CN110674797A - Optical fingerprint module and mobile terminal - Google Patents

Abstract

The invention provides an optical fingerprint module and a mobile terminal, which relate to the technical field of fingerprint modules. The optical fingerprint module includes a reinforcing plate, a circuit board and a chip. The reinforcing plate is provided with a first groove, and the circuit board is arranged in the first groove; the chip is located in the first groove and is electrically connected with the circuit board. In the optical fingerprint module, the circuit board is arranged in the first groove of the reinforcing plate, so that the overall height of the optical fingerprint module is reduced, and the occupied space is smaller, which is beneficial to the ultra-thin design of the optical fingerprint module and electronic products.

Description

Optical fingerprint module and mobile terminal

technical field

The invention relates to the technical field of fingerprint modules, in particular to an optical fingerprint module and a mobile terminal.

Background technique

With the increasing popularity of terminals, especially mobile terminals, users have higher and higher requirements for the use experience of the terminals, and the application of fingerprint identification technology in the terminals has become more and more popular. In current terminals, a fingerprint recognition module is usually installed in a fixed area under the screen of the terminal, so that the overall thickness of the terminal is relatively thick, and it is difficult to meet the high requirements of users for the terminal to be light and thin.

SUMMARY OF THE INVENTION

The objects of the present invention include providing an optical fingerprint module, which can effectively reduce the overall height of the optical fingerprint module and provide an optical fingerprint module with a thinner thickness.

The objects of the present invention include providing a mobile terminal, which can increase the screen ratio and improve the user experience.

Embodiments of the present invention can be implemented as follows:

In a first aspect, the embodiment provides an optical fingerprint module, comprising a reinforcing plate, a circuit board and a chip, wherein a first groove is defined on the reinforcing plate, and the circuit board is arranged in the first groove; The chip is disposed on the bottom wall of the first groove, or on the side of the circuit board away from the reinforcing plate, and the chip is electrically connected to the circuit board.

In an optional embodiment, a second groove is defined on a side of the circuit board away from the reinforcing plate, and the chip is arranged in the second groove. Alternatively, a first through hole is formed on the circuit board, the chip is located in the first through hole, and the chip is connected to the bottom wall of the first groove.

In an optional implementation manner, the circuit board is provided with a plurality of the first through holes arranged at intervals, the number of the chips is multiple, and each of the chips is correspondingly arranged in one of the first through holes. inside the hole.

In an optional embodiment, the circuit board includes a connection boss formed between two adjacent first through holes, and the chip is electrically connected to the connection boss.

In an optional embodiment, the periphery of the chip is filled with sealant. A glue-resisting layer is provided on the side of the circuit board away from the reinforcing plate, and the glue-resisting layer is located on the periphery of the sealant.

In an optional implementation manner, the chip and the reinforcing plate are bonded by an adhesive, and the circuit board and the reinforcing plate are connected by an adhesive.

In an optional embodiment, the reinforcing plate is a steel sheet.

In a second aspect, this embodiment provides a mobile terminal, including a display screen, a back cover, and the optical fingerprint module according to any one of the foregoing embodiments, the display screen is connected to the back cover and therebetween An accommodating cavity is formed, and the optical fingerprint module is arranged in the accommodating cavity.

In an optional embodiment, it also includes a middle frame, one side of the middle frame is connected with the display screen, and the other side is connected with the back cover; the middle frame is on one side close to the display screen A second through hole is opened, and the optical fingerprint module is arranged in the second through hole.

In an optional embodiment, the middle frame includes a bearing portion and a mounting portion formed by a side surface of the bearing portion close to the display screen protruding toward the display screen, and a second through hole is defined on the bearing portion . The reinforcing plate includes an interconnected bottom and an extension, the bottom is the bottom wall of the first groove, and the extension is away from a side edge of the bottom from the side wall of the first groove The bottom portion is arranged in the second through hole, and the extension portion is arranged on the bearing portion.

In an optional embodiment, foam is provided between the reinforcing plate and the display screen.

The optical fingerprint module and the mobile terminal provided by the present invention have beneficial effects including:

In the optical fingerprint module provided by the present invention, a first groove is formed on the reinforcing plate, and both the circuit board and the chip are arranged in the first groove, which is directly arranged on the surface of the reinforcing plate compared with the existing installation method. For circuit boards and chips, the overall height of the optical fingerprint module provided by the present invention is lower, which is more conducive to providing an ultra-thin optical fingerprint module and occupies less space in the terminal product.

The mobile terminal provided by the present invention adopts the above-mentioned optical fingerprint module. Due to the small thickness of the optical fingerprint module, it can be arranged below the display screen of the mobile terminal without occupying the screen area, which is beneficial to improve the screen ratio of the mobile terminal and improve the user experience.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of an optical fingerprint module provided by a first embodiment of the present invention;

2 is another schematic structural diagram of the optical fingerprint module provided by the first embodiment of the present invention;

3 is a schematic structural diagram of the optical fingerprint module provided by the first embodiment of the present invention from another perspective;

4 is a schematic diagram of the filling structure of the sealing member of the optical fingerprint module provided by the first embodiment of the present invention;

5 is a schematic structural diagram of an optical fingerprint module provided by a second embodiment of the present invention;

6 is a schematic structural diagram of the optical fingerprint module provided by the second embodiment of the present invention from another perspective;

7 is a schematic structural diagram of a mobile terminal according to a third embodiment of the present invention;

8 is a schematic structural diagram of a middle frame of a mobile terminal according to a third embodiment of the present invention;

9 is another schematic structural diagram of a middle frame of a mobile terminal according to a third embodiment of the present invention;

FIG. 10 is a schematic structural diagram of a mobile terminal according to a fourth embodiment of the present invention.

Icon: 100-optical fingerprint module; 110-reinforcing plate; 111-first groove; 115-bottom; 117-extension; 120-circuit board; 121-first through hole; 123-second groove; 125-first mounting hole; 126-second mounting hole; 127-connecting boss; 128-first boss; 129-second boss; 130-chip; 1301-chip collection area; 131-collection chip; 133 -Driver chip; 140-gold wire; 151-adhesive; 153-resistance layer; 155-adhesive; 160-sealant; 200-mobile terminal; 210-display; 220-middle frame; 221-th 2 through holes; 222-third groove; 223-bearing part; 225-installation part; 226-bearing platform; 230-battery assembly; 240-back cover; 260-foam; Division II.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. appear, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, or It is the orientation or positional relationship that the product of the invention is usually placed in use, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation , so it should not be construed as a limitation of the present invention.

In addition, where the terms "first", "second" and the like appear, they are only used to differentiate the description, and should not be construed as indicating or implying relative importance.

It should be noted that the features in the embodiments of the present invention may be combined with each other without conflict.

This embodiment provides an optical fingerprint module 100 and a mobile terminal 200 including the optical fingerprint module 100. By opening the first groove 111 on the reinforcing plate 110 of the optical fingerprint module 100, the entire optical fingerprint module is reduced in size. The height of the group 100 realizes the miniaturization and ultra-thin design of the optical fingerprint module 100 . Due to the small thickness of the ultra-thin optical fingerprint module 100, it can be completely installed under the display screen 210 of the mobile terminal 200. As the under-screen optical fingerprint module 100, no physical buttons or virtual buttons are required, which can greatly increase the screen ratio and improve the user experience. experience.

first embodiment

Referring to FIG. 1 , the present embodiment provides an optical fingerprint module 100 , which includes a reinforcing plate 110 , a circuit board 120 and a chip 130 . in the groove 111. Optionally, the circuit board 120 is adhered and fixed to the bottom wall of the first groove 111 through the adhesive 155 . Compared with installing the circuit board 120 on the unslotted reinforcing plate 110 , in this embodiment, the circuit board 120 adopts a sinking arrangement to reduce the installation position of the circuit board 120 , thereby increasing the overall height of the optical fingerprint module 100 . reduce. The chip 130 is located in the first groove 111 and is electrically connected to the circuit board 120 . Optionally, the chip 130 is disposed on the reinforcing plate 110 , that is, the chip 130 is directly connected to the bottom wall of the first groove 111 ; or the chip 130 is disposed on the circuit board 120 and is located on the circuit board 120 away from the reinforcing plate 110 the bottom wall side of the first groove 111. In this embodiment, the circuit board 120 is a flexible circuit board, of course, it can also be a printed circuit board or a flexible-rigid combination circuit board; the chip 130 can be, but is not limited to, an optical fingerprint chip, and the chip 130 and the circuit board 120 use gold wires 140 Connection; the reinforcing plate 110 is made of steel sheet. Of course, the reinforcing plate 110 can also be made of other materials, such as FR4, PET or PI, which is not specifically limited here.

Further, a second groove 123 is defined on the side of the circuit board 120 away from the reinforcing plate 110 . Please refer to FIG. 2 . The chip 130 is disposed on the bottom wall of the second groove 123 . For example, the chip 130 can be attached by means of adhesive. fit on the bottom wall of the second groove 123 . Compared with the chip 130 being directly disposed on the surface of the circuit board 120 , this method further reduces the overall height of the optical fingerprint module 100 .

Optionally, referring to FIG. 1 and FIG. 3 , the circuit board 120 defines a first through hole 121 , that is, the depth of the first through hole 121 directly penetrates the thickness of the circuit board 120 , exposing the bottom wall of the first groove 111 . The chip 130 is located in the first through hole 121 , and the chip 130 is connected to the bottom wall of the first groove 111 . The chip 130 is bonded to the bottom wall of the first groove 111 on the reinforcing plate 110 by using a bonding glue 151, for example, the chip 130 bonding glue 151 can be bonded by ACF (Anisotropic Conductive Film, anisotropic conductive film), so that the The chip 130 is attached and fixed on the bottom wall of the first groove 111 . By opening the first through hole 121 on the circuit board 120, the installation position of the chip 130 can be reduced as much as possible, thereby reducing the overall height of the optical fingerprint module 100 as much as possible, and an ultra-thin optical fingerprint module 100 is provided. .

As shown in FIG. 4 , the outer periphery of the chip 130 is filled with a sealant 160 , which not only protects the chip 130 , but also prevents the gold wire 140 from being oxidized and corroded, and further fixes the chip 130 . Optionally, a sealant 160 is filled between the chip 130 and the hole wall of the first through hole 121, and a layer of sealant 160 is also provided on the upper surface of the chip 130 away from the reinforcing plate 110 to prevent dust and the like from contaminating the chip 130. The chip 130 plays a role of sealing and protection, so as to improve the imaging quality of the optical fingerprint module 100 .

A glue-resisting layer 153 is provided on the bottom wall of the first groove 111 on the circuit board 120 away from the reinforcing plate 110 . The glue-resisting layer 153 is located on the periphery of the sealant 160 and is distributed in a ring shape, and is used to prevent the sealant 160 from being filled. Spill around. In this embodiment, the adhesive resist layer 153 adopts a PI (Polyimide, polyimide) reinforcing plate 110 to prevent the sealant 160 from overflowing. Of course, in other optional embodiments, the adhesive layer 153 can also be made of materials such as foam, which is not specifically limited here.

In the optical fingerprint module 100 provided in this embodiment, the circuit board 120 is disposed in the first groove 111 of the reinforcing plate 110 , and the chip 130 is disposed on the circuit board 120 by hollowing out grooves or through holes. The overall height of the optical fingerprint module 100 is greatly reduced, which is beneficial to provide an ultra-thin optical fingerprint module 100 .

It can be understood that only one chip 130 is provided in this embodiment, and the number of chips 130 may also be multiple. Multiple chips 130 are arranged side by side, and each chip 130 is electrically connected to the circuit board 120 . For example, the optical fingerprint module 100 is used under the display screen 210 of an electronic product. Since each chip 130 includes a part of the chip collection area 1301, the display screen 210 corresponding to the chip collection area 1301 is the sensing surface, and a finger touches the sensing surface. Operate electronic products. If a plurality of chips 130 are arranged in the optical fingerprint module 100, and the plurality of chips 130 are spliced with each other, the area of the collection area will be increased, and a large sensing surface will be provided, so that the user can touch a larger area on the display screen 210. Realize fingerprint recognition and improve user experience.

Second Embodiment

As shown in FIG. 5 and FIG. 6 , the optical fingerprint module 100 provided in this embodiment includes a reinforcing plate 110 , a circuit board 120 and a plurality of chips 130 . A first groove 111 is defined on the reinforcing plate 110 , and the circuit board 120 is attached to the bottom wall of the first groove 111 . A plurality of second grooves 123 or a plurality of first through holes 121 are formed on the side of the circuit board 120 away from the bottom wall of the first groove 111 , and the chip 130 is disposed in the second grooves 123 or the first through holes 121 , so as to reduce the overall height of the optical fingerprint module 100 .

It should be noted that the chip 130 used in this embodiment is an optical fingerprint chip 130, including a driver chip 133 and a collection chip 131. The driver chip 133 and the collection chip 131 can be set separately to form two chips 130, or two The chips 130 are integrated into one and integrated on one chip 130 . The optical fingerprint chips 130 shown in FIG. 1 to FIG. 4 are integrated into one, and the optical fingerprint chips 130 shown in FIG. 5 and FIG. 6 are separated from each other.

In this embodiment, a plurality of first through holes 121 are formed on the circuit board 120 as an example for description. The circuit board 120 is provided with a plurality of first through holes 121 arranged at intervals, the number of chips 130 is multiple, and each chip 130 is correspondingly disposed in one of the first through holes 121 . The circuit board 120 includes a connection boss 127 formed between two adjacent first through holes 121 , and the chip 130 is electrically connected to the connection boss 127 .

In the figure, only two first through holes 121 and two chips 130 are shown. For convenience of description, the two first through holes 121 are respectively defined as a first mounting hole 125 and a second mounting hole 126 . The circuit board 120 includes a connecting boss 127 formed in the middle and a first boss 128 and a second boss 129 formed on both sides. The first mounting hole 125 is located between the first boss 128 and the connecting boss 127. The two mounting holes 126 are located between the second boss 129 and the connecting boss 127 . The acquisition chip 131 is electrically connected to the connecting boss 127 and the first boss 128 respectively, and the driving chip 133 is electrically connected to the second boss 129 and the connecting boss 127 respectively. The connection bosses 127 are formed between the two first through holes 121 , which can facilitate the electrical connection between the chip 130 and the circuit board 120 .

The outer periphery of the collection chip 131 is filled with sealant 160 (not shown in FIG. 5 , see FIG. 4 ), and the gap between the first mounting hole 125 and the collection chip 131 is filled with sealant 160 to protect the collection chip 131 from dust It can prevent the pollution of foreign objects, and can also avoid the oxidation and corrosion of the gold wire 140. The outer periphery of the driver chip 133 is filled with sealant 160, and the gap between the second mounting hole 126 and the driver chip 133 is filled with sealant 160, which is used to protect the driver chip 133 from contamination by foreign objects such as dust, and also to avoid gold Line 140 is oxidized and corroded. A resist layer 153 is provided on the periphery of the sealant 160 on the side of the circuit board 120 away from the bottom wall of the first groove 111 of the reinforcing plate 110 to prevent the sealant 160 from overflowing to the periphery. The glue-resisting layer 153 can be reinforced with PI, and a reinforcing ring is formed on the periphery of the sealant 160; or, the glue-resisting layer 153 can also be made of foam or other materials.

It is easy to understand that there may be multiple first mounting holes 125 and second mounting holes 126 , and the number of collecting chips 131 and driving chips 133 may also be multiple. Multiple collecting chips 131 and multiple driving chips 133 are arranged side by side and are respectively Connect with the circuit board 120 . In this way, the area of the collection area of the collection chip 131 can be increased, thereby providing a larger sensing surface on the display screen 210 for the user to operate, and improving the user experience. Of course, it is not limited to this. In other optional embodiments, a first through hole 121 with a larger diameter may also be provided on the circuit board 120 , and a plurality of chips 130 are simultaneously arranged in the first through hole 121 . The chips 130 are all electrically connected to the circuit board 120, which is not specifically limited here.

The case of opening a plurality of second grooves 123 on the circuit board 120 is similar, and other contents not mentioned in this embodiment are similar to those described in the first embodiment, and will not be described in detail here.

In the optical fingerprint module 100 provided in this embodiment, a first groove 111 is formed on the reinforcing plate 110, and the circuit board 120 is installed on the bottom wall of the first groove 111; a first through hole is formed on the circuit board 120 121 , the chip 130 is installed in the first through hole 121 to reduce the overall height of the optical fingerprint module 100 and provide an ultra-thin optical fingerprint module 100 . In addition, a situation where multiple chips 130 are arranged on the reinforcing plate 110 is shown, which is suitable for the installation of various types of optical fingerprint chips 130, and multiple groups of chips 130 are arranged at the same time, which is beneficial to provide a large sensing surface and greatly improve the user experience.

Third Embodiment

As shown in FIG. 7 , the present embodiment provides a mobile terminal 200, including a display screen 210, a back cover 240, a middle frame 220, a battery assembly 230, and the optical fingerprint module 100 of any one of the foregoing embodiments, the display screen 210 and the rear The covers 240 are disposed opposite to each other and form an accommodating cavity therebetween. The optical fingerprint module 100 and the battery assembly 230 are arranged in the accommodating cavity. The middle frame 220 is used for connecting the display screen 210 and the back cover 240 . The mobile terminal 200 completely disposes the optical fingerprint module 100 under the display screen 210 (between the display screen 210 and the back cover 240 ), adopts the optical fingerprint module 100 under the screen, and does not need physical buttons or virtual buttons, which can greatly improve the mobile terminal. 200 screen-to-body ratio. Since the optical fingerprint module 100 is suitable for the application of multiple chips 130 splicing, it can provide a large sensing area, and the user can directly touch the designated area of the display screen 210 of the mobile terminal 200 to realize fingerprint recognition, and can realize 360-degree touch recognition in any direction. Improve user experience.

Optionally, as shown in FIG. 8, one side of the middle frame 220 is connected to the display screen 210, and the other side is connected to the back cover 240; a third groove 222 is formed on the side of the middle frame 220 close to the display screen 210, and the optical fingerprint mold The group 100 is disposed in the third groove 222 . By arranging the third groove 222 , the installation position of the optical fingerprint module 100 is lowered, and the thickness of the entire mobile terminal 200 is reduced. The battery assembly 230 is disposed on the side of the middle frame 220 away from the display screen 210 , that is, between the middle frame 220 and the back cover 240 . Optionally, the middle frame 220 includes a bearing portion 223 and a mounting portion 225 formed by a side surface of the bearing portion 223 close to the display screen 210 protruding toward the display screen 210 . The mounting portion 225 and the bearing portion 223 form a third groove 222 . The mounting portion 225 is connected to the display screen 210 , and the side of the bearing portion 223 away from the display screen 210 is connected to the back cover 240 .

Further, as shown in FIG. 9 , a second through hole 221 is formed on the bearing portion 223 . It should be understood that the diameter of the second through hole 221 is smaller than the diameter of the third groove 222 , so that the bearing portion 223 is located between the second through hole 221 and the mounting portion. A platform 226 is formed between 225 . The reinforcing plate 110 includes a bottom portion 115 and an extension portion 117 that are connected to each other. The bottom portion 115 is the bottom wall of the first groove 111; Outer bulge setting. The bottom portion 115 is disposed in the second through hole 221 , and the extending portion 117 is disposed on the platform 226 of the bearing portion 223 . By opening the second through hole 221 on the bearing portion 223 , the installation position of the optical fingerprint module 100 is lowered as much as possible, so as to reduce the assembly thickness of the optical fingerprint module 100 as much as possible, and reserve more thickness for the battery assembly 230 The space in the direction is also beneficial to reduce the overall thickness of the mobile terminal 200 .

In this embodiment, taking the mobile terminal 200 including the optical fingerprint module 100 provided in the first embodiment as an example, when the chip 130 in the optical fingerprint module 100 adopts the driving chip 133 and the collecting chip 131 to be integrated as a whole, The assembly of the optical fingerprint module 100 in the mobile terminal 200 is shown in the figure. A foam 260 is provided between the reinforcing plate 110 and the display screen 210 . Optionally, the display screen 210 adopts an OLED light-emitting display screen, and the side of the extension portion 117 on the reinforcing plate 110 close to the display screen 210 is assembled with the OLED light-emitting display screen by shading and pressing the foam 260 to reduce the optical fingerprint module. 100 assembly thickness. Further, the foam 260 includes a first subsection 261 and a second subsection 263 that are connected to each other. One side of the first subsection 261 is attached to the extension portion 117 , and the other side is attached to the display screen 210 . The second sub-sections 263 extend inward along the radial direction of the second through holes 221 . Optionally, a side of the circuit board 120 away from the bottom 115 is provided with an adhesive resist layer 153 for preventing the sealant 160 from overflowing, and the second sub-section 263 extends to the end face of the adhesive resist layer 153 close to the sealant 160, and is attached to the sealant 160. between the glue resist layer 153 and the display screen 210 . The foam 260 is used to cover the circuit board 120 around the chip 130 to reduce the incidence of light from the OLED display screen into the first through hole 121 , so as to reduce the interference of stray light on the chip 130 and improve the imaging quality of the optical fingerprint module 100 .

Since the optical fingerprint module 100 is completely arranged under the display screen 210, multiple chips 130 can be arranged in the optical fingerprint module 100, which will not affect the screen ratio, but also can increase the sensing surface, which can meet the security requirements of mobile payment , to achieve 360-degree touch recognition in any direction, greatly improving the user experience. Of course, the optical fingerprint module 100 can also be applied to other touch devices and terminal devices in addition to being applied to the mobile terminal 200, such as a mobile phone, a tablet computer, etc., which is not specifically limited here.

Fourth Embodiment

As shown in FIG. 10 , this embodiment provides a mobile terminal 200 using the optical fingerprint module 100 provided in the second embodiment. When the chip 130 in the optical fingerprint module 100 is provided with the driver chip 133 and the acquisition chip 131 separately, that is, the driver chip 133 and the acquisition chip 131 need to be set on the reinforcing plate 110 at the same time. At this time, the optical fingerprint module 100 is installed in the mobile terminal. The assembly within the 200 is shown in the figure.

The optical fingerprint module 100 is installed in the second through hole 221 of the middle frame 220 , two first through holes 121 are formed on the circuit board 120 , one first through hole 121 is provided with a collection chip 131 , and the other first through hole 121 A driver chip 133 is disposed therein, and a connection boss 127 is formed between the two first through holes 121 . The gap between the collecting chip 131 and the first through hole 121 and the gap between the driving chip 133 and the first through hole 121 are filled with the sealant 160 . The sealant 160 is prevented from overflowing to the periphery on the circuit board 120 . Only the sealant 160 in the second installation hole 126 is shown in the figure, and the sealant 160 in the first installation hole 125 is not shown. In addition, a sealant 160 is added on the side of the driver chip 133 away from the reinforcing plate 110 , that is, above the driver chip 133 , to wrap the driver chip 133 and the connection bosses 127 together. The first subsection 261 of the foam 260 is attached between the reinforcing plate 110 and the display screen 210 , and the second subsection 263 of the foam 260 is elongated and extended to the sealant 160 above the connection boss 127 , that is, the The second sub-section 263 extends inward along the radial direction of the second through hole 221 to the sealant 160 above the connection boss 127 , and covers the driving chip 133 and the connection boss 127 . One surface of the second sub-section 263 is adhered to the sealant 160 of the optical fingerprint module 100 , and the other side is adhered to the display screen 210 . This arrangement reduces the incidence of light from the OLED display screen to the first through hole 121 , in order to reduce the interference of stray light on the chip 130 and improve the imaging quality of the optical fingerprint module 100 .

In other optional embodiments, the mobile terminal 200 may also be provided with multiple driving chips 133 and multiple acquisition chips 131 under the screen to increase the sensing surface, meet the security requirements of mobile payment, and realize 360-degree touch recognition in any direction , greatly improving the user experience. In addition, other contents not mentioned in this embodiment are similar to those in the third embodiment, and are not repeated here.

To sum up, the embodiments of the present invention provide an optical fingerprint module 100 and a mobile terminal 200. The optical fingerprint module 100 defines a first groove 111 on the reinforcing plate 110, and the circuit board 120 is disposed in the first groove. A first through hole 121 is opened on the circuit board 120, the chip 130 is arranged in the first through hole 121, and the circuit board 120 and the chip 130 are installed in a sinking manner, which greatly reduces the overall size of the optical fingerprint module 100. The height is favorable for realizing the ultra-thin optical fingerprint module 100 . The ultra-thin optical fingerprint module 100 can be applied to the mobile terminal 200 as an under-screen optical fingerprint module 100 of the mobile terminal 200. Since the optical fingerprint module 100 is completely installed under the display screen 210, it does not need to be displayed on the display. Setting physical buttons or virtual buttons on the screen 210 can greatly increase the screen ratio of the mobile terminal 200 and improve the visual effect.

Secondly, the optical fingerprint module 100 can support multi-chip 130 splicing applications, that is, multiple chips 130 are arranged in the optical fingerprint module 100 to increase the collection area of the chips 130 , thereby providing a super large sensing surface for the mobile terminal 200 . Finally, by setting the second through hole 221 in the middle frame 220 to install the optical fingerprint module 100, the assembly height of the optical fingerprint module 100 and the mobile terminal 200 is reduced, and more space in the thickness direction is provided for the battery assembly 230 and the like . Therefore, the mobile terminal 200 has a high screen ratio, a large sensing surface, and a thin thickness, which can meet the security requirements of mobile payment, and can realize 360-degree touch recognition in any direction, thereby greatly improving user experience.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical scope disclosed by the present invention can easily think of changes or substitutions. All should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. An optical fingerprint module is characterized by comprising a reinforcing plate, a circuit board and a chip, wherein a first groove is formed in the reinforcing plate, and the circuit board is arranged in the first groove; the chip is arranged on the bottom wall of the first groove, or on one side of the circuit board far away from the reinforcing plate, and the chip is electrically connected with the circuit board.

2. The optical fingerprint module of claim 1, wherein a second groove is formed in a side of the circuit board away from the stiffener, and the chip is disposed in the second groove; or, a first through hole is formed in the circuit board, the chip is located in the first through hole, and the chip is connected to the bottom wall of the first groove.

3. The optical fingerprint module of claim 2, wherein the circuit board has a plurality of first through holes disposed at intervals, the number of the chips is plural, and each chip is disposed in one of the first through holes.

4. The optical fingerprint module of claim 3, wherein the circuit board comprises a connection boss formed between two adjacent first through holes, and the chip is electrically connected to the connection boss.

5. The optical fingerprint module of claim 1, wherein the periphery of the chip is filled with a sealant, and a glue blocking layer is disposed on a side of the circuit board away from the stiffener and located at the periphery of the sealant.

6. The optical fingerprint module of any one of claims 1 to 5, wherein the circuit board and the stiffener are connected by an adhesive, and the chip and the stiffener are bonded by an adhesive.

7. A mobile terminal, comprising a display screen, a back cover and the optical fingerprint module set forth in any one of claims 1 to 6, wherein the display screen is connected with the back cover, a containing cavity is formed between the display screen and the back cover, and the optical fingerprint module set is disposed in the containing cavity.

8. The mobile terminal of claim 7, further comprising a middle frame, wherein one side of the middle frame is connected with the display screen, and the other side of the middle frame is connected with the rear cover; a second through hole is formed in one side, close to the display screen, of the middle frame, and the optical fingerprint module is arranged in the second through hole.

9. The mobile terminal according to claim 8, wherein the middle frame comprises a bearing part and a mounting part formed by protruding from a side surface of the bearing part close to the display screen, and the bearing part is provided with the second through hole;

the reinforcing plate comprises a bottom part and an extension part which are connected with each other, the bottom part is the bottom wall of the first groove, and the extension part is arranged in a manner of protruding outwards along the radial direction from one side, far away from the bottom part, of the side wall of the first groove; the bottom is arranged in the second through hole, and the extension part is arranged on the bearing part.

10. The mobile terminal of claim 7, wherein foam is disposed between the stiffener and the display.

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