CN110671401A - Flowmeter probe gluing method - Google Patents
Flowmeter probe gluing method Download PDFInfo
- Publication number
- CN110671401A CN110671401A CN201910944807.3A CN201910944807A CN110671401A CN 110671401 A CN110671401 A CN 110671401A CN 201910944807 A CN201910944807 A CN 201910944807A CN 110671401 A CN110671401 A CN 110671401A
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- Prior art keywords
- gluing
- front window
- flowmeter
- flow meter
- cathode
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000523 sample Substances 0.000 title claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 238000007605 air drying Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000010923 batch production Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 6
- 229920006335 epoxy glue Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention discloses a gluing method for a flowmeter probe, and belongs to the technical field of piezoelectric ceramic devices. Firstly, cleaning a front window and a ceramic wafer of a flowmeter; then horizontally placing the ceramic wafer on a positioning tool, enabling the cathode gluing surface to be upward, and dripping glue on the cathode gluing surface; placing a front window of the flow meter, wherein the gluing surface of the inner cavity of the front window of the flow meter is glued with the cathode gluing surface of the ceramic plate; then the top end of the front window of the flowmeter is pressed and loosened; and finally, detaching the positioning tool. Compared with the existing hot-press gluing method, the gluing method saves the time for waiting for glue to be cured, greatly improves the production efficiency, saves a large amount of labor cost, does not need to use a high-temperature oven when operated at room temperature, reduces the energy consumption, and ensures that the performance of the glued product is better. Because the gluing process is completed in one step, problems in production can be found in time and immediately stopped to be solved, and the occurrence of batch production problems is avoided.
Description
Technical Field
The invention relates to the technical field of piezoelectric ceramic devices, in particular to a gluing method for a flowmeter probe.
Background
In the production of the flow meter probe, the piezoelectric ceramics and the front window are mainly glued by epoxy glue through hot pressing. The epoxy glue is a double-component glue which is divided into a component A and a component B, and the epoxy glue is used according to the proportion of 5: 2 and mixing well. When in use, the adhesive needs to be heated in an environment of 60 ℃, so that the curing speed is accelerated and the best gluing effect is achieved.
The hot-press gluing method is characterized in that a thin layer of epoxy glue (such as 7003A/B) is added between a cleaned front window and piezoelectric ceramic, a positioning tool is used for fixing the ceramic plate and the front window, so that the ceramic is glued at the central position of the front window, then a spring piece is used for applying pressure, the gluing area and the gluing effect are increased, and finally the ceramic plate and the front window are placed into a constant-temperature oven for heating, so that the curing speed of the epoxy glue can be accelerated at high temperature, and the production period is shortened; after 2 hours, the glue is naturally cooled, and the gluing work is finished after the positioning tool is removed. The hot-press gluing method has long curing time, multiple process steps and low production efficiency.
Disclosure of Invention
The invention aims to provide a flowmeter probe gluing method to solve the problems of long heating time and low production efficiency of the existing hot pressing method.
In order to solve the technical problem, the invention provides a flowmeter probe gluing method, which comprises the following steps:
cleaning a front window and a ceramic plate of the flowmeter;
horizontally placing the ceramic wafer on a positioning tool, enabling the cathode gluing surface to be upward, and dripping glue on the cathode gluing surface;
placing a front window of the flow meter, wherein the gluing surface of the inner cavity of the front window of the flow meter is attached to the cathode gluing surface of the ceramic plate;
the top end of the front window of the flowmeter is pressed and then released;
and (5) detaching the positioning tool.
Optionally, wash flowmeter front window and ceramic wafer and include:
cleaning a front window of the flowmeter by using clear water and air-drying;
soaking and cleaning the ceramic wafer with alcohol and air-drying.
Optionally, the glue is loctite 4850 glue.
Alternatively, the time for pressing the top end of the front window is 4 ~ 7 seconds.
Optionally, the time for pressing the top end of the front window is 5 seconds.
The invention provides a gluing method of a flowmeter probe, which comprises the following steps of firstly cleaning a front window and a ceramic wafer of a flowmeter; then horizontally placing the ceramic wafer on a positioning tool, enabling the cathode gluing surface to be upward, and dripping glue on the cathode gluing surface; placing a front window of the flow meter, wherein the gluing surface of the inner cavity of the front window of the flow meter is glued with the cathode gluing surface of the ceramic plate; then the top end of the front window of the flowmeter is pressed and loosened; and finally, detaching the positioning tool.
Compared with the existing hot-press gluing method, the gluing method saves the time for waiting for glue to be cured, greatly improves the production efficiency, saves a large amount of labor cost, does not need to use a high-temperature oven when operated at room temperature, reduces the energy consumption, and ensures that the performance of the glued product is better. Because the gluing process is completed in one step, problems in production can be found in time and immediately stopped to be solved, and the occurrence of batch production problems is avoided.
Drawings
Fig. 1 is a schematic flow chart of a method for gluing a flowmeter probe provided by the invention.
Detailed Description
The gluing method for the flowmeter probe provided by the invention is further explained in detail with reference to the attached drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides a flowmeter probe gluing method, the flow schematic diagram of which is shown in figure 1, comprising the following steps:
step S11, cleaning a front window and a ceramic plate of the flowmeter;
step S12, horizontally placing the ceramic wafer on a positioning tool, enabling the cathode gluing surface to be upward, and dripping glue on the cathode gluing surface;
s13, placing a front window of the flow meter, wherein the gluing surface of the inner cavity of the front window of the flow meter is glued with the cathode gluing surface of the ceramic plate;
s14, pressing the top end of the front window of the flowmeter and then releasing;
and step S15, detaching the positioning tool.
The method comprises the following steps of cleaning a front window of a flowmeter by using clear water, air-drying, soaking and cleaning a ceramic wafer by using alcohol, air-drying, horizontally placing the ceramic wafer on a positioning tool, enabling a cathode gluing surface of the ceramic wafer to face upwards, dripping glue on a cathode gluing surface of the ceramic wafer, wherein the glue is preferably Letai 4850 glue, placing a front window of the flowmeter, enabling an inner cavity gluing surface of the front window of the flowmeter to be attached to the cathode gluing surface of the ceramic wafer, pressing the top end of the front window of the flowmeter for 4 ~ 7 seconds, then loosening, preferably pressing for 5 seconds, and finally detaching the positioning tool.
Compared with the existing hot-press gluing method, the gluing method saves the time for waiting for glue to be cured, greatly improves the production efficiency, saves a large amount of labor cost, does not need to use a high-temperature oven when operated at room temperature, reduces the energy consumption, and ensures that the performance of the glued product is better. Because the gluing process is completed in one step, problems in production can be found in time and immediately stopped to be solved, and the occurrence of batch production problems is avoided.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (5)
1. A method of gluing a flow meter probe, comprising:
cleaning a front window and a ceramic plate of the flowmeter;
horizontally placing the ceramic wafer on a positioning tool, enabling the cathode gluing surface to be upward, and dripping glue on the cathode gluing surface;
placing a front window of the flow meter, wherein the gluing surface of the inner cavity of the front window of the flow meter is attached to the cathode gluing surface of the ceramic plate;
the top end of the front window of the flowmeter is pressed and then released;
and (5) detaching the positioning tool.
2. The method of gluing a flow meter probe as in claim 1, wherein cleaning the flow meter front window and the ceramic wafer comprises:
cleaning a front window of the flowmeter by using clear water and air-drying;
soaking and cleaning the ceramic wafer with alcohol and air-drying.
3. The method of gluing a flow meter probe of claim 1, wherein the glue is a loctite 4850 glue.
4. The method of gluing a flow meter probe of claim 1, wherein the time to press the top of the front window is 4 ~ 7 seconds.
5. The method of gluing a flow meter probe of claim 4, wherein the time to press the top of the front window is 5 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910944807.3A CN110671401A (en) | 2019-09-30 | 2019-09-30 | Flowmeter probe gluing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910944807.3A CN110671401A (en) | 2019-09-30 | 2019-09-30 | Flowmeter probe gluing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110671401A true CN110671401A (en) | 2020-01-10 |
Family
ID=69078822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910944807.3A Pending CN110671401A (en) | 2019-09-30 | 2019-09-30 | Flowmeter probe gluing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110671401A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112246568A (en) * | 2020-10-23 | 2021-01-22 | 海鹰企业集团有限责任公司 | Novel flow meter probe wafer gluing method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141067A (en) * | 2010-01-29 | 2011-08-03 | 中国人民解放军国防科学技术大学 | Method for sticking piezoelectric ceramic actuator in structural vibration control |
| CN104454848A (en) * | 2014-11-04 | 2015-03-25 | 上海飞利环球汽车零部件有限公司 | Multi-accessory laminating plate structure process method |
| CN107053679A (en) * | 2017-05-11 | 2017-08-18 | 昆山钰立电子科技股份有限公司 | The hot-pressing gluing technology of plastic parts and metal |
| US20170240475A1 (en) * | 2011-11-30 | 2017-08-24 | Component Re-Engineering Company, Inc. | Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices |
| CN206904004U (en) * | 2017-06-06 | 2018-01-19 | 天津爱普勒斯电子有限公司 | A kind of guidance type positioning bonding assembled fixture |
| CN108131370A (en) * | 2017-12-07 | 2018-06-08 | 湖北工业大学 | The method of attaching of foil gauge in rock triaxial compression test |
| CN109322888A (en) * | 2018-11-02 | 2019-02-12 | 广州凯立达电子有限公司 | The bottom cover of watch of deep water overpressure resistant and the stickup curing method of piezoelectric ceramic piece |
| CN209100426U (en) * | 2018-10-31 | 2019-07-12 | 广东思威特智能科技股份有限公司 | A kind of piezo sticker |
| CN209414347U (en) * | 2018-12-12 | 2019-09-20 | 江西合力泰科技有限公司 | A kind of joint tool of touch module |
-
2019
- 2019-09-30 CN CN201910944807.3A patent/CN110671401A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141067A (en) * | 2010-01-29 | 2011-08-03 | 中国人民解放军国防科学技术大学 | Method for sticking piezoelectric ceramic actuator in structural vibration control |
| US20170240475A1 (en) * | 2011-11-30 | 2017-08-24 | Component Re-Engineering Company, Inc. | Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices |
| CN104454848A (en) * | 2014-11-04 | 2015-03-25 | 上海飞利环球汽车零部件有限公司 | Multi-accessory laminating plate structure process method |
| CN107053679A (en) * | 2017-05-11 | 2017-08-18 | 昆山钰立电子科技股份有限公司 | The hot-pressing gluing technology of plastic parts and metal |
| CN206904004U (en) * | 2017-06-06 | 2018-01-19 | 天津爱普勒斯电子有限公司 | A kind of guidance type positioning bonding assembled fixture |
| CN108131370A (en) * | 2017-12-07 | 2018-06-08 | 湖北工业大学 | The method of attaching of foil gauge in rock triaxial compression test |
| CN209100426U (en) * | 2018-10-31 | 2019-07-12 | 广东思威特智能科技股份有限公司 | A kind of piezo sticker |
| CN109322888A (en) * | 2018-11-02 | 2019-02-12 | 广州凯立达电子有限公司 | The bottom cover of watch of deep water overpressure resistant and the stickup curing method of piezoelectric ceramic piece |
| CN209414347U (en) * | 2018-12-12 | 2019-09-20 | 江西合力泰科技有限公司 | A kind of joint tool of touch module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112246568A (en) * | 2020-10-23 | 2021-01-22 | 海鹰企业集团有限责任公司 | Novel flow meter probe wafer gluing method |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20200110 |