CN110653507B - Semi-solid processing method for preparing ultra-fine grain/nano-grain plate - Google Patents

Semi-solid processing method for preparing ultra-fine grain/nano-grain plate Download PDF

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CN110653507B
CN110653507B CN201910915467.1A CN201910915467A CN110653507B CN 110653507 B CN110653507 B CN 110653507B CN 201910915467 A CN201910915467 A CN 201910915467A CN 110653507 B CN110653507 B CN 110653507B
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plate
stirring
stirring pin
semi
processing
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CN110653507A (en
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姬书得
马琳
李清华
岳玉梅
宋崎
胡为
王留芳
熊需海
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Shenyang Aerospace University
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Shenyang Aerospace University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/1215—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding for other purposes than joining, e.g. built-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment

Abstract

A semi-solid processing method for preparing superfine crystal/nano crystal plate includes setting plate to be processed on backing plate and fixing, starting resistance wire auxiliary heating unit and dynamic torque transducer, rotating stirring pin to penetrate through plate until end face of static shaft shoulder is contacted with upper surface of plate, transmitting ultrasonic wave of ultrasonic transducer to region to be processed to refine crystal grain through stirring pin connected with ultrasonic amplitude transformer, stopping stirring pin to continue rotating when stirring processing tool system reaches set depth, moving stirring processing tool system forward along longitudinal direction of plate from left to right in step mode at set speed and finishing processing. In the processing process, the feedback signal based on the dynamic torque sensor is compared with the semi-solid processing model database, and the power of the resistance wire auxiliary heating device is subjected to feedback regulation. The solid-liquid ratio of the material is in a set range by regulating and controlling the temperature of the processing area, and the stability of the quality of the processing area is ensured.

Description

Semi-solid processing method for preparing ultra-fine grain/nano-grain plate
Technical Field
The invention belongs to the technical field of stirring friction processing technique, and particularly relates to a semi-solid processing technique for preparing an ultra-fine grain/nano-grain plate.
Background
Friction stir welding (Friction stir welding FSW) is a novel solid phase welding technique proposed by the british welding institute in 1991, has the advantages of high quality, energy saving, no pollution and the like, and is widely applied to the fields of aviation, aerospace, automobiles, ships and the like. Based on the idea of FSW, doctor Mishara in the United states proposed Friction Stir Processing (FSP), namely, the refining, homogenization and densification of the microstructure of the material are realized by utilizing severe plastic deformation, mixing and crushing of the material in a processing area caused by a stirring head. However, from the current research situation, besides the fact that a small amount of low-melting-point alloy (such as AZ31) can realize the nano-crystallization of the microstructure of the material, the nano-crystallization of most aluminum alloys and magnesium alloys is difficult. Therefore, many researchers have proposed some friction stir processing-based processes, such as water immersion FSP, multi-pass FSP, etc., by which the grain size can be further refined to improve the material properties.
The patent (application No. 201310050662.5) proposes a method for preparing ultra-fine grain/nano-crystal plate based on ultrasound-assisted semi-solid friction stir processing, which comprises the steps of firstly generating heat by friction between a stirring needle rotating at high speed and the plate to enable the material in a stirring area to reach a semi-solid state, and then increasing nucleation rate by using the acoustic cavitation effect when ultrasonic waves are transmitted in the semi-solid material to achieve the effect of refining grains. However, the patent (application No. 201310050662.5) has three problems as follows: 1) in order to avoid the generation of defects, the main stirring pin is mostly conical, and the geometrical shape causes the difference of temperature distribution along the thickness direction of the plate, so that the difference of the grain size in the thickness direction is caused; 2) when the material in the processing zone is in a semi-solid state, the low friction coefficient makes it difficult for the pin to generate sufficient frictional heat, so that it is impossible to obtain a low solid-liquid ratio by heat generation of the pin alone. In fact, satisfactory ultrasonic cavitation can only be obtained with a sufficiently low solid-to-liquid ratio; 3) in the processing process, the temperature peak values of a processing area are difficult to keep consistent due to plate thickness manufacturing errors, heat accumulation, change of a heating area and the like, and the stability of the processing quality of the prepared plate is influenced; 4) lower pin travel speeds are required to provide adequate heat input, and processing efficiency is low.
Disclosure of Invention
The invention provides a semi-solid processing technique for preparing an ultra-fine grain/nano-crystal plate, which completes the preparation of the ultra-fine grain/nano-crystal plate through the synergistic action of stirring, ultrasound, resistance heat and pressure.
A semi-solid processing method for preparing ultra-fine grain/nano-grain plates comprises the following steps:
step 1, storing the material type, the processing parameters, the solid-liquid ratio and the torque data corresponding to the solid-liquid ratio of a processing area into a computer through a large number of early-stage tests; generating a semi-solid processing online detection model through machine learning, and establishing a semi-solid processing model database;
step 2, horizontally placing the plate to be processed on the base plate structure and fixing the plate; the base plate structure consists of a base plate and a plurality of equal-size cushion blocks, the equal-size cushion blocks are placed in the grooves of the base plate and are flush with the upper surface of the base plate, a gap is formed between every two adjacent cushion blocks in the middle to form a plate suspension area, and then the position right below the stirring pin is suspended in the air in the machining process;
step 3, switching on a power supply, electrifying the dynamic torque sensor, and setting a torque range through a computer; starting the resistance wire auxiliary heating device, and setting an initial power value through a computer; starting a main motor of the friction stir welding machine to rotate a stirring pin of the friction stir processing tool system;
step 4, the stirring pin penetrates into the surface of the plate at a rotating speed of 1000-70000 rpm and penetrates through the plate, the penetrating speed is 1-5 mm/min, and the stirring pin is continuously pressed down for 0.1-0.3 mm in the direction vertical to the surface of the plate after the end face of the static shaft shoulder is tightly attached to the upper surface of the processed plate;
and 5, directly transmitting the ultrasonic wave of the ultrasonic transducer to an area to be processed through a stirring pin, wherein the ultrasonic wave parameters are as follows: the frequency is 40-80K, and the amplitude is 20-60 μm;
step 6, when the stirring processing tool system reaches the set pricking depth, stopping pricking and continuously rotating for 3-8 min to preheat the material, and then moving the stirring pin forward in an echelon manner from left to right along the longitudinal direction of the plate at a speed of 50-500 mm/min until the surface of the whole plate is processed; in the processing process, the real-time torque sensor acquires the torque of a processing area, then matches the torque with a semi-solid processing model database, and maintains the current technological parameters unchanged when the torque value is within a set range; when the torque value is higher than the set range, the power of the resistance wire auxiliary heating device is increased; when the torque value is lower than the set range, the power of the resistance wire auxiliary heating device is reduced; and continuously adjusting the power of the resistance wire auxiliary heating device through closed-loop feedback, so that the measured torque value is in a set range until the processing is finished.
The stirring processing tool system comprises a stirring needle, an ultrasonic transducer, an ultrasonic amplitude transformer, a resistance wire auxiliary heating device, a static shaft shoulder and a stirring friction processing equipment shell, wherein one end of the ultrasonic transducer is fixedly installed with the ultrasonic amplitude transformer, the other end of the ultrasonic amplitude transformer is fixedly installed with the stirring needle, the stirring needle consists of a stirring needle shaft, a main stirring needle and an auxiliary stirring needle which are connected together, one end of the stirring needle shaft is connected with the ultrasonic amplitude transformer, the other end of the stirring needle shaft is connected with the large-diameter end of the main stirring needle, the maximum diameter of the main stirring needle is smaller than the diameter of the stirring needle shaft, so that the bottom of the stirring needle shaft forms a rotary small shaft shoulder, the small-diameter end of the main stirring needle is connected with the auxiliary stirring needle, and the static shaft shoulder is coaxially sleeved on the stirring needle shaft; the inner wall of the shell of the friction stir processing equipment is sequentially provided with a first supporting plate and a second supporting plate through bolts, the first supporting plate is provided with a main motor, the second supporting plate is provided with a dynamic torque sensor, the main motor is connected with an ultrasonic transducer of a stirring processing tool system through the dynamic torque sensor, the output end of the torque sensor is connected with a computer, and the computer is connected with a resistance wire auxiliary heating device.
The main stirring pin is in a cone frustum-shaped structure, the outer surface of the main stirring pin is in a sawtooth structure, and the maximum diameter d of the main stirring pin2The thickness T of the plate is 1.2-1.5 times, the cone angle is less than 5 degrees, and a resistance wire auxiliary heating device with power adjustable through a computer is arranged in the main stirring pin; distance H from the maximum diameter position of the main stirring pin to the highest point of the end surface of the auxiliary stirring pin1Is thicker than the plateThe degree T is 0.2-0.5 mm larger, and the distance H from the maximum diameter position of the main stirring pin to the vertex of the auxiliary stirring pin2The distance H from the maximum diameter position of the main stirring pin to the highest point of the end surface of the auxiliary stirring pin1The difference is compared with the thickness H of the cushion block32-6 mm small.
The auxiliary stirring needle is in a cone-shaped structure; maximum diameter d of the auxiliary agitating needle3Is the maximum diameter d of the main stirring pin21.3-2 times, the maximum included angle beta of the two buses at the upper end is 140-160 degrees, and the maximum included angle alpha of the two buses at the lower end is 90-120 degrees.
Welding heat input is regulated and controlled in the semi-solid processing process through the resistance wire auxiliary heating device in the main stirring pin, so that the material is in a state of controllable and adjustable solid-liquid ratio, and the resistance wire power required by regulation and control is obtained through a semi-solid processing model database.
Diameter d of the small rotating shaft shoulder4Is the maximum diameter d of the main stirring pin21.1-4 times of; diameter d of the stationary shoulder1The thickness T of the plate is 3-5 times.
Width W of the pad2Is the maximum diameter d of the main stirring pin21-4 times of the total weight of the powder.
Width W of the overhanging region of the sheet during processing1And the maximum diameter d of the sub-probe3Is greater than the maximum diameter d of the main stirring pin2The size is 4-20 mm.
The invention has the beneficial effects that:
firstly, in the process of semi-solid processing, the sound cavitation effect generated when the intense stirring of the rotary stirring pin and the ultrasonic wave are transmitted in the semi-solid material greatly increases the nucleation rate of the material, promotes the grain refinement, and makes the ultra-fine grain/nano-crystallization of low-melting-point metal plates of aluminum alloy, magnesium alloy and the like possible.
The temperature of the processing area is increased through the resistance wire auxiliary heating device, so that the material in the processing area can easily reach and keep a semi-solid state, the solid-liquid ratio of the material is controllable, the effect of ultrasonic grain refinement is maximized, a higher stirring needle moving speed can be adopted in the processing process, and the processing efficiency is improved; the resistance wire auxiliary heating device provides higher heat input for the bottom material of the processing area, and the problem that temperature distribution difference exists along the plate thickness direction when only a stirring needle and a small rotating shaft shoulder generate heat through friction can be solved.
And thirdly, the method of combining the dynamic torque sensor and the resistance wire auxiliary heating device can enable the solid-liquid ratio of the material in the processing area to be always kept in a set range, and the stability of the processing effect in the processing process is maintained.
In the semi-solid processing process, pressure is also an important factor influencing the metal nucleation rate, and because the static shaft shoulder moves synchronously along with the stirring needle, the optimal pressurizing effect can be achieved by adjusting the diameter size and the pressing amount of the static shaft shoulder; the friction between the static shaft shoulder and the surface of the plate in the machining process can eliminate structures such as arc lines, so that the post-treatment work of the machined material is simple, and the material waste can be reduced.
And fifthly, the stirring pin consists of a stirring pin shaft, a main stirring pin and an auxiliary stirring pin, wherein the main stirring pin is mainly positioned inside the plate, and the auxiliary stirring pin is positioned outside the plate. The rotary small shaft shoulder has a sealing function and can prevent the material in the semi-solid state from overflowing; in the processing process, the stirring needle penetrates through the plate, so that the crystal grain refinement of the plate along the thickness direction can be realized; the lower part of the metal material area to be processed is suspended based on the back support-free technology, so that the vibration effect of ultrasonic waves can be further improved, and the grain refinement is facilitated. The invention can make the crystal grain of the processing area reach ultra-fine crystal, even nano crystal, and obtain the metal plate with high strength and high ductility.
Drawings
FIG. 1 is an enlarged view of the configuration of a stir processing tool system of the semi-solid processing method for preparing an ultra-fine grain/nano-grain plate material;
FIG. 2 is a partially enlarged view of the semi-solid processing method for preparing an ultra-fine grain/nano-grain plate at the stirring pin;
FIG. 3 is a schematic view showing the operation of a semi-solid processing method for preparing an ultra-fine grain/nano-grain plate;
FIG. 4 is a schematic diagram showing the positional relationship between the pins and the plate during the friction stir processing;
FIG. 5 is a flow chart of a control method of the present invention;
in the figure: 1. the ultrasonic vibration processing device comprises an ultrasonic transducer, 2. an ultrasonic amplitude transformer, 3. a static shaft shoulder, 4. a main stirring pin, 5. an auxiliary stirring pin, 6. a stirring pin, 7. a rotary small shaft shoulder, 8. a stirring pin shaft, 9. a stirring processing tool system, 10. a plate, 11. a backing plate, 12. a cushion block, 13. a resistance wire auxiliary heating device, 14. a dynamic torque sensor, 15. a main motor, 16. a first supporting plate, 17. a second supporting plate, 18. a stirring friction processing device shell and 19. a computer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1 to 4: the stirring processing tool system 9 comprises a stirring needle 6, an ultrasonic transducer 1, an ultrasonic amplitude transformer 2, a resistance wire auxiliary heating device 13, a static shaft shoulder 3 and a stirring friction processing equipment shell 18, one end of the ultrasonic transducer 1 is fixedly arranged with the ultrasonic amplitude transformer 2, the other end of the ultrasonic amplitude transformer 2 is fixedly arranged with the stirring pin 6, the stirring pin 6 consists of a stirring pin shaft 8, a main stirring pin 4 and an auxiliary stirring pin 5 which are connected together, a resistance wire auxiliary heating device 13 with power adjustable by a computer 19 is arranged in the main stirring pin 4, one end of a stirring pin shaft 8 is connected with the ultrasonic amplitude transformer 2, the other end is connected with the large-diameter end of the main stirring pin 4, the maximum diameter of the main stirring pin 4 is smaller than the diameter of the stirring pin shaft, so that a rotary small shaft shoulder 7 is formed at the bottom of the stirring pin shaft 8, the small diameter end of the main stirring pin 4 is connected with the auxiliary stirring pin 5, and a static shaft shoulder 3 is coaxially sleeved on the stirring pin shaft; a first supporting plate 16 and a second supporting plate 17 are sequentially arranged on the inner wall of the shell 18 of the friction stir processing equipment through bolts, a main motor 15 is installed on the first supporting plate 16, a dynamic torque sensor 14 is installed on the second supporting plate 17, the main motor 15 is connected with an ultrasonic transducer 1 of a stirring processing tool system 9 through the dynamic torque sensor 14, the output end of the torque sensor is connected with a computer 19, and when the material fluidity of a processing area is poor, the torque value is large; when the material fluidity of the processing area is good, the torque value is small, and the computer 19 is connected with the resistance wire auxiliary heating device 13.
The main stirring pin 4 is in a cone frustum structure, the outer surface of the main stirring pin is in a cone shape structure, and the maximum diameter d of the main stirring pin 421.3 times the thickness T of the plate 10, and the cone angle is less than 5 degrees; the distance H from the maximum diameter position of the main stirring pin 4 to the highest point of the end surface of the auxiliary stirring pin 51Is 0.3mm larger than the thickness T of the plate 10, and the distance H from the maximum diameter position of the main stirring pin 4 to the top point of the auxiliary stirring pin 52The distance H from the maximum diameter position of the main stirring pin 4 to the highest point of the end surface of the auxiliary stirring pin 51The difference is compared with the thickness H of the cushion block 1234mm smaller; the auxiliary stirring pin 5 is in a cone-shaped structure, and the maximum diameter d of the auxiliary stirring pin 53The main stirring pin 4 has a diameter d21.6 times of the total angle of the two buses at the upper end, wherein the maximum included angle beta of the two buses at the upper end is 150 degrees, and the maximum included angle alpha of the two buses at the lower end is 100 degrees; width W of the pad 122Is the maximum diameter d of the main stirring pin 423 times of the total weight of the composition; the width W of the overhanging region of the sheet 10 during processing1With the maximum diameter d of the auxiliary agitating pin 53Is smaller than the maximum diameter d of the main pin 4212mm in size; diameter d of the small rotating shoulder 74Is the maximum diameter d of the main stirring pin 423 times of the total weight of the composition; diameter d of the stationary shoulder 314 times the thickness T of the sheet 10.
A semi-solid processing method for preparing ultra-fine grain/nano-grain plates comprises the following steps:
step 1, storing the material type, the processing parameters, the solid-liquid ratio and the torque data corresponding to the solid-liquid ratio in a processing area into a computer 19 through a large number of early-stage tests, wherein the processing parameters are as follows: the rotating speed omega, the welding speed v, the pressing amount h and the power p of the resistance wire auxiliary heating device 13; a supervised machine learning separator is provided according to a learning theory, a Support Vector Machine (SVM) algorithm is used, torque histogram calculation is carried out through a computer system, SVM parameters are initialized, an SVM training function is called to carry out training by combining the algorithm, a semi-solid friction stir processing online detection model is generated, and a semi-solid processing model database is established;
step 2, horizontally placing the plate 10 to be processed on a backing plate structure and fixing; the cushion plate structure consists of a cushion plate 11 and a plurality of cushion blocks 12 with equal sizes, the number of the cushion blocks 12 is related to the concrete condition of the actual semi-solid processing of the superfine crystal/nano crystal plate, the cushion blocks 12 with equal sizes are placed in a groove of the cushion plate 11 and are flush with the upper surface of the cushion plate 11, a gap is arranged between two adjacent cushion blocks at the middle position to form a plate suspension area, and suspension under the stirring pin 6 is realized in the processing process; in order to process the ultra-fine grain/nano-size of the whole plate material 10, the following conditions must be satisfied: the stirring pin 6 penetrates through the processing plate 10, so that in order to avoid the damage of the stirring pin 6 caused by the contact between the stirring pin 6 and the backing plate 11, the area right below the stirring pin 6 is suspended, namely the back surface is not supported, and the processing method is different from the conventional stirring friction processing, the back surface of the plate 10 to be processed does not need backing plate structure support in the processing process, so that the vibration effect of ultrasonic waves can be enhanced, and crystal grains can be further refined;
step 3, switching on a power supply, electrifying the real-time torque sensor 14, and setting the torque range to be 50-55 N.M through the computer 19; the resistance wire auxiliary heating device 13 is started, and the power value is set to be 50W through the computer 19; starting a main motor 15 of the friction stir welding machine to rotate a stirring pin 6 of the friction stir processing tool system;
step 4, the stirring pin 6 penetrates into the surface of the plate 10 at a speed of 5000 rpm and penetrates through the plate 10 at a speed of 3mm/min until the end face of the static shaft shoulder 3 is in contact with the upper surface of the plate 10, and then is continuously pressed down for 0.2mm in a direction vertical to the surface of the plate 10;
and 5, directly transmitting the ultrasonic waves of the ultrasonic transducer 1 to an area to be processed through a stirring needle 6 connected with the ultrasonic amplitude transformer 2, wherein the parameters of the ultrasonic waves are as follows: the frequency is 60K, the amplitude is 45 mu m, and the effect of grain refinement is achieved by utilizing the acoustic cavitation effect generated when ultrasonic waves are transmitted in the semisolid material;
step 6, when the stirring processing tool system 9 reaches the set pricking depth, stopping pricking and continuing to rotate the stirring pin 6 for 6min to preheat the material, and then moving the stirring pin 6 forwards in a reciprocating manner from left to right along the longitudinal direction of the plate 10 at a speed of 200mm/min until the surface of the whole plate 10 is processed; in the processing process, the real-time torque sensor 14 collects the torque of a processing area, then the torque is matched with the semi-solid processing model database, when the torque value is within a set range, the current technological parameters are kept unchanged, and when the torque value is higher than the set range, the power of the resistance wire auxiliary heating device 13 is increased; when the torque value is lower than the set range, the power of the resistance wire auxiliary heating device 13 is reduced, and in the processing process, the consistency of the temperature of the processing area is ensured by real-time adjustment of the power of the resistance wire auxiliary heating device 13 through the computer 19 based on the feedback signal of the torque sensor, so that the solid-liquid ratio of the material in the processing area is kept in the set range; the power of the resistance wire auxiliary heating device 13 is continuously adjusted through closed-loop feedback, so that the measured torque value is in a set range until the machining is completed, and the effect of steady-state machining is achieved, as shown in fig. 5.
Example 2
The difference between this embodiment and embodiment 1 is that the torque is set in the range of 45 to 50N · M in step 3, and the other steps are the same as embodiment 1.
Example 3
The difference between the present embodiment and embodiment 1 is that in step 3, the power of the resistance wire auxiliary heating device 13 is set to 70W, and other steps are the same as embodiment 1.
Example 4
This example is different from example 1 in that the rotational speed of the probe 6 was 7000 rpm in step 4, and the other steps were the same as example 1.
Example 5
The present embodiment is different from embodiment 1 in that in step 5, the ultrasonic frequency is 50K, and other steps are the same as embodiment 1.
Example 6
This embodiment is different from embodiment 1 in that the pin 6 is moved forward in steps of 50mm/min from left to right in the longitudinal direction of the sheet material 10 in steps of 50mm/min, and the other steps are the same as embodiment 1.
Example 7
The difference between this embodiment and embodiment 1 is that in step 6, when the stir processing tool system 9 reaches the set pricking depth, the stir pin 6 stops pricking and continues rotating for 8min, and other steps are the same as embodiment 1.

Claims (8)

1. A semi-solid processing method for preparing ultra-fine grain/nano-grain plates is characterized by comprising the following steps:
step 1, storing the material type, the processing parameters, the solid-liquid ratio and the torque data corresponding to the solid-liquid ratio of a processing area into a computer through a large number of early-stage tests; generating a semi-solid processing online detection model through machine learning, and establishing a semi-solid processing model database;
step 2, horizontally placing the plate to be processed on the base plate structure and fixing the plate; the base plate structure consists of a base plate and a plurality of equal-size cushion blocks, the equal-size cushion blocks are placed in the grooves of the base plate and are flush with the upper surface of the base plate, a gap is formed between every two adjacent cushion blocks in the middle to form a plate suspension area, and then the position right below the stirring pin is suspended in the air in the machining process;
step 3, switching on a power supply, electrifying the dynamic torque sensor, and setting a torque range through a computer; the resistance wire auxiliary heating device is started, the initial power value is set through the computer, and the resistance wire auxiliary heating device with the power adjusted through the computer is arranged inside the main stirring pin of the stirring pin; starting a main motor of the friction stir welding machine to rotate a stirring pin of the friction stir processing tool system;
step 4, the stirring pin penetrates into the surface of the plate at a rotating speed of 1000-70000 rpm and penetrates through the plate, the penetrating speed is 1-5 mm/min, and the stirring pin is continuously pressed down for 0.1-0.3 mm in the direction vertical to the surface of the plate after the end face of the static shaft shoulder is tightly attached to the upper surface of the processed plate;
and 5, directly transmitting the ultrasonic wave of the ultrasonic transducer to an area to be processed through a stirring pin, wherein the ultrasonic wave parameters are as follows: the frequency is 40-80K, and the amplitude is 20-60 μm;
step 6, when the stirring processing tool system reaches the set pricking depth, stopping pricking and continuously rotating for 3-8 min to preheat the material, and then moving the stirring pin forward in an echelon manner from left to right along the longitudinal direction of the plate at a speed of 50-500 mm/min until the surface of the whole plate is processed; in the processing process, the real-time torque sensor acquires the torque of a processing area, then matches the torque with a semi-solid processing model database, and maintains the current technological parameters unchanged when the torque value is within a set range; when the torque value is higher than the set range, the power of the resistance wire auxiliary heating device is increased; when the torque value is lower than the set range, the power of the resistance wire auxiliary heating device is reduced; and the power of the resistance wire auxiliary heating device is continuously adjusted through closed-loop feedback, so that the measured torque value is in a set range until the processing is finished.
2. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 1, wherein: the stirring processing tool system comprises a stirring needle, an ultrasonic transducer, an ultrasonic amplitude transformer, a resistance wire auxiliary heating device, a static shaft shoulder and a stirring friction processing equipment shell, wherein one end of the ultrasonic transducer is fixedly installed with the ultrasonic amplitude transformer, the other end of the ultrasonic amplitude transformer is fixedly installed with the stirring needle, the stirring needle consists of a stirring needle shaft, a main stirring needle and an auxiliary stirring needle which are connected together, one end of the stirring needle shaft is connected with the ultrasonic amplitude transformer, the other end of the stirring needle shaft is connected with the large-diameter end of the main stirring needle, the maximum diameter of the main stirring needle is smaller than the diameter of the stirring needle shaft so that the bottom of the stirring needle shaft forms a rotary small shaft shoulder, the small-diameter end of the main stirring needle is connected with the auxiliary stirring needle, and the static shaft shoulder is coaxially sleeved on the stirring needle shaft; the inner wall of the shell of the friction stir processing equipment is sequentially provided with a first supporting plate and a second supporting plate through bolts, the first supporting plate is provided with a main motor, the second supporting plate is provided with a dynamic torque sensor, the main motor is connected with an ultrasonic transducer of a stirring processing tool system through the dynamic torque sensor, the output end of the torque sensor is connected with a computer, and the computer is connected with a resistance wire auxiliary heating device.
3. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 1, wherein: the main stirring pin is of a truncated cone-shaped structure, and the outer surface of the main stirring pin is of a sawtooth-shaped structure; maximum diameter d of the main pin2The thickness T of the plate is 1.2-1.5 times, the cone angle is less than 5 degrees, and a resistance wire auxiliary heating device with power adjustable through a computer is arranged in the main stirring pin; distance H from the maximum diameter position of the main stirring pin to the highest point of the end surface of the auxiliary stirring pin1The thickness of the plate is 0.2-0.5 mm larger than the thickness T of the plate, and the distance H from the maximum diameter position of the main stirring pin to the vertex of the auxiliary stirring pin2The distance H from the maximum diameter position of the main stirring pin to the highest point of the end surface of the auxiliary stirring pin1The difference is compared with the thickness H of the cushion block32-6 mm small.
4. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 2, wherein: the auxiliary stirring needle is in a cone-shaped structure; maximum diameter d of the auxiliary agitating needle3Is the maximum diameter d of the main stirring pin21.3-2 times, the maximum included angle beta of the two upper busbars is 140-160 degrees, and the maximum included angle alpha of the two lower busbars is 90-120 degrees.
5. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 1, wherein: welding heat input is regulated and controlled in the semi-solid processing process through the resistance wire auxiliary heating device in the main stirring pin, so that the material is in a state of controllable and adjustable solid-liquid ratio, and the resistance wire power required by regulation and control is obtained through a semi-solid processing model database.
6. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 2, wherein: diameter d of the small rotating shaft shoulder4Is the maximum diameter d of the main stirring pin21.1-4 times of; diameter d of the stationary shoulder1The thickness T of the plate is 3-5 times.
7. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 1, wherein: width W of the pad2Is the maximum diameter d of the main stirring pin21-4 times of the total weight of the powder.
8. The semi-solid processing method for preparing ultra-fine grain/nano-grain plates as claimed in claim 1, wherein: width W of the overhanging region of the sheet during processing1And the maximum diameter d of the sub-probe3Is greater than the maximum diameter d of the main stirring pin2The size is 4-20 mm.
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