fig. 2, wherein, referring to fig. 3, taking the sensing module as a single-sided module 41 (an unpressurized single-sided module) in a touch screen with a double-layer structure, and the single-sided module 41 has n TX channels as an example, the single-sided module 41 is connected to a touch chip 42, and the n TX channels of the single-sided module 41 are pressed together with a flexible circuit board FPC43 extending from the touch chip 42; the plurality of sensing channels in the sensing module are n TX channels of the single-sided module 41. It should be noted that, in the embodiment and the following embodiments, the sensing module is taken as a single-side module in the touch screen with a double-layer structure for illustration.
Specifically, the touch chip generally comprises a coding unit and a sampling unit, and the touch chip respectively performs suspended sampling on each TX channel through the sampling unit to obtain first sampling data of each TX channel; the suspended sampling specifically includes controlling a sampled TX channel to be connected to a sampling unit only, and acquiring first sampling data of the TX channel through the sampling unit. When one TX channel is subjected to suspended sampling, other TX channels are in a suspended state so as to avoid mutual interference; the TX channel in a suspended state means that the TX channel is not connected with the coding unit and the sampling unit. However, the floating sampling of the first sampling data of the multiple TX channels may be performed in parallel, or may be performed sequentially, or performed in groups sequentially, which may be determined according to the configuration of hardware (for example, the number of ADCs) or software parameters in the system.
And 102, taking the two induction channels as a group, and respectively carrying out mutual capacitance detection on each group of induction channels.
Specifically, one of any two TX channels of the n TX channels is used as a coding channel, and the other TX channel is used as a sampling channel to obtain second sampling data of the other TX channel. And sequentially carrying out mutual capacitance detection on each group of channels to obtain corresponding second sampling data. That is, any two sensing channels are taken as a group, and any one TX channel is at least included in one group of sensing channels; and then, performing mutual capacitance detection on each group of induction channels respectively, specifically, connecting two TX channels in one group of induction channels inside the touch chip, controlling to code one channel in the group of induction channels, and sampling the other channel, so as to obtain second sampling data of the other channel. Each group of induction channels carries out mutual capacitance detection in sequence, namely, only one group of induction channels carries out mutual capacitance detection at the same moment, and other groups of induction channels are all in a suspended state when one group of induction channels carry out mutual capacitance detection so as to avoid mutual interference.
It should be noted that fig. 2 only schematically shows the execution sequence of step 101 and step 102, but is not limited to this, and step 102 may be executed first and then step 101 is executed.
And 103, for each induction channel with the second sampling data, obtaining a detection result of whether the induction module has an open circuit phenomenon according to the second sampling data and the first sampling data of each induction channel.
Specifically, for the TX channel having the second sampling data, the detection result of whether the single-side module (the sense module) has the open circuit phenomenon can be obtained according to the difference data between the second sampling data and the first sampling data of the TX channel.
Compared with the prior art, the method includes the steps that firstly, all induction channels in the induction module are controlled to be in a suspended state, and suspended sampling is conducted on the induction channels respectively to obtain first sampling data of the induction channels; then, two induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, so that second sampling data of each induction channel with the second sampling data are obtained; and finally, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the difference data of the second sampling data and the first sampling data of each induction channel. Namely, the induction module is detected based on the mutual capacitance detection principle, so that the detection cost is low, and the detection is simple and feasible; meanwhile, the method can be applied to detection of the single induction module in the double-layer structure touch screen, so that the single induction module with an open circuit phenomenon is removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
The second embodiment of the present application relates to a method for detecting a sensing module, which is a refinement based on the first embodiment, and mainly comprises the following steps: two adjacent sensing channels are used as a group.
The specific flow of the detection method of the sensing module in this embodiment is shown in fig. 4.
Step 201 and step 203 are substantially the same as step 101 and step 103, and are not described herein again, with the main difference that step 202 specifically includes:
In the embodiment, two adjacent sensing channels are taken as a group, the distance between the adjacent sensing channels is short, and the signal-to-noise ratio is high, so that the more accurate the data obtained by sampling is, and the more accurate the detection result is.
In this embodiment, two adjacent sensing channels are taken as a group, which includes two schemes, specifically as follows:
the first scheme is as follows: taking the ith induction channel and the (i + 1) th induction channel as a group, and respectively carrying out mutual capacitance detection on each group of induction channels; each induction channel is sequentially numbered according to the physical position arrangement sequence, wherein i is 1, 2, 3, … … and n-1, and n is the total number of the induction channels; taking the ith induction channel and the (i + 1) th induction channel as a group, so as to obtain n-1 groups of induction channels; wherein, no matter n is an odd number or an even number, the ith sensing channel and the (i + 1) th sensing channel can be grouped according to the above mode. Referring to fig. 5, taking the sensing module as a single-sided module with 9 TX channels as an example, eight sets of sensing channels can be obtained, the first set of sensing channels: TX1, TX2, second set of sense channels: TX2, TX3, third set of inductive channels: TX3, TX4 and the like, eight groups of induction channels can be obtained; during mutual capacitance detection, except for the head induction channel and the tail induction channel, the middle induction channels are detected twice, and the detection reliability is higher.
Preferably, when the mutual capacitance detection is respectively carried out on each group of induction channels, the former induction channel in each group of induction channels is coded, and the latter induction channel is sampled to obtain second sampling data of the latter induction channel; or, the next sensing channel in each group of sensing channels is coded, and the previous sensing channel is sampled to obtain second sampling data of the previous sensing channel. Taking the single-sided module of fig. 5 as an example, the coding sampling method is as follows: coding TX1, sampling TX2, coding TX2, sampling TX3, coding TX3, sampling TX4, and the like, so that second sampling data of channels TX2 to TX9 can be obtained; alternatively, TX9 is coded and sampled at TX8, TX8 is coded and sampled at TX7, TX7 is coded and sampled at TX6, and so on, so that second sampled data of channels TX8 to TX1 can be obtained. The coding sampling is performed according to the above manner, and the second sampling data of 8 TX channels of the 9 TX channels can be obtained, that is, the second sampling data of n-1 sensing channels of the n sensing channels can be obtained, so that the detection result obtained by analyzing in step 303 is more reliable.
Scheme II: when the total number n of the sensing channels included in the sensing module is an odd number, only one sensing channel of all the sensing channels is included in two sets of sensing channels, and the other sensing channels are included in only one set of sensing channels, so as to obtain (n-1)/2+1 sets of sensing channels, please refer to fig. 6, taking the sensing module as a single-sided module having 9 TX channels as an example, then the 9 TX channels in the single-sided module can be divided into five sets, the first set of sensing channels: TX1, TX2, second set of sense channels: TX3, TX4, third set of inductive channels: TX5, TX6, fourth set of sense channels: TX7, TX8, fifth set of sense channels: TX8, TX 9; when the total number n of the induction channels included by the induction module is an even number, any induction channel is only contained in one group of induction channels, and n/2 groups of induction channels can be obtained; referring to fig. 7, taking the sensing module as a single-sided module having 8 TX channels as an example, the 8 TX channels in the single-sided module can be divided into four groups, the first group of sensing channels: TX1, TX2, second set of sense channels: TX3, TX4, third set of inductive channels: TX5, TX6, fourth set of sense channels: TX7, TX 8; during mutual capacitance detection, when the induction module comprises odd induction channels, except the last but one induction channel, other induction channels only need to be detected once; when the induction module comprises an even number of induction channels, each group of induction channels only need to be detected once, and the detection is simpler and faster.
It should be noted that, in this embodiment, two adjacent sensing channels are taken as a group, but not limited to this, when the gap between adjacent channels is small enough and the signal-to-noise ratio is high enough, two non-adjacent sensing channels may also be taken as a group, taking the single-sided module in fig. 7 as an example, the channels TX1 and TX3 are divided into a group, the channels TX5 and TX7 are divided into a group, the channels TX2 and TX4 are divided into a group, and the channels TX6 and TX8 are divided into a group, or the channels TX1 and TX2 are divided into a group, the channels TX1 and TX3 are divided into a group, the channels TX2 and TX4 are divided into a group, the channels TX5 and TX7 are divided into a group, and the channels TX6 and TX8 are divided into a group.
The third embodiment of the present application relates to a method for detecting a sensing module, which is a refinement based on the second embodiment, and the main refinement is as follows: a specific method for judging whether an open circuit exists in a sensing module is provided.
The specific flow of the detection method of the sensing module in this embodiment is shown in fig. 8.
Step 301 and step 302 are substantially the same as step 201 and step 202, and are not described herein again, but mainly differ in that:
Specifically, the sensing module includes n sensing channels, and when the ith sensing channel and the (i + 1) th sensing channel are taken as a group according to the first scheme in the second embodiment, n-1 groups of sensing channels can be obtained, and when mutual capacitance detection is performed, the former sensing channel in each group of sensing channels is coded, and the latter sensing channel is sampled, and second sampling data of the latter sensing channel is obtained, for example, second sampling data of n-1 sensing channels except for the 1 st sensing channel can be obtained.
Step 303, for each sensing channel having the second sampling data, obtaining a detection result of whether the sensing module has an open circuit phenomenon according to the second sampling data and the first sampling data of each sensing channel, specifically including:
and a substep 3031, for each sensing channel with the second sampling data, obtaining a second eigenvalue of the sensing channel according to the second sampling data of the sensing channel, and obtaining a first eigenvalue of the sensing channel according to the first sampling data of the sensing channel.
Specifically, for each sensing channel with second sampling data, filtering, smoothing and the like are performed on the second sampling data of each sensing channel to filter noise interference in the second sampling data, so that a second characteristic value of each sensing channel is obtained; obtaining a second characteristic value of each sensing channel from second sampling data of n-1 sensing channels, and representing the second characteristic value of each sensing channel by using D _ RAW; specifically, the second feature value of the 2 nd sensing channel is D _ RAW2, the second feature value of the 3 rd sensing channel is D _ RAW3, … …, and the second feature value of the nth sensing channel is D _ RAW, so that the second feature values D _ RAW2 to D _ RAW of the 2 nd to nth sensing channels can be obtained. Similarly, the first sampling data of each sensing channel is subjected to filtering, smoothing and other processing to filter noise interference in the first sampling data, so that a first characteristic value of each sensing channel is obtained; obtaining a first characteristic value of each sensing channel from first sampling data of n-1 sensing channels, and representing the first characteristic value of each sensing channel by using D _ REF; specifically, the first characteristic value of the 2 nd sensing channel is D _ REF2, the first characteristic value of the 3 rd sensing channel is D _ REF3, … …, and the first characteristic value of the nth sensing channel is D _ REFn, so that the first characteristic values D _ REF2 to D _ REFn of the 2 nd to nth sensing channels can be obtained.
And a substep 3032 of calculating a difference value between the first characteristic value of the sensing channel and the second characteristic value of the sensing channel, and taking the difference value as a detection value corresponding to the sensing channel.
Specifically, a difference value between a first characteristic value and a second characteristic value of each sensing channel is calculated, and the difference value is used as a detection value corresponding to the sensing channel; specifically, the detection value corresponding to the 2 nd sensing channel is represented as DIFF2, the detection value corresponding to the 3 rd sensing channel is represented as DIFF3, … …, and the detection value corresponding to the nth sensing channel is represented as DIFF n, that is, the detection values DIFF2 to DIFF n corresponding to the 2 nd to nth sensing channels can be obtained. It should be noted that the difference between the first characteristic value of the sensing channel and the second characteristic value of the sensing channel may be understood as the difference between the first characteristic value and the second characteristic value, or the difference between the second characteristic value and the first characteristic value.
Specifically, for each sensing channel, if there is no open circuit phenomenon in both sensing channels in a group of sensing channels where the sensing channel is located, a larger difference (i.e., a larger detection value) should exist between a first characteristic value D _ REF and a second characteristic value D _ RAW of the sensing channel, that is, the detection value of the sensing channel is larger than a preset threshold corresponding to the group of sensing channels, and if at least one of the detection values DIFF2 to DIFFn corresponding to the 2 nd to nth sensing channels is smaller than the preset threshold corresponding to the group where the sensing channel is located, it is indicated that at least one of the 2 nd to nth sensing channels is open circuit, and it is determined that the detection result of the sensing module is the open circuit phenomenon; otherwise, the detection result of the induction module is judged to be that no open circuit phenomenon exists. Wherein the preset threshold is set by a tester according to experience; specifically, the size of the preset threshold of each group of sensing channels is related to the distance between two sensing channels in the group of sensing channels, and the smaller the distance between the two sensing channels is, the larger the coupling performance is; when the code printing signals are the same, the distance between the two sensing channels in the group of sensing channels is smaller, and the difference between the second sampling data and the first sampling data is larger; therefore, if the preset threshold is set as the difference between the second characteristic value (obtained by processing the second sampling data) and the first characteristic value (obtained by processing the first sampling data) corresponding to the same sensing channel, the smaller the distance between the two sensing channels is, the larger the preset threshold is; conversely, the larger the distance between the two sensing channels is, the smaller the preset threshold value is. If the adjacent induction channels are taken as a group, the preset threshold values of all the groups of induction channels are equal; if the adjacent sensing channels are not grouped, the preset threshold of each group of sensing channels needs to be set according to the division mode of each group.
In this embodiment, under the condition that it is determined that the detection result of the sensing module has an open circuit phenomenon, it may be further determined whether each sensing channel is open-circuited.
If in step 302, according to the first embodiment: taking the ith sensing channel and the (i + 1) th sensing channel as a group as an example, a specific determination manner of whether each sensing channel is open-circuited is as follows, where THR represents a preset threshold.
(1) When i is 1, then:
if DIFF2 is greater than or equal to THR, the sensing channel 1 is normal.
If DIFF2 is less than THR and DIFF3 is more than or equal to THR, the sensing channel 1 is open.
(2)1< i < n, then:
if DIFFI is larger than or equal to THR and DIFFI +1 is larger than or equal to THR, the induction channel i is normal.
If DIFFI is less than THR and DIFFI +1 is more than or equal to THR, the induction channel i-1 is open-circuited.
If DIFFI is larger than or equal to THR and DIFFI +1 is smaller than THR, the sensing channel i +1 is opened.
(3) When i is n, then:
if DIFFn is larger than or equal to THR, the sensing channel n is normal.
If DIFFn is less than THR and DIFFn-1 is more than or equal to THR, the sensing channel n is open-circuited.
In addition, if the detection values DIFF of the continuous multiple channels are all smaller than the preset threshold, manual detection can be performed on the continuous multiple sensing channels, so as to specifically judge the sensing channel in an open circuit among the continuous multiple sensing channels.
If in step 302, according to the second embodiment, only one sensing channel is included in the two sets of sensing channels or any one sensing channel is included in only one set of sensing channels; at this time, performing mutual capacitance detection on each group of sensing channels, taking coding on the previous sensing channel in each group of sensing channels and sampling the next sensing channel, taking the second sampling data of the next sensing channel as an example, obtaining second sampling data of the next sensing channel in each group of sensing channels, obtaining a second sampling value and a first sampling value of the next sensing channel in each group of sensing channels, calculating a detection value of the next sensing channel in each group of sensing channels, and when the detection value is greater than a preset threshold value corresponding to the group of sensing channels, determining that neither sensing channel in the group of sensing channels is open-circuited; when the detection value is smaller than a preset threshold value corresponding to the group where the detection value is located, judging that at least one induction channel in the group of induction channels has an open circuit phenomenon; and then, which sensing channel has the open circuit phenomenon or two sensing channels have the open circuit phenomenon can be determined in a manual detection mode. That is, in such a grouping manner, the sensing channels in which the open circuit phenomenon may occur can be determined relatively quickly in a small range.
Compared with the first embodiment, the present embodiment provides a specific method for determining whether an open circuit exists in the sensing module. It should be noted that this embodiment may also be used as a refinement on the basis of the first embodiment, and in step 302, two non-adjacent sensing channels may also be used as a group, so that the same technical effect may be achieved.
A fourth embodiment of the present application relates to an assembling method of a touch screen with a dual-layer structure, please refer to fig. 9, which is a specific flowchart of the assembling method of the touch screen with the dual-layer structure.
Specifically, a first single-sided module for forming a double-layer structure is provided, the first single-sided module is provided with a TX channel or an RX channel, and the first single-sided module and an FPC (flexible printed circuit) extending out of a touch chip are pressed together.
In step 403, if the detection result of the first single-sided module is that there is no open circuit, a second single-sided module for assembling the touch screen with the double-layer structure is provided, and the second single-sided module is connected to the touch chip.
Specifically, if the detection result of the first single-sided module is that the open circuit phenomenon does not exist, the first single-sided module is a good product and can be used for manufacturing a double-layer structure touch screen; then, providing a second single-side module for assembling the touch screen with the double-layer structure, wherein the second single-side module is provided with a channel which is different from the channel of the first single-side module (namely the second single-side module is provided with an RX channel or a TX channel), and pressing the second single-side module and the FPC extended out of the touch chip together; if the detection result of the first single-sided module is that an open circuit phenomenon exists, the first single-sided module needs to be detached, another single-sided module needs to be provided again, the newly provided single-sided module is connected with the touch chip, and detection is performed according to the mode of the step 402 until a single-sided module without the open circuit phenomenon is obtained.
Specifically, if the detection result of the second single-sided module is that no open circuit phenomenon exists, the second single-sided module is a good product and can be used for manufacturing a double-layer touch screen; then, the first single-sided module without the open circuit phenomenon and the second single-sided module without the open circuit phenomenon are pressed together, and the TX channel and the RX channel on the two single-sided modules after pressing are perpendicular to each other to form a double-layer structure touch screen, which is shown in fig. 1. If the second single-sided module has an open circuit, the second single-sided module is detached, another single-sided module is provided again, the newly provided single-sided module is connected with the touch chip, and the detection is performed in step 404 until a single-sided module without an open circuit is obtained.
Compared with the prior art, the touch screen with the double-layer structure can be formed after the two single-side modules and the touch chip are assembled together, so that the touch chip is connected to the single-side modules and is used for detecting the single-side modules, when the detection result of the single-side modules is that an open circuit phenomenon does not exist, the single-side modules are qualified, the other single-side module is continuously assembled and tested, and pressing is carried out only after the two single-side modules are completely qualified, so that the sensing module can be detected in the assembling process of the touch screen, and the touch screen is very convenient and quick; and the formed double-layer touch screen can be ensured not to have an open circuit phenomenon, and the loss is reduced.
The fifth embodiment of the present application relates to a touch chip, wherein the touch chip is connected to a sensing module, and specifically, an FPC extending from the touch chip is pressed together with the sensing module. Referring to fig. 10, the touch chip includes a control unit 1, a coding unit 2, a sampling unit 3, and an analysis unit 4.
The control unit 1 is used for respectively performing suspended sampling on a plurality of mutually disjoint induction channels contained in the induction module to obtain first sampling data of each induction channel; when one induction channel is sampled, other induction channels are all in a suspended state.
The control unit 1 is further configured to group two sensing channels, and perform mutual capacitance detection on each group of sensing channels. The mutual capacitance detection comprises that the control unit 1 is used for controlling the coding unit 2 to code one induction channel in each group of induction channels and controlling the sampling unit 3 to sample the other induction channel to obtain second sampling data of the other induction channel; wherein any one induction channel is at least contained in one group of induction channels;
the analysis unit 4 is used for obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel for each induction channel with the second sampling data.
Since the first embodiment corresponds to the present embodiment, the present embodiment can be implemented in cooperation with the first embodiment. The related technical details mentioned in the first embodiment are still valid in this embodiment, and the technical effects that can be achieved in the first embodiment can also be achieved in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related-art details mentioned in the present embodiment can also be applied to the first embodiment.
Compared with the prior art, the method includes the steps that firstly, all induction channels in the induction module are controlled to be in a suspended state, and suspended sampling is conducted on the induction channels respectively to obtain first sampling data of the induction channels; then, two induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, so that second sampling data of each induction channel with the second sampling data are obtained; and finally, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the difference data of the second sampling data and the first sampling data of each induction channel. Namely, the induction module is detected based on the mutual capacitance detection principle, so that the detection cost is low, and the detection is simple and feasible; meanwhile, the method can be applied to detection of the single induction module in the double-layer structure touch screen, so that the single induction module with an open circuit phenomenon is removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
The sixth embodiment of the present application relates to a touch chip, which is a refinement on the basis of the fifth embodiment, and the main refinement is as follows: two adjacent sensing channels are used as a group.
In this embodiment, the control unit 1 takes two adjacent sensing channels as a group, and performs mutual capacitance detection on each group of sensing channels respectively; two adjacent induction channels are taken as a group, and the method comprises the following two schemes:
the first scheme is as follows: taking the ith induction channel and the (i + 1) th induction channel as a group, and respectively carrying out mutual capacitance detection on each group of induction channels; each induction channel is sequentially numbered according to the physical position arrangement sequence, wherein i is 1, 2, 3, … … and n-1, and n is the total number of the induction channels; taking the ith induction channel and the (i + 1) th induction channel as a group, so as to obtain n-1 groups of induction channels; wherein, no matter n is an odd number or an even number, the ith sensing channel and the (i + 1) th sensing channel can be grouped according to the above mode. Referring to fig. 5, taking the sensing module as a single-sided module with 9 TX channels as an example, eight sets of sensing channels can be obtained, the first set of sensing channels: TX1, TX2, second set of sense channels: TX2, TX3, third set of inductive channels: TX3, TX4 and the like, eight groups of induction channels can be obtained; during mutual capacitance detection, except for the head induction channel and the tail induction channel, the middle induction channels are detected twice, and the detection reliability is higher.
Preferably, the mutual capacitance detection of each group of sensing channels by the control chip 1 specifically includes that the code printing unit 2 is controlled to print a code on the previous sensing channel in each group of sensing channels, and the sampling unit 3 is controlled to sample the next sensing channel to obtain second sampling data of the next sensing channel; or, the control unit 1 is configured to control the coding unit 2 to code a subsequent sensing channel in each group of sensing channels, and control the sampling unit 3 to sample a previous sensing channel, so as to obtain second sampling data of the previous sensing channel. Referring to fig. 5, taking the sensing module as a single-sided module having 9 TX channels as an example, coding and sampling are performed in the above manner, so that second sampling data of 8 TX channels of the 9 TX channels can be obtained, that is, second sampling data of n-1 sensing channels of the n sensing channels can be obtained, so that a detection result obtained by subsequent analysis is more reliable.
Scheme II: when the total number n of the sensing channels included in the sensing module is an odd number, only one sensing channel of all the sensing channels is included in two sets of sensing channels, and the other sensing channels are included in only one set of sensing channels, so as to obtain (n-1)/2+1 sets of sensing channels, please refer to fig. 6, taking the sensing module as a single-sided module having 9 TX channels as an example, then the 9 TX channels in the single-sided module can be divided into five sets, the first set of sensing channels: TX1, TX2, second set of sense channels: TX3, TX4, third set of inductive channels: TX5, TX6, fourth set of sense channels: TX7, TX8, fifth set of sense channels: TX8, TX 9; when the total number n of the induction channels included by the induction module is an even number, any induction channel is only contained in one group of induction channels, and n/2 groups of induction channels can be obtained; referring to fig. 7, taking the sensing module as a single-sided module having 8 TX channels as an example, the 8 TX channels in the single-sided module can be divided into four groups, the first group of sensing channels: TX1, TX2, second set of sense channels: TX3, TX4, third set of inductive channels: TX5, TX6, fourth set of sense channels: TX7, TX 8; during mutual capacitance detection, when the induction module comprises odd induction channels, except the last but one induction channel, other induction channels only need to be detected once; when the induction module comprises an even number of induction channels, each group of induction channels only need to be detected once, and the detection is simpler and faster.
Since the second embodiment corresponds to the present embodiment, the present embodiment can be implemented in cooperation with the second embodiment. The related technical details mentioned in the second embodiment are still valid in this embodiment, and the technical effects that can be achieved in the second embodiment can also be achieved in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related-art details mentioned in the present embodiment can also be applied to the second embodiment.
Compared with the fifth embodiment, the embodiment takes two adjacent sensing channels as a group, the distance between the adjacent sensing channels is short, the signal-to-noise ratio is high, and the detection result is more accurate.
A seventh embodiment of the present application relates to a touch chip, which is a refinement based on the fifth embodiment, and the main refinement is as follows: referring to fig. 11, the analyzing unit 4 includes a data processing subunit 41, a calculating subunit 42, and a determining subunit 43.
The data processing subunit 41 is configured to, for each sensing channel having the second sampling data, obtain a second eigenvalue of the sensing channel according to the second sampling data of the sensing channel, and obtain a first eigenvalue of the sensing channel according to the first sampling data of the sensing channel.
The calculating subunit 42 is configured to calculate a difference between the first characteristic value of the sensing channel and the second characteristic value of the sensing channel, and use the difference as a corresponding detection value of the sensing channel.
The judging subunit 43 is configured to judge whether there is at least one detection value corresponding to one sensing channel in the detection values corresponding to the sensing channels that is smaller than a preset threshold corresponding to a group in which the sensing channel is located; if yes, judging that the detection result of the induction module is that an open circuit phenomenon exists; if not, the detection result of the induction module is judged to be that the open circuit phenomenon does not exist.
Since the third embodiment corresponds to the present embodiment, the present embodiment can be implemented in cooperation with the third embodiment. The related technical details mentioned in the third embodiment are still valid in this embodiment, and the technical effects that can be achieved in the third embodiment can also be achieved in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related-art details mentioned in the present embodiment can also be applied to the third embodiment.
In this embodiment, a specific method for determining whether an open circuit exists in the sensing module is provided, compared with the fifth embodiment. It should be noted that this embodiment can also be a refinement on the basis of the sixth embodiment, and the same technical effects can be achieved.
The eighth embodiment of the present application relates to a touch screen with a double-layer structure, which includes the touch chip of any one of the fourth to seventh embodiments, and two single-sided modules respectively connected to the touch chip and pressed together.
In this embodiment, the two single-sided modules pressed together are single-sided modules that are not open-circuited by the detection method of the sensing module in any one of the first to third embodiments.
Compared with the prior art, the method includes the steps that firstly, all induction channels in the induction module are controlled to be in a suspended state, and suspended sampling is conducted on the induction channels respectively to obtain first sampling data of the induction channels; then, two induction channels are used as a group, and mutual capacitance detection is respectively carried out on each group of induction channels, so that second sampling data of each induction channel with the second sampling data are obtained; and finally, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the difference data of the second sampling data and the first sampling data of each induction channel. Namely, the induction module is detected based on the mutual capacitance detection principle, so that the detection cost is low, and the detection is simple and feasible; meanwhile, the method can be applied to detection of the single induction module in the double-layer structure touch screen, so that the single induction module with an open circuit phenomenon is removed in time before the double-layer structure touch screen is assembled, and subsequent loss is reduced.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the present application, and that various changes in form and details may be made therein without departing from the spirit and scope of the present application in practice.
Claims (16)
1. A detection method of a sensing module is characterized by comprising the following steps:
respectively carrying out suspended sampling on a plurality of mutually disjoint induction channels contained in the induction module to obtain first sampling data of each induction channel;
two induction channels are used as a group, mutual capacitance detection is respectively carried out on each group of induction channels, and the mutual capacitance detection comprises the following steps: coding one induction channel in each group of induction channels, and sampling the other induction channel to obtain second sampling data of the other induction channel, wherein any induction channel is at least contained in one group of induction channels;
and for each induction channel with second sampling data, obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel.
2. The method as claimed in claim 1, wherein the step of grouping the two sensing channels and performing mutual capacitance detection on each group of sensing channels comprises: and taking two adjacent induction channels as a group, and respectively carrying out mutual capacitance detection on each group of induction channels.
3. The method as claimed in claim 2, wherein the step of grouping two adjacent sensing channels and performing mutual capacitance detection on each group of sensing channels comprises: the method comprises the steps of taking the ith induction channel and the (i + 1) th induction channel as a group, and respectively carrying out mutual capacitance detection on the induction channels in each group, wherein the induction channels are numbered in sequence according to the arrangement sequence, i is 1, 2, 3, … … and n-1, and n is the total number of the induction channels.
4. The method according to claim 3, wherein the mutual capacitance detection specifically includes coding a previous sensing channel in each sensing channel group and sampling a subsequent sensing channel to obtain second sampling data of the subsequent sensing channel; or,
and printing a code on the next induction channel in each group of induction channels, and sampling the previous induction channel to obtain second sampling data of the previous induction channel.
5. The method as claimed in claim 2, wherein any one of the sensing channels is only included in one of the sensing channels; or, only one sensing channel in all the sensing channels is contained in two groups of sensing channels, and the rest sensing channels are contained in only one group of sensing channels.
6. The method for detecting the open circuit of the sensor module according to claim 1, wherein the obtaining a detection result of whether the open circuit phenomenon exists in the sensor module for each of the sensing channels having the second sampling data according to the second sampling data and the first sampling data of each of the sensing channels comprises:
for each induction channel with second sampling data, obtaining a second characteristic value of the induction channel according to the second sampling data of the induction channel, and obtaining a first characteristic value of the induction channel according to the first sampling data of the induction channel;
calculating a difference value between a first characteristic value of the induction channel and a second characteristic value of the induction channel, and taking the difference value as a detection value corresponding to the induction channel;
judging whether at least one detection value corresponding to the induction channel is smaller than a preset threshold corresponding to a group where the induction channel is located in the detection values corresponding to the induction channels; if the detection result of the induction module exists, judging that the open circuit phenomenon exists in the detection result of the induction module; if not, the detection result of the induction module is judged to be that the open circuit phenomenon does not exist.
7. The method for detecting the sensing module of claim 1, wherein the method is applied to a touch chip, and the sensing module is connected to the touch chip.
8. The method as claimed in any one of claims 1 to 7, wherein the sensing module is a single-sided module in a touch screen with a double-layer structure.
9. A method of assembling a touch screen, comprising:
providing a first single-side module for assembling into a touch screen, and connecting the first single-side module to a touch chip;
the detection method of claim 8, wherein the touch chip detects the first single-sided module and obtains a detection result of whether the first single-sided module has an open circuit;
if the detection result of the first single-sided module is that the open circuit phenomenon does not exist, providing a second single-sided module for assembling the double-layer structure touch screen, and connecting the second single-sided module to the touch chip;
the detection method of claim 8, wherein the touch chip detects the second single-sided module and obtains a detection result of whether the second single-sided module has an open circuit;
and if the detection result of the second single-sided module is that the open circuit phenomenon does not exist, pressing the first single-sided module and the second single-sided module together to form the touch screen with the double-layer structure.
10. A touch chip is characterized in that the touch chip is connected with a sensing module, and the sensing module comprises a plurality of sensing channels which are sequentially arranged and do not intersect with each other; the touch chip includes: the device comprises a control unit, a coding unit, a sampling unit and an analysis unit;
the control unit is used for respectively carrying out suspended sampling on a plurality of mutually disjoint induction channels contained in the induction module to obtain first sampling data of each induction channel;
the control unit is further configured to use the two sensing channels as a group, and perform mutual capacitance detection on each group of sensing channels respectively, where the mutual capacitance detection includes that the control unit is configured to control the code printing unit to print a code on one sensing channel in each group of sensing channels, and control the sampling unit to sample another sensing channel, so as to obtain second sampling data of the another sensing channel; wherein any one of the sensing channels is at least contained in one group of sensing channels;
the analysis unit is used for obtaining a detection result of whether the induction module has an open circuit phenomenon or not according to the second sampling data and the first sampling data of each induction channel with the second sampling data.
11. The touch chip of claim 10, wherein the control unit is specifically configured to group two adjacent sensing channels and perform mutual capacitance detection on each group of sensing channels.
12. The touch chip of claim 11, wherein the control unit is specifically configured to group the ith sensing channel and the (i + 1) th sensing channel, and perform mutual capacitance detection on each group of sensing channels respectively; the induction channels are numbered in sequence according to the arrangement sequence, i is 1, 2, 3, … … and n-1, and n is the total number of the induction channels.
13. The touch chip of claim 11, wherein any one of the sensing channels is only included in one of the sensing channels; or, only one sensing channel in all the sensing channels is contained in two groups of sensing channels, and the rest sensing channels are contained in only one group of sensing channels.
14. The touch chip of claim 12, wherein the mutual capacitance detection specifically includes that the control unit is configured to control the coding unit to code a previous sensing channel in each sensing channel group, and control the sampling unit to sample a subsequent sensing channel, so as to obtain second sampling data of the subsequent sensing channel; or,
the control unit is used for controlling the code printing unit to print a code on the next induction channel in each group of induction channels and controlling the sampling unit to sample the previous induction channel so as to obtain second sampling data of the previous induction channel.
15. The touch chip of claim 10, wherein the analysis unit comprises:
the data processing subunit is used for obtaining a second characteristic value of each induction channel with second sampling data according to the second sampling data of the induction channel and obtaining a first characteristic value of the induction channel according to the first sampling data of the induction channel;
the calculating subunit is used for calculating a difference value between a first characteristic value of the sensing channel and a second characteristic value of the sensing channel, and taking the difference value as a detection value corresponding to the sensing channel;
the judging subunit is used for judging whether at least one detection value corresponding to the induction channel is smaller than a preset threshold corresponding to the group of the induction channel or not in the detection values corresponding to the induction channels; if the detection result of the induction module exists, judging that the open circuit phenomenon exists in the detection result of the induction module; if not, the detection result of the induction module is judged to be that the open circuit phenomenon does not exist.
16. A touch screen, comprising: the touch chip of any one of claims 10 to 15, and two single-sided modules respectively connected to the touch chip and pressed together.
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| PCT/CN2018/078977 WO2019173987A1 (en) | 2018-03-14 | 2018-03-14 | Induction module detecting method, touch chip, touch screen and assembling method thereof |
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| WO2019173987A1 (en) | 2019-09-19 |
| CN110678766A (en) | 2020-01-10 |
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