CN110640412A - Machining method of cutter - Google Patents

Machining method of cutter Download PDF

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Publication number
CN110640412A
CN110640412A CN201810669241.3A CN201810669241A CN110640412A CN 110640412 A CN110640412 A CN 110640412A CN 201810669241 A CN201810669241 A CN 201810669241A CN 110640412 A CN110640412 A CN 110640412A
Authority
CN
China
Prior art keywords
cutter
cutting
hard alloy
welding
alloy substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810669241.3A
Other languages
Chinese (zh)
Inventor
董向阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yangzhou Jiangyu Blade Tools Co Ltd
Original Assignee
Yangzhou Jiangyu Blade Tools Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yangzhou Jiangyu Blade Tools Co Ltd filed Critical Yangzhou Jiangyu Blade Tools Co Ltd
Priority to CN201810669241.3A priority Critical patent/CN110640412A/en
Publication of CN110640412A publication Critical patent/CN110640412A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools

Abstract

The invention relates to a machining method of a cutter. The method comprises the following steps: the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface; secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter; and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge. The process method of the invention is simple, the processing precision is high, and the coating is coated on the surface of the diamond, thereby effectively preventing the transmission and reflection of laser and improving the processing efficiency and quality of the cutter.

Description

Machining method of cutter
Technical Field
The invention relates to a machining method of a cutter.
Background
Diamond is a crystal of a single carbon atom, and has the highest hardness, rigidity, refractive index and thermal conductivity in nature. Can meet most requirements of precision and ultra-precision cutting on cutter materials, and is an ideal precision cutting cutter material. When the diamond cutter is manufactured by adopting the traditional mechanical grinding method, because the grinding linear velocity is high, the local pressure is large, the impact on the surface and the cutting edge of the cutter is severe, the surface of the cutter can generate tiny furrows and thicker processing deterioration layers inevitably, and the saw teeth of the cutting edge are larger, thereby limiting the further improvement of the quality of the cutter.
Disclosure of Invention
Aiming at the defects, the invention aims to provide a machining method of a cutter, which has the advantages of simple process method, high machining precision and good quality.
Therefore, the technical scheme adopted by the invention is as follows:
the method comprises the following steps:
the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;
secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;
and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.
As a further improvement of the technical scheme, before the processing, the surface of the diamond cutter is cleaned by steam.
As a further improvement of the technical scheme, the surface of the diamond is coated with a coating.
The invention has the advantages that:
the process method of the invention is simple, the processing precision is high, and the coating is coated on the surface of the diamond, thereby effectively preventing the transmission and reflection of laser and improving the processing efficiency and quality of the cutter.
Detailed Description
A machining method of a cutter comprises the following steps:
the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;
secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;
and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.
As a further improvement of the technical scheme, before the processing, the surface of the diamond cutter is cleaned by steam.
As a further improvement of the technical scheme, the surface of the diamond is coated with a coating.

Claims (3)

1. The machining method of the cutter is characterized by comprising the following steps of:
the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;
secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;
and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.
2. A method of machining a tool as claimed in claim 1, wherein the diamond tool surface is cleaned with steam prior to machining.
3. A method of machining a tool as claimed in claim 1, wherein the diamond surface is coated with a coating.
CN201810669241.3A 2018-06-26 2018-06-26 Machining method of cutter Pending CN110640412A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810669241.3A CN110640412A (en) 2018-06-26 2018-06-26 Machining method of cutter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810669241.3A CN110640412A (en) 2018-06-26 2018-06-26 Machining method of cutter

Publications (1)

Publication Number Publication Date
CN110640412A true CN110640412A (en) 2020-01-03

Family

ID=69008655

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810669241.3A Pending CN110640412A (en) 2018-06-26 2018-06-26 Machining method of cutter

Country Status (1)

Country Link
CN (1) CN110640412A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111331259A (en) * 2020-02-26 2020-06-26 上海交通大学 Method and device for processing high-precision monocrystal diamond arc cutter by using laser

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111331259A (en) * 2020-02-26 2020-06-26 上海交通大学 Method and device for processing high-precision monocrystal diamond arc cutter by using laser
CN111331259B (en) * 2020-02-26 2021-11-12 上海交通大学 Method and device for processing high-precision monocrystal diamond arc cutter by using laser

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WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200103