CN110674797A - Optical fingerprint module and mobile terminal - Google Patents
Optical fingerprint module and mobile terminal Download PDFInfo
- Publication number
- CN110674797A CN110674797A CN201911093406.8A CN201911093406A CN110674797A CN 110674797 A CN110674797 A CN 110674797A CN 201911093406 A CN201911093406 A CN 201911093406A CN 110674797 A CN110674797 A CN 110674797A
- Authority
- CN
- China
- Prior art keywords
- chip
- fingerprint module
- circuit board
- optical fingerprint
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Vascular Medicine (AREA)
- Image Input (AREA)
- Telephone Set Structure (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an optical fingerprint module and a mobile terminal, and relates to the technical field of fingerprint modules. The optical fingerprint module comprises a reinforcing plate, a circuit board and a chip, wherein a first groove is formed in the reinforcing plate, and the circuit board is arranged in the first groove; the chip is positioned in the first groove and is electrically connected with the circuit board. This optics fingerprint module locates the circuit board in the first recess of stiffening plate for the whole height of optics fingerprint module reduces, and occupation space is littleer, is favorable to the ultra-thin design of optics fingerprint module and electronic product.
Description
Technical Field
The invention relates to the technical field of fingerprint modules, in particular to an optical fingerprint module and a mobile terminal.
Background
With the increasing popularization of terminals, especially mobile terminals, the requirements of users on the use experience of the terminals are higher and higher, and the application of the fingerprint identification technology in the terminals is also more and more popular. At present, a fingerprint identification module is usually installed in a fixed region under a screen of a terminal, so that the whole thickness of the terminal is thick, and the high requirement of a user on terminal lightness and thinness is difficult to meet.
Disclosure of Invention
The invention aims to provide an optical fingerprint module, which can effectively reduce the overall height of the optical fingerprint module and provide the optical fingerprint module with thinner thickness.
The invention aims to provide a mobile terminal which can improve screen occupation ratio and improve user experience.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment provides an optical fingerprint module, which includes a stiffener, a circuit board, and a chip, where the stiffener is provided with a first groove, and the circuit board is disposed in the first groove; the chip is arranged on the bottom wall of the first groove, or on one side of the circuit board far away from the reinforcing plate, and the chip is electrically connected with the circuit board.
In an optional embodiment, a second groove is formed in one side of the circuit board, which is far away from the reinforcing plate, and the chip is arranged in the second groove. Or, a first through hole is formed in the circuit board, the chip is located in the first through hole, and the chip is connected to the bottom wall of the first groove.
In an optional embodiment, the circuit board is provided with a plurality of first through holes arranged at intervals, the number of the chips is multiple, and each chip is correspondingly arranged in one first through hole.
In an alternative embodiment, the circuit board includes a connection pad formed between two adjacent first through holes, and the chip is electrically connected to the connection pad.
In an alternative embodiment, the periphery of the chip is filled with a sealant. One side of the circuit board, which is far away from the reinforcing plate, is provided with a glue blocking layer, and the glue blocking layer is positioned on the periphery of the sealant.
In an optional embodiment, the chip and the reinforcing plate are bonded by a bonding adhesive, and the circuit board and the reinforcing plate are connected by an adhesive.
In an alternative embodiment, the stiffening plate is a steel sheet.
In a second aspect, the present embodiment provides a mobile terminal, including a display screen, a back cover and the optical fingerprint module of any one of the foregoing embodiments, the display screen is connected with the back cover, and a receiving cavity is formed between the display screen and the back cover, and the optical fingerprint module is disposed in the receiving cavity.
In an optional embodiment, the mobile phone further comprises a middle frame, wherein one side of the middle frame is connected with the display screen, and the other side of the middle frame is connected with the rear cover; a second through hole is formed in one side, close to the display screen, of the middle frame, and the optical fingerprint module is arranged in the second through hole.
In an optional implementation manner, the middle frame includes a bearing portion and a mounting portion formed by protruding from a side surface of the bearing portion close to the display screen toward the display screen, and the bearing portion is provided with a second through hole. The reinforcing plate comprises a bottom part and an extension part which are connected with each other, the bottom part is the bottom wall of the first groove, and the extension part is arranged in a manner of protruding outwards along the radial direction from one side, far away from the bottom part, of the side wall of the first groove; the bottom is arranged in the second through hole, and the extension part is arranged on the bearing part.
In an alternative embodiment, foam is disposed between the reinforcing plate and the display screen.
The optical fingerprint module and the mobile terminal provided by the invention have the beneficial effects that:
compared with the prior art that the circuit board and the chip are directly arranged on the surface of the reinforcing plate in an installation mode, the optical fingerprint module provided by the invention is lower in overall height, is more beneficial to providing an ultrathin optical fingerprint module, and occupies less space in a terminal product.
The mobile terminal provided by the invention adopts the optical fingerprint module, and the optical fingerprint module is small in thickness, can be arranged below a display screen of the mobile terminal, does not occupy the area of the screen, is favorable for improving the screen occupation ratio of the mobile terminal, and improves the user experience.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an optical fingerprint module according to a first embodiment of the present invention;
fig. 2 is another schematic structural diagram of an optical fingerprint module according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of another view angle of the optical fingerprint module according to the first embodiment of the present invention;
fig. 4 is a schematic filling structure diagram of a sealing member of an optical fingerprint module according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of an optical fingerprint module according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of another view angle of the optical fingerprint module according to the second embodiment of the present invention;
fig. 7 is a schematic structural diagram of a mobile terminal according to a third embodiment of the present invention;
fig. 8 is a schematic structural diagram of a middle frame of a mobile terminal according to a third embodiment of the present invention;
fig. 9 is another schematic structural diagram of a middle frame of a mobile terminal according to a third embodiment of the present invention;
fig. 10 is a schematic structural diagram of a mobile terminal according to a fourth embodiment of the present invention.
Icon: 100-an optical fingerprint module; 110-a stiffener; 111-a first recess; 115-bottom; 117-an extension; 120-a circuit board; 121 — a first via; 123-a second groove; 125-a first mounting hole; 126-a second mounting hole; 127-a connecting boss; 128-a first boss; 129-a second boss; 130-chip; 1301-a chip collection area; 131-a collection chip; 133-a driver chip; 140-gold wires; 151-laminating adhesive; 153-glue resisting layer; 155-adhesive; 160-sealing glue; 200-a mobile terminal; 210-a display screen; 220-middle frame; 221-a second via; 222-a third groove; 223-a carrier; 225-an installation part; 226-a platform; 230-a battery assembly; 240-rear cover; 260-foam cotton; 261-first subsection; 263-second subsection.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
This embodiment provides an optics fingerprint module 100 and including this optics fingerprint module 100's mobile terminal 200, through set up first recess 111 on the stiffening plate 110 at optics fingerprint module 100, reduces whole optics fingerprint module 100's height, realizes the miniaturization of optics fingerprint module 100, ultra-thin design. Because ultra-thin optical fingerprint module 100 thickness is little, can install completely in the below of mobile terminal 200 display screen 210, as optical fingerprint module 100 under the screen, need not entity button or virtual button, can improve the screen by a wide margin and account for the ratio, promote user experience.
First embodiment
Referring to fig. 1, the present embodiment provides an optical fingerprint module 100, including a stiffener 110, a circuit board 120 and a chip 130, wherein the stiffener 110 is provided with a first groove 111, and the circuit board 120 is disposed in the first groove 111. Optionally, the circuit board 120 is attached to the bottom wall of the first groove 111 by an adhesive 155. Compared with the case that the circuit board 120 is installed on the reinforcement plate 110 that is not grooved, the circuit board 120 in this embodiment adopts a sinking arrangement mode to reduce the installation position of the circuit board 120, so that the overall height of the optical fingerprint module 100 is reduced. The chip 130 is located in the first groove 111 and electrically connected to the circuit board 120. Alternatively, the chip 130 is disposed on the stiffener 110, i.e., the chip 130 is directly connected to the bottom wall of the first groove 111; or the chip 130 is disposed on the circuit board 120 and located on the side of the circuit board 120 away from the bottom wall of the first groove 111 of the reinforcing plate 110. In this embodiment, the circuit board 120 is a flexible circuit board, and may be a printed circuit board or a rigid-flex circuit board; the chip 130 may be, but is not limited to, an optical fingerprint chip, and the chip 130 is connected to the circuit board 120 by a gold wire 140; the stiffening plate 110 is made of steel sheet, but the stiffening plate 110 may be made of other materials, such as FR4, PET or PI, and is not limited herein.
Further, a second groove 123 is formed on a side of the circuit board 120 away from the reinforcing plate 110, referring to fig. 2, the chip 130 is disposed on a bottom wall of the second groove 123, for example, the chip 130 can be attached to the bottom wall of the second groove 123 by an adhesive method. Compared with the way that the chip 130 is directly arranged on the surface of the circuit board 120, the method further reduces the overall height of the optical fingerprint module 100.
Optionally, referring to fig. 1 and fig. 3, a first through hole 121 is formed in the circuit board 120, that is, the depth of the first through hole 121 directly penetrates through the thickness of the circuit board 120, and the bottom wall of the first groove 111 is exposed. The chip 130 is located in the first through hole 121, and the chip 130 is connected to the bottom wall of the first groove 111. The chip 130 and the bottom wall of the first groove 111 on the reinforcing plate 110 are adhered by an adhesive 151, for example, the chip 130 can be adhered by the adhesive 151 of the ACF (Anisotropic Conductive Film), so that the chip 130 is adhered and fixed on the bottom wall of the first groove 111. The first through hole 121 is formed in the circuit board 120, so that the installation position of the chip 130 can be reduced as much as possible, the overall height of the optical fingerprint module 100 can be reduced as much as possible, and the ultra-thin optical fingerprint module 100 is provided.
As shown in fig. 4, the periphery of the chip 130 is filled with a sealant 160, which is used to protect the chip 130, prevent the gold wire 140 from oxidation and corrosion, and further fix the chip 130. Optionally, a sealant 160 is filled between the chip 130 and the wall of the first through hole 121, and a layer of the sealant 160 is also disposed on the upper surface of the chip 130 away from the stiffener 110, so as to prevent dust and the like from polluting the chip 130, and perform sealing and protecting functions on the chip 130, so as to improve the imaging quality of the optical fingerprint module 100.
The circuit board 120 is provided with a glue blocking layer 153 on one side of the bottom wall of the first groove 111 far away from the reinforcing plate 110, and the glue blocking layer 153 is located on the periphery of the sealant 160 and distributed annularly to prevent the filled sealant 160 from overflowing around. In this embodiment, the glue blocking layer 153 is a PI (Polyimide) stiffener 110 to block the sealant 160 from overflowing. Of course, in other alternative embodiments, the glue blocking layer 153 may also be made of foam or the like, and is not limited herein.
In the optical fingerprint module 100 provided in this embodiment, the circuit board 120 is disposed in the first groove 111 of the stiffener 110, and the chip 130 is disposed on the circuit board 120 in a manner of hollowing out the groove or the through hole, so that the overall height of the optical fingerprint module 100 is greatly reduced, which is beneficial to providing an ultra-thin optical fingerprint module 100.
It is understood that, in the embodiment, only one chip 130 is provided, the number of the chips 130 may be multiple, a plurality of chips 130 are arranged side by side, and each chip 130 is electrically connected to the circuit board 120. For example, when the optical fingerprint module 100 is used below the display screen 210 of an electronic product, each chip 130 includes a part of the chip collection area 1301, the display screen 210 corresponding to the chip collection area 1301 is a sensing surface, and the electronic product can be operated by touching the sensing surface with a finger. If set up a plurality of chips 130 in this optics fingerprint module 100, a plurality of chips 130 splice each other, can increase and gather the district area, provide the super large response face to fingerprint identification can all be realized in the regional touch of the bigger area of user on display screen 210, promotion user experience.
Second embodiment
Referring to fig. 5 and 6, the optical fingerprint module 100 provided in this embodiment includes a stiffener 110, a circuit board 120, and a plurality of chips 130. The reinforcing plate 110 is provided with a first groove 111, and the circuit board 120 is attached to the bottom wall of the first groove 111. A plurality of second grooves 123 or a plurality of first through holes 121 are disposed on a side of the circuit board 120 away from the bottom wall of the first groove 111, and the chip 130 is disposed in the second grooves 123 or the first through holes 121 to reduce the overall height of the optical fingerprint module 100.
It should be noted that the chip 130 adopted in this embodiment is the optical fingerprint chip 130, and includes the driving chip 133 and the collecting chip 131, the driving chip 133 and the collecting chip 131 may be separately arranged as two chips 130, or the two chips 130 may be combined into one and integrated on one chip 130. The optical fingerprint chip 130 shown in fig. 1 to 4 is in a manner that both are integrated, and the optical fingerprint chip 130 shown in fig. 5 and 6 is in a manner that both are separately provided.
In this embodiment, the circuit board 120 is provided with a plurality of first through holes 121. The circuit board 120 is provided with a plurality of first through holes 121 arranged at intervals, the number of the chips 130 is multiple, and each chip 130 is correspondingly arranged in one first through hole 121. The circuit board 120 includes a connection boss 127 formed between two adjacent first through holes 121, and the chip 130 is electrically connected to the connection boss 127.
Only two first vias 121 and two chips 130 are shown in the figure. For convenience of description, the two first through holes 121 are respectively defined as a first mounting hole 125 and a second mounting hole 126, the first mounting hole 125 is provided with a collecting chip 131, and the second mounting hole 126 is provided with a driving chip 133. The circuit board 120 includes a connection boss 127 formed at the center and a first boss 128 and a second boss 129 formed at both sides, the first mounting hole 125 is located between the first boss 128 and the connection boss 127, and the second mounting hole 126 is located between the second boss 129 and the connection boss 127. The collection chip 131 is electrically connected to the connection boss 127 and the first boss 128, respectively, and the driving chip 133 is electrically connected to the second boss 129 and the connection boss 127, respectively. Forming the connection boss 127 between the two first through holes 121 may facilitate electrical connection of the chip 130 and the circuit board 120.
The periphery of the collecting chip 131 is filled with a sealant 160 (not shown in fig. 5, see fig. 4), and the gap between the first mounting hole 125 and the collecting chip 131 is filled with the sealant 160 to protect the collecting chip 131 from being contaminated by foreign matters such as dust, and to prevent the gold wire 140 from being oxidized and corroded. The periphery of the driving chip 133 is filled with the sealant 160, and the gap between the second mounting hole 126 and the driving chip 133 is filled with the sealant 160, so as to protect the driving chip 133 from contamination of foreign matters such as dust, and simultaneously prevent the gold wire 140 from oxidation corrosion. The side of the circuit board 120 away from the bottom wall of the first groove 111 of the reinforcing plate 110 is provided with a glue blocking layer 153 at the periphery of the sealant 160 for blocking the sealant 160 from overflowing to the periphery. The glue resisting layer 153 can be reinforced by PI, and a reinforcing ring is formed on the periphery of the sealant 160; alternatively, the glue barrier 153 may be made of foam or the like.
It is easy to understand that there may be a plurality of first mounting holes 125 and second mounting holes 126, and there may also be a plurality of acquisition chips 131 and driving chips 133, and a plurality of acquisition chips 131 and a plurality of driving chips 133 are arranged side by side and are respectively connected to the circuit board 120. Therefore, the area of the collection chip 131 can be increased, so that a larger sensing surface is provided on the display screen 210 for operation of a user, and the user experience is improved. Of course, the invention is not limited to this, and in other alternative embodiments, a first through hole 121 with a larger aperture may be disposed on the circuit board 120, and a plurality of chips 130 may be disposed in the first through hole 121 at the same time, and each chip 130 is electrically connected to the circuit board 120, which is not limited in this respect.
The second grooves 123 are formed in the circuit board 120, and other contents not mentioned in the present embodiment are similar to those described in the first embodiment, and will not be described in detail here.
In the optical fingerprint module 100 provided in this embodiment, the reinforcing plate 110 is provided with the first groove 111, and the circuit board 120 is installed on the bottom wall of the first groove 111; set up first through-hole 121 on circuit board 120, chip 130 installs at first through-hole 121, realizes that optical fingerprint module 100's whole height reduces, provides ultra-thin optical fingerprint module 100. In addition, the situation that a plurality of chips 130 set up on stiffening plate 110 has been demonstrated, the installation of the optical fingerprint chip 130 of the various different grade types of adaptation sets up multiunit chip 130 simultaneously, is favorable to providing the super large response face, promotes user experience by a wide margin.
Third embodiment
As shown in fig. 7, the present embodiment provides a mobile terminal 200, which includes a display screen 210, a rear cover 240, a middle frame 220, a battery assembly 230, and the optical fingerprint module 100 of any of the foregoing embodiments, wherein the display screen 210 and the rear cover 240 are disposed opposite to each other and form a receiving cavity therebetween, the optical fingerprint module 100 and the battery assembly 230 are disposed in the receiving cavity, and the middle frame 220 is used for connecting the display screen 210 and the rear cover 240. This mobile terminal 200 sets up optical fingerprint module 100 completely in display screen 210 below (between display screen 210 and hou gai 240), adopts optical fingerprint module 100 under the screen, need not entity button or virtual button, can improve mobile terminal 200's screen to account for than by a wide margin. Because this optics fingerprint module 100 is applicable to a plurality of chips 130 concatenation and uses, can provide super large response area, the user directly dabs mobile terminal 200 display screen 210 specified area and can realize fingerprint identification, can realize 360 degrees arbitrary direction touch identification, promotes user experience by a wide margin.
Alternatively, as shown in fig. 8, one side of the middle frame 220 is connected to the display screen 210, and the other side is connected to the rear cover 240; a third groove 222 is formed in one side of the middle frame 220 close to the display screen 210, and the optical fingerprint module 100 is disposed in the third groove 222. Through setting up third recess 222, make the mounted position of optical fingerprint module 100 sink, reduce the thickness of whole mobile terminal 200. The battery assembly 230 is disposed on a side of the middle frame 220 away from the display screen 210, i.e., between the middle frame 220 and the rear cover 240. Optionally, the middle frame 220 includes a bearing portion 223 and a mounting portion 225 formed by a side surface of the bearing portion 223 near the display screen 210 protruding toward the display screen 210, and the mounting portion 225 and the bearing portion 223 form a third groove 222. The mounting part 225 is connected with the display screen 210, and one side of the bearing part 223 far away from the display screen 210 is connected with the rear cover 240; the optical fingerprint module 100 is disposed on a side of the supporting portion 223 close to the display screen 210.
Further, as shown in fig. 9, the bearing part 223 is opened with the second through hole 221, and it should be understood that the diameter of the second through hole 221 is smaller than the diameter of the third groove 222, so that the bearing part 223 forms a bearing platform 226 between the second through hole 221 and the mounting part 225. The reinforcing plate 110 includes a bottom portion 115 and an extension portion 117 connected to each other, the bottom portion 115 being a bottom wall of the first groove 111; the extension portion 117 is provided to protrude radially outward from a side surface of the side wall of the first groove 111 away from the bottom wall. The bottom 115 is disposed in the second through hole 221, and the extension portion 117 is disposed on the platform 226 of the supporting portion 223. Through set up second through-hole 221 on load-bearing portion 223, make the mounted position of optics fingerprint module 100 sink as far as possible to reduce the assembly thickness of optics fingerprint module 100 as far as possible, reserved the space of more thickness directions for battery pack 230, also be favorable to reducing mobile terminal 200's whole thickness simultaneously.
In this embodiment, taking the example that the mobile terminal 200 includes the optical fingerprint module 100 provided in the foregoing first embodiment as an example, when the chip 130 in the optical fingerprint module 100 is integrated with the driving chip 133 and the collecting chip 131 into a whole, the assembly of the optical fingerprint module 100 in the mobile terminal 200 is shown in the figure. Foam 260 is disposed between the reinforcing plate 110 and the display screen 210. Optionally, the display screen 210 is an OLED light-emitting display screen, and one side of the extending portion 117 on the reinforcing plate 110, which is close to the display screen 210, is assembled with the OLED light-emitting display screen through the light-shielding pressing and attaching foam 260, so as to reduce the assembly thickness of the optical fingerprint module 100. Further, the foam 260 includes a first sub portion 261 and a second sub portion 263 connected to each other, where one side of the first sub portion 261 is attached to the extension portion 117, and the other side is attached to the display screen 210. The second subsection 263 extends inward in the radial direction of the second through hole 221. Optionally, a glue blocking layer 153 for blocking the overflow of the sealant 160 is disposed on a side of the circuit board 120 away from the bottom 115, and the second portion 263 extends to an end surface of the glue blocking layer 153 close to the sealant 160 and is attached between the glue blocking layer 153 and the display screen 210. The foam 260 is used for covering the circuit board 120 around the chip 130, so that light rays of the OLED light-emitting display screen are reduced from being incident into the first through hole 121, interference of stray light on the chip 130 is reduced, and the imaging quality of the optical fingerprint module 100 is improved.
Because optics fingerprint module 100 sets up in display screen 210 below completely, can set up a plurality of chips 130 in optics fingerprint module 100, neither can influence the screen and account for the ratio, can also increase the response face, can satisfy the security requirement of mobile payment, realize 360 degrees arbitrary direction touch identifications, promote user experience by a wide margin. Of course, the optical fingerprint module 100 may be applied to other touch devices and terminal devices besides the mobile terminal 200, such as a mobile phone, a tablet computer, and the like, and is not limited herein.
Fourth embodiment
Referring to fig. 10, the present embodiment provides a mobile terminal 200, which employs the optical fingerprint module 100 of the second embodiment. When the chip 130 in the optical fingerprint module 100 is separately disposed by using the driving chip 133 and the capturing chip 131, that is, the driving chip 133 and the capturing chip 131 need to be disposed on the reinforcing plate 110 at the same time, at this time, the optical fingerprint module 100 is assembled in the mobile terminal 200 as shown in the figure.
The optical fingerprint module 100 is installed in the second through hole 221 of the middle frame 220, two first through holes 121 are formed in the circuit board 120, the acquisition chip 131 is arranged in one first through hole 121, the driving chip 133 is arranged in the other first through hole 121, and the connecting boss 127 is formed between the two first through holes 121. The gap between the acquisition chip 131 and the first through hole 121 and the gap between the driving chip 133 and the first through hole 121 are filled with a sealant 160, a sealant layer 153 is arranged on the periphery of the sealant 160, and the sealant layer 153 is arranged on the circuit board 120 to prevent the sealant 160 from overflowing to the periphery. Only the sealant 160 in the second mounting hole 126 is shown and the sealant 160 in the first mounting hole 125 is not shown. In addition, the sealant 160 is added on the side of the driving chip 133 away from the reinforcing plate 110, i.e., above the driving chip 133, so as to wrap the driving chip 133 and the connecting boss 127 together. The first subsection 261 of the foam 260 is attached between the reinforcing plate 110 and the display screen 210, and the second subsection 263 of the foam 260 is extended to the sealant 160 above the connecting boss 127, that is, the second subsection 263 of the foam 260 is extended inwards to the sealant 160 above the connecting boss 127 along the radial direction of the second through hole 221, so as to cover the driving chip 133 and the connecting boss 127. The surface of one side of the second part 263 is attached to the sealant 160 of the optical fingerprint module 100, and the other side is attached to the display screen 210, so that the light of the OLED light-emitting display screen is reduced to be incident into the first through hole 121, the interference of stray light to the chip 130 is reduced, and the imaging quality of the optical fingerprint module 100 is improved.
In other optional embodiments, the mobile terminal 200 may also be provided with a plurality of driving chips 133 and a plurality of acquisition chips 131 under the screen to increase the sensing surface, meet the security requirement of mobile payment, realize touch recognition in any direction of 360 degrees, and greatly improve user experience. In addition, other contents not mentioned in this embodiment are similar to those in the third embodiment, and are not described again here.
In summary, the embodiment of the present invention provides an optical fingerprint module 100 and a mobile terminal 200, in which the optical fingerprint module 100 has a first groove 111 formed on a stiffener 110, and a circuit board 120 is disposed in the first groove 111; set up first through-hole 121 on circuit board 120, chip 130 sets up in first through-hole 121, adopts the sunken mounting means with circuit board 120 and chip 130, greatly reduced optical fingerprint module 100's overall height, be favorable to realizing ultra-thin type optical fingerprint module 100. This kind of ultra-thin type optics fingerprint module 100 can use on mobile terminal 200, as optics fingerprint module 100 under mobile terminal 200's the screen, because optics fingerprint module 100 installs the below at display screen 210 completely, need not to set up entity button or virtual button on display screen 210, can improve mobile terminal 200's screen by a wide margin and account for than, promote visual effect.
Secondly, this optical fingerprint module 100 can support multicore piece 130 concatenation application, sets up a plurality of chips 130 in optical fingerprint module 100 promptly, increases the regional area of gathering of chip 130 to provide the super large response face for mobile terminal 200. Finally, through setting up second through-hole 221 at center 220 to installation optics fingerprint module 100 has reduced the assembly height of optics fingerprint module 100 and mobile terminal 200, provides more thickness direction's space for battery pack 230 etc.. Therefore, the screen of the mobile terminal 200 has high occupation ratio, a large sensing surface and a small thickness, can meet the safety requirement of mobile payment, can realize touch identification in any direction at 360 degrees, and greatly improves the user experience.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. An optical fingerprint module is characterized by comprising a reinforcing plate, a circuit board and a chip, wherein a first groove is formed in the reinforcing plate, and the circuit board is arranged in the first groove; the chip is arranged on the bottom wall of the first groove, or on one side of the circuit board far away from the reinforcing plate, and the chip is electrically connected with the circuit board.
2. The optical fingerprint module of claim 1, wherein a second groove is formed in a side of the circuit board away from the stiffener, and the chip is disposed in the second groove; or, a first through hole is formed in the circuit board, the chip is located in the first through hole, and the chip is connected to the bottom wall of the first groove.
3. The optical fingerprint module of claim 2, wherein the circuit board has a plurality of first through holes disposed at intervals, the number of the chips is plural, and each chip is disposed in one of the first through holes.
4. The optical fingerprint module of claim 3, wherein the circuit board comprises a connection boss formed between two adjacent first through holes, and the chip is electrically connected to the connection boss.
5. The optical fingerprint module of claim 1, wherein the periphery of the chip is filled with a sealant, and a glue blocking layer is disposed on a side of the circuit board away from the stiffener and located at the periphery of the sealant.
6. The optical fingerprint module of any one of claims 1 to 5, wherein the circuit board and the stiffener are connected by an adhesive, and the chip and the stiffener are bonded by an adhesive.
7. A mobile terminal, comprising a display screen, a back cover and the optical fingerprint module set forth in any one of claims 1 to 6, wherein the display screen is connected with the back cover, a containing cavity is formed between the display screen and the back cover, and the optical fingerprint module set is disposed in the containing cavity.
8. The mobile terminal of claim 7, further comprising a middle frame, wherein one side of the middle frame is connected with the display screen, and the other side of the middle frame is connected with the rear cover; a second through hole is formed in one side, close to the display screen, of the middle frame, and the optical fingerprint module is arranged in the second through hole.
9. The mobile terminal according to claim 8, wherein the middle frame comprises a bearing part and a mounting part formed by protruding from a side surface of the bearing part close to the display screen, and the bearing part is provided with the second through hole;
the reinforcing plate comprises a bottom part and an extension part which are connected with each other, the bottom part is the bottom wall of the first groove, and the extension part is arranged in a manner of protruding outwards along the radial direction from one side, far away from the bottom part, of the side wall of the first groove; the bottom is arranged in the second through hole, and the extension part is arranged on the bearing part.
10. The mobile terminal of claim 7, wherein foam is disposed between the stiffener and the display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911093406.8A CN110674797A (en) | 2019-11-11 | 2019-11-11 | Optical fingerprint module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911093406.8A CN110674797A (en) | 2019-11-11 | 2019-11-11 | Optical fingerprint module and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110674797A true CN110674797A (en) | 2020-01-10 |
Family
ID=69086758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911093406.8A Pending CN110674797A (en) | 2019-11-11 | 2019-11-11 | Optical fingerprint module and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110674797A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111273734A (en) * | 2020-01-22 | 2020-06-12 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
| WO2022056937A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
| WO2022056938A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
-
2019
- 2019-11-11 CN CN201911093406.8A patent/CN110674797A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111273734A (en) * | 2020-01-22 | 2020-06-12 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| CN111273734B (en) * | 2020-01-22 | 2021-06-04 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| WO2022056937A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
| WO2022056938A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
| CN112183340B (en) * | 2020-09-28 | 2024-04-26 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110674797A (en) | Optical fingerprint module and mobile terminal | |
| US10565425B2 (en) | Under-screen biometric identification apparatus, biometric identification component and terminal device | |
| US11119615B2 (en) | Fingerprint sensor and button combinations and methods of making same | |
| CN105404880B (en) | Electronic device with fingerprint sensor assembly | |
| US9743564B2 (en) | Electromagnetic shielding structures | |
| CN103390374B (en) | Display device and manufacture method thereof | |
| CN106385473B (en) | Casing, fingerprint module and mobile terminal | |
| KR20190028617A (en) | Protective film, display module, display device, method of manufacturing display module and method of manufacturing display device | |
| CN111512447A (en) | Fingerprint identification module and electronic device comprising same | |
| CN210776723U (en) | Optical fingerprint module and mobile terminal | |
| CN111191635A (en) | Fingerprint identification module and fingerprint identification display device | |
| CN112183340B (en) | Optical fingerprint module and mobile terminal | |
| EP3288245B1 (en) | Fingerprint sensor and terminal using the same | |
| CN216250727U (en) | Chip packaging structure and electronic equipment | |
| US11393243B2 (en) | Structural component, electronic apparatus, and fingerprint module assembly method | |
| CN107241469B (en) | Decorative ring, cover plate assembly, electronic device and manufacturing method of cover plate assembly | |
| WO2014065511A1 (en) | Fingerprint sensor package, and portable electronic device including same | |
| CN109471547B (en) | Touch display panel and display device | |
| CN213338754U (en) | Fingerprint module and electronic equipment | |
| KR20210145970A (en) | Optical fingerprint recognition sensor module and electronic device using the same | |
| CN111049961A (en) | Terminal equipment | |
| CN211787126U (en) | Fingerprint identification module and fingerprint identification display device | |
| CN211236924U (en) | Fingerprint module and electronic equipment | |
| CN216957009U (en) | Touch structure and electronic equipment | |
| CN212365016U (en) | Waterproof side fingerprint device and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201210 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshanqiu titanium biometric technology Co., Ltd Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right |