CN110634808A - Packaging element and manufacturing method thereof - Google Patents

Packaging element and manufacturing method thereof Download PDF

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Publication number
CN110634808A
CN110634808A CN201810649411.1A CN201810649411A CN110634808A CN 110634808 A CN110634808 A CN 110634808A CN 201810649411 A CN201810649411 A CN 201810649411A CN 110634808 A CN110634808 A CN 110634808A
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CN
China
Prior art keywords
unit
substrate
package
conductor
passive
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Granted
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CN201810649411.1A
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Chinese (zh)
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CN110634808B (en
Inventor
吴淑媛
张文斌
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Inpaq Technology Co Ltd
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Inpaq Technology Co Ltd
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Priority to CN201810649411.1A priority Critical patent/CN110634808B/en
Publication of CN110634808A publication Critical patent/CN110634808A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention discloses a packaging element and a manufacturing method thereof. The passive unit is arranged on the substrate unit. The conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected with the passive unit. The packaging unit covers the passive unit and the conductor unit. The electric medium unit electrically contacts the conductor unit and is exposed by the encapsulation unit. Therefore, the packaging element provided by the invention can be applied to electronic equipment.

Description

Packaging element and manufacturing method thereof
Technical Field
The present invention relates to a package device and a method for fabricating the same, and more particularly, to a package device applicable to an electronic device and a method for fabricating the same.
Background
With the development of technology, different passive device package products have been developed in the field of passive devices for electronic devices or electronic products.
Disclosure of Invention
The present invention provides a package device and a method for manufacturing the same, which is directed to overcome the shortcomings of the prior art.
In order to solve the above technical problem, one technical solution of the present invention is to provide a package device, which includes a substrate unit, a passive unit, a conductor unit, a package unit, and an electrical medium unit. The passive unit is arranged on the substrate unit. The conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected with the passive unit. The packaging unit covers the passive unit and the conductor unit. The electric medium unit electrically contacts the conductor unit and is exposed by the encapsulation unit.
Preferably, the substrate unit includes a base layer and a flat layer on the base layer, the passive unit is on the flat layer, and the conductor unit is on the base layer and connected to the base layer.
Preferably, the substrate unit includes a base layer and a flat layer on the base layer, and the passive unit and the conductor unit are both located on the flat layer.
Preferably, the conductor unit includes at least one first conductive member and at least one second conductive member located on the substrate unit, and the at least one first conductive member and the at least one second conductive member are electrically connected to the passive unit; the packaging unit is used for partially covering at least one first conductive piece and at least one second conductive piece, the at least one first conductive piece is provided with a plurality of first contact parts, the at least one second conductive piece is provided with a plurality of second contact parts, and the electric media unit is electrically connected with the plurality of first contact parts and the plurality of second contact parts.
Preferably, the electrical medium unit includes a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other, each of the electrode layers is electrically connected to the corresponding first contact portion, and each of the second electrode layers is electrically connected to the corresponding second contact portion.
Preferably, the passive unit comprises: at least one coil, which is positioned on the substrate unit, is adjacent to the conductor unit and is electrically connected with the conductor unit; and at least one isolation layer covering the at least one coil and adjacent to the conductor unit, the at least one isolation layer being covered by the encapsulation unit.
In order to solve the above technical problem, another technical solution of the present invention is to provide a method for manufacturing a package device, including the following steps: providing a substrate unit; forming a passive unit on the substrate unit; forming a conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit; the packaging unit is covered on the passive unit and the conductor unit to form a packaging body. Wherein, cutting the packaging main body, forming an electric medium unit to be electrically connected with the conductor unit, and manufacturing a plurality of packaging elements; alternatively, the electric medium unit is formed to be electrically connected to the conductor unit, and the package body is cut to manufacture a plurality of package elements.
Preferably, in the step of providing the substrate unit, the following steps are further included:
providing a base layer; and
forming a planar layer on the base layer;
the passive unit is located on the flat layer, and the conductor unit is located on the base layer and connected to the base layer.
Preferably, in the step of providing the substrate unit, the following steps are further included:
providing a base layer; and
forming a planar layer on the base layer;
wherein, the passive unit and the conductor unit are both positioned on the flat layer.
Preferably, in the step of forming the conductor unit on the substrate unit, the following steps are further included:
forming at least one first conductive member and at least one second conductive member on the substrate unit, the at least one first conductive member and the at least one second conductive member being electrically connected to the passive unit;
the packaging unit is used for partially covering at least one first conductive piece and at least one second conductive piece, the at least one first conductive piece is provided with a plurality of first contact parts, the at least one second conductive piece is provided with a plurality of second contact parts, and the electric media unit is electrically connected with the plurality of first contact parts and the plurality of second contact parts.
Preferably, in the step of forming the electrical connection between the electrical medium unit and the conductor unit, the following steps are further included:
forming a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other;
each electrode layer is electrically connected to the corresponding first contact portion, and each second electrode layer is electrically connected to the corresponding second contact portion.
Preferably, in the step of forming the passive unit on the substrate unit, the method further comprises the steps of:
forming at least one coil on the substrate unit; and
at least one isolation layer is formed on the at least one coil, the at least one isolation layer is adjacent to the conductor unit and covered by the packaging unit.
The invention has the advantages that the packaging element and the manufacturing method thereof can manufacture a plurality of packaging elements by forming the passive unit on the substrate unit, forming the conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit, covering the packaging unit on the passive unit and the conductor unit to manufacture a packaging main body, and cutting the packaging main body to form an electric medium unit to be electrically connected with the conductor unit; or, forming the electric medium unit to be electrically connected with the conductor unit, and cutting the packaging main body to manufacture a plurality of packaging elements, so as to provide a user with a packaging element applicable to electronic equipment and a manufacturing method thereof.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a flow chart of a method for manufacturing a package device according to the present invention.
Fig. 2A to 2F are side views of a first structure to a sixth structure of the package component according to the first embodiment of the invention.
Fig. 2G is a perspective view of the package device according to the first embodiment of the invention.
Fig. 3A to 3J are side views of a first structure to a tenth structure of a package component according to a second embodiment of the invention.
Fig. 3K to 3M are first to third perspective views of a package component according to a second embodiment of the invention.
Fig. 4 is a side view of a package device according to a third embodiment of the present invention.
Fig. 5 is a side view of a package device according to a fourth embodiment of the present invention.
Detailed Description
The following description is provided for the embodiments of the present disclosure relating to "package component and method for making the same" by specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various changes in detail without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
First, please refer to fig. 1, which is a flowchart illustrating a method for fabricating a package device according to the present invention. As shown in the drawings, the present invention provides a method for manufacturing a package device, which may include the following steps:
step S20: providing a substrate unit;
step S21: forming a passive unit on the substrate unit;
step S22: forming a conductor unit on the substrate unit, wherein the conductor unit is adjacent to and electrically connected with the passive unit; and
step S23: the packaging unit is covered on the passive unit and the conductor unit to form a packaging body.
After step S23, the method for manufacturing the package device of the present invention can proceed to step S24 or step S25, as follows.
Step S24: cutting the packaging main body, and forming an electric medium unit to be electrically connected with the conductor unit to manufacture a plurality of packaging elements;
step S25: forming an electric medium unit to be electrically connected with the conductor unit, and cutting the package body to manufacture a plurality of package elements.
The packaging element manufactured by the manufacturing method of the packaging element can be applied to electronic equipment. The package component of the present invention can have various embodiments through the manufacturing method of the package component, which will be further described below.
First embodiment
Referring to fig. 2A to 2G, fig. 2A to 2F are side views of a first structure to a sixth structure of a package device according to a first embodiment of the present invention, and fig. 2G is a perspective view of the package device according to the first embodiment of the present invention, and the manufacturing method of the package device according to the present invention is combined with fig. 1. As can be seen from the above figures, the package device 1 of the present invention includes a substrate unit 10, a passive unit 11, a conductor unit 12, a package unit 13 and an electrical medium unit 14. The passive unit 11 is disposed on the substrate unit 10. The conductor unit 12 and the passive unit 11 are disposed on the same side of the substrate unit 10 and electrically connected to the passive unit 11. The encapsulation unit 13 covers the passive unit 11 and the conductor unit 12. The electric intermediate unit 14 electrically contacts the conductor unit 12 and is exposed by the encapsulation unit 13.
Specifically, the package device 1 of the present invention can be manufactured through the steps S20 to S24 or the steps S20 to S25 in the manufacturing method of the package device, and in the embodiment, the steps S20 to S24 are taken as an illustration, but not limited thereto. Further, the substrate unit 10 is provided in step S20, and the substrate unit 10 may be made of iron oxide, but not limited thereto. Next, step S21 is performed to form a passive unit 11 on the substrate unit, where the passive unit 11 may be, but is not limited to, an inductor. Then, step S22 is performed again, and the conductor unit 12 is formed on the substrate unit 10, the conductor unit 12 can be adjacent to and electrically connected to the passive unit 11, and the conductor unit 12 can be an electrode, but not limited thereto. Then, step S23 is performed to cover the package unit 13 between the passive unit 11 and the conductive unit 12 to form a package body Z, wherein the package unit 13 may be made of a polymer material, but not limited thereto.
Before step S24, the present invention may print an iron oxide paste on the top surface of the package body Z (i.e., the surface covering the package unit 13), and then polish the top surface and the bottom surface of the package body Z (i.e., the bottom of the substrate unit 10) to thin the substrate unit 10 and expose the conductor unit 12 to the package unit 13. Finally, step S24 is performed again, the package body Z is cut to form a plurality of unfinished products of the package elements 1, and the electric medium unit 14 is formed on the conductor unit 12 of each package element 1 to make a finished product of the package element 1, as shown in fig. 2G. In fig. 2G, (a) and (b) are different patterns that can be made after the package device 1 of the present invention is implemented.
In one preferred embodiment, the substrate unit 10 may include a substrate layer 100 and a planar layer 101 disposed on the substrate layer 100, and the passive unit 11 and the conductor unit 12 are disposed on the planar layer 101. That is, in step S20 of the method for manufacturing a package component of the present invention, the method further includes: step S200: providing a base layer; and step S201: a planar layer is formed on the base layer. Therefore, the package device 1 of the present invention can be manufactured by providing the base layer 100 first, and then forming the flat layer 101 on the base layer 100 by using the photolithography process to form the substrate unit 10. Next, as described above, the passive element 11 and the conductive element 12 are formed on the planarization layer 101. The base layer 100 may be made of iron oxide or ceramic, and the planarization layer 101 may be made of polymer, but not limited thereto.
In another preferred embodiment, the passive unit 11 may include at least one coil 110 and at least one isolation layer 111. At least one coil 110 is disposed on the substrate unit 10, and is adjacent to and electrically connected to the conductor unit 12. At least one isolation layer 111 covers the at least one coil 110 and is adjacent to the conductor unit 12, and the at least one isolation layer 111 is covered by the encapsulation unit 13. In the present embodiment, the coils 110 and the isolation layers 111 are taken as examples, but not limited thereto.
For example, the package device 1 of the present invention can be formed by the step further included in the step S21 of the method for manufacturing the package device to form the passive unit 11 including the coil 110 and the isolation layer 111. That is, the coil 110 is formed on the substrate unit 10 in step S210, and then the isolation layer 111 is formed on the coil 110 in step S211, so as to form the passive unit 11 on the substrate unit 10. In addition, by sequentially repeating the steps S210 and S211, a plurality of coils 110 and a plurality of isolation layers 111 can be stacked.
It is noted that in the process of forming the passive unit 11 by sequentially forming the coil 110 and the isolation layer 111, the conductive unit 12 can be formed simultaneously. That is, in step S210, some of the conductor units 12 may be formed together, and in step S211, some of the conductor units 12 may be formed again together. Furthermore, the steps of forming the passive element 11 and the conductive element 12 can be combined with the photolithography process.
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Second embodiment
Referring to fig. 3A to 3M, fig. 3A to 3J are side views illustrating a first structure to a tenth structure of a package device according to a second embodiment of the present invention, and fig. 3K to 3M are side views illustrating a first perspective view to a third perspective view of a package device according to a second embodiment of the present invention, and are matched with the method for manufacturing the package device according to the present invention, fig. 1, and fig. 2A to 2G. As shown in the drawings, the package device in this embodiment has similar operations to the same components of the package device in the first embodiment, and therefore, the description is omitted, and it should be noted that, in this embodiment, the substrate unit 10 includes a base layer 100 and a flat layer 101 located on the base layer 100, the passive unit 11 is located on the flat layer 101, and the conductor unit 12 is located on the base layer 100 and connected to the base layer 100.
Specifically, the difference between the present embodiment and the first embodiment is that the conductor unit 12 of the present embodiment is located on the substrate layer 100 and connected to the substrate layer 100. Therefore, the package component 1 of the present invention can provide the base layer 100 first by the manufacturing method of the package component, and then form the flat layer 101 with a slightly smaller area than the base layer 100 on the base layer 100 by using the photolithography process technology to manufacture the substrate unit 10, the passive unit 11 can be formed on the flat layer 101, and the conductor unit 12 can be formed on the base layer 100 not covered by the flat layer 101 to connect with the base layer 100.
In addition, in the present embodiment, it is preferable to have a plurality of embodiments, one of which is shown in fig. 3A to 3G, and the other is shown in fig. 3A to 3D (a) and then fig. 3H to 3J. Further, the difference between the two embodiments is that the conductive pillars formed by the conductive elements 12 can be three or four, as shown by the dashed boxes C1 in fig. 3D and C2 in fig. 3H. When the number of the conductive pillars formed by the conductive elements 12 of the package body Z is four (as shown in the dashed box C1 in fig. 3D), the package device 1 can be made as shown in fig. 3K (a), and the first electrode layer 140 and the second electrode layer 141 can be located at the long sides or corners. When there are three conductive pillars formed by the conductive elements 12 of the package body Z (as shown in the dashed box C2 in fig. 3H), the package device 1 is manufactured as shown in fig. 3K (b), fig. 3L and fig. 3M, and the first electrode layer 140 and the second electrode layer 141 can be located at the long sides or corners.
In this embodiment, after step S23, in addition to printing the iron oxide glue on the top surface of the package body Z and polishing the top surface and the bottom surface of the package body Z (i.e., the bottom of the substrate unit 10), the electrode layer 3 may be sputtered after polishing the top surface of the package body Z, as shown in fig. 3F. Then, step S24 or step S25 is performed again to manufacture the package component 1.
It should be noted that the package component 1 of the present embodiment can be manufactured by steps S20 to S24 or steps S20 to S25 in the manufacturing method of the package component, wherein steps S20 to S24 are the same as those of the first embodiment, and therefore, are not described in detail herein; since the difference between the step S25 and the step S24 is only the sequence of the steps of forming the electrical media unit and cutting the package body, it is not described in detail herein.
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Third embodiment
Referring to fig. 4, fig. 4 is a schematic side view of a package device according to a third embodiment of the present invention, and the package device manufacturing method of the present invention is combined with fig. 1 and fig. 2A to 3I. As shown in the figures, the package component in this embodiment is similar to the same components of the package components in the previous embodiments, and is not repeated herein, and it is worth noting that in this embodiment, the conductor unit 12 includes at least one first conductive member 120 and at least one second conductive member 121 located on the substrate unit 10, and the at least one first conductive member 120 and the at least one second conductive member 121 are electrically connected to the passive unit 11; the at least one first conductive member 120 and the at least one second conductive member are both partially covered by the package unit 13, the at least one first conductive member 120 has a plurality of first contact portions 120A, the at least one second conductive member 121 has a plurality of second contact portions 121A, and the electrical media unit 14 is electrically connected to the plurality of first contact portions 120A and the plurality of second contact portions 121A.
For example, the conductor unit 12 of the present invention further includes at least one first conductive member 120 and at least one second conductive member 121, wherein the at least one first conductive member 120 may have a plurality of first contact portions 120A, and the at least one second conductive member 121 may also have a plurality of second contact portions 121A. That is, the package component 1 of the present invention can further include the step S220 (forming at least one first conductive member and at least one second conductive member on the substrate unit, the at least one first conductive member and the at least one second conductive member being electrically connected to the passive unit) on the substrate unit 10 by the step S22 of the manufacturing method of the package component, and the first conductive member 120 and the second conductive member 121 on the substrate unit 10. Next, step S23 is performed to cover the package unit 13 on the first conductive member 120 and the second conductive member 121. As described in the foregoing embodiment, in the process of forming the coil 110 and the isolation layer 111, a portion of the first conductive member 120 and a portion of the second conductive member 121 may be formed together, and then the first conductive member 120 and the second conductive member 121 may be formed in a stacked manner. Moreover, the portions of the first conductive member 120 and the second conductive member 121 covered by the encapsulation unit 13 of the present invention may further form a pillar structure.
Then, after step S23, an iron oxide paste may be printed on the top surface of the package body Z, and the top surface and the bottom surface (i.e., the bottom of the substrate unit 10) of the package body Z may be ground, so that the first contact portions 120A of the first conductive member 120 and the second contact portions 121A of the second conductive member 121 may be exposed out of the package unit 13. Finally, step S24 or step S25 is performed to cut the package body Z and form the electrical media unit 14 on the first contacts 120A and the second contacts 121A. The electrical medium unit 14 includes a first electrode layer 140 and a second electrode layer 141, and the first electrode layer 140 and the second electrode layer 141 respectively cover the top surface and the side edge of the package device 1.
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Fourth embodiment
Referring to fig. 5, fig. 5 is a schematic side view of a structure of a package device according to a fourth embodiment of the present invention, and the package device manufacturing method of the present invention is combined with fig. 1 and fig. 2A to 4. As shown in the figures, the package device in the present embodiment has similar operations to the same components of the package devices in the previous embodiments, and thus, the description thereof is omitted, and it is worth noting that the difference from the electrical medium unit 14 in the third embodiment is that, in the present embodiment, the electrical medium unit 14 includes a plurality of first electrode layers 140 separated from each other and a plurality of second electrode layers 141 separated from each other, each of the electrode layers 140 is electrically connected to the corresponding first contact portion 120A, and each of the second electrode layers 141 is electrically connected to the corresponding second contact portion 121A.
Specifically, the electrical media unit 14 of the package component 1 of the present invention further comprises a plurality of first electrode layers 140 separated from each other and a plurality of second electrode layers 141 separated from each other. The package component 1 of the present invention can be manufactured by the step S240 (cutting the package body, forming the plurality of first electrode layers separated from each other, and forming the plurality of second electrode layers separated from each other to manufacture the plurality of package components) further included in the step S24 of the manufacturing method of the package component, or the step S250 (forming the plurality of first electrode layers separated from each other, and the plurality of second electrode layers separated from each other, and cutting the package body to manufacture the plurality of package components) further included in the step S25, after covering the package unit 13 on the first conductive member 120 and the second conductive member 121, and grinding the package body Z, forming the first electrode layer 140 on each first contact portion 120A and forming the second electrode layer 141 on each second contact portion 121A respectively in a barrel plating or coating manner. Wherein, the first electrode layer 140 covered by the first contact portion 120A on the top surface of the package device 1 and the first electrode layer 140 covered by the first contact portion 120A on the side of the package device 1 are separated from each other; in contrast, the second electrode layer 141 covered by the second contact portion 121A on the top surface of the package element 1 and the second electrode layer 141 covered by the second contact portion 121A on the side of the package element 1 are also separated from each other.
It should be noted that the first electrode layer 140 and the second electrode layer 141 in the above embodiments may be nickel (Ni) or tin (Sn), the thickness may be 1 to 15 μm, and the length of the first electrode layer 140 and the second electrode layer 141 on the side of the package device 1 may be 50 to 300 μm. Thereby, by providing a large-area electrode layer on the package element 1, sufficient strength for soldering to a circuit board of an electronic device or an electronic product is provided.
However, the package device and the method for fabricating the same of the present invention are not limited to the above examples.
Advantageous effects of the embodiments
The invention has the advantages that the packaging element and the manufacturing method thereof can manufacture a plurality of packaging elements 1 by forming the passive unit 11 on the substrate unit 10, forming the conductor unit 12 on the substrate unit 10, wherein the conductor unit 12 is adjacent to and electrically connected with the passive unit 11, covering the packaging unit 13 on the passive unit 11 and the conductor unit 12 to manufacture the packaging main body Z, cutting the packaging main body Z, and forming the electric medium unit 14 to be electrically connected with the conductor unit 12; alternatively, the electric medium unit 14 and the conductor unit 12 are electrically connected, and the package body Z is cut to form a plurality of package components 1 ", so as to provide a package component 1 applicable to an electronic device for a user, and a manufacturing method for manufacturing the package component 1.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims (12)

1. A packaged component, comprising:
a substrate unit;
a passive unit disposed on the substrate unit;
the conductor unit and the passive unit are arranged on the same side of the substrate unit and are electrically connected to the passive unit;
a packaging unit covering the passive unit and the conductor unit; and
and the electric medium unit is electrically contacted with the conductor unit and is exposed by the packaging unit.
2. The packaged component of claim 1, wherein the substrate unit comprises a base layer and a planar layer on the base layer, the passive unit is on the planar layer, and the conductor unit is on the base layer and connected to the base layer.
3. The package component of claim 1, wherein the substrate unit comprises a base layer and a planar layer on the base layer, and wherein the passive unit and the conductor unit are both on the planar layer.
4. The package component of claim 1, wherein the conductor unit comprises at least one first conductive member and at least one second conductive member on the substrate unit, the at least one first conductive member and the at least one second conductive member being electrically connected to the passive unit; the package unit is disposed on the substrate, and the package unit is disposed on the substrate, wherein at least one of the first conductive members and at least one of the second conductive members are partially covered by the package unit, at least one of the first conductive members has a plurality of first contact portions, at least one of the second conductive members has a plurality of second contact portions, and the electrical media unit is electrically connected to the plurality of first contact portions and the plurality of second contact portions.
5. The package component of claim 4, wherein the electrical medium unit comprises a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other, each of the first electrode layers is electrically connected to the corresponding first contact portion, and each of the second electrode layers is electrically connected to the corresponding second contact portion.
6. The package component of claim 1, wherein the passive unit comprises:
at least one coil, located on the substrate unit, and adjacent to and electrically connected to the conductor unit; and
at least one isolation layer covering at least one of the coils and adjacent to the conductor unit, the at least one isolation layer being covered by the encapsulation unit.
7. A method of making a packaged component, comprising the steps of:
providing a substrate unit;
forming a passive unit on the substrate unit;
forming a conductor unit on the substrate unit, the conductor unit being adjacent to and electrically connected to the passive unit; and
covering the packaging unit on the passive unit and the conductor unit to manufacture a packaging main body;
wherein, the packaging main body is cut, and an electric medium unit is formed to be electrically connected with the conductor unit, so as to manufacture a plurality of packaging elements; alternatively, an electric medium unit is formed to be electrically connected to the conductor unit, and the package body is cut to make a plurality of the package elements.
8. The method of claim 7, wherein the step of providing the substrate unit further comprises the steps of:
providing a base layer; and
forming a planar layer on the base layer;
wherein the passive unit is located on the flat layer, and the conductor unit is located on the substrate layer and connected to the substrate layer.
9. The method of claim 7, wherein the step of providing the substrate unit further comprises the steps of:
providing a base layer; and
forming a planar layer on the base layer;
wherein the passive unit and the conductor unit are both located on a flat layer.
10. The method for manufacturing a package component according to claim 7, further comprising the steps of, in the step of forming the conductor unit on the substrate unit:
forming at least one first conductive member and at least one second conductive member on the substrate unit, wherein the at least one first conductive member and the at least one second conductive member are electrically connected to the passive unit;
the package unit is disposed on the substrate, and the package unit is disposed on the substrate, wherein at least one of the first conductive members and at least one of the second conductive members are partially covered by the package unit, at least one of the first conductive members has a plurality of first contact portions, at least one of the second conductive members has a plurality of second contact portions, and the electrical media unit is electrically connected to the plurality of first contact portions and the plurality of second contact portions.
11. The method of claim 10, wherein the step of forming the electrical connection between the electrical medium unit and the conductor unit further comprises the steps of:
forming a plurality of first electrode layers separated from each other and a plurality of second electrode layers separated from each other;
each electrode layer is electrically connected to the corresponding first contact portion, and each second electrode layer is electrically connected to the corresponding second contact portion.
12. The method as claimed in claim 7, further comprising the steps of, in the step of forming the passive unit on the substrate unit:
forming at least one coil on the substrate unit; and
and forming at least one isolation layer on at least one of the coils, wherein the at least one isolation layer is adjacent to the conductor unit and covered by the packaging unit.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1236203A (en) * 1998-04-15 1999-11-24 株式会社村田制作所 Electronic part and method of manufacturing the same
JP2005340573A (en) * 2004-05-28 2005-12-08 Fujikura Ltd Semiconductor element, manufacturing method thereof and semiconductor device
CN103915243A (en) * 2012-12-28 2014-07-09 三星电机株式会社 Inductor
CN208460742U (en) * 2018-06-22 2019-02-01 佳邦科技股份有限公司 Potted element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1236203A (en) * 1998-04-15 1999-11-24 株式会社村田制作所 Electronic part and method of manufacturing the same
JP2005340573A (en) * 2004-05-28 2005-12-08 Fujikura Ltd Semiconductor element, manufacturing method thereof and semiconductor device
CN103915243A (en) * 2012-12-28 2014-07-09 三星电机株式会社 Inductor
CN208460742U (en) * 2018-06-22 2019-02-01 佳邦科技股份有限公司 Potted element

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