CN110643314A - Efficient epoxy heat-conducting structural adhesive and preparation method thereof - Google Patents
Efficient epoxy heat-conducting structural adhesive and preparation method thereof Download PDFInfo
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- CN110643314A CN110643314A CN201911008165.2A CN201911008165A CN110643314A CN 110643314 A CN110643314 A CN 110643314A CN 201911008165 A CN201911008165 A CN 201911008165A CN 110643314 A CN110643314 A CN 110643314A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention relates to the technical field of epoxy glue, in particular to high-efficiency epoxy heat-conducting structural glue and a preparation method and application thereof. The efficient epoxy heat-conducting structural adhesive at least comprises the following components in parts by weight: 30-50 parts of epoxy resin, 40-70 parts of filler, 15-20 parts of curing agent, 0.5-3 parts of dispersing agent, 0.5-3 parts of defoaming agent, 0.3-3 parts of leveling auxiliary agent and 0.5-3 parts of color paste. The epoxy heat-conducting adhesive provided by the invention is a single-component high-temperature curing epoxy adhesive and has the advantages of high bonding strength, good heat-conducting property, quick curing, excellent storage stability and the like.
Description
Technical Field
The invention relates to the technical field of epoxy glue, in particular to high-efficiency epoxy heat-conducting structural glue and a preparation method and application thereof.
Background
In daily industrial production, people often need to bond and fix electronic components, so the bonding glue plays an indispensable role. The adhesive used for bonding is various, such as acrylic resin adhesive, silicone resin adhesive, epoxy resin adhesive and the like, wherein the epoxy resin structural adhesive has excellent mechanical property, chemical medium resistance, bonding property and electrical insulation property, and is widely applied to pouring and encapsulating of machinery, electronic components and transformers.
With the development of scientific technology in the future, new requirements are also put forward on the electronic component packaging technology. Electronic components such as surface-mounted components, inductors, transformers and the like have increasingly large power and smaller volume. With the improvement of power, the technical requirements of components on heat dissipation and packaging are higher and higher. At present, the packaging technology mostly adopts an epoxy resin packaging process, after electronic components are packaged, epoxy resin is cured into a hard solid state, heat cannot be led out in time, and the service life of the electronic components is shortened.
Therefore, the invention of the single-component high-temperature curing epoxy adhesive with high bonding strength, good thermal conductivity, fast curing and good storage stability is particularly important.
Disclosure of Invention
In order to solve the technical problems, the first aspect of the invention provides an efficient epoxy heat-conducting structural adhesive, which at least comprises the following components in parts by weight: 30-50 parts of epoxy resin, 40-70 parts of filler, 15-20 parts of curing agent, 0.5-3 parts of dispersing agent, 0.5-3 parts of defoaming agent, 0.3-3 parts of leveling auxiliary agent and 0.5-3 parts of color paste.
In a preferred embodiment of the present invention, the epoxy resin is at least one selected from the group consisting of a phenol resin, an alicyclic epoxy resin, a bisphenol a epoxy resin, a bisphenol F epoxy resin, and an aliphatic epoxy resin.
In a preferred embodiment of the present invention, the filler is at least one selected from the group consisting of flake graphite, silicon carbide, aluminum nitride, boron nitride, alumina, silicon nitride, silica, and hydrotalcite.
As a preferred technical scheme of the present invention, the filler is a combination of hydrotalcite and alumina, and the mass ratio is 1: (2-5).
As a preferable technical scheme of the invention, the alumina is nano alumina, and the particle size is 30-60 nm.
As a preferable technical scheme of the present invention, the curing agent is at least one selected from the group consisting of an aliphatic amine curing agent, an aromatic diamine curing agent, a dicyandiamide curing agent, an imidazole curing agent, an organic acid anhydride curing agent, and an organic hydrazide curing agent.
In a preferred embodiment of the present invention, the imidazole-based curing agent is at least one selected from the group consisting of 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, imidazole, and 2-phenylimidazole.
As a preferable technical scheme of the invention, the curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio is 1: (1-4).
The second aspect of the present invention provides a preparation method of the epoxy thermal conductive structural adhesive, including at least the following steps: mixing and stirring the epoxy resin, the filler, the dispersing agent, the defoaming agent, the leveling assistant and the color paste uniformly, cooling to below 40 ℃, adding the curing agent, grinding into paste on a three-roller machine, defoaming in vacuum and discharging to obtain the color paste.
The third aspect of the invention provides an application of the epoxy heat-conducting structural adhesive, which can be applied to heat-conducting adhesion of various components, including heat-conducting adhesion of metal and components, and heat-conducting adhesion of PCB and heat-radiating aluminum substrate.
Has the advantages that: the invention provides an efficient epoxy heat-conducting structural adhesive which is prepared from epoxy resin, a filler, a curing agent, a dispersing agent, a defoaming agent, a leveling auxiliary agent and a color paste, is a single-component high-temperature curing epoxy adhesive, and has the advantages of high bonding strength, good heat conduction performance, quick curing, excellent storage stability and the like.
Detailed Description
The disclosure may be understood more readily by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "any" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the technical problems, the first aspect of the invention provides an efficient epoxy heat-conducting structural adhesive, which at least comprises the following components in parts by weight: 30-50 parts of epoxy resin, 40-70 parts of filler, 15-20 parts of curing agent, 0.5-3 parts of dispersing agent, 0.5-3 parts of defoaming agent, 0.3-3 parts of leveling auxiliary agent and 0.5-3 parts of color paste.
Preferably, the epoxy heat-conducting structural adhesive at least comprises the following components, by weight, 30 parts of epoxy resin, 40 parts of filler, 20 parts of curing agent, 2 parts of dispersing agent, 3 parts of defoaming agent, 2 parts of leveling assistant and 2 parts of color paste.
Epoxy resin
In the present invention, the epoxy resin is at least one selected from the group consisting of a phenol resin, an alicyclic epoxy resin, a bisphenol a epoxy resin, a bisphenol F type epoxy resin, and an aliphatic epoxy resin.
Preferably, the epoxy resin is a bisphenol a epoxy resin.
In the present invention, the bisphenol A epoxy resin is not particularly limited, and is commercially available but not limited to Henan Hui resin Co., Ltd, under the trade name CYD-128.
Filler material
In the present invention, the filler is at least one selected from the group consisting of flake graphite, silicon carbide, aluminum nitride, boron nitride, alumina, silicon nitride, silica, and hydrotalcite.
Preferably, the filler is a combination of hydrotalcite and alumina.
More preferably, the mass ratio of the hydrotalcite to the alumina is 1: (2-5).
Most preferably, the mass ratio of the hydrotalcite to the alumina is 1: 4.
in the invention, the hydrotalcite is aluminum magnesium hydrotalcite, and the CAS number is 11097-59-9.
In the invention, the alumina is nano alumina with the particle size of 30-60 nm.
The nano alumina is not particularly limited, and can be purchased from, but not limited to, Jippon, Hangzhou New Material liability company, model CY-L30.
According to the invention, the heat conductivity of the epoxy adhesive is improved by compounding the hydrotalcite and the aluminum oxide. The inventors consider that possible reasons are: the invention firstly utilizes the magnalium hydrotalcite with the layered structure to improve the dispersion performance of the nano alumina in the matrix and avoid the reduction of the heat conductivity coefficient of the epoxy adhesive caused by the excessive agglomeration of the nano alumina; secondly, the lamellar structure of the aluminum-magnesium hydrotalcite layer is beneficial to the curing agent to enter the lamellar structure of the aluminum-magnesium hydrotalcite layer, and the aluminum-magnesium hydrotalcite layer is mixed with epoxy resin for curing in the later use process, so that the hydrotalcite interlayer structure is expanded in the curing process to achieve the stripping effect, and a heat conduction channel is formed in the resin matrix, thereby being more beneficial to the improvement of the heat conductivity of the product; the aluminum oxide with the specific particle size range and the aluminum-magnesium hydrotalcite are matched for use, so that the high bulk density is obtained, the contact probability of the fillers is effectively improved, the interface contact state of the inorganic fillers and the resin matrix is improved, a heat conduction channel can be effectively formed in the epoxy adhesive, and the heat conductivity of the epoxy adhesive is further improved.
Curing agent
In the invention, the curing agent is at least one selected from aliphatic amine curing agents, aromatic diamine curing agents, dicyandiamide curing agents, imidazole curing agents, organic acid anhydride curing agents and organic hydrazide curing agents.
Preferably, the imidazole-based curing agent is at least one selected from the group consisting of 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, imidazole and 2-phenylimidazole.
More preferably, the curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio of the curing agent to the dicyandiamide is 1: (1-4).
Most preferably, the mass ratio of the 2-ethyl-4-methylimidazole to the dicyandiamide is 1: 2.
the dicyandiamide has a CAS number of 461-58-5.
The CAS number of the 2-ethyl-4-methylimidazole is 931-36-2.
Dispersing agent
In the present invention, the dispersant is not particularly limited, and there may be mentioned, but not limited to, polyethylene glycol 2000, sodium tripolyphosphate, sodium polyacrylate, oleic acid, octadecanol, sodium dodecylbenzenesulfonate, and the like.
Preferably, the dispersant is sodium polyacrylate.
Defoaming agent
In the present invention, the antifoaming agent is not particularly limited, and there may be mentioned, but not limited to, 6800 antifoaming agent, 900 antifoaming agent, JUST5501 antifoaming agent, BYK-141 antifoaming agent, BYK-A535 antifoaming agent, KS-603 antifoaming agent, AKN-3386 antifoaming agent, AKN-3330 antifoaming agent and the like.
Preferably, the defoaming agent is BYK-A535 defoaming agent.
Leveling aid
In the present invention, the leveling aid is not particularly limited, and there may be mentioned, but not limited to, silicones and acrylates.
Preferably, the leveling aid is polydimethylsiloxane.
Color paste
In the present invention, the color paste is not particularly limited, and is commercially available and suitable for use in the present invention.
The second aspect of the present invention provides a method for preparing the structural adhesive, which at least comprises the following steps: mixing and stirring the epoxy resin, the filler, the dispersing agent, the defoaming agent, the leveling assistant and the color paste uniformly, cooling to below 40 ℃, adding the curing agent, grinding into paste on a three-roller machine, defoaming in vacuum and discharging to obtain the color paste.
The third aspect of the invention provides an application of the structural adhesive, which can be applied to heat conduction bonding of various components, including heat conduction bonding of metal and components, and heat conduction bonding of PCB and heat dissipation aluminum substrate.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
Embodiment 1 provides an efficient epoxy heat-conducting structural adhesive, which comprises, by weight, 30 parts of epoxy resin, 40 parts of filler, 20 parts of curing agent, 2 parts of dispersing agent, 3 parts of defoaming agent, 2 parts of leveling assistant and 2 parts of color paste.
The epoxy resin is bisphenol A epoxy resin and is purchased from Henan Hui energy resin Co., Ltd, under the trade name CYD-128.
The filler is a combination of aluminum magnesium hydrotalcite and nano aluminum oxide, and the mass ratio is 1: 4; the particle size of the nano alumina is 30 nm; the aluminum magnesium hydrotalcite is purchased from hong Kong Xin Rundy chemical Co., Ltd; the nano-alumina is purchased from new materials GmbH of Jiufong, Hangzhou, model CY-L30.
The curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio is 1: 2.
the dispersing agent is sodium polyacrylate, and the CAS number is 9003-04-7.
The antifoaming agent is a BYK-A535 antifoaming agent, and is purchased from Dayang New Material Co., Ltd, Shenzhen city.
The leveling auxiliary agent is polydimethylsiloxane, and the CAS number is 9006-65-9.
The color paste is black color paste, is produced into adhesive products Limited company by Dongguan city, and has the following product name: AB-100 epoxy black paste.
The preparation method of the high-efficiency epoxy heat-conducting structural adhesive at least comprises the following steps: mixing and stirring the epoxy resin, the filler, the dispersing agent, the defoaming agent, the leveling assistant and the color paste uniformly, cooling to 20 ℃, adding the curing agent, grinding into paste on a three-roller machine, defoaming in vacuum and discharging to obtain the color paste.
Example 2
The difference between the embodiment 2 and the embodiment 1 is that the epoxy heat-conducting structural adhesive comprises the following components in parts by weight: 30 parts of epoxy resin, 40 parts of filler, 15 parts of curing agent, 0.5 part of dispersing agent, 0.5 part of defoaming agent, 0.3 part of leveling assistant and 0.5 part of color paste; the filler is a combination of aluminum magnesium hydrotalcite and nano aluminum oxide, and the mass ratio is 1: 2; the curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio is 1: 1.
example 3
The difference between the embodiment 3 and the embodiment 1 is that the epoxy heat-conducting structural adhesive comprises the following components in parts by weight: 50 parts of epoxy resin, 70 parts of filler, 20 parts of curing agent, 3 parts of dispersing agent, 3 parts of defoaming agent, 3 parts of leveling assistant and 3 parts of color paste; the filler is a combination of aluminum magnesium hydrotalcite and nano aluminum oxide, and the mass ratio is 1: 5; the curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio is 1: 4.
example 4
Example 4 differs from example 1 in that the filler is nano alumina.
Example 5
Example 5 differs from example 1 in that the filler is magnesium aluminum hydrotalcite.
Example 6
Example 6 differs from example 1 in that the nano alumina has a particle size of 500nm, and is available from ninopone new materials llc, model number: CY-L500.
Example 7
Example 7 differs from example 1 in that the filler is a combination of aluminum magnesium hydrotalcite and nano alumina, and the mass ratio is 1: 10.
example 8
Example 8 differs from example 1 in that the filler is a combination of aluminum magnesium hydrotalcite and nano alumina, and the mass ratio is 1: 0.5.
performance testing
Coefficient of thermal conductivity: the test was carried out according to ASTM D-5470 test method, and the test results are shown in Table 1.
TABLE 1 test results of thermal conductivity of epoxy structural heat-conductive adhesives prepared in examples 1 to 8
Example 1 is the best embodiment of the present invention, and the performance test method and test data of the cured epoxy thermal conductive structural adhesive are shown in table 2.
| Detection of | Numerical value | Test method |
| Shear strength (carbon steel/carbon steel) | 22±2MPa | GB/T 7124-2008 |
| Peel strength | 16N/cm | GB/T 7122-1996 |
| Hardness of | 92D | GB/T 2411-1980 |
| Glass transition temperature | 76℃ | ASTM E1545 |
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (10)
1. The efficient epoxy heat-conducting structural adhesive is characterized by at least comprising the following components in parts by weight: 30-50 parts of epoxy resin, 40-70 parts of filler, 15-20 parts of curing agent, 0.5-3 parts of dispersing agent, 0.5-3 parts of defoaming agent, 0.3-3 parts of leveling auxiliary agent and 0.5-3 parts of color paste.
2. The epoxy thermal conductive structural adhesive of claim 1, wherein the epoxy resin is at least one selected from the group consisting of phenolic resin, cycloaliphatic epoxy resin, bisphenol a epoxy resin, bisphenol F epoxy resin, and aliphatic epoxy resin.
3. The epoxy structural adhesive according to claim 1, wherein the filler is at least one selected from the group consisting of graphite flakes, silicon carbide, aluminum nitride, boron nitride, aluminum oxide, silicon nitride, silicon dioxide, and hydrotalcite.
4. The epoxy heat-conducting structural adhesive according to claim 3, wherein the filler is a combination of hydrotalcite and alumina, and the mass ratio of the hydrotalcite to the alumina is 1: (2-5).
5. The epoxy heat-conducting structural adhesive as claimed in claim 4, wherein the alumina is nano alumina, and the particle size is 30-60 nm.
6. The epoxy heat-conducting structural adhesive according to claim 1, wherein the curing agent is at least one selected from the group consisting of an aliphatic amine curing agent, an aromatic diamine curing agent, a dicyandiamide curing agent, an imidazole curing agent, an organic acid anhydride curing agent and an organic hydrazide curing agent.
7. The epoxy thermal conductive structural adhesive according to claim 6, wherein the imidazole-based curing agent is at least one selected from the group consisting of 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, imidazole and 2-phenylimidazole.
8. The epoxy heat-conducting structural adhesive according to claim 6, wherein the curing agent is a combination of 2-ethyl-4-methylimidazole and dicyandiamide, and the mass ratio of the curing agent to the curing agent is 1: (1-4).
9. The preparation method of the epoxy heat-conducting structural adhesive according to any one of claims 1 to 8, characterized by comprising at least the following steps: mixing and stirring the epoxy resin, the filler, the dispersing agent, the defoaming agent, the leveling assistant and the color paste uniformly, cooling to below 40 ℃, adding the curing agent, grinding into paste on a three-roller machine, defoaming in vacuum and discharging to obtain the color paste.
10. The use of the epoxy structural adhesive according to any one of claims 1 to 8, wherein the epoxy structural adhesive is used for the heat-conducting adhesion of various components, including the heat-conducting adhesion of metal to components and the heat-dissipating aluminum substrate to PCB.
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