CN110632996A - Liquid cooling equipment, liquid cooling method and liquid cooling system - Google Patents
Liquid cooling equipment, liquid cooling method and liquid cooling system Download PDFInfo
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- CN110632996A CN110632996A CN201910867327.1A CN201910867327A CN110632996A CN 110632996 A CN110632996 A CN 110632996A CN 201910867327 A CN201910867327 A CN 201910867327A CN 110632996 A CN110632996 A CN 110632996A
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Abstract
The application provides a liquid cooling device, includes: a liquid cooling tank having a first liquid cooling medium for heat exchange with the server unit; the heat exchange circulating pipeline is arranged in the first liquid cooling medium, an inlet of a second liquid cooling medium of the heat exchange circulating pipeline is arranged on one side close to the bottom of the liquid cooling box body, an outlet of the second liquid cooling medium of the heat exchange circulating pipeline is arranged on one side close to the top of the liquid cooling box body, and the heat exchange circulating pipeline is used for heat exchange between the second liquid cooling medium and the first liquid cooling medium; and the cooling system is connected with the outlet and the inlet and is used for cooling the second liquid cooling medium in the heat exchange circulating pipeline. Therefore, the radiating cost is reduced, and the radiating efficiency is improved. The application also provides a liquid cooling method and a liquid cooling system for the server, and the method and the system have the beneficial effects.
Description
Technical Field
The application relates to the technical field of servers, in particular to liquid cooling equipment, a liquid cooling method and a liquid cooling system.
Background
With conventional server designs using heat sinks, almost half of the power is consumed in heat dissipation. Energy usage efficiency (PUE) is a pointer to evaluate energy efficiency of a data center, the ratio of all energy consumed by the data center to energy used by an IT load is 2 as a benchmark, and the closer to 1, the better the energy efficiency level is, and the more energy is saved.
In the server system of the present day, the heat dissipation problem is more and more important, so the whole server is developed to be immersed in liquid for circulating cooling, and the insulating cooling liquid is used to replace air cooling. The heat generated by the electronic components is directly and rapidly conducted to the fluid, eliminating the need for other actively cooled components such as interface materials, heat sinks, and fans. Meanwhile, the special liquid is completely insulated and non-corrosive, and even if the components are immersed for more than 20 years, the components cannot be changed and any influence on the electronic components cannot be caused. The immersed phase-change heat exchange liquid cooling system greatly reduces the volume flow of the refrigerant and reduces the heat transfer temperature difference by utilizing the liquid refrigerant, thereby obtaining higher power density of equipment, higher energy efficiency ratio and lower surface temperature of a chip, and greatly improving the calculation density and performance. The existing liquid cooling server framework is to circulate the whole liquid cooling medium to cool, so that the efficiency is low and the energy consumption is large.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a liquid cooling device, a liquid cooling method and a liquid cooling system, and the heat exchange efficiency is improved and the energy consumption is saved through the heat exchange between a heat exchange circulating pipeline and a first liquid cooling medium in a liquid cooling box body. The specific scheme is as follows:
the application discloses liquid cooling equipment includes:
a liquid cooling tank having a first liquid cooling medium for heat exchange with the server unit;
the heat exchange circulating pipeline is arranged in the first liquid cooling medium, an inlet of a second liquid cooling medium of the heat exchange circulating pipeline is arranged at one side close to the bottom of the liquid cooling box body, an outlet of the second liquid cooling medium of the heat exchange circulating pipeline is arranged at one side close to the top of the liquid cooling box body, and the heat exchange circulating pipeline is used for heat exchange between the second liquid cooling medium and the first liquid cooling medium;
and the cooling system is connected with the outlet and the inlet and is used for cooling the second liquid cooling medium in the heat exchange circulating pipeline.
Optionally, the heat exchange circulation pipeline includes a plurality of laminated sub-pipelines connected in a stacked manner, and the laminated sub-pipelines and the server unit are distributed at intervals.
Optionally, the server unit is a server unit with a heat output higher than a preset heat output.
Optionally, the heat exchange circulation pipe is a spiral pipe.
Optionally, the cooling system comprises:
a power plant;
a cooling element for cooling the second liquid cooling medium of the outlet;
and the electronic flow meter is used for controlling the flow of the second liquid cooling medium in the heat exchange circulating pipeline.
Optionally, the heat exchange circulation pipeline is a copper pipe.
Optionally, the first liquid cooling medium is a fluorinated liquid.
Optionally, the method further includes:
and the temperature sensor is connected with the liquid cooling server and used for acquiring the temperature of the first liquid cooling medium.
The application provides a liquid cooling method for a server, comprising the following steps:
the cooling system inputs the second liquid cooling medium with the first temperature to an inlet of the heat exchange circulating pipeline;
the second liquid cooling medium exchanges heat with the first liquid cooling medium in the liquid cooling box body in the heat exchange circulating pipeline to obtain the second liquid cooling medium at a second temperature;
and the second liquid cooling medium is conveyed from the outlet of the heat exchange circulating pipeline to a cooling system for cooling.
The application provides a liquid cooling system, includes: such as the liquid cooling apparatus and controller described above.
The application provides a liquid cooling device, includes: a liquid cooling tank having a first liquid cooling medium for heat exchange with the server unit; the heat exchange circulating pipeline is arranged in the first liquid cooling medium, an inlet of a second liquid cooling medium of the heat exchange circulating pipeline is arranged on one side close to the bottom of the liquid cooling box body, an outlet of the second liquid cooling medium of the heat exchange circulating pipeline is arranged on one side close to the top of the liquid cooling box body, and the heat exchange circulating pipeline is used for heat exchange between the second liquid cooling medium and the first liquid cooling medium; and the cooling system is connected with the outlet and the inlet and is used for cooling the second liquid cooling medium in the heat exchange circulating pipeline.
It is thus clear that this application is through setting up heat transfer circulating line in first liquid cooling medium, the entry of the second liquid cooling medium that sets up heat transfer circulating line is in bottom one side of nearly liquid cooling box, microthermal second liquid cooling medium begins the circulation from the bottom, the heat exchange of the higher first liquid cooling medium of temperature of bottom has been accelerated, the heat dissipation of bottom has been accelerated, and the high power consumption that needs whole first liquid cooling medium to circulate among the correlation technique has been avoided, the heat dissipation cost is reduced, the heat dissipation efficiency is improved, user experience is improved. The application also provides a liquid cooling method and a liquid cooling system for the server, which have the beneficial effects and are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a liquid cooling apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of another liquid cooling apparatus according to an embodiment of the present disclosure;
fig. 3 is a schematic flowchart of a liquid cooling method for a server according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Present liquid cooling server framework circulates the holistic liquid cooling medium and cools down, it is big to consume energy simultaneously of inefficiency, the application provides a liquid cooling equipment, through set up heat transfer circulating line in first liquid cooling medium, the entry of the second liquid cooling medium that sets up heat transfer circulating line is in bottom one side of nearly liquid cooling box, microthermal second liquid cooling medium circulates from the bottom, the heat exchange of the higher first liquid cooling medium of temperature of bottom has been accelerated, the heat dissipation of bottom has been accelerated, and the high power consumption that needs whole first liquid cooling medium to circulate among the correlation technique has been avoided, reduce the heat dissipation cost, improve the radiating efficiency, improve user experience, please specifically refer to figure 1, figure 1 is the liquid cooling equipment that this application embodiment provided, include:
a liquid-cooled tank 100 having a first liquid-cooled medium 200 heat-exchanged with the server unit 300; the heat exchange circulating pipeline 400 is arranged in the first liquid cooling medium 200, an inlet 410 of a second liquid cooling medium 500 of the heat exchange circulating pipeline 400 is arranged at one side close to the bottom of the liquid cooling box 100, an outlet 420 of the second liquid cooling medium 500 of the heat exchange circulating pipeline 400 is arranged at one side close to the top of the liquid cooling box 100, and the heat exchange circulating pipeline 400 is used for heat exchange between the second liquid cooling medium 500 and the first liquid cooling medium 200; and a cooling system 600 connected to the outlet 420 and the inlet 410 for cooling the second liquid cooling medium 500 in the heat exchange circulation pipe 400.
In the field of artificial intelligence, the requirement for computing power is not limited, and the number of integrated computing power in unit space restricts the scale of a computing system and the maximum speed of model training. The superposition of the GPUs in the unit space enables heat dissipation to become a bottleneck of an AI computing platform, and from this point, the immersed liquid cooling server naturally has AI attributes, so that the heat dissipation problem caused by surge of computing density is well solved. The existing liquid cooling server framework is to circulate the whole liquid cooling medium to cool, so that the efficiency is low and the energy consumption is large. The liquid cooling server provided by this embodiment can greatly improve the heat flow design only by directly immersing IT hardware, i.e. the server set 300, in the non-conductive first liquid cooling medium 200, the heat generated by the server set 300 is directly and rapidly transferred to the first liquid cooling medium 200, and there is no need for other interface materials, radiators and fans of the active cooling server set 300, by arranging the heat exchange circulation pipeline 400 in the first liquid cooling medium 200, arranging the inlet of the second liquid cooling medium 500 of the heat exchange circulation pipeline 400 at one side near the bottom of the liquid cooling box 100, and circulating the low-temperature second liquid cooling medium 500 from the bottom, the heat exchange of the first liquid cooling medium 200 with higher temperature at the bottom is accelerated, the heat dissipation at the bottom is accelerated, and the high energy consumption of the whole first liquid cooling medium 200 required to circulate in the related art is avoided, the heat dissipation cost is reduced, and the heat dissipation efficiency is improved, the user experience is improved.
The first liquid cooling medium 200 is not limited in this embodiment, and it should be understood that the first liquid cooling medium 200 may be an insulating cooling medium, an insulating oil substance, a fluorinated liquid, or a liquid cooling medium made of other materials as long as the purpose of this embodiment is achieved. Preferably, the first liquid cooling medium 200 is a fluorinated liquid that is not fugitive, non-toxic, non-corrosive. The first liquid cooling medium 200 is placed in the liquid cooling box 100, the volume of the first liquid cooling medium 200 is not limited in this embodiment, the first liquid cooling medium 200 may be fully filled in the liquid cooling box 100, or may be set in the liquid cooling box 100 by a certain volume, and a specific user may set the first liquid cooling medium 200 in a customized manner according to actual needs, for example, when the server unit 300 needs a large amount of heat dissipation when the server operates for a long time at present, the first liquid cooling medium 200 may be fully filled in the liquid cooling box 100; the current server operation market is small, and the heat dissipation capacity of the corresponding server unit 300 is small, then a part of the first liquid cooling medium 200 may be filled in the liquid cooling box 100.
In this embodiment, the shape and size parameters of the liquid cooling box 100 are not limited, and the user can set the liquid cooling box according to actual requirements, and certainly, the material of the liquid cooling box 100 is not limited in this embodiment, as long as the purpose of this embodiment can be achieved, and the liquid cooling box 100, the server unit 300, and the corresponding assembly do not react with the first liquid cooling medium 200. The liquid-cooled tank 100 needs to be sealed to prevent the first liquid-cooled medium 200 from leaking. The liquid cooling tank 100 may be an integrated tank or a split tank, and is not set in this embodiment. Further, the liquid cooling box 100 may include a movable box cover and a box wall, and a sealing device is disposed between the box cover and the box wall to ensure the sealing performance of the liquid cooling box 100, and thus, the movable box cover may be convenient for the related technical staff to overhaul the server.
In this embodiment, the server units 300 disposed in the first liquid cooling medium 200 are not limited, and may be all the server units 300, or may be some server units 300 with a large heat generation amount, and a user may set the server units according to actual requirements, and the server units 300 in this embodiment are not limited to the specific positions of the heat exchange circulation pipes 400, and the user may set the server units according to actual requirements. The server machine group 300 having a large heat generation amount may be one or more of a memory device, a chipset, a power supply, and a hard disk device, and may be another server machine group 300 having a large heat generation amount.
The heat exchange circulation pipe 400 of setting in first liquid cooling medium 200, this embodiment do not inject heat exchange circulation pipe 400's shape, size, material, and the user sets up according to actual demand. The heat exchange circulation pipe 400 may be a regular column, such as a cylinder or a polygonal column, may be a laminated column, may be a spiral column, or may be of other shapes, and certainly, the surface area of the heat exchange circulation device is increased as much as possible on the basis of satisfying the requirement of packaging so as to perform heat exchange with the first liquid cooling medium 200 with high efficiency, thereby reducing the problem that the temperature of the first liquid cooling medium 200 is increased due to heat generated by the server unit 300. The embodiment does not limit the manner in which the heat exchange circulation pipe 400 is disposed in the first liquid cooling medium 200, the heat exchange circulation pipe 400 may be disposed in the first liquid cooling medium 200 as required, a preset volume of the heat exchange circulation pipe 400 may be disposed in the first liquid cooling medium 200, and the preset volume may be 4/5, 2/3, 1/2 or other values of the volume of the heat exchange circulation pipe 400. The inlet 410 of the second liquid cooling medium 500 of the heat exchange circulation pipe 400 is disposed near one side of the bottom of the liquid-cooled tank 100, and the outlet 420 of the second liquid cooling medium 500 of the heat exchange circulation pipe 400 is disposed near one side of the top of the liquid-cooled tank 100. Because the second liquid cooling medium 500 is arranged at the bottom of the near liquid cooling box body 100 from the inlet 410 of the heat exchange circulation conduit, the second liquid cooling medium 500 below promotes the first liquid cooling medium 200 below to perform heat exchange, the temperature of the first liquid cooling medium 200 below is reduced, the first liquid cooling medium 200 above can perform heat exchange with the first liquid cooling medium 200 below downwards, circulation is performed, self liquid cooling circulation of the first liquid cooling medium 200 is accelerated, and circulation efficiency is improved. It can be understood that, the heat exchange circulation pipeline 400 is used for the heat exchange between the second liquid cooling medium 500 and the first liquid cooling medium 200, which means that the second liquid cooling medium 500 is fully exchanged with the heat exchange circulation conduit, the first liquid cooling medium 200 exchanges heat with the heat exchange circulation conduit, and the heat exchange circulation conduit exchanges heat with the first liquid cooling medium 200 to realize the final heat dissipation. The second liquid cooling medium 500 is not limited in this embodiment, and may be the same as or different from the first liquid cooling medium 200, and may be water or a fluorinated liquid.
And a cooling system 600 connected to the outlet 420 and the inlet 410 for cooling the second liquid cooling medium 500 in the heat exchange circulation pipe 400. The connection mode is not limited in this embodiment, and it is sufficient that sealing is ensured.
It can be known that, in the embodiment, the heat exchange circulation pipe is arranged in a cold-in-hot-out operation mode, a cold circulation is formed at the bottom, the hot first liquid cooling medium above the cold circulation pipe sinks, so that the self circulation of the first liquid cooling medium in the liquid cooling box body is faster, the heat exchange circulation pipe has high heat dissipation performance, and the heat dissipation efficiency is better as the Thermal Conductivity is higher.
Based on above-mentioned technical scheme, this embodiment is through setting up heat transfer circulating line in first liquid cooling medium, the entry of the second liquid cooling medium that sets up heat transfer circulating line is in bottom one side of nearly liquid cooling box, microthermal second liquid cooling medium begins the circulation from the bottom, the heat exchange of the higher first liquid cooling medium of temperature of bottom has been accelerated, the heat dissipation of bottom has been accelerated, and the high power consumption that needs whole first liquid cooling medium to circulate among the correlation technique has been avoided, the heat dissipation cost is reduced, the heat dissipation efficiency is improved, user experience is improved.
Based on the foregoing embodiments, in order to improve the heat exchange efficiency, the present embodiment provides a liquid cooling apparatus, and specifically refer to fig. 2, fig. 2 is another liquid cooling apparatus provided in the present embodiment, where the heat exchange circulation pipeline 400 includes a plurality of laminated sub-pipelines, and the laminated sub-pipelines are distributed at intervals with the server unit 300.
The embodiment does not limit the sheet layer sub-pipeline, the horizontal section of the sheet layer sub-pipeline can be a circle, an ellipse, a triangle, a polygon or an irregular figure, the user can set the sheet layer thickness of the sheet layer sub-pipeline in a user-defined mode, and the user can set the connection mode between the two sheet layers in a user-defined mode such as the connection position and the distance between the two sheet layers. The layer sub-pipelines and the server unit 300 are distributed at intervals, so that the first liquid cooling media 200 around the server unit 300 after heat dissipation can exchange heat in a period of time, and the temperature is reduced.
Based on above-mentioned technical scheme, this embodiment is connected with server unit 300 interval through the lamella subduct that sets up the range upon range of connection of heat transfer circulating line 400, is favorable to the heat dissipation, has improved the radiating efficiency.
In a specific embodiment of the liquid cooling apparatus provided in the present application, the server set 300 is further explained, and the server set 300 is a server set 300 with a heat quantity higher than a preset heat quantity.
Specifically, the server set 300 is the server set 300 with the heat output higher than the preset heat, and the preset heat is not limited in this embodiment, and the user can set the server set by self. For saving first liquid cooling medium 200, when reducing the cost, first liquid cooling medium 200 is not full of liquid cooling box 100, submerge the server unit 300 that calorific capacity is higher than predetermineeing the heat in first liquid cooling medium 200 this moment, set up the server unit 300 that calorific capacity is lower than predetermineeing the heat in the top of first liquid cooling medium 200, at this moment, guarantee that the server unit 300 that calorific capacity is high can carry out the heat exchange with first liquid cooling medium 200. It can be seen that, according to the technical scheme provided by this embodiment, the server set 300 with the heat generation higher than the preset heat is disposed in the first liquid cooling medium 200, so that the cost can be reduced under the condition of heat dissipation.
Based on the above embodiment, in order to improve the heat exchange efficiency, the present embodiment provides a liquid cooling apparatus, wherein the heat exchange circulation pipe 400 is a spiral pipe. The spiral structure of the heat exchange circulation pipe 400 is not limited in this embodiment, and the diameter, the spiral diameter, and the material of the spiral pipe are limited as long as the purpose of this embodiment can be achieved, and the user can set the spiral structure according to actual needs. It can be seen that, in this embodiment, the heat exchange circulation pipeline 400 is set to be spiral, so that the contact area with the first liquid cooling medium 200 is increased, and the heat transfer efficiency is improved.
In one embodiment of the liquid cooling apparatus provided herein, further elaboration is directed to a cooling system, comprising: a power plant; a cooling member for cooling the second liquid cooling medium 500 of the outlet 420; and an electronic flow meter for controlling the flow rate of the second liquid cooling medium 500 in the heat exchange circulation pipe 400. The power device is not limited in this embodiment, and may be a pump or a motor, or may be other devices to facilitate the circulation of the second liquid cooling medium 500 in the heat exchange circulation pipe 400. The cooling element may be a device that performs cooling by a refrigerant, may be a vapor compression type natural cooling system, and may be any device as long as the object of the present embodiment can be achieved. The electronic flow meter is connected with a pipeline of the second liquid cooling medium 500 corresponding to the cooling system, and is used for collecting the circulation flow of the second liquid cooling medium 500. As can be seen, the cooling system can control the circulation flow rate of the second liquid cooling medium 500 through the electronic flow meter, and avoid the high energy consumption phenomenon caused by the circulation of the second liquid cooling medium 500 with a large flow rate when the heat generation amount of the current server set 300 is small.
Further, the heat exchange circulation pipe 400 is a copper pipe. The corrosion resistance is strong, the oxidation is not easy, and the bright bending model is easy to be formed because the corrosion resistance is strong, and the bright bending model is not easy to be chemically reacted with some liquid substances.
Further, the first liquid cooling medium 200 is a fluorinated liquid.
Further, the liquid cooling apparatus further includes: and the temperature sensor is connected with the liquid cooling server and used for acquiring the temperature of the first liquid cooling medium 200. When the temperature of the first liquid cooling medium 200 is successfully matched with the preset flow matching table, the circulation of the second liquid cooling medium 500 in the heat exchange circulating pipeline 400 is controlled according to the corresponding flow of the second liquid cooling medium 500, the efficiency is improved, and the energy is saved.
The liquid cooling method for the server according to the embodiments of the present application is described below, and the liquid cooling method for the server described below and the liquid cooling apparatus described above may be referred to correspondingly. Referring to fig. 3, fig. 3 is a schematic flow chart of a liquid cooling method for a server according to an embodiment of the present application, which is mainly applied to the liquid cooling apparatus, and includes:
s301, inputting a second liquid cooling medium with a first temperature into an inlet of a heat exchange circulating pipeline by a cooling system;
s302, performing heat exchange between the second liquid cooling medium and the first liquid cooling medium in the liquid cooling box body in the heat exchange circulating pipeline to obtain a second liquid cooling medium at a second temperature;
and S303, conveying the second liquid cooling medium from the outlet of the heat exchange circulating pipeline to a cooling system for cooling.
In the following, a liquid cooling system provided by an embodiment of the present application is introduced, and the liquid cooling system described below and the liquid cooling apparatus described above may be referred to correspondingly.
The application provides a liquid cooling system, includes: such as the liquid cooling apparatus and controller described above.
The controller is configured to control cooling and circulation of the second liquid cooling medium, and specifically, the electronic flow meter may be controlled to circulate the second liquid cooling medium according to a preset rule based on data transmitted from the temperature sensor. The preset rule may be that the cooling temperature, the circulation rate, and the circulation capacity of the corresponding second liquid cooling medium are matched according to the temperature, and of course, the user may also set the preset rule according to actual needs, and this embodiment is not limited.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A liquid cooling apparatus, comprising:
a liquid cooling tank having a first liquid cooling medium for heat exchange with the server unit;
the heat exchange circulating pipeline is arranged in the first liquid cooling medium, an inlet of a second liquid cooling medium of the heat exchange circulating pipeline is arranged at one side close to the bottom of the liquid cooling box body, an outlet of the second liquid cooling medium of the heat exchange circulating pipeline is arranged at one side close to the top of the liquid cooling box body, and the heat exchange circulating pipeline is used for heat exchange between the second liquid cooling medium and the first liquid cooling medium;
and the cooling system is connected with the outlet and the inlet and is used for cooling the second liquid cooling medium in the heat exchange circulating pipeline.
2. The liquid cooling apparatus of claim l, wherein the heat exchange circulation line comprises a plurality of stacked and connected laminar sub-lines, and the laminar sub-lines are spaced apart from the server assembly.
3. The liquid cooling apparatus of claim l, wherein the server assembly is a server assembly that generates heat above a predetermined amount of heat.
4. The liquid cooling apparatus of claim l, wherein the heat exchange circulation tube is a helical tube.
5. The liquid cooling apparatus of claim l, wherein the cooling system comprises:
a power plant;
a cooling element for cooling the second liquid cooling medium of the outlet;
and the electronic flow meter is used for controlling the flow of the second liquid cooling medium in the heat exchange circulating pipeline.
6. The liquid cooling apparatus of claim 1, wherein the heat exchange circulation conduit is a copper tube.
7. The liquid cooling apparatus of claim l, wherein the first liquid cooling medium is a fluorinated liquid.
8. The liquid cooling apparatus of any of claims 1 to 7, further comprising:
and the temperature sensor is connected with the liquid cooling server and used for acquiring the temperature of the first liquid cooling medium.
9. A liquid cooling method for a server, comprising:
the cooling system inputs the second liquid cooling medium with the first temperature to an inlet of the heat exchange circulating pipeline;
the second liquid cooling medium exchanges heat with the first liquid cooling medium in the liquid cooling box body in the heat exchange circulating pipeline to obtain the second liquid cooling medium at a second temperature;
and the second liquid cooling medium is conveyed from the outlet of the heat exchange circulating pipeline to the cooling system for cooling.
10. A liquid cooling system, comprising: a liquid cooling apparatus and controller as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910867327.1A CN110632996A (en) | 2019-09-12 | 2019-09-12 | Liquid cooling equipment, liquid cooling method and liquid cooling system |
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| CN201910867327.1A CN110632996A (en) | 2019-09-12 | 2019-09-12 | Liquid cooling equipment, liquid cooling method and liquid cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115686162A (en) * | 2022-12-28 | 2023-02-03 | 苏州浪潮智能科技有限公司 | Liquid cooling circulation system and method of server, electronic device and storage medium |
| WO2023025093A1 (en) * | 2021-08-25 | 2023-03-02 | 华为技术有限公司 | Dual cooling passage-based liquid-cooled heat dissipation structure |
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Application publication date: 20191231 |