CN110655890A - Waterproof repair adhesive for solar module back plate - Google Patents
Waterproof repair adhesive for solar module back plate Download PDFInfo
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- CN110655890A CN110655890A CN201910811191.2A CN201910811191A CN110655890A CN 110655890 A CN110655890 A CN 110655890A CN 201910811191 A CN201910811191 A CN 201910811191A CN 110655890 A CN110655890 A CN 110655890A
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- bisphenol
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- 239000000853 adhesive Substances 0.000 title claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 33
- 239000003822 epoxy resin Substances 0.000 claims abstract description 47
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 47
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 42
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 19
- 239000005077 polysulfide Substances 0.000 claims abstract description 19
- 229920001021 polysulfide Polymers 0.000 claims abstract description 19
- 150000008117 polysulfides Polymers 0.000 claims abstract description 19
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 42
- 238000003756 stirring Methods 0.000 claims description 42
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 25
- 239000003085 diluting agent Substances 0.000 claims description 24
- 239000000741 silica gel Substances 0.000 claims description 24
- 229910002027 silica gel Inorganic materials 0.000 claims description 24
- 239000013008 thixotropic agent Substances 0.000 claims description 24
- 229910000831 Steel Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 150000001412 amines Chemical class 0.000 claims description 18
- 239000002518 antifoaming agent Substances 0.000 claims description 18
- -1 modified cyclic amine Chemical class 0.000 claims description 18
- 239000002893 slag Substances 0.000 claims description 18
- 239000010959 steel Substances 0.000 claims description 18
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 6
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 230000032683 aging Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a waterproof repair adhesive for a solar module backboard, which comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1-5:0.1-0.5:3-8, and the component A comprises 80-120 parts by weight of amino epoxy resin, 6101#36-60 parts by weight of epoxy resin, 63-90 parts by weight of bisphenol A type epoxy resin, 24-35 parts by weight of polyamide resin, 13-23 parts by weight of polysulfide rubber and 31-50 parts by weight of polyglycidyl ether. The mechanical properties of the product bonded by the invention comprise high compressive strength and high tensile strength; the repairing and the curing bonding can be carried out under the common condition (in the air), and the repairing and the curing bonding can be carried out under the humid condition. The solar cell back plate repairing method is suitable for rapid repairing treatment of the solar cell back plate under the outdoor rainwater condition, has remarkable technical and economic benefits, and has good weather resistance, insulativity and ageing resistance besides remarkable water blocking and water isolating effects.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a waterproof repair adhesive for a solar module back plate.
Background
Solar module is by high-efficient single crystal/polycrystal solar wafer, low-iron super white matte toughened glass, packaging material (EVA, POE etc.), the function backplate, the interconnection bar, the busbar, terminal box and aluminum alloy frame are constituteed, solar module backplate uses under outdoor changeable climatic environment, so its weatherability, ageing resistance etc. need accord with the standard, in addition, under outdoor rainwater weather and backplate have the circumstances of water, the backplate damages, traditional restoration is glued and is not had fine adhesion under the circumstances that has water, consequently, need a solar module backplate and glue with waterproof repair.
Disclosure of Invention
The invention aims to provide a waterproof repair adhesive for a solar module backboard, which is used for solving the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1-5:0.1-0.5:3-8, the component A comprises 80-120 parts by weight of amino epoxy resin 6101#36-60 parts by weight of bisphenol A epoxy resin 63-90 parts by weight of polyamide resin 24-35 parts by weight of polysulfide rubber 13-23 parts by weight of polyglycidyl ether 31-50 parts by weight of polyglycidyl ether, the component B comprises 12-20 parts by weight of reactive diluent, 25-30 parts by weight of silica gel powder, 6-16 parts by weight of thixotropic agent and 3-9 parts by weight of defoaming agent, and the component C comprises 16-30 parts by weight of modified amine curing agent, 26-40 parts by weight of modified cyclic amine and 5-12 parts by weight of curing agent YF-33#5-12 parts by weight of curing agent, 250 portions of steel slag powder 160 and 90 to 200 portions of aluminum powder.
As a further scheme of the invention: the mass ratio of the component A to the component B to the component C is 1-3:0.1-0.3:3-5, the component A comprises 120 parts by weight of amino epoxy resin, 6101#60 parts by weight of epoxy resin, 90 parts by weight of bisphenol A epoxy resin, 35 parts by weight of polyamide resin, 23 parts by weight of polysulfide rubber and 50 parts by weight of polyglycidyl ether, the component B comprises 12 parts by weight of reactive diluent, 25 parts by weight of silica gel powder, 6 parts by weight of thixotropic agent and 3 parts by weight of defoaming agent, and the component C comprises 30 parts by weight of modified amine curing agent, 40 parts by weight of modified cyclic amine, 12 parts by weight of curing agent YF-33#12 parts by weight of steel slag powder and 200 parts by weight of aluminum powder.
As a further scheme of the invention: the mass ratio of the component A to the component B to the component C is 3-5:0.3-0.5:5-8, the component A comprises 80 parts by weight of amino epoxy resin, 6101#36 parts by weight of epoxy resin, 63 parts by weight of bisphenol A type epoxy resin, 24 parts by weight of polyamide resin, 13 parts by weight of polysulfide rubber and 31 parts by weight of polyglycidyl ether, the component B comprises 20 parts by weight of active diluent, 35 parts by weight of silica gel powder, 16 parts by weight of thixotropic agent and 9 parts by weight of defoaming agent, and the component C comprises 16 parts by weight of modified amine curing agent, 26 parts by weight of modified cyclic amine, 5 parts by weight of curing agent YF-33#5 parts by weight of steel slag powder and 90 parts by weight of aluminum powder.
As a further scheme of the invention: the mass ratio of the component A to the component B to the component C is 2-4:0.2-0.4:5-7, the component A comprises 84 parts of amino epoxy resin, 6101#41 parts of epoxy resin, 65 parts of bisphenol A epoxy resin, 28 parts of polyamide resin, 14 parts of polysulfide rubber and 32 parts of polyglycidyl ether by weight, the component B comprises 15 parts of reactive diluent, 30 parts of silica gel powder, 10 parts of thixotropic agent and 7 parts of defoaming agent by weight, and the component C comprises 20 parts of modified amine curing agent, 30 parts of modified cyclic amine, 10 parts of curing agent YF-33#10 parts of steel slag powder and 150 parts of aluminum powder.
As a further scheme of the invention: the bisphenol A type epoxy resin is one or a mixture of bisphenol A type epoxy resin E-51 and bisphenol A type epoxy resin E-44.
As a further scheme of the invention: the silica gel powder is silica powder modified by a silane coupling agent, the active diluent is one or a mixture of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
The waterproof repair adhesive for the solar module back plate is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
As a further scheme of the invention: the stirring temperatures in the steps S1 and S2 were 60 ℃ and 40 ℃, respectively.
Compared with the prior art, the invention has the beneficial effects that: the mechanical properties of the product bonded by the invention comprise high compressive strength and high tensile strength; the repairing and the curing bonding can be carried out under the common condition (in the air), and the repairing and the curing bonding can be carried out under the humid condition. The solar cell back plate repairing method is suitable for rapid repairing treatment of the solar cell back plate under the outdoor rainwater condition, has remarkable technical and economic benefits, and has good weather resistance, insulativity and ageing resistance besides remarkable water blocking and water isolating effects.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1-5:0.1-0.5:3-8, the component A comprises 80-120 parts by weight of amino epoxy resin 6101#36-60 parts by weight of bisphenol A epoxy resin 63-90 parts by weight of polyamide resin 24-35 parts by weight of polysulfide rubber 13-23 parts by weight of polyglycidyl ether 31-50 parts by weight of polyglycidyl ether, the component B comprises 12-20 parts by weight of reactive diluent, 25-30 parts by weight of silica gel powder, 6-16 parts by weight of thixotropic agent and 3-9 parts by weight of defoaming agent, and the component C comprises 16-30 parts by weight of modified amine curing agent, 26-40 parts by weight of modified cyclic amine and 5-12 parts by weight of curing agent YF-33#5-12 parts by weight of curing agent, 250 portions of steel slag powder 160 and 90 to 200 portions of aluminum powder.
The bisphenol A epoxy resin is one or two of bisphenol A epoxy resin E-51 and bisphenol A epoxy resin E-44, the silica gel powder is silica powder modified by a silane coupling agent, the active diluent is one or two of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
The waterproof repair adhesive for the solar module back plate is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
The stirring temperatures in the steps S1 and S2 were 60 ℃ and 40 ℃, respectively.
The first embodiment is as follows:
the waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1-3:0.1-0.3:3-5, the component A comprises 120 parts by weight of amino epoxy resin, 60 parts by weight of epoxy resin 6101#60 parts by weight of bisphenol A epoxy resin, 90 parts by weight of polyamide resin 35 parts by weight of polysulfide rubber 23 parts by weight of polyglycidyl ether 50 parts by weight of active diluent, 25 parts by weight of silica gel powder, 6 parts by weight of thixotropic agent and 3 parts by weight of defoaming agent, and the component C comprises 30 parts by weight of modified amine curing agent, 40 parts by weight of modified cyclic amine, 12 parts by weight of curing agent YF-33#12 parts by weight of steel slag powder and 200 parts by weight of aluminum powder.
The bisphenol A epoxy resin is one or two of bisphenol A epoxy resin E-51 and bisphenol A epoxy resin E-44, the silica gel powder is silica powder modified by a silane coupling agent, the active diluent is one or two of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
The waterproof repair adhesive for the solar module back plate is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
The stirring temperatures in the steps S1 and S2 were 60 ℃ and 40 ℃, respectively.
Example two:
the waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 3-5:0.3-0.5:5-8, the component A comprises 80 parts by weight of amino epoxy resin, 6101#36 parts by weight of epoxy resin, 63 parts by weight of bisphenol A epoxy resin, 24 parts by weight of polyamide resin, 13 parts by weight of polysulfide rubber and 31 parts by weight of polyglycidyl ether, the component B comprises 20 parts by weight of active diluent, 35 parts by weight of silica gel powder, 16 parts by weight of thixotropic agent and 9 parts by weight of defoaming agent, and the component C comprises 16 parts by weight of modified amine curing agent, 26 parts by weight of modified cyclic amine, 5 parts by weight of curing agent YF-33#5 parts by weight of steel slag powder and 90 parts by weight of aluminum powder.
The bisphenol A epoxy resin is one or two of bisphenol A epoxy resin E-51 and bisphenol A epoxy resin E-44, the silica gel powder is silica powder modified by a silane coupling agent, the active diluent is one or two of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
The waterproof repair adhesive for the solar module back plate is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
The stirring temperatures in the steps S1 and S2 were 60 ℃ and 40 ℃, respectively.
Example three:
the waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 2-4:0.2-0.4:5-7, the component A comprises 84 parts by weight of amino epoxy resin, 6101#41 parts by weight of epoxy resin, 65 parts by weight of bisphenol A epoxy resin, 28 parts by weight of polyamide resin, 14 parts by weight of polysulfide rubber and 32 parts by weight of polyglycidyl ether, the component B comprises 15 parts by weight of reactive diluent, 30 parts by weight of silica gel powder, 10 parts by weight of thixotropic agent and 7 parts by weight of defoaming agent, and the component C comprises 20 parts by weight of modified amine curing agent, 30 parts by weight of modified cyclic amine, 10 parts by weight of curing agent YF-33#10 parts by weight of steel slag powder and 150 parts by weight of aluminum powder.
The bisphenol A epoxy resin is one or two of bisphenol A epoxy resin E-51 and bisphenol A epoxy resin E-44, the silica gel powder is silica powder modified by a silane coupling agent, the active diluent is one or two of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
The waterproof repair adhesive for the solar module back plate is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
The stirring temperatures in the steps S1 and S2 were 60 ℃ and 40 ℃, respectively.
The invention aims to repair outdoor solar back panels by using the repair adhesive in rainy days or under the condition that the solar back panels have water, so that the repair adhesive needs to have the effects of water resistance, ageing resistance, weather resistance and the like, and the ageing resistance, the weather resistance and the illumination stripping degree of the repair adhesive are detected according to the ASTM G155 ageing detection standard, and the detection results all meet the standard; the bonding strength in water completely meets the strength requirement, can be repaired and cured under common conditions (in air), and can also be rapidly repaired and cured in a humid rainwater environment. The method is suitable for rapid repairing treatment of the solar cell backboard under the outdoor rainwater condition, and the waterproof and waterproof effects of the solar cell backboard are identified according to the NY/T1527-2007 glue water soluble substance content determination standard, so that the waterproof and waterproof effects meet the standard and the effect is excellent.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. The waterproof repair adhesive for the solar module back plate comprises a component A, a component B and a component C, and is characterized in that the mass ratio of the component A to the component B to the component C is 1-5:0.1-0.5:3-8, the component A comprises 80-120 parts by weight of amino epoxy resin, 6101#36-60 parts by weight of epoxy resin, 63-90 parts by weight of bisphenol A type epoxy resin, 24-35 parts by weight of polyamide resin, 13-23 parts by weight of polysulfide rubber and 31-50 parts by weight of polyglycidyl ether, the component B comprises 12-20 parts by weight of active diluent, 25-30 parts by weight of silica gel powder, 6-16 parts by weight of thixotropic agent and 3-9 parts by weight of defoaming agent, and the component C comprises 16-30 parts by weight of modified amine curing agent, 26-40 parts by weight of modified cyclic amine, 5-12 parts by weight of curing agent YF-33#5, 12 parts by weight of curing agent, 250 portions of steel slag powder 160 and 90 to 200 portions of aluminum powder.
2. The waterproof repair adhesive for the solar module back plate as claimed in claim 1, wherein the mass ratio of the component A, the component B and the component C is 1-3:0.1-0.3:3-5, the component A comprises 120 parts by weight of amino epoxy resin, 6101#60 parts by weight of epoxy resin, 90 parts by weight of bisphenol A epoxy resin, 35 parts by weight of polyamide resin, 23 parts by weight of polysulfide rubber and 50 parts by weight of polyglycidyl ether, the component B comprises 12 parts by weight of reactive diluent, 25 parts by weight of silica gel powder, 6 parts by weight of thixotropic agent and 3 parts by weight of defoaming agent, and the component C comprises 30 parts by weight of modified amine curing agent, 40 parts by weight of modified cyclic amine, 12 parts by weight of curing agent YF-33#12 parts by weight of steel slag powder and 200 parts by weight of aluminum powder.
3. The waterproof repair adhesive for the solar module back plate as claimed in claim 1, wherein the mass ratio of the component A, the component B and the component C is 3-5:0.3-0.5:5-8, the component A comprises 80 parts by weight of amino epoxy resin, 6101#36 parts by weight of bisphenol A epoxy resin, 63 parts by weight of polyamide resin, 13 parts by weight of polysulfide rubber and 31 parts by weight of polyglycidyl ether, the component B comprises 20 parts by weight of reactive diluent, 35 parts by weight of silica gel powder, 16 parts by weight of thixotropic agent and 9 parts by weight of defoaming agent, and the component C comprises 16 parts by weight of modified amine curing agent, 26 parts by weight of modified cyclic amine, 5 parts by weight of curing agent YF-33#5 parts by weight of steel slag powder and 160 parts by weight of aluminum powder.
4. The waterproof repair adhesive for the solar module back plate as claimed in claim 1, wherein the mass ratio of the component A, the component B and the component C is 2-4:0.2-0.4:5-7, the component A comprises 84 parts by weight of amino epoxy resin, 6101#41 parts by weight of epoxy resin, 65 parts by weight of bisphenol A epoxy resin, 28 parts by weight of polyamide resin, 14 parts by weight of polysulfide rubber and 32 parts by weight of polyglycidyl ether, the component B comprises 15 parts by weight of reactive diluent, 30 parts by weight of silica gel powder, 10 parts by weight of thixotropic agent and 7 parts by weight of defoaming agent, and the component C comprises 20 parts by weight of modified amine curing agent, 30 parts by weight of modified cyclic amine, 10 parts by weight of curing agent YF-33#10 parts by weight of steel slag powder and 150 parts by weight of aluminum powder.
5. The waterproof repair adhesive for the solar module back sheet as claimed in claim 1, wherein the bisphenol a epoxy resin is one or a mixture of bisphenol a epoxy resin E-51 and bisphenol a epoxy resin E-44.
6. The waterproof repair adhesive for the solar module back panel according to claim 1, wherein the silica gel powder is silica powder modified by a silane coupling agent, the reactive diluent is one or a mixture of benzyl glycidyl ether 692 and resorcinol diglycidyl ether 694, and the thixotropic agent is hydrophilic nano-silica.
7. The waterproof repair adhesive for solar module back sheets as claimed in any one of claims 1 to 6, which is prepared by the following steps:
s1: preparing a component A, stirring amino epoxy resin, epoxy resin 6101#, bisphenol A type epoxy resin, polyamide resin, polysulfide rubber and polyglycidyl ether at a certain temperature, and uniformly stirring to obtain the component A;
s2: preparing a component B, stirring the reactive diluent, the silica gel powder, the thixotropic agent and the defoaming agent at a certain temperature according to the proportion, and uniformly stirring to obtain the component B;
s3: preparing a component C, stirring a modified amine curing agent, modified cyclic amine, a curing agent YF-33#, steel slag powder and aluminum powder at normal temperature according to a ratio, and uniformly stirring to obtain the component C;
s4: and blending the component A, B, C obtained from S1, S2 and S3 according to the weight ratio to obtain the repair adhesive.
8. The waterproof repair adhesive for solar module back sheets as claimed in claim 7, wherein the stirring temperatures in the steps S1 and S2 are 60 ℃ and 40 ℃, respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910811191.2A CN110655890A (en) | 2019-08-30 | 2019-08-30 | Waterproof repair adhesive for solar module back plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910811191.2A CN110655890A (en) | 2019-08-30 | 2019-08-30 | Waterproof repair adhesive for solar module back plate |
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| CN110655890A true CN110655890A (en) | 2020-01-07 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921566A (en) * | 2009-06-12 | 2010-12-22 | 北京公科固桥技术有限公司 | Structural adhesive for steel bonding |
| CN109536102A (en) * | 2018-12-06 | 2019-03-29 | 中国建材检验认证集团厦门宏业有限公司 | A kind of high density underwater epoxy repair sheets and its preparation method and application |
| KR20190074791A (en) * | 2017-12-20 | 2019-06-28 | 이아이씨티코리아 주식회사 | Low Temperature Curing Epoxy Resin Composition |
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- 2019-08-30 CN CN201910811191.2A patent/CN110655890A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921566A (en) * | 2009-06-12 | 2010-12-22 | 北京公科固桥技术有限公司 | Structural adhesive for steel bonding |
| KR20190074791A (en) * | 2017-12-20 | 2019-06-28 | 이아이씨티코리아 주식회사 | Low Temperature Curing Epoxy Resin Composition |
| CN109536102A (en) * | 2018-12-06 | 2019-03-29 | 中国建材检验认证集团厦门宏业有限公司 | A kind of high density underwater epoxy repair sheets and its preparation method and application |
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Application publication date: 20200107 |