CN110670747A - Green environment-friendly heat-insulation board - Google Patents
Green environment-friendly heat-insulation board Download PDFInfo
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- CN110670747A CN110670747A CN201910964487.8A CN201910964487A CN110670747A CN 110670747 A CN110670747 A CN 110670747A CN 201910964487 A CN201910964487 A CN 201910964487A CN 110670747 A CN110670747 A CN 110670747A
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Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
- E04B1/806—Heat insulating elements slab-shaped with air or gas pockets included in the slab
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Building Environments (AREA)
Abstract
The invention discloses a green environment-friendly heat-insulating plate which comprises a middle supporting material with a honeycomb structure, wherein high-gas-resistance material layers are wrapped outside two sides of the middle supporting material, the inner side surface of each high-gas-resistance material layer is provided with a low-emissivity surface, honeycomb holes of the middle supporting material are filled with air, argon, carbon dioxide or a mixture of the air, the argon and the carbon dioxide or the mixture of the air, the argon and the carbon dioxide, or the mixture of the air, the argon and the carbon dioxide is vacuumized, a phonon eutectic is coated on the low-emissivity surface and the surface of the middle supporting material or is mixed with the. The invention can reduce the transmission of heat flow by adopting a reasonable structure and matching with the phonon eutectic, achieves lower heat conductivity coefficient, has light weight and good flame retardant effect, can be cut into any size to meet the installation requirement, can be folded into multiple layers for use to meet the requirements of installation thickness and thermal resistance, can recycle the used materials, has simple production process and use process, is pollution-free, and belongs to green and environment-friendly.
Description
Technical Field
The invention relates to a green environment-friendly material, in particular to a green environment-friendly heat-insulating board for heat insulation of walls and other objects.
Background
Heat transfer occurs by three mechanisms: thermal conduction, thermal convection, and thermal radiation. Thermal conduction is the transfer of kinetic energy between molecules of a substance. Thermal convection is the transfer of heat by molecules of a substance moving from one place to another in space. Thermal radiation is the transfer of heat in the space between two objects by electromagnetic waves.
Thermal insulation materials have been developed in an effort to reduce thermal conduction, convection and radiation. Many thermal insulation materials have emerged in the 1950 s, but widespread use has only begun by the time of the oil crisis in the 1970 s. Due to the oil crisis, coupled with the improvement of living conditions, it is becoming very important that buildings need to be insulated, to prevent heat loss, and to improve energy efficiency. The usual thermal insulation mechanism is to use air as the best insulator. The thermal conductivity coefficient of air at normal temperature is 0.025 w/(m.K), and the purpose of low thermal conductivity coefficient is achieved by trapping air in tiny pores of the common thermal insulation materials, but the minimum limit of the thermal conductivity coefficient of the common thermal insulation materials is also limited. The heat conductivity coefficient of the commonly used heat preservation and insulation material is 0.035-0.06 w/(m.K). Recently developed Vacuum technology combined with microporous structural materials can achieve thermal conductivities of less than 0.025 w/(m.K), which is the Vacuum Insulation Panel (VIP).
The commonly used heat preservation and insulation materials include: expanded Polystyrene (EPS), Extruded Polystyrene (XPS), Polyurethane Foam (PU or PUR), Phenolic resin Insulation Board (PIB), glass fiber wool, rock wool, and the like. The raw materials such as EPS, XPS, PU, PIB and the like are derived from petroleum products, pollution in the production process is not environment-friendly, the products cannot be recycled, and the products are white and colored pollution sources, and finally pollute the environment and water bodies. The production process of glass fiber cotton, rock wool and the like is high temperature and high energy consumption, dust pollution is serious in the production and use processes, 20-30% of adhesives, resins and the like contained in the glass fiber cotton, the rock wool and the like are mostly from petroleum products, the products are difficult to recycle, and finally the environment and the water body are polluted. These commonly used heat insulating materials have environmental problems, which affect the ecological environment and sustainable development.
For the sake of analytical convenience, the three heat transfer processes are all expressed in terms of thermal conductivity. In these conventional thermal insulating materials, the heat conduction and convection of gas or air can be considered as a combined heat transfer, which is determined by the gas thermal conductivity λgAnd (4) showing. The total heat transfer coefficient of the heat-insulating material is expressed by each coefficient:
λ＝λg+λs+λr……(1)
in the formula: lambda [ alpha ]g-the thermal conductivity of the gas in the pores of the thermal insulation material, w/(m · K).
λsThe thermal conductivity of the solid component of the thermal insulation material, w/(m.K).
λrThermal conductivity of the thermal radiation of the thermal insulation material, w/(m.K).
The vacuum panel VIP is presented to reduce lambdagAnd λrAnd the overall thermal conductivity lambda is reduced. The vacuum panel VIP is composed of three parts:
(1) high gas barrier outer coating layer: preventing gas (air) from leaking in.
(2) Core material: the porous material is made into a plate shape and used as a supporting framework, and the porous material is subjected to atmospheric pressure after being vacuumized. The porous material is generally aerogel, expanded perlite, glass fiber, mineral wool, etc.
(3) Getter: the core material can generate gas, air can leak into the VIP plate of the vacuum plate, and the getter can absorb the gas.
The convection heat transfer is realized by the integral movement of gas molecules existing in the heat-insulating material, and the vacuum can reduce the convection heat transfer. The vacuum can also reduce the thermal conduction of the gas because the collisions of the attached gas molecules and atoms, or gas molecules and atoms, with the core material are reduced. The thermal property of the core material of the vacuum plate VIP is the same as that of the common heat preservation and insulation material, and the vacuum plate VIP can achieve a smaller heat conductivity coefficient. Some studies have claimed that a minimum thermal conductivity of 0.004 w/(m.k) can be achieved in the central region of the vacuum panel VIP. Although the vacuum panel VIP has the effect of edge thermal bridging, some studies have claimed that the vacuum panel VIP can achieve an overall thermal conductivity of 0.006-0.008w/(m · K). In fact, in practical applications, it is difficult to maintain the vacuum in the vacuum panel VIP, and a thermal conductivity less than that of air is not much achieved. Over the past decades, much effort has been made to improve the structure of vacuum panels VIP, and much work has been done to maintain vacuum levels. Plastics are compounded with aluminum foil and other metal foils to form surface protective layers as outer wraps, for example, U.S. patent 4,444,821 to Young et al, U.S. patent 4,529,638 to Yamamoto et al, and U.S. patent 8,663,773 to Jang et al.
To improve the gas barrier properties, double outer wraps are used, for example, U.S. Pat. No. 4,726,974 to Nowobilski et al, U.S. Pat. No. 7,449,227B2 to Echigoya et al, U.S. Pat. No. 7,517,576B2 to Echigoya et al, U.S. Pat. No. 7,968,159B2 to Feinerman, U.S. Pat. No. 8,137,784B2 to Veltkamp, and U.S. Pat. No. 8,475,893B2 to Feinerman. The vacuum panel VIP of the multi-layer structure is described in detail in U.S. patent 8,383,225B2 to Rotter.
The sealing of the vacuum panel VIP to maintain a vacuum is important and various sealing methods have been developed and invented, such as U.S. patent 8,281,558B2 to Hiemeyer et al and U.S. patent 8,377,538B2 to Eberhardt et al.
The getter absorbs and absorbs the gas leaked into the vacuum panel VIP or the gas released by the air and the core material. Getter materials include zeolites, activated carbon, and quicklime, among others, for example, U.S. patent 7,838,098B2 to Kim et al and U.S. patent 8,663,773 to Jang et al. Getters can also be combined and constructed as Metal Organic Systems (MOFs), for example, U.S. patent 5,648,508A to Yaghi, and U.S. patent 8,647,417B2 to Eisenhardt et al.
Although vacuum panels VIP have been greatly improved, there are many problems with their use as thermal insulating materials. These problems include: (1) it is difficult to maintain the vacuum for a long enough time to allow it to be used as a commonly used thermal insulating material. (2) The materials used for the outer casing, core, getter and seal are relatively expensive. (3) The vacuum panel VIP could not be cut because the vacuum dropped due to a leak in the cut. (4) The edge heat bridge function of the VIP outer wrapping layer of the vacuum plate increases the overall heat conductivity coefficient. (5) The VIP core material of the vacuum plate is mostly a material used for common heat insulation materials, so that the environment is protected, and the ecological environment and sustainable development are influenced. These problems limit the practical application of vacuum panels VIP.
The common external wall heat insulation material is non-green and environment-friendly, influences the ecological environment and sustainable development and has fire hazard. In the beginning of twenty years, the foreign countries put high attention on the environmental protection problem of the common heat insulation materials, and begin the research work in the aspect, but besides the great progress in the aspects of improving the heat insulation performance, reducing the material consumption and recycling technology, the development of the alternative novel material is slow.
Disclosure of Invention
The invention aims to solve the technical problem of providing a green environment-friendly heat-insulating plate which can achieve a very small heat conductivity coefficient, can be used for heat insulation in any occasion, is easy to process and produce, low in manufacturing cost and convenient to use, can recycle raw materials which are not derived from petroleum products, and is green and environment-friendly.
The invention solves the technical problems by the following technical scheme:
the invention relates to a green environment-friendly heat-insulating plate which comprises a middle supporting material with a honeycomb structure, wherein high-gas-resistance material layers are wrapped outside two sides of the middle supporting material, the inner side surface of each high-gas-resistance material layer is provided with a low-emissivity surface, honeycomb holes of the middle supporting material are filled with air, argon, carbon dioxide or a mixture of the air, the argon and the carbon dioxide or the mixture of the air, the argon and the carbon dioxide, or the honeycomb holes are vacuumized, a phonon eutectic is coated on the low-emissivity surface and the surface of.
The high gas barrier material layer is an aluminum foil or a plastic composite film plated with a metal layer, a paper composite film, a high polymer composite film, a metal plate, a galvanized plate, a stainless steel plate, a glass magnesium plate and a calcium magnesium plate.
The surface with low emissivity is the surface of an aluminum film, a metal film or a metal plate.
The usage amount of the phonon eutectic is 0.2-2 mg of phonon eutectic matched with each cubic centimeter of insulation board.
The supporting material is plant fiber, waste paper recycled fiber, glass fiber, rock wool, plastic, mineral fiber or papery material.
The sizing material is sodium silicate, potassium silicate, oxidized starch, modified starch, polyvinyl alcohol, hot melt adhesive, pressure sensitive agent, polyvinyl acetate or polyurethane sizing material.
The phonon eutectic is prepared by mixing an organic material and an inorganic material, or mixing the inorganic material and the inorganic material; or is prepared by mixing polystyrene, polyvinyl alcohol, polyurethane, nano expanded graphite and micron expanded graphite; or is prepared by mixing polystyrene, polyvinyl alcohol, polyurethane, salt hydrate, melting point-reducing salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate, potassium silicate, salt hydrate, melting point lowering salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate and potassium silicate with nano expanded graphite and micron expanded graphite.
The invention has the following beneficial effects:
1) the invention reduces the total kinetic energy of gas or air molecules in pores by adopting a phonon eutectic with a spatially continuous infinite structure, wherein countless continuous and infinite small cavities exist in the phonon eutectic, the total kinetic energy of the gas or air molecules is reduced, and the thermal conductivity of the gas and the air is reduced.
2) The middle support material adopted by the invention is of a honeycomb structure, and air, argon, carbon dioxide or a mixture of the air and the argon or the carbon dioxide are filled in honeycomb holes of the middle support material, or the middle support material is vacuumized and matched with a phonon eutectic to reduce heat flowThe heat transfer of the material reaches a lower heat conductivity coefficient of 0.025-0.033 (w/m.K), and the material is light and reaches 30-100kg/m3。
3) The environment-friendly heat-insulation board has good flame-retardant effect, the combustion performance can reach grade B of a flame-retardant material, and if the flame-retardant material is subjected to fire-proof treatment, the combustion performance can reach grade A of a non-combustible material.
4) The green environment-friendly insulation board can be cut into any size to meet the installation requirement, can be stacked into multiple layers to meet the requirements of installation thickness and thermal resistance, can be recycled, and is simple in production process and use process and free of pollution.
5) The environment-friendly heat-insulation board can be used for heat insulation in any occasions, is easy to process and produce, low in manufacturing cost and convenient to use, can recycle raw materials without petroleum products, and is environment-friendly.
Drawings
FIG. 1 is a schematic structural diagram of the green environmental-protection heat-insulation board of the invention;
FIG. 2 is a schematic plane structure diagram of the middle support material of the green environmental-friendly insulation board of the invention;
FIG. 3 is a photograph of an intermediate support material of the green environmental protection insulation board of the present invention;
FIG. 4 is a schematic perspective view of an intermediate support material of the green environmental-friendly insulation board of the present invention;
FIG. 5 is a schematic diagram of the green environmental-friendly insulation board of the present invention after two surfaces of the intermediate support material are coated with the phonon eutectic;
FIG. 6 is a schematic diagram of a cross-cut structure of the green environmental-friendly insulation board showing the distribution of phonon eutectic crystals;
FIG. 7 is a flow chart of the production process of the green environmental protection insulation board of the invention.
In the figure:
1-a high gas barrier material layer; 2-honeycomb holes; 3-intermediate support material; 4-phonon cocrystals; 5-low emissivity surface.
Detailed Description
The technical scheme of the invention is further explained in detail by combining the attached drawings:
as shown in the attached drawing, the green environment-friendly heat-insulating plate comprises a middle supporting material 3 with a honeycomb hole 2 structure, two sides of the middle supporting material 3 are wrapped with high-gas-resistance material layers 1, the inner side surface of each high-gas-resistance material layer 1 is provided with a low-emissivity surface 5, honeycomb holes 2 of the middle supporting material 3 are filled with air, argon, carbon dioxide or a mixture of the air, the argon, the carbon dioxide and the mixture, or the honeycomb holes are vacuumized, a phonon eutectic 4 is coated on the low-emissivity surface 5 and the surface of the middle supporting material 3 or is mixed with the middle supporting material, and the high-gas-resistance material layers 1 and the middle.
The high gas barrier material layer 1 is an aluminum foil, or a plastic composite film, a paper composite film, a high polymer composite film, a metal plate, a galvanized plate, a stainless steel plate, a glass magnesium plate and a calcium magnesium plate which are manufactured by a deposition or coating method and have enough gas impermeability and strength and are plated with metal layers.
The low emissivity surface 5 is the surface of an aluminum film, a metal film or a metal plate.
The dosage of the phonon eutectic 4 is 0.2-2 mg of phonon eutectic matched with each cubic centimeter of insulation board.
The middle supporting material 3 is plant fiber, waste paper recycled fiber, glass fiber, rock wool, plastic and mineral fiber, and can also be a sheet or paper honeycomb structure made of recycled waste paper for the purpose of recycling waste materials. The thinner the material, the less heat transfer, considering sufficient support strength. The honeycomb structure of the support material achieves maximum strength with minimal material weight and minimal material usage.
The glue material is sodium silicate, potassium silicate, oxidized starch, modified starch, polyvinyl alcohol, hot melt adhesive, pressure sensitive agent, polyvinyl acetate or polyurethane glue material, and aims to form fastening and bonding between the high gas barrier material layer 1 and the middle support material 3.
The phonon eutectic is also called a phonon eutectic mixture or a photonic eutectic.
The phonon eutectic is prepared by mixing an organic material and an inorganic material, or mixing the inorganic material and the inorganic material; or is made of polystyrene, polyvinyl alcohol, polyurethane, nano expanded graphite and micron expanded graphite; or is prepared by mixing polystyrene, polyvinyl alcohol, polyurethane, salt hydrate, melting point-reducing salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate, potassium silicate, salt hydrate, melting point lowering salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate and potassium silicate with nano expanded graphite and micron expanded graphite.
The theory of the thermal conductivity of substances proves that the defect points in the crystal can scatter phonons and reduce the thermal conductivity of the crystal, and the density and the elastic modulus of the defect points are changed, so that the transmission speed of sound is changed. The defect points caused by the holes in the phonon eutectic adopted by the invention can reduce the heat conductivity coefficient to be very small. In addition, the dynamic interaction generated by the charge acceleration of the particles in the phonon eutectic and the dipole vibration, the coupled electromagnetic field is transmitted to the space around the phonon eutectic in the form of waves, so that the kinetic energy of the substances in the surrounding space is reduced, and the heat transfer is reduced.
The thermal radiation of the object surface through a space larger than the optical length is mainly related to the object surface emissivity. Low emissivity surfaces can greatly reduce thermal radiation. The surface radiation coefficient of the aluminum foil and the aluminum alloy adopted by the invention is 0.03, which is much smaller than that of the common heat-insulating material. The surface emissivity of silver is much smaller, 0.02-0.03, but the price of silver is expensive.
The green environment-friendly heat-insulation board overcomes the defects of common heat-insulation materials and vacuum panels VIP, and has the following advantages:
(1) low thermal conductivity is provided by the phononic eutectic and the kinetic energy of the air or gas molecules in the support material space is reduced.
(2) Thermal radiation transfer is reduced by low emissivity surfaces.
(3) The green environment-friendly heat-insulation board can be cut into various sizes so as to meet the installation requirement.
(4) The green environment-friendly heat-insulation board has no influence of a heat bridge at the edge of the outer wrapping layer.
(5) Two or more green environment-friendly heat-insulating boards are stacked to meet the requirements of thickness and heat resistance.
(6) The middle supporting material adopts a honeycomb structure, so that the maximum strength and the minimum material consumption are achieved.
The thickness of the green environment-friendly heat-insulation board depends on the size of the honeycomb structure, the thickness and the strength of the paper-like object made of the intermediate support material and the overall strength requirement of the green environment-friendly heat-insulation board. Generally, the phonon eutectic crystal used in each cubic centimeter of green environmental-friendly heat-insulating board is 0.2-2 mg, preferably 0.5-1.5 mg. The thickness of the green environment-friendly heat-insulation board in the heat transfer direction can be 1-60 mm, and preferably 1-15 mm. The thickness of the intermediate support material of the paper is 0.02 to 2 mm, preferably 0.05 to 1 mm. The area of one honeycomb hole perpendicular to the heat transfer direction may be 0.1-1x 106Square millimeter, preferably 1-1x103Square millimeter. A honeycomb pore volume of 0.1-106Cubic millimeter, preferably 0.5-1x 105Cubic millimeters.
The green environment-friendly heat-insulation board has very small heat conductivity coefficient and density of only 30-100kg/m3. Thus, the vacuum plate has high heat resistance and heat preservation performance, overcomes the defects of common heat preservation and insulation materials and vacuum panels VIP, is easy to manufacture and convenient to use, has low manufacturing cost, and can be cut into different sizes to be suitable for use requirements.
The two-sided high gas barrier material layer of the invention uses aluminum foil, metal foil or metal sheet, the intermediate support material uses paper made of inorganic fiber, or plant fiber (or waste paper recycled fiber) and other materials, and the combustion performance can reach A grade of non-combustible material by adding fire-proof treatment. The two-side high gas barrier material layer of the invention uses aluminum foil, metal foil or metal sheet, the middle support material uses common paper, the combustion performance can reach B level of flame-retardant material, if the flame-retardant material is added with fire-proof treatment, the combustion performance can reach A level of flame-retardant material. The materials and the production process used in the invention are green and environment-friendly and have no pollution.
The production process flow of the green environment-friendly insulation board is shown in figure 7, and comprises the following operation steps:
(1) coating the two sides of the paper-like object supporting material with a sizing material and phonon eutectic, and then drying and coiling;
(2) unreeling the paper-like object, gluing, then carrying out composite drying, transverse cutting and forming to manufacture a continuous honeycomb core with a certain specification;
(3) after the honeycomb core is stretched and shaped, glue is coated on the surface of the honeycomb core, the honeycomb core is compounded with an aluminum foil or other high-gas-barrier material layers, and then the honeycomb core is dried, cooled and transversely cut to obtain the green environment-friendly heat-insulation board.
The production process is simple and reasonable, has low energy consumption, and belongs to green environmental protection.
Although the present disclosure and the embodiments have been described in detail herein, the present disclosure may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. Therefore, the above disclosure of the present invention and the present embodiments is not intended to be exhaustive or to be limited. All changes, variations, improvements, substitutions and the like that fall within the scope or equivalence of the invention are intended to be embraced by the invention.
Claims (7)
1. The green environment-friendly heat-insulation board is characterized by comprising a middle supporting material with a honeycomb structure, wherein high-gas-resistance material layers are wrapped outside two sides of the middle supporting material, the inner side surface of each high-gas-resistance material layer is provided with a low-emissivity surface, honeycomb holes of the middle supporting material are filled with air, argon, carbon dioxide or a mixture of the air, the argon and the carbon dioxide or the mixture of the air, the carbon dioxide and the mixture of the air, the argon and the carbon dioxide or the mixture of the air.
2. The green environmental-friendly heat-insulation board according to claim 1, wherein the high gas barrier material layer is an aluminum foil or a plastic composite film plated with a metal layer, a paper composite film, a high polymer composite film, a metal plate, a galvanized plate, a stainless steel plate, a glass magnesium plate, or a calcium magnesium plate.
3. The green, environment-friendly and heat-insulating board according to claim 1, wherein the surface with low emissivity is the surface of an aluminum film, a metal film or a metal plate.
4. The green environmental protection insulation board of claim 1, wherein the amount of the phonon eutectic is 0.2-2 mg per cubic centimeter of insulation board.
5. The green, environmentally friendly insulation board of claim 1, wherein the support material is plant fiber, waste paper recycled fiber, glass fiber, rock wool, plastic, mineral fiber or paper-like material.
6. The green environment-friendly insulation board according to claim 1, wherein the glue material is sodium silicate, potassium silicate, oxidized starch, modified starch, polyvinyl alcohol, hot melt adhesive, pressure sensitive agent, polyvinyl acetate or polyurethane glue material.
7. The green environment-friendly heat-insulating board according to claim 1, wherein the phonon eutectic is prepared by mixing an organic material and an inorganic material, or the inorganic material and the inorganic material; or is prepared by mixing polystyrene, polyvinyl alcohol, polyurethane, nano expanded graphite and micron expanded graphite; or is prepared by mixing polystyrene, polyvinyl alcohol, polyurethane, salt hydrate, melting point-reducing salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate, potassium silicate, salt hydrate, melting point lowering salt, molten salt with different melting points and metal oxide; or is prepared by mixing sodium silicate and potassium silicate with nano expanded graphite and micron expanded graphite.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112878518A (en) * | 2021-01-18 | 2021-06-01 | 上海大学 | Assembled building structure heated board |
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| CA2876324A1 (en) * | 2014-12-31 | 2016-06-30 | Joe R. H. Zhao | High resistance panels (hrp) |
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Inventor after: Zhao Ruhe Inventor after: Sun Jiaojiao Inventor after: Chen Yan Inventor after: Zhang Xueyan Inventor after: Cao Jinghua Inventor after: Sang Yizhou Inventor after: Sha Haiming Inventor after: Chen Xiaoping Inventor before: Zhao Ruhe Inventor before: Sun Jiaojiao Inventor before: Chen Yan Inventor before: Zhang Xueyan Inventor before: Cao Jinghua Inventor before: Sang Yizhou Inventor before: Sha Haiming |
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Application publication date: 20200110 |