CN110666280A - Method for nickel coating interface reaction of micro-welding point and consumption rule of nickel coating - Google Patents
Method for nickel coating interface reaction of micro-welding point and consumption rule of nickel coating Download PDFInfo
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- CN110666280A CN110666280A CN201911047291.9A CN201911047291A CN110666280A CN 110666280 A CN110666280 A CN 110666280A CN 201911047291 A CN201911047291 A CN 201911047291A CN 110666280 A CN110666280 A CN 110666280A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
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Abstract
The invention discloses a method for nickel coating interface reaction of micro-welding points and a consumption rule of a nickel coating, and relates to the technical field of nickel coating; the method comprises the following steps: three types of brazing filler metals are welded on a nickel layer, the consumption of the nickel layer, the thickness of an interface IMC (intrinsic mode memory) and the shearing performance of an aged welding spot are tested by controlling the liquid retention time and the isothermal aging time, the microstructure and the shearing fracture morphology of the welding spot are observed, the mechanism of coating consumption is analyzed, and the rule of nickel coating consumption is deduced, so that the thickness of the nickel layer of the brazing filler metal is formulated reasonably; according to the consumption rule of the nickel layer, the plating layer thickness is set for different brazing filler metals, and the reliability of welding spots is improved; through researching the consumption rule of the liquid retention time and the isothermal aging time on nickel plating layers of 3 different solders, the growth rate of the interface IMC and the influence of the shearing performance after the aging of the welding spot, the consumption trend of the nickel plating layer thickness of the welding spot is predicted, and therefore the corresponding nickel plating layer thicknesses of the different solders are reasonably formulated.
Description
Technical Field
The invention belongs to the technical field of nickel plating, and particularly relates to a method for nickel plating interface reaction of micro-welding points and a consumption rule of a nickel layer.
Background
In electronic components makes and encapsulates, solder and cladding material reaction form welded joint, and the interact between molten liquid brazing filler metal and cladding material divide into two aspects: the first is that the coating metal diffuses into the molten liquid solder; and secondly, the brazing filler metal and the coating metal react to generate an interface compound IMC layer. The solder and the coating are connected with each other by an interface IMC layer. However, the interface IMC itself has the characteristics of hardness and brittleness, and an excessively thick IMC layer may reduce the reliability of a solder joint, resulting in failure of an electronic component. Because nickel has the obvious function of preventing copper from diffusing into the brazing filler metal to generate excessively thick IMC, a nickel barrier layer is introduced between the brazing filler metal and the substrate, the reliability of a welding spot can be effectively improved, and the method has a good application prospect. However, after a long period of high-temperature service, the nickel plating layer on the bonding pad is continuously consumed due to the reaction with the solder, which is also a problem that people in the industry pay attention to. Therefore, the influence of the nickel plating on the solder joint performance has been studied intensively.
The thickness of the nickel layer is used as an important guarantee of the quality of the nickel layer, and a large amount of consumption can occur along with the increase of service time in the actual long-term service process. Meanwhile, no clear regulation is made on the research on reasonably selecting the thickness of the nickel plating layer in the field of electronic elements at present. Because the service fields of the solders adopted by the electronic components are different, the thicknesses of the nickel plating layers selected by the solders with different welding temperatures are different. The main research of the method is that the interface reaction of the solders with different welding temperatures on the nickel plating layer and the consumption rule of the nickel plating layer are studied, so that the thicknesses of the solder nickel plating layers with different welding temperatures are reasonably formulated.
The nickel-plated copper plate is adopted in the field of electronic packaging, so that high reliability can be achieved, and meanwhile, due to the good heat conduction and electric conductivity of copper, heat can be dissipated in time, and product failure is avoided. However, when the nickel-plated copper substrate is adopted, the nickel layer is greatly consumed in long-term service, so that the IMC of the welding spot interface grows excessively, and the Kirkendall hole can be induced. Therefore, the research on the consumption of the nickel plating layer has important significance on the reliability of the welding spot.
Disclosure of Invention
To solve the problems in the background art; the invention aims to provide a method for nickel coating interface reaction of a micro welding point and a consumption rule of a nickel coating.
The invention relates to a method for nickel coating interface reaction of micro welding points and consumption rule of nickel coating, which comprises the following steps: three solders of SAC305, Sn5Sb and 42Sn58Bi are welded on a nickel layer, the consumption of the nickel layer, the thickness of an interface IMC and the shearing performance of an aged welding spot are tested by controlling the liquid retention time and the isothermal aging time, the microstructure and the shearing fracture morphology of the welding spot are observed, the mechanism of plating layer consumption is analyzed, and the rule of nickel layer consumption is deduced, so that the thickness of the nickel layer of the solders is reasonably formulated.
A method for nickel coating interface reaction of micro welding point and consumption rule of nickel coating comprises the following steps:
the method comprises the following steps: pretreatment in welding:
cleaning the nickel-plated copper substrate, performing ultrasonic cleaning, adding a small amount of dilute hydrochloric acid to remove an oxide film on the surface of a nickel layer, cleaning again by using absolute ethyl alcohol, and drying the nickel-plated copper substrate in a drying oven; measuring the surface coating of the processed nickel-plated copper substrate, and measuring the initial thickness of the coating by adopting CAD;
step two: preparing a welding spot:
firstly, removing an oxide film on the surface of a solder block by using abrasive paper, then cutting the solder block into powder, ultrasonically cleaning the powder by using absolute ethyl alcohol and airing the powder for later use, pouring analytically pure glycerol into a crucible of a flat electric furnace, then putting the solder powder into the glycerol by using tweezers, adding the temperature suitable for each material by using the flat electric furnace, after the solder is molten, turning off the power supply of the electric furnace, and after a solder ball is solidified, taking out the solder ball by using the tweezers; finally, putting the solder ball into absolute ethyl alcohol, cleaning off glycerol on the surface of the solder ball by using ultrasonic waves, and then taking out and drying;
step three: and (3) welding by adopting reflow soldering:
selecting proper soldering flux before ball planting, uniformly coating the soldering flux on a nickel-plated copper substrate, and carrying out reflow soldering on three prepared BGA (ball grid array) ball planting on the nickel-plated copper substrate at three different soldering temperatures, wherein three BGA are SAC305, Sn-5Sb and 42Sn58Bi respectively;
step four: measuring the thickness of an interface IMC layer and a coating of a welded welding spot:
observing and analyzing a microstructure of an interface of a lead-free interconnection micro-welding point by adopting a GX71-6230A multifunctional optical microscope and a scanning electron microscope, simultaneously, measuring the thickness of an interface IMC layer by using Auto CAD software for researching the growth dynamics of an intermetallic compound layer of the interface of the welding point, firstly measuring the area A of a sample and the length of the interface layer by using an area measuring button, measuring the thickness of the interface IMC by measuring the area A to the length L, and then averaging the thickness of the measured interface IMC layer; in order to avoid errors, 10 groups of photo measurements are carried out on each welding spot; the thickness of the coating is measured by the same method.
Preferably, the heating and welding temperature of the SAC305 is 260 ℃, the heating and welding temperature of the Sn-5Sb is 280 ℃, and the heating and welding temperature of the 42Sn58Bi is 170 ℃.
Compared with the prior art, the invention has the beneficial effects that:
firstly, according to the consumption rule of a nickel layer, the thickness of a coating is set for different brazing materials, and the reliability of a welding spot is improved;
and secondly, predicting the consumption trend of the nickel plating layer thickness of the welding spot by researching the consumption rule of the liquid retention time and the isothermal aging time on the nickel plating layers of 3 different solders, the growth rate of the interface IMC and the shearing performance influence after the welding spot aging, thereby reasonably formulating the corresponding nickel plating layer thicknesses of the different solders.
Detailed Description
The technical scheme of the specific implementation mode is as follows: three solders of SAC305, Sn5Sb and 42Sn58Bi are welded on a nickel layer, the consumption of the nickel layer, the thickness of an interface IMC and the shearing performance of an aged welding spot are tested by controlling the liquid retention time and the isothermal aging time, the microstructure and the shearing fracture morphology of the welding spot are observed, the mechanism of plating layer consumption is analyzed, and the rule of nickel layer consumption is deduced, so that the thickness of the nickel layer of the solders is reasonably formulated.
1. Under different liquid state residence times, micro welding points of 3 brazing filler metals are prepared, and the influence of the liquid state residence time on the consumption rate of a nickel plating layer and the growth rate of an interface IMC is researched by adopting a high-temperature aging method.
2. Carrying out isothermal aging on the 3 welding spots, and analyzing the consumption rule of the nickel plating layer in the aging process.
3. The change of the shearing performance of the welding spot in the coating consumption process is researched by adopting an isothermal aging method.
4. And summarizing the consumption rule of the nickel-plated layers of the 3 types of micro welding spots, and analyzing the conversion of the consumption mechanism.
The study method of this example:
the method comprises the steps of firstly, reading a document about nickel plating layer consumption through system collection, summarizing the problems faced by the existing nickel plating layer in the using process, summarizing the solutions provided by researchers in various countries for the problems aiming at the existing problems, analyzing the feasibility of the solutions, combining the existing experimental conditions of a laboratory, making an experimental scheme about the consumption of 3 different brazing filler metal nickel plating layers, namely, preparing welding spots, carrying out reflow soldering, measuring the thickness of a nickel plating layer after soldering, measuring the shearing strength of the welding spots, designing an isothermal aging experiment, analyzing the influence of aging time on the nickel plating layer, obtaining the consumption rule of the nickel layer, and reasonably formulating the thickness of the nickel plating layer.
Theoretical analysis and calculation of this example:
1) reaction of the braze with the substrate metal is an elemental diffusion process. Under solid phase conditions, interfacial compound growth is governed by the elemental diffusion mechanism and is therefore most sensitive to time-dependent temperature among the many factors that affect interfacial IMC growth. When the environment temperature of the welding spot is constant, the appearance of the welding spot interface compound and the type of the interface structure are continuously changed along with the prolonging of the aging time; when the welding spot is positioned in different aging time periods, the growth rate of the interface IMC is different, and the growth rate is represented by different thicknesses of the interface IMC. When the effective temperature changes, the appearance, the components and the growth rate of the interfacial IMC also generate obvious differences.
2) In the test, a GX71-6230A multifunctional optical microscope and a scanning electron microscope are adopted to observe and analyze the microstructure of the lead-free interconnection micro-welding point interface. Meanwhile, in order to research the growth dynamics of the intermetallic compound layer on the welding spot interface, the thickness of the IMC layer on the interface is measured by means of Auto CAD software in the test. Firstly, measuring the area A of the sample and the length of the interface layer by using an area measuring button, measuring the thickness of the interface IMC by measuring the area A to be more than the length L, and then averaging the thickness of the measured interface IMC layer. To avoid errors, 10 sets of photo measurements were made for each weld spot. The thickness of the coating is measured by the same method.
The experimental procedure and procedure of this example:
1) pretreatment in welding:
cleaning the nickel-plated copper substrate, adopting ultrasonic cleaning, simultaneously adding a small amount of dilute hydrochloric acid to remove an oxide film on the surface of the nickel layer, cleaning again by using absolute ethyl alcohol, and drying the nickel-plated copper substrate in a drying oven. And measuring the surface coating of the processed nickel-plated copper substrate, and measuring the initial thickness of the coating by adopting CAD.
2) Preparing a welding spot:
firstly, removing an oxide film on the surface of a solder block by using sand paper, then cutting the solder block into powder, ultrasonically cleaning the powder by using absolute ethyl alcohol and airing the powder for later use, pouring analytically pure glycerol into a crucible of a flat electric furnace, then putting the solder powder into the glycerol by using tweezers, adding the temperature suitable for each material by using the flat electric furnace (the heating temperature of SAC305 is 260 ℃, the heating temperature of Sn-5Sb is 280 ℃, the heating temperature of 42Sn58Bi is 170 ℃), after the solder is molten, turning off the power supply of the electric furnace, and taking out the solder ball by using the tweezers after the solder ball is solidified. And finally, putting the solder ball into absolute ethyl alcohol, cleaning the glycerol on the surface of the solder ball by using ultrasonic waves, and taking out and airing.
3) And (3) welding by adopting reflow soldering:
selecting proper soldering flux before ball mounting, uniformly coating the soldering flux on a nickel-plated copper substrate, and carrying out reflow soldering on three prepared BGA (SAC 305, Sn-5Sb, 42Sn58 Bi) balls on the nickel-plated copper substrate at three different soldering temperatures (SAC 305 soldering temperature of 260 ℃, Sn-5Sb soldering temperature of 280 ℃ and 42Sn58Bi soldering temperature of 170 ℃).
4) Measuring the thickness of an interface IMC layer and a coating of a welded welding spot:
in the test, a GX71-6230A multifunctional optical microscope and a scanning electron microscope are adopted to observe and analyze the microstructure of the lead-free interconnection micro-welding point interface. Meanwhile, in order to research the growth dynamics of the intermetallic compound layer on the welding spot interface, the thickness of the interface IMC layer is measured by means of AutoCAD software in the test. Firstly, measuring the area A of the sample and the length of the interface layer by using an area measuring button, measuring the thickness of the interface IMC by measuring the area A to be more than the length L, and then averaging the thickness of the measured interface IMC layer. To avoid errors, 10 sets of photo measurements were made for each weld spot. The thickness of the coating is measured by the same method.
The aging test design of this example: because the aging temperatures of different materials are different, according to the GJB548A-96 standard, the aging temperature is set as follows: the SAC305 aging temperature is 150 ℃, the Sn-5Sb aging temperature is 180 ℃, the 42Sn58Bi aging temperature is 100 ℃, the aging time set according to the simplest design principle of the engineering industry standard can be counted in cycles, so the aging time is selected to be 1 week, 2 weeks, 3 weeks and 4 weeks.
The aging post-shear performance test of the solder joint of the embodiment: firstly fixing the prepared welding point on a platform, opening an indicating device of a shearing instrument, adjusting worms on two sides, adjusting a tool nose to the rear row of the welding point, then transmitting the preset parameters to shearing test equipment in real time, and then clicking a start button to test the shearing performance. And in the operation, the shearing force borne by the welding spot is sent to a host of the testing instrument in real time by virtue of the sensor, and after the test, a test result is derived by virtue of software. The shear rate of this experiment was 0.1 mm/s, the shear stroke 1.0 mm, and the shear height was set at 20-45 μm. The number of the welding spots prepared under each process condition is measured by 12, and the average value is calculated to obtain the shear strength.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. A method for nickel coating interface reaction and nickel coating consumption rule of micro welding point is characterized in that: the method comprises the following steps: three solders of SAC305, Sn5Sb and 42Sn58Bi are welded on a nickel layer, the consumption of the nickel layer, the thickness of an interface IMC and the shearing performance of an aged welding spot are tested by controlling the liquid retention time and the isothermal aging time, the microstructure and the shearing fracture morphology of the welding spot are observed, the mechanism of plating layer consumption is analyzed, and the rule of nickel layer consumption is deduced, so that the thickness of the nickel layer of the solders is reasonably formulated.
2. A method for nickel coating interface reaction and nickel coating consumption rule of micro welding point is characterized in that: the specific operation method comprises the following steps:
the method comprises the following steps: pretreatment in welding:
cleaning the nickel-plated copper substrate, performing ultrasonic cleaning, adding a small amount of dilute hydrochloric acid to remove an oxide film on the surface of a nickel layer, cleaning again by using absolute ethyl alcohol, and drying the nickel-plated copper substrate in a drying oven; measuring the surface coating of the processed nickel-plated copper substrate, and measuring the initial thickness of the coating by adopting CAD;
step two: preparing a welding spot:
firstly, removing an oxide film on the surface of a solder block by using abrasive paper, then cutting the solder block into powder, ultrasonically cleaning the powder by using absolute ethyl alcohol and airing the powder for later use, pouring analytically pure glycerol into a crucible of a flat electric furnace, then putting the solder powder into the glycerol by using tweezers, adding the temperature suitable for each material by using the flat electric furnace, after the solder is molten, turning off the power supply of the electric furnace, and after a solder ball is solidified, taking out the solder ball by using the tweezers; finally, putting the solder ball into absolute ethyl alcohol, cleaning off glycerol on the surface of the solder ball by using ultrasonic waves, and then taking out and drying;
step three: and (3) welding by adopting reflow soldering:
selecting proper soldering flux before ball planting, uniformly coating the soldering flux on a nickel-plated copper substrate, and carrying out reflow soldering on three prepared BGA (ball grid array) ball planting on the nickel-plated copper substrate at three different soldering temperatures, wherein three BGA are SAC305, Sn-5Sb and 42Sn58Bi respectively;
step four: measuring the thickness of an interface IMC layer and a coating of a welded welding spot:
observing and analyzing a microstructure of an interface of a lead-free interconnection micro-welding point by adopting a GX71-6230A multifunctional optical microscope and a scanning electron microscope, simultaneously, measuring the thickness of an interface IMC layer by using Auto CAD software for researching the growth dynamics of an intermetallic compound layer of the interface of the welding point, firstly measuring the area A of a sample and the length of the interface layer by using an area measuring button, measuring the thickness of the interface IMC by measuring the area A to the length L, and then averaging the thickness of the measured interface IMC layer; in order to avoid errors, 10 groups of photo measurements are carried out on each welding spot; the thickness of the coating is measured by the same method.
3. The method for the interfacial reaction of the nickel-plated layer of the micro-welding point and the consumption rule of the nickel layer according to claim 2, which is characterized in that: the heating and welding temperature of the SAC305 is 260 ℃, the heating and welding temperature of the Sn-5Sb is 280 ℃, and the heating and welding temperature of the 42Sn58Bi is 170 ℃.
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Cited By (1)
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| CN114749744A (en) * | 2022-05-12 | 2022-07-15 | 华北水利水电大学 | Method for predicting nitride of non-magnetic steel connection interface |
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| CN1320959A (en) * | 2001-05-11 | 2001-11-07 | 黄清池 | Process for preparing tin balls used for package welding of chip |
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