CN110648975B - Dehumidification subassembly and have its optical module - Google Patents
Dehumidification subassembly and have its optical module Download PDFInfo
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- CN110648975B CN110648975B CN201810679154.6A CN201810679154A CN110648975B CN 110648975 B CN110648975 B CN 110648975B CN 201810679154 A CN201810679154 A CN 201810679154A CN 110648975 B CN110648975 B CN 110648975B
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- moisture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
Abstract
The application discloses dehumidification subassembly and have its optical module, the dehumidification subassembly includes moisture collection portion and the moisture evaporation portion that links to each other with moisture collection portion, and the evaporation intensity around the moisture evaporation portion is greater than the evaporation intensity around the moisture collection portion, and the moisture collection portion is used for absorbing moisture, and the moisture evaporation portion is used for evaporating the moisture that the moisture collection portion collected. The dehumidification is realized to dehumidification subassembly accessible moisture collection portion's the water absorption and the evaporation of moisture evaporation portion, and when the dehumidification subassembly was arranged in the optical module, the dehumidification subassembly can effectively reduce the regional moisture content of glue and the sensitive device of steam to avoid moisture to influence the efficiency of glue and the sensitive device of steam.
Description
Technical Field
The application relates to the technical field of optical communication element manufacturing, in particular to a dehumidification assembly and an optical module with the dehumidification assembly.
Background
Currently, a large amount of glue is required in an optical module to achieve loading of multiple components in the optical module, however, moisture accelerates the aging of the glue, resulting in failure of multiple components or failure of the entire optical module.
In addition, other moisture sensitive devices in the optical module may also be affected by moisture during use, resulting in failure.
In the prior art, the waterproof performance of the optical module can be improved in an airtight packaging mode, but the problems of high cost, complex packaging, sacrifice of photoelectric performance and the like exist; alternatively, a welding loading method can be used instead of a glue loading method, but the problems of complex welding structure, difficult control of precision and the like exist.
Disclosure of Invention
An embodiment of the application provides an optical module, which comprises a shell and a dehumidifying assembly arranged in the shell; the dehumidification assembly comprises a moisture collection part and a moisture evaporation part connected with the moisture collection part, the evaporation intensity of the moisture evaporation part is greater than that of the moisture collection part, the moisture collection part is used for absorbing moisture, and the moisture evaporation part is used for evaporating the moisture collected by the moisture collection part; the moisture collection part and the moisture evaporation part are located at different positions in the shell, the optical module comprises a photoelectric device and an electronic chip, the moisture collection part is arranged adjacent to the photoelectric device, and the moisture evaporation part is arranged adjacent to the electronic chip.
In one embodiment, the optical module includes an accommodating space and a heating area, the moisture collecting portion is located in the accommodating space, and the moisture evaporating portion is located outside the accommodating space.
In one embodiment, the dehumidifying component covers the accommodating space.
In one embodiment, the moisture removal component includes capillary fibers that transport moisture from the moisture collection section to the moisture evaporation section.
In one embodiment, the moisture removal component is a capillary fiber tape.
In one embodiment, the heating area includes a housing, a printed circuit board, and a heating device on the printed circuit board, heat conduction exists between the housing and the heating device, and the moisture evaporation portion is attached to the housing.
In one embodiment, the moisture evaporation part and the heat generating device are separated from each other.
In one embodiment, the intensity of the air flow around the moisture evaporation portion is greater than the intensity of the air flow around the moisture collection portion.
In one embodiment, the temperature around the moisture evaporation portion is greater than the temperature around the moisture collection portion.
Compared with the prior art, the dehumidification is realized to the water absorption of dehumidification subassembly accessible moisture collection portion and the evaporation of moisture evaporation portion of the technical scheme of this application, and when the dehumidification subassembly was arranged in the optical module, the dehumidification subassembly can effectively reduce the regional moisture content of glue and the sensitive device of steam to avoid moisture to influence the efficiency of glue and the sensitive device of steam.
Drawings
FIG. 1 is a schematic view of a dehumidification assembly according to an embodiment of the present application;
fig. 2 is a cross-sectional view of an optical module according to an embodiment of the present application;
fig. 3 is an exploded view of an optical module according to an embodiment of the present application.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 is a schematic diagram of a dehumidification assembly 100 according to an embodiment of the present disclosure.
The dehumidifying module 100 includes a moisture collecting part 10 and a moisture evaporating part 20 connected to the moisture collecting part 10.
The moisture collecting section 10 serves to absorb moisture.
The moisture evaporation part 20 serves to evaporate the moisture collected by the moisture collection part 10.
The evaporation intensity around the moisture evaporation part 20 is greater than the evaporation intensity around the moisture collection part 10.
The dehumidifying module 100 of the present embodiment can realize dehumidification by the water absorption of the water collecting part 10 and the evaporation of the water evaporating part 20, and has a simple structure and is convenient to mount and dismount.
In a specific example, the dehumidifying assembly 100 further includes a moisture transfer part 30 connecting the moisture collection part 10 and the moisture evaporation part 20.
The moisture transfer part 30 serves to transfer moisture of the moisture collection part 10 to the moisture evaporation part 20.
The moisture collection part 10, the moisture evaporation part 20, and the moisture transmission part 30 may be made of the same material, and there is no clear limit between each two of them, but not limited thereto, and the three parts may be made of different materials, or the three parts may have different shapes, and the like.
In addition, the dehumidifying module 100 may only include the moisture collecting part 10 and the moisture evaporating part 20, that is, the moisture in the moisture collecting part 10 is directly transmitted to the moisture evaporating part 20.
The moisture collection part 10 is located in the first area S1, and the moisture has the first evaporation intensity in the first area S1, that is, the evaporation intensity around the moisture collection part 10 is the first evaporation intensity.
The moisture evaporation unit 20 is located in the second area S2, and the moisture has the second evaporation intensity in the second area S2, that is, the evaporation intensity around the moisture evaporation unit 20 at this time is the second evaporation intensity.
The second evaporation intensity is greater than the first evaporation intensity, that is, the evaporation intensity around the moisture evaporation part 20 is greater than the evaporation intensity around the moisture collection part 10.
The moisture transfer part 30 is located between the first region S1 and the second region S2, but the moisture transfer part 30 may be located in the first region S1 or the second region S2.
That is, the first region S1 and the second region S2 are two different regions, the moisture collection unit 10 mainly absorbs moisture in the first region S1 and transfers the absorbed moisture to the moisture evaporation unit 20 through the moisture transfer unit 30, and the moisture evaporation unit 20 mainly evaporates moisture in the second region S2, so that moisture in the first region S1 can be transported to the second region S2 and evaporated, and dehumidification of the first region S1 or humidification of the second region S2 can be achieved.
The dehumidifying module 100 of the present embodiment can realize dehumidification by the water absorption of the water collecting part 10 and the evaporation of the water evaporating part 20, and has a simple structure and is convenient to mount and dismount.
The moisture of the moisture collection part 10 reaches the moisture evaporation part 20 by a capillary phenomenon.
Specifically, the dehumidifying module 100 includes capillary fibers, which transport the moisture of the moisture collecting part 10 to the moisture evaporating part 20.
That is, the moisture collection part 10 and the moisture evaporation part 20 each include capillary fibers, the capillary fibers of the moisture collection part 10 are used to absorb moisture, and the moisture of the moisture collection part 10 is diffused to the moisture evaporation part 20 through the capillary fibers.
Here, the dehumidifying module 100 is exemplified by a capillary fiber tape as a whole, that is, the moisture collecting part 10, the moisture evaporating part 20 and the moisture transporting part 30 are all capillary fibers.
It is understood that the dehumidifying component 100 may have only a part of the regions with capillary fibers, or the density, shape, etc. of the capillary fibers in different regions of the dehumidifying component 100 may be different, in which case the absorption and evaporation effects of the capillary fibers in different regions are different.
In practical operation, the capillary fibers of the moisture collection part 10 can strongly adsorb the moisture in the first region S1, and the adsorbed moisture is transported to the moisture evaporation part 20 through the moisture transport part 30, i.e. the moisture is diffused to the moisture evaporation part 20 of the second region S2 along the capillary fiber direction, since the second evaporation strength of the second region S2 is greater than the first evaporation strength of the first region S1, the evaporation of the moisture in the second region S2 is strong, the capillary fibers at the moisture evaporation part 20 gradually become dry, the moisture concentration of the moisture evaporation part 20 is far lower than that of the moisture collection part 10, the moisture can be continuously transported from the moisture collection part 10 to the moisture evaporation part 20 and evaporated, and thus, the dehumidification of the first region S1 is realized.
In the present embodiment, the temperature of the second region S2 is greater than the temperature of the first region S1.
That is, the temperature around the moisture evaporation part 20 is higher than the temperature around the moisture collection part 10.
In this case, the evaporation intensity of the moisture is controlled by the temperature, and the higher the temperature is, the higher the evaporation intensity of the moisture is.
Here, the temperature can be regulated by a heating part, a heat radiating part, and the like.
Alternatively, the airflow intensity of the second region S2 is greater than the airflow intensity of the first region S1.
That is, the intensity of the air flow around the moisture evaporation part 20 is greater than the intensity of the air flow around the moisture collection part 10.
In this case, the evaporation intensity of the moisture is controlled by the airflow intensity, and the higher the airflow intensity is, the higher the evaporation intensity of the moisture is.
Here, the air flow intensity can be controlled by an air blowing part, a vacuum part, and the like.
Still alternatively, the degree of openness of the second region S2 is greater than the degree of openness of the first region S1.
That is, the degree of openness of the area around the moisture evaporation part 20 is greater than the degree of openness of the area around the moisture collection part 10.
In this case, the evaporation intensity of the water is controlled by the degree of opening of the region, and the higher the degree of opening, the higher the evaporation intensity of the water.
Here, the "degree of opening" refers to the degree of communication between the corresponding region and the outside, and for example, the degree of opening of the closed space is smaller than the degree of opening of the open space.
It is understood that the first area S1 and the second area S2 may be different in only one of temperature, airflow intensity or openness, or may be different in a plurality of temperatures, airflow intensities or openness, which may be determined according to actual situations.
With reference to fig. 2 and fig. 3, an embodiment of the present application further provides an optical module 200.
The optical module 200 includes a housing 2021 and a dehumidifying unit 100 provided in the housing 2021.
The dehumidifying module 100 includes a moisture collecting part 10 and a moisture evaporating part 20 connected to the moisture collecting part 10, wherein the moisture collecting part 10 absorbs moisture, and the moisture evaporating part 20 evaporates the moisture collected by the moisture collecting part 10.
The evaporation intensity of the moisture evaporation part 20 is greater than that of the moisture collection part 10.
The moisture collection section 10 and the moisture evaporation section 20 are located at different positions within the case 2021.
The optical module 200 includes a photoelectric device and an electronic chip, the moisture collector 10 is disposed adjacent to the photoelectric device, and the moisture evaporator 20 is disposed adjacent to the electronic chip.
Here, the photoelectric device may be a moisture sensitive device in the optical module 200, the electronic chip may be a heat generating device in the optical module 200, and when the dehumidifying assembly 100 is used in the optical module 200, the dehumidifying assembly 100 may effectively reduce the moisture content in the photoelectric device region, thereby preventing moisture from affecting the efficacy of the photoelectric device.
Specifically, the optical module 200 includes an accommodating space 201 and a heat generating region 202.
The moisture collection part 10 is located in the accommodation space 201, and the moisture evaporation part 20 is located outside the accommodation space 201.
Here, the accommodating space 201 is a semi-closed space, and the accommodating space 201 has an opening 2011 so that the accommodating space 201 communicates with the heat generating region 202.
The part of the optical module 200 that needs to use glue or the photoelectric device in the optical module 200 can be packaged in the accommodating space 201, the moisture collecting part 10 of the dehumidifying component 100 is arranged in the accommodating space 201, and the moisture collecting part 10 is used for absorbing moisture in the accommodating space 201, so that the effect of the glue and the photoelectric device is prevented from being influenced by the moisture.
Referring to fig. 3, the accommodating space 201 is an accommodating cavity with an upper portion opened, the dehumidifying component 100 covers the accommodating space 201, the opening 2011 is substantially a portion of the accommodating space 201 close to the heat generating region 202, and the dehumidifying component 100 extends to the heat generating region 202 directly from the upper portion of the accommodating space 201.
At this time, the dehumidifying component 100 just seals the accommodating space 201, which is equivalent to the dehumidifying component 100 and the accommodating space 201 forming a closed space, so on the one hand, the dehumidifying component 100 can fully absorb the moisture in the accommodating space 201, and on the other hand, the external moisture can be prevented from entering the accommodating space 201.
The heat generating region 202 includes a housing 2021, a printed circuit board 2022, and a heat generating device 2023 (e.g., an electronic chip) disposed on the printed circuit board 2022, and heat conduction exists between the housing 2021 and the heat generating device 2023.
Here, the case 2021 is taken as an example to directly contact a side of the heat generating device 2023 away from the printed circuit board 2022.
The moisture evaporation portion 20 is attached to the case 2021, so that heat of the heat generating device 2023 can be transferred to the moisture evaporation portion 20 through the case 2021, and the temperature of the moisture evaporation portion 20 is high, so that moisture at the moisture evaporation portion 20 can be quickly evaporated.
The moisture transfer part 30 may be located in the accommodating space 201, or the moisture transfer part 30 may be located in the heat generating region 202, or a part of the moisture transfer part 30 may be located in the accommodating space 201 and another part may be located in the heat generating region 202.
Of course, other regions may be included between the accommodating space 201 and the heat generating region 202.
The dehumidifying module 100 includes capillary fibers, which transport the moisture of the moisture collecting part 10 to the moisture evaporating part 20.
Here, the dehumidifying module 100 is a capillary fiber tape, the moisture collecting part 10 is attached to the upper side of the accommodating space 201 to close the accommodating space 201, and the moisture evaporating part 20 is attached to the case 2021 by extending to the heat generating region 202 through the opening 2011.
Since the temperature of the accommodating space 201 is low and the temperature of the heat generating region 202 is high, when the moisture collecting part 10 absorbs the moisture in the accommodating space 201, the moisture is transmitted to the moisture evaporating part 20 through the moisture transmitting part 30, and the moisture evaporating part 20 evaporates the moisture.
Moreover, since the temperature of the heat generating region 202 is always higher than that of the accommodating space 201, the moisture is continuously diffused from the moisture collecting unit 10 to the moisture evaporating unit 20 through the moisture transmitting unit 30, and the moisture is evaporated by the moisture evaporating unit 20, so that the humidity in the accommodating space 201 can be effectively reduced, and the effects of the glue and the photoelectric device are prevented from being affected by the moisture.
In addition, the airflow strength of the heat generating region 202 is also greater than that of the accommodating space 201, and the dehumidification effect is further improved.
In conclusion, dehumidification is realized to the water absorption of this application dehumidification subassembly accessible moisture collection portion and the evaporation of moisture evaporation portion, and when the dehumidification subassembly was arranged in the optical module, the dehumidification subassembly can effectively reduce the regional moisture content of glue and the sensitive device of steam to avoid moisture to influence the efficiency of glue and the sensitive device of steam.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (7)
1. An optical module is characterized by comprising a shell and a dehumidifying component arranged in the shell; the dehumidification assembly comprises a moisture collection part and a moisture evaporation part connected with the moisture collection part, the evaporation intensity of the moisture evaporation part is greater than that of the moisture collection part, the moisture collection part is used for absorbing moisture, and the moisture evaporation part is used for evaporating the moisture collected by the moisture collection part; moisture collection portion with moisture evaporation position is located different positions in the casing, the optical module includes photoelectric device and electronic chip, moisture collection portion is close to photoelectric device sets up, moisture evaporation portion is close to electronic chip sets up, the optical module is including being located the accommodation space of casing and the region that generates heat, moisture collection portion reaches photoelectric device is located in the accommodation space, moisture evaporation portion reaches electronic chip is located the region that generates heat, the subassembly that dehumidifies cover in accommodation space's top and seal accommodation space.
2. The optical module of claim 1, wherein the moisture removal component comprises capillary fibers that transport moisture from the moisture collection section to the moisture evaporation section.
3. A light module as claimed in claim 2, characterized in that the moisture removing member is a capillary fibre strip.
4. The optical module according to claim 3, wherein the heat generating region includes a housing, a printed circuit board, and a heat generating device on the printed circuit board, heat conduction exists between the housing and the heat generating device, and the moisture evaporation unit is attached to the housing.
5. The optical module according to claim 4, wherein the moisture evaporation unit and the heat generating device are provided separately from each other.
6. The optical module according to claim 1, wherein an intensity of an air flow around the moisture evaporation portion is larger than an intensity of an air flow around the moisture collection portion.
7. The optical module according to claim 1, wherein a temperature around the moisture evaporation portion is higher than a temperature around the moisture collection portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810679154.6A CN110648975B (en) | 2018-06-27 | 2018-06-27 | Dehumidification subassembly and have its optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810679154.6A CN110648975B (en) | 2018-06-27 | 2018-06-27 | Dehumidification subassembly and have its optical module |
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| CN110648975A CN110648975A (en) | 2020-01-03 |
| CN110648975B true CN110648975B (en) | 2022-04-22 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101131270A (en) * | 2007-09-26 | 2008-02-27 | 施军达 | Semiconductor temperature and moisture control device |
| JP2008060175A (en) * | 2006-08-29 | 2008-03-13 | Toshiba Corp | Electronic equipment and cooling method thereof |
| CN104503044A (en) * | 2014-12-31 | 2015-04-08 | 苏州旭创科技有限公司 | Optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| CN107329215A (en) * | 2016-04-28 | 2017-11-07 | 苏州旭创科技有限公司 | Optical module and its assemble method |
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2018
- 2018-06-27 CN CN201810679154.6A patent/CN110648975B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060175A (en) * | 2006-08-29 | 2008-03-13 | Toshiba Corp | Electronic equipment and cooling method thereof |
| CN101131270A (en) * | 2007-09-26 | 2008-02-27 | 施军达 | Semiconductor temperature and moisture control device |
| CN104503044A (en) * | 2014-12-31 | 2015-04-08 | 苏州旭创科技有限公司 | Optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| CN107329215A (en) * | 2016-04-28 | 2017-11-07 | 苏州旭创科技有限公司 | Optical module and its assemble method |
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| CN110648975A (en) | 2020-01-03 |
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