CN110656251B - Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method - Google Patents
Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method Download PDFInfo
- Publication number
- CN110656251B CN110656251B CN201910906070.6A CN201910906070A CN110656251B CN 110656251 B CN110656251 B CN 110656251B CN 201910906070 A CN201910906070 A CN 201910906070A CN 110656251 B CN110656251 B CN 110656251B
- Authority
- CN
- China
- Prior art keywords
- gold
- circuit board
- water
- accelerator
- environment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/008—Wet processes by an alkaline or ammoniacal leaching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Detergent Compositions (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a quick and environment-friendly circuit board gold removing liquid, a preparation method and application thereof and a gold removing method. The gold stripping liquid comprises iodine, water-soluble iodide, an accelerator, a pH stabilizer and water; the accelerator is one or a combination of more of EDTA, EDTA derivatives, amine-containing compounds and potassium sodium tartrate. According to the invention, by selecting the specific accelerator and regulating and controlling the dosage and proportion of each component, the high-efficiency gold-removing liquid can be obtained under the condition of not adding hydrogen peroxide, and the gold-removing liquid for the circuit board has the advantages of high gold-removing treatment speed, high stability, safety, no toxicity, no harm to human bodies and no pollution to the environment.
Description
Technical Field
The invention relates to the technical field of waste recovery, in particular to a quick and environment-friendly circuit board gold removing liquid, a preparation method and application thereof, and a gold removing method.
Background
PCB boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Printed wiring boards have evolved from single-layer to double-sided, multi-layer, and flex boards, and have continued to evolve toward high precision, high density, and high reliability. The size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products.
With the continuous updating of the technical level of the electronic industry, the quantity and types of electronic products which are eliminated and discarded are more and more. As an important component of electronic products, the amount of printed wiring boards discarded is increasing. The printed circuit board comprises a large amount of plastics (epoxy resin and the like) and base metals (copper, lead, zinc and the like), and also generally comprises rare noble metals (gold, silver, platinum and the like), wherein the content of gold reaches 80g/t, which is far higher than the gold grade in common gold ore. Therefore, the waste printed circuit board is recycled, so that precious rare and precious metal resources can be obtained, and the serious pollution to the environment can be effectively prevented.
Nowadays, in order to obtain purer gold, it is appropriate to use hydrometallurgical techniques, but in view of environmental protection and safety concerns, there is a trend towards increasingly replacing non-cyanide reagents. Anionic complex of gold [ AuX ] according to Russian Hospital of noble Metal exploration2]Comparison of the stability (X is an anion) shows that: CN-＞＞I-＞＞Br-＞＞Cl-＞＞NCS-＞＞NCO-The iodine complex of gold is inferior to the gold cyanide complex but stronger than the cyanate, which is bromine, chlorine, thiocyanide or the like. And compared with cyanide, iodine is a non-toxic agent and is widely used in medicine. Therefore, the iodine-iodide solution is selected to withdraw gold from the circuit board, which meets the production requirements of modern industry. Although the gold withdrawal by the iodination method has the advantages of environmental friendliness and no harm to human bodies, the technical problem of low gold withdrawal speed exists in the current gold withdrawal technology by the iodination method. For example, in the technical scheme for withdrawing gold mentioned in patent document CN101392325B, the time for completing the whole gold withdrawing process is at least 2 hours, and the speed of the gold withdrawing speed plays a crucial role in the application and popularization of the iodination method, and especially for large-batch and large-scale enterprises, the gold withdrawing efficiency is very important.
Disclosure of Invention
The invention aims to overcome the defects or shortcomings of low gold-removing speed and low efficiency in the prior art, and provides a fast and environment-friendly circuit board gold-removing liquid. The gold stripping liquid provided by the invention can be used for recovering gold from the circuit board, and has the advantages of high gold stripping speed, high efficiency, safety, no toxicity and environmental friendliness.
The invention also aims to provide a preparation method of the gold stripping liquid.
The invention also aims to provide the application of the gold stripping liquid in the gold stripping of the circuit board.
The invention also aims to provide a gold stripping method.
In order to achieve the purpose, the invention adopts the following technical scheme:
a fast and environment-friendly circuit board gold removing liquid comprises iodine, water-soluble iodide, an accelerator, a pH stabilizer and water;
the molar ratio of the iodine to the water-soluble iodide is 1: 1-14; the concentration of the water-soluble iodide is 1-25 g/L;
the accelerator is one or more of EDTA, EDTA derivatives, amine-containing compounds or potassium sodium tartrate; the concentration of the accelerator is 1-10 g/L;
the concentration of the pH stabilizer is 1-50 g/L.
When the conventional iodination method is used for gold stripping, hydrogen peroxide is generally added, and iodine, iodide ions and gold react as follows:
I2+I-→I3 -
2Au+I3 -+I-→2AuI2 -
2Au+I3 -→2AuI4 -+I-
2Au+4I-+H2O2→2AuI2 -+2OH-
however, as the reaction proceeds, gold is continuously dissolved out, and hydrogen peroxide in the gold stripping solution is continuously consumed or decomposed, so that the gold stripping speed is low and the efficiency is low; in addition, hydrogen peroxide has pungent smell and certain toxicity, and is not safe and environment-friendly.
Through a plurality of attempts, the invention discovers that the specific accelerator is added into the conventional gold stripping liquid, the dosage and the proportion of each component are regulated, the gold stripping speed can be obviously accelerated under the condition of not adding hydrogen peroxide, and the main principle is as follows: the accelerator can be complexed with gold ions, so that the leaching of gold is an oxidation process and a complexing process. The gold leaching is firstly to leach the iodine simple substance I in the gold removing liquid2And iodide ion I in iodide-Reaction to form I3 -Gold quilt I-And I3 -Oxidation to Au+Or Au3+Then Au+Or Au3 +Reaction with accelerator to form stable complex Au (I) L2Or Au (III) L4(L is an accelerator) to dissolve the gold in the solution, thereby completing the gold withdrawal process. The accelerator plays a role of assisting in complexing the alloy so as to improve the efficiency of gold withdrawal.
The specific reaction process is as follows:
I2+I-→I3 -
2Au+I3 -+I-→2AuI2 -
2Au+I3 -→2AuI4 -+I-
Au++2I-→AuI2 -
Au3++4I-→AuI4 -
Au++2L→Au(I)L2
Au3++4L→Au(III)L4
in addition, hydrogen peroxide is not needed, so that the influence of consumption or decomposition on the gold withdrawal efficiency is avoided, and the gold withdrawal rate is greatly improved (the gold withdrawal can be completely realized by 10-60); the gold removing liquid also has the advantages of high stability, safety, no toxicity, no harm to human bodies and no pollution to the environment.
Preferably, the amine-containing compound is one or more of ethylenediamine, triethanolamine or glycine.
Preferably, the water-soluble iodide is one or both of sodium iodide and potassium iodide.
Preferably, the EDTA derivative is one or two of EDTA-2 Na or EDTA-4 Na.
Preferably, the pH stabilizer is one or more of ammonia water, sodium hydroxide, potassium hydroxide or borax
Preferably, the concentration of the accelerator is 1-5 g/L.
Preferably, the concentration of the pH stabilizer is 1-20 g/L.
Preferably, the molar ratio of the iodine to the water-soluble iodide is 1: 1-12.
The preparation method of the rapid and environment-friendly circuit board gold stripping liquid comprises the following steps: mixing iodine, water-soluble iodide, accelerator, pH stabilizer and water.
The application of the rapid and environment-friendly circuit board gold stripping liquid in circuit board gold stripping is also within the protection scope of the invention.
The invention also provides a gold withdrawal method, which comprises the following steps:
and soaking the circuit board in the gold removing liquid, and stirring.
Preferably, the circuit board further comprises a step of cleaning by using a polar solvent before being placed in the gold stripping solution.
More preferably, the cleaning mode is one or two of vibration cleaning or ultrasonic cleaning.
More preferably, the polar solvent is one or more of methanol, ethanol, n-propanol or acetone.
Preferably, the soaking temperature of the circuit board is 10-70 ℃ and the soaking time is 10-60 s.
Preferably, the stirring speed is 100-1000 r/min.
When the gold on the circuit board forms a complex and is dissolved in the solution, the gold continuously consumes the surrounding I-And I3 -The concentration polarization of the gold stripping liquid can be eliminated by stirring the gold stripping liquid, so that the gold stripping speed is ensured to be stable.
The gold stripping liquid is suitable for various circuit boards, in particular to waste circuit boards. Specifically, the sources of the waste circuit boards include various types of circuit boards containing gold plating used in electronic products such as computers, large servers, mobile phones, and vehicle-mounted electronic devices.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, by selecting the specific accelerator and regulating and controlling the dosage and proportion of each component, the high-efficiency gold-removing liquid can be obtained under the condition of not adding hydrogen peroxide, and the gold-removing liquid for the circuit board has the advantages of high gold-removing treatment speed, high stability, safety, no toxicity, no harm to human bodies and no pollution to the environment.
Drawings
FIG. 1 is an EDS map of the surface of a circuit board obtained before gold withdrawal;
FIG. 2 is an EDS map of the surface of the circuit board obtained after gold withdrawal;
FIG. 3 is a diagram of a circuit board before and after gold withdrawal.
Detailed Description
The invention is further illustrated by the following examples. These examples are intended to illustrate the invention and are not intended to limit the scope of the invention. Experimental procedures without specific conditions noted in the examples below, generally according to conditions conventional in the art or as suggested by the manufacturer; the raw materials, reagents and the like used are, unless otherwise specified, those commercially available from the conventional markets and the like. Any insubstantial changes and substitutions made by those skilled in the art based on the present invention are intended to be covered by the claims.
Example 1
The embodiment provides a quick and environment-friendly gold removing liquid for a waste circuit board, which comprises iodine, water-soluble iodide, an accelerator, a pH stabilizer and water.
Specifically, the composition of the metal stripping solution of the present embodiment is as follows: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:10, 30g/L potassium iodide, 2g/L potassium sodium tartrate (accelerator), 2g/L EDTA-4 Na (accelerator), 2g/L sodium hydroxide (pH stabilizer), 2g/L aqueous ammonia (pH stabilizer).
The gold stripping solution is prepared by the following preparation processes: mixing iodine, water-soluble iodide, accelerator, pH stabilizer and water.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
s2, soaking the cleaned circuit board in a gold stripping solution for 30s at the temperature of 35 ℃ and at the magneton rotating speed of 300 r/min.
FIG. 1 is an EDS spectrum of the surface of a circuit board before gold stripping in this example. FIG. 2 is an EDS spectrum of the surface of the wiring board obtained after gold stripping in this example. FIG. 3 is a diagram showing a waste wiring board before and after gold withdrawal. As can be seen from fig. 1, the element composition on the surface of the circuit board is Au (Cu comes from the substrate, Ni and P come from the nickel layer on the Cu layer), and the structure on the circuit board is that the copper layer is the substrate, the upper layer is the nickel layer, and the upper layer is the gold layer. As can be seen from FIG. 2, only Ni and P elements are used to indicate that the gold is removed after gold stripping, which meets the requirement. As can be seen from fig. 3, the gold on the circuit board is completely removed.
The gold withdrawal time of this example was 30s, and the gold withdrawal rate was 100%.
Example 2
The present embodiment provides a metal removing liquid, which comprises: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:5, 50g/L potassium iodide, 1g/L triethanolamine (accelerator), 1g/L EDTA-2 Na (accelerator), 1g/L sodium hydroxide (pH stabilizer), 10g/L ammonia water (pH stabilizer), 10g/L borax (pH stabilizer).
The preparation process was identical to example 1.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
s2, soaking the cleaned circuit board in a gold stripping solution for 50s at the temperature of 35 ℃ and at the magneton rotating speed of 400 r/min.
The gold withdrawal time in this example was 50s, and the gold withdrawal rate was 100%.
Example 3
The present embodiment provides a metal removing liquid, which comprises: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:8, 40g/L potassium iodide, 1g/L EDTA-2 Na (accelerator), 4g/L potassium sodium tartrate (accelerator), 1g/L sodium hydroxide (pH stabilizer), 19g/L borax (pH stabilizer), 30g/L ammonia water (pH stabilizer).
The preparation process was identical to example 1.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
s2, soaking the cleaned circuit board in the gold stripping solution for 40s at the temperature of 45 ℃ and at the magneton rotating speed of 500 r/min.
The gold withdrawal time in this example was 40s, and the gold withdrawal rate was 100%.
Example 4
The present embodiment provides a metal removing liquid, which comprises: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:14, 55g/L potassium iodide, 2g/L potassium sodium tartrate (accelerator), 4g/L glycine (accelerator), 1g/L sodium hydroxide (pH stabilizer), 10g/L borax (pH stabilizer), 2g/L ammonia (pH stabilizer).
The preparation process was identical to example 1.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
and S2, soaking the cleaned circuit board in the gold stripping solution for 60s at the temperature of 35 ℃ and at the magneton rotating speed of 300 r/min.
The gold withdrawal time in this example was 60s, and the gold withdrawal rate was 100%.
Example 5
The present embodiment provides a metal removing liquid, which comprises: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:1, 60g/L potassium iodide, 4g/L EDTA-2 Na (accelerator), 2g/L potassium sodium tartrate (accelerator), 4g/L ethylenediamine (accelerator), 1g/L sodium hydroxide (pH stabilizer).
The preparation process was identical to example 1.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
s2, soaking the cleaned circuit board in a gold stripping solution for 30s at the temperature of 40 ℃ and at the magneton rotating speed of 300 r/min.
The gold withdrawal time in this example was 60s, and the gold withdrawal rate was 100%.
Example 6
The composition of the gold stripping solution of the present embodiment is as follows: the molar ratio of iodine to potassium iodide (water-soluble iodide) was 1:12, 80g/L potassium iodide, 5g/L potassium sodium tartrate (accelerator), 2g/L EDTA-4 Na (accelerator), 3g/L sodium hydroxide (pH stabilizer), 2g/L aqueous ammonia (pH stabilizer).
The gold stripping solution is prepared by the following preparation processes: mixing iodine, water-soluble iodide, accelerator, pH stabilizer and water.
And performing gold removing treatment on the waste circuit board by using the gold removing liquid.
The gold removing step comprises the following steps:
s1, placing the waste circuit board containing gold plating into ethanol for ultrasonic cleaning for 5min, and then cleaning with deionized water;
and S2, soaking the cleaned circuit board in the gold stripping solution for 10s at the temperature of 35 ℃ and at the magneton rotating speed of 300 r/min.
The gold withdrawal time in this example was 10s, and the gold withdrawal rate was 100%.
Comparative example 1
This comparative example provides a degolding solution which is identical to that of example 1 except that no accelerator is added.
The same procedure as in example 1 was followed to carry out the gold stripping treatment, and it was found that gold was hardly stripped.
Comparative example 2
The comparative example provides a conventional gold stripping solution, and the rest is consistent with the embodiment except that an accelerator is not added, and 1.5 wt% of hydrogen peroxide is added.
The same procedure as in example 1 was followed to carry out the gold stripping treatment, and it was found that almost no gold was stripped when the gold stripping was carried out for 60 seconds. The gold is removed for at least two hours, and the hydrogen peroxide is continuously decomposed, so that the gold removing capability is poor.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (9)
1. A fast environment-friendly circuit board gold stripping liquid is characterized by comprising iodine, water-soluble iodide, an accelerator, a pH stabilizer and water;
the molar ratio of the iodine to the water-soluble iodide is 1: 1-14; the concentration of the water-soluble iodide is 1-25 g/L;
the accelerator is one or a combination of more of EDTA, EDTA derivatives or potassium sodium tartrate; the concentration of the accelerator is 1-10 g/L;
the pH stabilizer is one or more of ammonia water, sodium hydroxide, potassium hydroxide or borax;
the concentration of the pH stabilizer is 1-50 g/L.
2. The quick and environment-friendly circuit board gold stripping solution as claimed in claim 1, wherein the water-soluble iodide is one or both of sodium iodide and potassium iodide; the EDTA derivative is one or two of EDTA & 2Na or EDTA & 4 Na.
3. The quick environment-friendly circuit board metal stripping liquid as claimed in claim 1, wherein the concentration of the accelerator is 1-5 g/L; the concentration of the pH stabilizer is 1-20 g/L; the molar ratio of the iodine to the water-soluble iodide is 1: 1-12.
4. The preparation method of the rapid and environment-friendly circuit board metal stripping liquid as claimed in any one of claims 1 to 3, which is characterized by comprising the following steps: mixing iodine, water-soluble iodide, accelerator, pH stabilizer and water.
5. The use of the rapid and environment-friendly circuit board gold stripping solution as claimed in any one of claims 1 to 3 in circuit board gold stripping.
6. A gold withdrawal method is characterized by comprising the following steps: soaking the circuit board in the metal removing liquid as claimed in any one of claims 1 to 4, and stirring.
7. The method for removing gold according to claim 6, wherein the circuit board further comprises a step of cleaning with a polar solvent before being placed in the gold removing solution.
8. The method for removing gold according to claim 7, wherein the polar solvent is one or more of methanol, ethanol, n-propanol or acetone.
9. The method for withdrawing gold according to claim 6, wherein the temperature for soaking the circuit board is 10-70 ℃ and the time is 10-60 s; the stirring speed is 100-1000 r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906070.6A CN110656251B (en) | 2019-09-24 | 2019-09-24 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906070.6A CN110656251B (en) | 2019-09-24 | 2019-09-24 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110656251A CN110656251A (en) | 2020-01-07 |
| CN110656251B true CN110656251B (en) | 2021-11-26 |
Family
ID=69038919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910906070.6A Active CN110656251B (en) | 2019-09-24 | 2019-09-24 | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110656251B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101392325A (en) * | 2008-10-21 | 2009-03-25 | 东华大学 | Method for extracting gold from waste printed circuit board |
| CN104532001A (en) * | 2010-04-15 | 2015-04-22 | 高级技术材料公司 | Method for recycling of obsolete printed circuit boards |
| CN104988317A (en) * | 2015-06-23 | 2015-10-21 | 中国电器科学研究院有限公司 | Method for extracting metallic silver from waste circuit board |
| CN105018725A (en) * | 2015-08-07 | 2015-11-04 | 珠海格力电器股份有限公司 | Gold leaching solution and method for recycling gold |
| CN105400958A (en) * | 2015-12-03 | 2016-03-16 | 福建工程学院 | Method and device for rapidly leaching out gold in waste circuit board |
| CN105586494A (en) * | 2016-03-21 | 2016-05-18 | 黑龙江科技大学 | Method for recycling gold from iodide gold leaching pregnant solution on basis of recycling of waste solution |
| CN107354308A (en) * | 2017-07-28 | 2017-11-17 | 许良秋 | A kind of method for gold of purifying metals |
-
2019
- 2019-09-24 CN CN201910906070.6A patent/CN110656251B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101392325A (en) * | 2008-10-21 | 2009-03-25 | 东华大学 | Method for extracting gold from waste printed circuit board |
| CN104532001A (en) * | 2010-04-15 | 2015-04-22 | 高级技术材料公司 | Method for recycling of obsolete printed circuit boards |
| CN104988317A (en) * | 2015-06-23 | 2015-10-21 | 中国电器科学研究院有限公司 | Method for extracting metallic silver from waste circuit board |
| CN105018725A (en) * | 2015-08-07 | 2015-11-04 | 珠海格力电器股份有限公司 | Gold leaching solution and method for recycling gold |
| CN105400958A (en) * | 2015-12-03 | 2016-03-16 | 福建工程学院 | Method and device for rapidly leaching out gold in waste circuit board |
| CN105586494A (en) * | 2016-03-21 | 2016-05-18 | 黑龙江科技大学 | Method for recycling gold from iodide gold leaching pregnant solution on basis of recycling of waste solution |
| CN107354308A (en) * | 2017-07-28 | 2017-11-17 | 许良秋 | A kind of method for gold of purifying metals |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110656251A (en) | 2020-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101392325B (en) | Method for extracting gold from waste printed circuit board | |
| TWI568859B (en) | Method for recycling of obsolete printed circuit boards | |
| CN105112674B (en) | A kind of waste printed circuit board Whote-wet method recovery process | |
| TWI471457B (en) | Metal stripping additive, composition containing the same, and method for stripping metal by using the composition | |
| JP4551994B2 (en) | Method for recovering tin, tin alloy or lead alloy from printed circuit board | |
| CN103695653B (en) | A kind of method of noble metal on wet underwater welding circuit board | |
| CN105297020B (en) | Tin stripping additive and application thereof | |
| CN113215412B (en) | Method for selectively leaching and recovering silver on surface of waste silver-plated part or silver-containing solid waste | |
| CN105154680B (en) | A kind of method from waste and old printed wiring plate surface selective detachment metallic gold | |
| CN103540748B (en) | A kind of metal of waste printed circuit board substrate and nonmetallic separation method | |
| CN110656251B (en) | Rapid and environment-friendly circuit board gold stripping liquid, preparation method and application thereof, and gold stripping method | |
| CN101748410A (en) | Metal-dissolving solution | |
| Hao et al. | Study of gold leaching from pre-treated waste printed circuit boards by thiosulfate‑cobalt-glycine system and separation by solvent extraction | |
| Kulandaisamy et al. | The aqueous recovery of gold from electronic scrap | |
| JP2016520716A (en) | Method for concentrating metal from scrap containing metal | |
| CN109487088A (en) | A kind of waste and old plating piece gradient recycling metal process of copper-based nickel plating-Gold plated Layer | |
| JP2007016259A (en) | System for collecting gold while recycling iodine ion in gold-removing liquid | |
| KR101481366B1 (en) | Selective recovery method of silver and tin in the anode slime | |
| KR101364521B1 (en) | Method for separating tin from intermetallic | |
| Yin et al. | Comparison of leaching processes of gold and copper from printed circuit boards of waste mobile phone | |
| EP3055437B1 (en) | Hydrometallurgy process for the recovery of materials from electronic boards | |
| CN114807612A (en) | Method for selectively recovering noble metal palladium in solid waste by utilizing acetonitrile-anhydrous chloride salt system | |
| WO2020245736A1 (en) | Procedure for retrieving the precious metal plating and the carrier from electronic components with nickel-containing intermediate layer | |
| CN112813271B (en) | Method for recovering brownification waste liquid | |
| CN1912184A (en) | Etching method of copper-coated electronic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |